CN103164004A - Electronic device - Google Patents
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- CN103164004A CN103164004A CN201110427042XA CN201110427042A CN103164004A CN 103164004 A CN103164004 A CN 103164004A CN 201110427042X A CN201110427042X A CN 201110427042XA CN 201110427042 A CN201110427042 A CN 201110427042A CN 103164004 A CN103164004 A CN 103164004A
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- air intake
- intake vent
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Abstract
The invention discloses an electronic device comprising a shell body, a plurality of electronic elements and a plurality of strobes. The shell body is provided with a plurality of wind inlets and a wind outlet. The plurality of electronic elements comprise a fan. When the electronic device works, the plurality of electronic elements can be driven to emit heat so that a temperature can be increased to a working temperature, a plurality of heat-emitting areas are formed in the shell body, each heat-emitting area corresponds to each wind inlet, each wind inlet is provided with each strobe and each strobe is provided with each thermal expansion element. Each thermal expansion element is used for inducing the temperature of each corresponding heat-emitting area and producing a deformation. The deformation of each thermal expansion element drives each strobe connected with each thermal expansion element to move between a first position and a second position, so that each of the plurality of wind inlets is controlled to be in a closed state or an opened state. The wind inlets which are opened at at least two different time points are different, so that a flow filed, inside the shell body, of cooling air can be changed.
Description
Technical field
The invention relates to a kind of electronic installation, it is espespecially a kind of that the adjustment air intake vent is opened or closes according to actual febrile state is different, the electronic installation interior flow field is changed, can dispels the heat for the higher electronic component of the degree of heat, the electronic installation of the radiating effect that performance is best.
Background technology
Electronic installation, computer apparatus especially is because heating can be large, therefore usually in housing (for example note-book type computer casing or computer mainframe shell), all be provided with many louvres, can make enclosure interior and cool exterior air form convection current, be beneficial to heat energy and disperse fast.
As for housing louvre configuration mode, be mainly according to thermal source or flow field configuration.After the louvre location positioning of housing, just determined the enclosure interior flow field, can't because of the user use state or environment different and change to some extent.In other words, not only one usually, the inner common electronic component of electronic installation, and the degree of heat of electronic component is different, and position and the temperature of necessary all electronic components of comprehensive consideration of deviser are then designed the louvre that each electronic component Homogeneouslly-radiating effect can be provided simultaneously.
But when electronic installation uses state not simultaneously, the degree of heat of electronic component also can change, with the design in traditional heat-dissipating hole, and can't for single source or different use states changes the flow field.When wherein an electronic component temperature raises, existing way is to improve whole rotation speed of the fan to increase heat dissipation, reaches the purpose that reduces heat source temperature, but improves the way of rotation speed of the fan, just passive raising heat energy distributes speed, and can't directly provide cooling effect for electronic component.
Disclose in order to for the means of improving radiating efficiency as for existing patent or open source literature, nothing more than improving radiating fan rotation speed, or be added to air port or air outlet quantity, existing patent or open source literature all have no and can change electronic installation internal cooling wind flow field, structure or the method that can dispel the heat for the higher electronic component of the degree of heat.
Accordingly as can be known, how can adjust air intake vent and open or close according to the actual febrile state difference of electronic installation, the electronic installation interior flow field is changed, to dispel the heat for the higher electronic component of the degree of heat, the radiating effect that performance is best makes heat dissipation technology association area personage problem anxious to be resolved.
Summary of the invention
Because the disappearance of prior art, the present invention proposes a kind of electronic installation, can adjust the air intake vent folding according to actual febrile state difference, and the electronic installation interior flow field is changed, can dispel the heat for the higher electronic component of the degree of heat, the radiating effect that performance is best.
For achieving the above object, the present invention proposes a kind of electronic installation, comprises:
One housing, it has a plurality of air intake vents and an air outlet, and this air intake vent is to import cooling air to enter in this housing;
A plurality of electronic components, be arranged in this housing, each this electronic component has a working temperature when work, wherein the working temperature of at least two these electronic components is different, when this electronic installation work, can drive described a plurality of electronic component heating, make described a plurality of electronic component be warming up to working temperature, form a plurality of heating regions by described a plurality of electronic components in this housing, each this heating region is corresponding to this air intake vent, and each this heating region has at least one this electronic component; And
A plurality of gates, be arranged at this housing corresponding to described a plurality of air outlet positions, each this gate is provided with a heat-swelling element, each this heat-swelling element is respond to the temperature of corresponding heating region and produce deformation, driving by the deformation of this heat-swelling element the gate that connects is displaced between a primary importance and a second place, be closed state or open state to control described a plurality of air intake vent, the position of this air intake vent of opening when at least two different time points is different, changes thus cooling air in the flow field of this enclosure interior.
For making your juror for structure purpose of the present invention and effect, further understanding and approval be arranged, hereby coordinate diagram to be described in detail as follows.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of gate sealing air intake vent of the present invention;
Fig. 3 is the structural representation of gate opening air intake vent of the present invention;
Fig. 4 to Fig. 6 is that the present invention is in structure and the flow field schematic diagram of the open different air intake vents of different time points;
Fig. 7 is structure and the flow field schematic diagram that all air intake vents of the present invention all are opening.
Description of reference numerals: 20-electronic installation; The 21-housing; 211-the first air intake vent; 212-the second air intake vent; 213-the 3rd air intake vent; 2131-the first hollow part; 214-the 4th air intake vent; 215-the 5th air intake vent; The 216-air outlet; The 217-grab; 22A-the first electronic component (fan); The 221A-wind inlet end; The 222A-outlet air end; 22B-the second electronic component; 22C-the 3rd electronic component; 22D-quadrielectron element; 22E-the 5th electronic component; The 23-radiating fin; The 231-heat pipe; 24A-the first gate; 24B-the second gate; 24C-the 3rd gate; 24D-the 4th gate; 24E-the 5th gate; 241A～241E-heat-swelling element; 242C-the second hollow part.
Embodiment
Be to reach technological means and the effect that purpose is used hereinafter with reference to the graphic the present invention of description who encloses, and following graphic cited embodiment is only aid illustration, understands in order to your juror, but that the technological means of this case is not limited to is cited graphic.
See also shown in Figure 1ly, the present invention is to provide a kind of electronic installation 20, and the kind of electronic installation 20 of the present invention and shape be restriction not, and such as having a housing can all be included in order to the device of containing electronic components, for example notebook computer or panel computer.As shown in Figure 1, electronic installation 20 of the present invention comprises a housing 21, be provided with a plurality of electronic components in housing 21, described a plurality of electronic components comprise one first electronic component 22A, one second electronic component 22B, one the 3rd electronic component 22C, a quadrielectron element 22D, one the 5th electronic component 22E.Described a plurality of electronic component 22A～22E has a working temperature when work, and wherein the working temperature of at least two electronic components is different, kind according to electronic component is different, its working temperature is also different, when electronic installation 20 work, can drive described a plurality of electronic component 22A～22E gradually heating up to working temperature.Kind according to electronic installation 20 is different, and the electronic component 22A～22E that arranges in pairs or groups is also different.For example, if electronic installation 20 1 notebook computers, the first electronic component 22A is a fan, and the fan 22A of the present embodiment is a centrifugal fan.The second electronic component 22B and the 3rd electronic component 22C can be double data rate memory (DDR SDRAM), CPU (central processing unit) (CPU), image figure array chip (VGA chip) one of them, for example, the second electronic component 22B is double data rate memory (DDR SDRAM), and the 3rd electronic component 22C is CPU (central processing unit) (CPU).Quadrielectron element 22D and the 5th electronic component 22E can be storer (RAM), south bridge north bridge chips (PCH), radio area network (WLAN) interface card and third generation Mobile Communications systems (3G) interface card one of them, for example, quadrielectron element 22D is south bridge north bridge chips (PCH), and the 5th electronic component 22E is radio area network (WLAN) interface card.
With regard to above-mentioned electronic component, wherein, the working temperature of double data rate memory (DDR SDRAM), CPU (central processing unit) (CPU) and image figure array chip (VGA chip) is higher, in the scope of 40～50 degree approximately Celsius, and the working temperature of storer (RAM), south bridge north bridge chips (PCH), radio area network (WLAN) interface card and third generation Mobile Communications systems (3G) interface card is lower, in the scope of 30～40 degree approximately Celsius.Be to import cooling-air as for fan running, its working temperature is minimum, in the scope of 20～30 degree approximately Celsius.Described a plurality of electronic component 22A～22E are arranged in housing 21, because electronic component 22A～22E has different working temperatures, therefore can be in a plurality of heating regions of the interior formation of housing 21, dispersed for making the heat energy in housing 21, therefore be designed into air port and air outlet in housing 21, and coordinate fan to import and derive cooling air.
See also shown in Figure 1ly, be provided with one first air intake vent 211, one second air intake vent 212, one the 3rd air intake vent 213, one the 4th air intake vent 214, one the 5th air intake vent 215 and an air outlet 216 in housing 21.Fig. 1 is the bottom view that shows housing 21, that is first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215 and air outlet 216 be the bottoms that are arranged at electronic installation 20, and air outlet 216 can be complied with the required side that extends to housing 21.In the present embodiment, described a plurality of air intake vents 211～215 and air outlet 216 are all that the first hollow part array by a plurality of strips consists of, and described a plurality of the first hollow parts are to run through housing 21.fan 22A has a wind inlet end 221A and an outlet air end 222A, the wind inlet end 221A of fan 22A and this first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, form one between the 5th air intake vent 215 and enter wind flow field, , the outlet air end 222A of fan 22A is corresponding to air outlet 216, be provided with a radiating fin 23 in outlet air end 222 and air outlet 216, be connected in being provided with a heat pipe 231 between radiating fin 23 and the 3rd electronic component 22C, the heat energy that produces when being beneficial to the 3rd electronic component 22C work conducts to radiating fin 23 fast.In addition, the second air intake vent 212 is corresponding to the second electronic component 22B, and the 3rd air intake vent 213 is corresponding to the 3rd electronic component 22C, and the 4th air intake vent 214 is corresponding to quadrielectron element 22D, and the 5th air intake vent 213 is corresponding to the 5th electronic component 22E.
should be noted that, if electronic component that can corresponding each heating arranges an air intake vent, when cooling air is directly also directly blowed to electronic component by the air intake vent importing, its cooling effect should be best, but because case of electronic device is attractive in appearance, the various conditions such as size and intensity are considered, and can't too much air intake vent be set in housing, therefore preferentially consider the second higher electronic component 22B of working temperature and the 3rd electronic component 22C, as shown in Figure 1, the second air intake vent 212 and the 3rd air intake vent 213 are to arrange respectively corresponding to the second electronic component 22B and the 3rd electronic component 22C, contain a larger heating region as for the 4th air intake vent 214 and 213 of the 5th air intake vents, be not only for quadrielectron element 22D and the 5th electronic component 22E.In other words, the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215 be a corresponding heating region respectively, the electronic component that can generate heat when each heating region has at least one in work.In addition, the distance of the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215 and the first air intake vent 211 is different and be sequentially to lengthen, after its purpose will be illustrated in.
Secondly, be respectively equipped with one first gate 24A, one second gate 24B, one the 3rd gate 24C, one the 4th gate 24D and one the 5th gate 24E in this housing corresponding to the position of this first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214 and the 5th air intake vent 215.The first gate 24A, the second gate 24B, the 3rd gate 24C, the 4th gate 24D and the 5th gate 24E are respectively equipped with a heat-swelling element 241A～241E, each heat-swelling element 241A～241E has a deformation temperature, and each heat-swelling element 241A～241E is that the temperature of responding to corresponding heating region can produce deformation when arriving this deformation temperature.Described a plurality of heat-swelling element 241A～241E is a kind of anisotropic material that expands with heat and contract with cold, and the expand with heat and contract with cold direction of expanding with heat and contract with cold of material of this anisotropic is single direction.When described a plurality of heat-swelling element 241A～241E produce deformation because of temperature variation, can drive respectively the first gate 24A, the second gate 24B, the 3rd gate 24C, the 4th gate 24D and the 5th gate 24E that connect by deformation and be displaced between a primary importance and a second place, be closed state or open state to control the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214 and the 5th air intake vent 215.
In addition, this first gate 24A, the second gate 24B, the 3rd gate 24C, the 4th gate 24D and the 5th gate 24E wherein at least a gate can adopt the material with one first thermal expansivity, the heat-swelling element corresponding with the gate with this first thermal expansivity has one second thermal expansivity, and this first thermal expansivity is not equal to this second thermal expansivity.For example, the 3rd gate 24C adopts the material with one first thermal expansivity to consist of, the heat-swelling element 241C that is connected with the 3rd gate 24C has one second thermal expansivity, the 3rd gate 24C and heat-swelling element 241C be the sensing environment temperature simultaneously, because the first thermal expansivity is different from this second thermal expansivity, therefore can drive the 3rd gate 24C and produce displacement, can reach the purpose that the present invention closed or opened the 3rd air intake vent 213.Above-described embodiment explanation, the first gate 24A of the present invention, the second gate 24B, the 3rd gate 24C, the 4th gate 24D, the 5th gate 24E, different the getting final product of expansion coefficient from the heat-swelling element 241A～241E that arranges in pairs or groups respectively, no matter whether heat-swelling element modification amount greater than the deflection of gate, all the attainable cost invention purpose of closing or opening air intake vent.
See also Fig. 1 to shown in Figure 3, describe gate of the present invention in detail and with structure and the relative pass of air intake vent be, Fig. 2 and Fig. 3 are for representing illustrative examples with the 3rd air intake vent 213 of Fig. 1 and the 3rd gate 24C.Because size and the form of the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215 are different, therefore size and the form of the first gate 24A, the second gate 24B, the 3rd gate 24C, the 4th gate 24D and the 5th gate 24E also are not quite similar, but all follow the structure of arranging in pairs or groups shown in the second figure and the 3rd figure.
The 3rd air intake vent 213 is that the first hollow part 2131 arrays by a plurality of strips consist of, be provided with a plurality of grabs 217 in housing 21 medial surfaces (that is housing 21 is towards one side of the 3rd electronic component 22C), location by described a plurality of grabs 217, make the 3rd gate 24C correspondence be arranged at the 3rd air intake vent 213, and the 3rd gate 24C can be parallel to a first direction F1 slip.Be provided with heat-swelling element 241C in the 3rd gate 24C one side, heat-swelling element 241C can produce because of temperature variation deformation.Be provided with a plurality of the second hollow part 242C in the 3rd gate 24C.Heat-swelling element 241C shown in Figure 2 is the original state when being in normal temperature, that is electronic installation 20 is not when working, and at this moment, the 3rd gate 24C is positioned at primary importance, the position of the first hollow part 2131 and the second hollow part 242C is mutual dislocation, and therefore the 3rd air intake vent 213 is closed state.In other words, when electronic installation 20 is not worked, due to the first electronic component 22A, the second electronic component 22B, the 3rd electronic component 22C, quadrielectron element 22D and the 5th electronic component 22E heating that can not heat up, therefore described a plurality of heat-swelling element 241A～241E are in the normal temperature original state, and therefore the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215 all can present closed state.When electronic installation 20 is started working, the 3rd electronic component 22C also can enter duty, and can heat up gradually, make the 3rd electronic component 22C neighboring area heating, when heat-swelling element 241C senses the temperature arrival deformation temperature of the heating region that the 3rd electronic component 22C is set, heat-swelling element 241C can produce expansion deformation, the 3rd gate 24C is pushed to the second place shown in Figure 3, the the firstth hollow part 2131 is mutual corresponding with the position of the second hollow part 242C, makes the 3rd air intake vent 213 be open state.In like manner, when electronic installation 20 in running order, and when the first electronic component 22A, the second electronic component 22B, the 3rd electronic component 22C, quadrielectron element 22D and the 5th electronic component 22E are warming up to working temperature, described a plurality of heat-swelling element 241A～241E can sense temperature and raises and produce deformation, can drive the first gate 24A, the second gate 24B, the 3rd gate 24C, the 4th gate 24D and the 5th gate 24E and move and open the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214, the 5th air intake vent 215.
Because the working temperature of the first electronic component 22A of the present invention, the second electronic component 22B, the 3rd electronic component 22C, quadrielectron element 22D and the 5th electronic component 22E is different, therefore the time point of described a plurality of heat-swelling element 241A～241E generation expansion deformation also can be different, the position of the air intake vent of therefore opening when at least two different time points also can be different, can make thus the flow field of enclosure interior be changed.
see also shown in Figure 4, wherein the 3rd air intake vent 213 is open state, the first air intake vent 211, the second air intake vent 212, the 4th air intake vent 214 and the 5th air intake vent 215 are closed state (representing with oblique line), the heating region (that is the 3rd electronic component 22C set zone) that represents the 3rd air intake vent 213 correspondences produces high temperature, and temperature reaches the deformation temperature of heat-swelling element 241C (can consult Fig. 1), as for the first air intake vent 211, the second air intake vent 212, the first electronic component 22A of the 4th air intake vent 214 and the 5th air intake vent 215 corresponding heating regions, the second electronic component 22B, quadrielectron element 22D and the 5th electronic component 22E not yet reach heat- swelling element 241A, 241B, 241D, the deformation temperature of 241E (can consult Fig. 1), so the first air intake vent 211, the second air intake vent 212, the 4th air intake vent 214 and the 5th air intake vent 215 are closed state.Thus, fan 22A can import cooling air by the 3rd air intake vent 213, cooling air can directly blow to the 3rd electronic component 22C, dispel the heat for the 3rd electronic component 22C, do not stop transport by fan 22A and turn, sustainable cooling air is imported in housing 21, the suction that produces by fan 22A running attracts, cooling air can be by outlet air end 222A by radiating fin 23, the partial heat energy of the 3rd electronic component 22C can conduct to radiating fin 23 by heat pipe 231, when cooling air passes through radiating fin 23, heat energy can be discharged outside the housing 21 of electronic installations 20 via air outlet 216.Owing to only having 213 one-tenth open states of the 3rd air intake vent, therefore can make the 3rd air intake vent 213 obtain directly and fully cooling effect.The flow field of cooling air is as shown in the hollow arrow in figure.
see also shown in Figure 5, wherein the second air intake vent 212 and the 3rd air intake vent 213 are open state, the first air intake vent 211, the 4th air intake vent 214 and the 5th air intake vent 215 are closed state, represent the second air intake vent 212 heating region corresponding with three air intake vents 213 (that is the second electronic component 22B, the 3rd electronic component 22C set zone) produce high temperature, and temperature reaches heat-swelling element 241B, the deformation temperature of 241C (can consult Fig. 1), as for the first air intake vent 211, the first electronic component 22A of the 4th air intake vent 214 and the 5th air intake vent 215 corresponding heating regions, quadrielectron element 22D and the 5th electronic component 22E not yet reach heat-swelling element 241A, 241D, the deformation temperature of 241E (can consult figure) 1, so the first air intake vent 211, the 4th air intake vent 214 and the 5th air intake vent 215 are closed state.By fan 22A running, cooling air is imported in housing 21 by the second air intake vent 212 and the 3rd air intake vent 213, can be directly the second air intake vent 212 and corresponding the second electronic component 22B of the 3rd air intake vent 213 and the 3rd electronic component 22C be dispelled the heat, cooling air is discharged outside the housing 21 of electronic installations 20 by air outlet 216 again.The flow field of cooling air is as shown in the hollow arrow in figure.
See also shown in Figure 6, wherein the second air intake vent 212 and the 4th air intake vent 214 are open state, the first air intake vent 211, the 3rd air intake vent 213 and the 5th air intake vent 215 are closed state, by fan 22A running, cooling air is imported in housing 21 by the second air intake vent 212 and the 4th air intake vent 214, can be directly the second air intake vent 212 and corresponding the second electronic component 22B of the 4th air intake vent 213 and quadrielectron element 22D be dispelled the heat, cooling air is discharged outside the housing 21 of electronic installations 20 by air outlet 216 again.The flow field of cooling air is as shown in the hollow arrow in figure.
see also shown in Figure 7, it shows the first air intake vent 211, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214 and the 5th air intake vent 215 all present open state, represent the first electronic component 22A, the second electronic component 22B, the 3rd electronic component 22C, quadrielectron element 22D and the 5th electronic component 22E present the condition of high temperature, therefore all air intake vents are opened, turn round cooling air by the first air intake vent 211 by fan 22A, the second air intake vent 212, the 3rd air intake vent 213, the 4th air intake vent 214 and the 5th air intake vent 215 import in housing 21, can all electronic components be dispelled the heat, cooling air is discharged outside the housing 21 of electronic installation 20 by air outlet 216 again.The flow field of cooling air is as shown in the hollow arrow in figure.
In sum, electronic installation provided by the invention, by a plurality of gates of a plurality of air intake vent collocation, and gate has heat-swelling element, can adjust air intake vent and opens or close according to actual febrile state difference, makes the cooling air that enters in case of electronic device through particular heat source, the electronic installation interior flow field is changed, can dispel the heat for specific electronic component, make the cooling air flow velocity increase of electronic component position, and do not need to improve rotation speed of the fan.The present invention can effectively provide best radiating effect really when difference is used state for different heat sources and for electronic installation.
The above person is only embodiments of the invention, when can not with the scope implemented of restriction the present invention.The equalization of namely generally doing according to the present patent application the scope of the claims changes and modifies, and all should still belong in the scope that patent of the present invention contains, sincerely please your juror's explicit example for reference, and pray Hui Zhun, be that institute is to praying.
Claims (10)
1. an electronic installation, is characterized in that, comprises:
One housing, it has a plurality of air intake vents and an air outlet;
A plurality of electronic components, be arranged in described housing, each described electronic component has a working temperature when work, wherein the working temperature of at least two described electronic components is different, when described electronic installation work, can drive described a plurality of electronic component heating, make described a plurality of electronic component be warming up to described a plurality of working temperature, form a plurality of heating regions by described a plurality of electronic components in described housing, each described air intake vent is corresponding to a described heating region, and each described heating region has at least one described electronic component; And
A plurality of gates, be arranged at described housing corresponding to described a plurality of air outlet positions, each described gate is provided with a heat-swelling element, each described heat-swelling element is respond to the temperature of corresponding heating region and produce deformation, drives by the deformation of described heat-swelling element the gate that connects and is displaced between a primary importance and a second place.
2. electronic installation according to claim 1, it is characterized in that, described a plurality of gate gate wherein has one first thermal expansivity, the described heat-swelling element corresponding with the described gate with described first thermal expansivity has one second thermal expansivity, and described the first thermal expansivity is not equal to described the second thermal expansivity.
3. electronic installation according to claim 1, is characterized in that, described heat-swelling element is the non-tropism's material that expands with heat and contract with cold that waits, and the expand with heat and contract with cold direction of expanding with heat and contract with cold of material of described anisotropic is single direction.
4. electronic installation according to claim 1, is characterized in that, described heat-swelling element has a deformation temperature, and when described heat-swelling element temperature sensor arrived described deformation temperature, described heat-swelling element can produce distortion.
5. electronic installation according to claim 1, is characterized in that, when each described gate was positioned at described primary importance, each described air intake vent was closed state; When each described gate was positioned at the described second place, each described air intake vent was open state.
6. electronic installation according to claim 5, it is characterized in that, each described air intake vent is to be made of a plurality of the first hollow part arrays, described a plurality of hollow part is to run through described housing, each described air intake vent corresponding each described gate that arranges be to be consisted of by a plurality of the second hollow parts, when described gate is positioned at described primary importance, the position of described the first hollow part and described the second hollow part is mutual dislocation, make described air intake vent be closed state, when described gate is positioned at the described second place, described the first hollow part is mutual corresponding with the position of described the second hollow part, make described air intake vent be open state.
7. electronic installation according to claim 1, it is characterized in that, described a plurality of air intake vent comprises one first air intake vent, one second air intake vent, one the 3rd air intake vent, one the 4th air intake vent and one the 5th air intake vent, be provided with a fan in described housing, described fan has a wind inlet end and an outlet air end, form one between described wind inlet end and described a plurality of air intake vent and enter wind flow field, described outlet air end is corresponding to described air outlet.
8. electronic installation according to claim 7, is characterized in that, the distance of described the second air intake vent, described the 3rd air intake vent, described the 4th air intake vent, described the 5th air intake vent and described the first air intake vent is different and be sequentially to lengthen.
9. electronic installation according to claim 7, it is characterized in that, the working temperature of the electronic component that described the second air intake vent and the corresponding heating region of the 3rd air intake vent are set is higher than the working temperature of described the 4th air intake vent and the set electronic component of the corresponding heating region of the 5th air intake vent.
10. electronic installation according to claim 9, it is characterized in that, the set electronic component of described the second air intake vent and the corresponding heating region of the 3rd air intake vent be a pair of haplotype data rate memory, a CPU (central processing unit) and an image figure array chip at least one of them, the set electronic component of described the 4th air intake vent and the corresponding heating region of the 5th air intake vent be a storer, a south bridge north bridge chips, a radio area network interface card and a third generation Mobile Communications system interface card at least one of them.
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| CN201110427042XA CN103164004A (en) | 2011-12-19 | 2011-12-19 | Electronic device |
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| CN201110427042XA CN103164004A (en) | 2011-12-19 | 2011-12-19 | Electronic device |
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| CN103164004A true CN103164004A (en) | 2013-06-19 |
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Cited By (6)
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| CN104932649A (en) * | 2015-07-18 | 2015-09-23 | 吉首大学 | Flush joint CPU radiating and dust removal device |
| CN104932650A (en) * | 2015-07-18 | 2015-09-23 | 吉首大学 | Integrated CPU heat radiation and dust removal device |
| CN105068623A (en) * | 2015-07-18 | 2015-11-18 | 吉首大学 | Nested CPU heat radiation and dust removal device |
| CN105468498A (en) * | 2014-09-03 | 2016-04-06 | 中兴通讯股份有限公司 | Heat treatment method and apparatus |
| CN111414062A (en) * | 2020-03-25 | 2020-07-14 | 联想(北京)有限公司 | Electronic apparatus and control method |
| CN111610837A (en) * | 2020-05-14 | 2020-09-01 | 维沃移动通信有限公司 | Heat dissipation method and device |
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| CN101048721A (en) * | 2004-10-25 | 2007-10-03 | 克尼尔有限公司 | Device and network rack |
| US20100167636A1 (en) * | 2008-12-26 | 2010-07-01 | Anandaroop Bhattacharya | Active vents for cooling of computing device |
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Application publication date: 20130619 |