CN102984915A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN102984915A CN102984915A CN2011102602100A CN201110260210A CN102984915A CN 102984915 A CN102984915 A CN 102984915A CN 2011102602100 A CN2011102602100 A CN 2011102602100A CN 201110260210 A CN201110260210 A CN 201110260210A CN 102984915 A CN102984915 A CN 102984915A
- Authority
- CN
- China
- Prior art keywords
- radiator
- fin
- air
- otch
- wind district
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A heat dissipation device includes a radiator and a cooling fan arranged at one side of the radiator. The cooling fan is provided with an air outlet corresponding to the radiator. The cooling fan has at least one strong wind zone and a weak wind zone at the outlet. The radiator comprises an air-in surface close to the cooling fan, and an air-out surface away from the cooling fan. the radiator is formed by arranging a plurality of cooling fins; a flow channel is formed between every two adjacent cooling fins; the radiator is provided with a cut corresponding to the strong wind area; the cut is arranged from the outermost cooling fin of the radiator to the inside of radiator, and extends in the direction of from the air-in surface to the air-out surface; and dust carried in flow blown from the air outlet of the cooling fan flows outside of the radiator via the cut.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applicable to the heat-generating electronic elements heat radiation.
Background technology
Along with the develop rapidly of electronic industry, the continuous lifting of electronic building brick (such as the central processing unit) speed of service produces a large amount of heats during operation, and itself and system temperature are raise, and then affects its Systems balanth.For guaranteeing that electronic building brick can normally move, a heat abstractor is installed usually thereon, discharge the heat that it produces.
Existing heat abstractor generally includes a radiator, and in a side of this radiator one radiator fan is set, and is sucked air-flow and is blowed to radiator so that its heat is taken away by the external world by this radiator fan.Yet, tend to a large amount of dust in the air-flow of radiator fan by external world's suction, and because the cold gas strength of flow that radiator fan blows out does not wait, begin to be blowed to radiator by radiator fan thereby dust is concentrated on by the strong zone of cooling blast, cause radiator to be affected its heat dispersion in the side near radiator fan by dust accumulation.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor that prevents dust accumulation.
A kind of heat abstractor, comprise radiator and be located at the radiator fan of this radiator one side, the corresponding radiator of this radiator fan is provided with an air outlet, this radiator fan has at least one high wind district and weak wind district in the air outlet place, described radiator comprises that the inlet air face of close radiator fan reaches the outlet air surface away from radiator fan, described radiator is arranged by some fin and is formed, form gas channel between every adjacent two fin, described radiator is provided with the otch in corresponding high wind district, described otch is offered to the inside by the outermost fin of radiator, described otch is extended towards the direction of outlet air surface by inlet air, in the air-flow that described radiator fan is blown out by air outlet with dust flow to the outside of radiator by described otch.
A kind of heat abstractor, comprise radiator, be located at the radiator fan of this radiator one side and the heat pipe that is connected with radiator, the corresponding radiator of this radiator fan is provided with an air outlet, this radiator fan has at least one high wind district and weak wind district in the air outlet place, described radiator comprises that the inlet air face of close radiator fan reaches the outlet air surface away from radiator fan, described radiator is arranged by some fin and is formed, form gas channel between every adjacent two fin, described radiator is provided with an accepting groove of accommodating heat pipe, described accepting groove by inlet air towards interior recessed, described radiator is provided with the otch in corresponding high wind district, described otch is offered and is positioned at the below of accepting groove to the inside by the outermost fin of radiator, described otch is extended towards the direction of outlet air surface by inlet air, in the air-flow that described radiator fan is blown out by air outlet with dust flow to the outside of radiator by described otch.
Compared with prior art, in the air-flow that the radiator fan in this heat abstractor is blown out by air outlet with dust flow to the outside of radiator by described otch, thereby make prevent dust on radiator accumulation and affect heat dispersion.
Description of drawings
The three-dimensional assembly diagram of one embodiment of Fig. 1 heat abstractor of the present invention.
Fig. 2 is the exploded view of heat abstractor shown in Figure 1.
Fig. 3 is the inversion figure of the radiator of heat abstractor shown in Figure 2.
Fig. 4 is the flow field schematic diagram after heat abstractor shown in Figure 1 is removed absorber plate and heat pipe.
The main element symbol description
| |
100 |
| The |
10 |
| The |
20 |
| |
30 |
| Accepting |
31 |
| The |
32 |
| |
33 |
| The first radiating |
40 |
| The first fin | 42 |
| The first gas channel | 43 |
| The second radiating |
50 |
| The second fin | 52 |
| The second gas channel | 53 |
| Otch | 54 |
| The |
60 |
| The |
70 |
| |
80 |
| |
81 |
| |
82 |
| |
83 |
| |
84 |
| |
85 |
| |
86 |
| |
87 |
| Tongue | 88 |
| The |
89 |
| Weak wind |
90 |
| Body | 420、520 |
| Flanging | 422、522 |
| Extension | 523 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, this heat abstractor 100 comprises the first absorber plate 10, the second absorber plate 20, radiator 30, is connected in the first heat pipe 60 between the first absorber plate 10 and the radiator 30, is connected in the second heat pipe 70 between the second absorber plate 20 and the radiator 30 and is located at the radiator fan 80 of these radiator 30 1 sides.
Please consult simultaneously Fig. 2, described the first absorber plate 10 and the second absorber plate 20 are made by the good metal of the heat conductivilitys such as copper, and its lower surface is respectively applied to be connected to absorb the heat that this electronic component produces with an electronic component.
One end of one end of described the first heat pipe 60 and the second heat pipe 70 is connected with the first absorber plate 10 and the second absorber plate 20 respectively, the other end is connected with radiator 30, so that the different heats that electronic component was produced is conducted on the radiator 30, outwards distribute by this radiator 30 again.
This radiator 30 is roughly the square shape, and this radiator 30 is in being inlet air face 32 near a side of radiator fan 80, is outlet air surface 33 away from a side of this radiator fan 80.This radiator 30 is provided with an accepting groove 31, to be used for accommodating the first heat pipe 60 and the second heat pipe 70.This accepting groove 31 is by inside recessed formation the in inlet air face 32 middle parts of radiator 30.Please consult simultaneously Fig. 3, this radiator 30 comprises one first radiating fin group 40 and the two second radiating fin groups 50 that are arranged side by side, and two second radiating fin groups 50 lay respectively at the relative two side ends of the first radiating fin group 40.
Each first radiating fin group 40 is arranged by some the first fin 42 and is formed, and 42 of every two first adjacent fin form one first gas channel 43.Each first fin 42 comprises a body 420 and the flanging 422 that is extended to form by relative two lateral bucklings of body 420.
Described the second radiating fin group 50 is arranged by some the second fin 52 and is formed, and 52 of every two second adjacent fin form one second gas channel 53.The structure of the structure of each the second fin 52 and the first fin 42 is substantially identical, and it comprises a body 520 and the flanging 522 that is extended to form by relative two lateral bucklings of body 520.The structure difference of the structure of each the second fin 52 and the first fin 42 is: the body 520 of each the second fin 52 is shorter than the first fin 42 in a side of inlet air face 32, and the top of described body 520 extends to form an extension 523 in the direction of a side direction inlet air face 32 of close inlet air face 32, and described extension 523 is mutually concordant in an end of inlet air face 32 with the first fin 42 in an end of inlet air face 32.During assembling, the body 420,520 that the flanging 422 of each first fin 42 and the flanging 522 of the second fin 52 are adjacent leans, and is provided with the buckle structure (not shown) that cooperatively interacts by flanging 422,522 and is fixedly connected with.Because the body 520 of the second fin 52 is shorter than the body 420 of the first fin 42 in a side of inlet air face 32, and body 520 is extended with extension 523, thereby the bottom in each the second radiating fin group forms a kerf 54, and described otch 54 is surrounded by body 520 and extension 523.Described otch 54 is roughly the square shape, and described otch 54 is offered to the inside by the second radiating fin group 50 outermost the second fin 52, and runs through all second fin 52.Described otch 54 is opened in the below of accepting groove 31 and is connected with accepting groove 31.Described otch 54 is extended to the direction of outlet air surface 33 by the inlet air face 32 of radiator 30, and described the second gas channel 53 is connected between otch 54 and the outlet air surface 33.
This radiator fan 80 is a centrifugal fan, and it comprises a base 81 and is contained in the impeller 82 in this base 81 and is covered on a cover plate 83 on this base 81.This base 81 comprises a base plate 84 and extends upward a sidewall 85 that forms by base plate 84 peripheries.Be respectively equipped with an air intake vent 86 on this base plate 84 and the cover plate 83, described sidewall 85 is a volute wall, and a side of its corresponding radiator 30 is offered an air outlet 87.Also be provided with a tongue 88 of inwardly giving prominence on this sidewall 85.Please consult simultaneously Fig. 4, during use, described impeller 82 rotarily drives and is blown out by air outlet 87 after extraneous air-flow is entered by air intake vent 86, and this air-flow that blows out forms respectively a high wind district 89 in the both sides at air outlet 87 places, forms a weak wind district 90 in the middle of air outlet 87.The second radiating fin group 50 of described radiator 30 is corresponding to high wind district 89, the first radiating fin group 40 is corresponding to weak wind district 90, because the second radiating fin group 50 is provided with otch 54, thereby make institute in the air-flow that radiator fan 80 sucks by the external world with dust flowed out by otch 54, prevent that dust from affecting the performance of heat abstractor 100 in inlet air face 32 accumulations of radiator 30.Because otch 54 only is located at the bottom of radiator 30, thereby both can guarantee to be flowed out by otch 54 places by the dust that air intake vent 86 sucks, and can guarantee that again the air blast that radiator fan 80 blows out crossed radiator 30 by the directed stream of the second gas channel 53 of otch 54 tops.In addition, because otch 54 does not extend to the outlet air surface 33 of radiator 30, thereby make radiator 30 still keep the structure of existing radiator in outlet air surface 33, can prevent that extraneous foreign material from being entered in the radiator 30 by the outlet air surface 33 of radiator 30 and affect the performance of heat abstractor.
During implementation, the structure of this radiator 30 and radiator fan 80 is not limited to the situation of present embodiment, as can not being provided with tongue 88 on the radiator fan 80, thereby radiator fan 80 only has a high wind district 89, be that high wind district 89 and weak wind district 90 lay respectively at radiator fan 80 in the relative both sides at air outlet 87 places, simultaneously, the structure of radiator 30 is the change of correspondence also, namely only comprising 50 pairs of second radiating fin groups should arrange in high wind district 89, and weak wind district 90 correspondences are provided with the first radiating fin group 40.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. heat abstractor, comprise radiator and be located at the radiator fan of this radiator one side, the corresponding radiator of this radiator fan is provided with an air outlet, this radiator fan has at least one high wind district and weak wind district in the air outlet place, described radiator comprises that the inlet air face of close radiator fan reaches the outlet air surface away from radiator fan, described radiator is arranged by some fin and is formed, form gas channel between every adjacent two fin, it is characterized in that: described radiator is provided with the otch in corresponding high wind district, described otch is offered to the inside by the outermost fin of radiator, described otch is extended towards the direction of outlet air surface by inlet air, in the air-flow that described radiator fan is blown out by air outlet with dust flow to the outside of radiator by described otch.
2. heat abstractor as claimed in claim 1 is characterized in that: described radiator comprises the first radiating fin group in corresponding weak wind district and the second radiating fin group in corresponding high wind district, and described otch is located on the second radiating fin group.
3. heat abstractor as claimed in claim 1, it is characterized in that: described heat abstractor also comprises the heat pipe that is connected with radiator, and a side of described radiator is provided with the accepting groove of accommodating heat pipe, and described otch is located at the below of accepting groove and is connected with accepting groove.
4. heat abstractor as claimed in claim 2, it is characterized in that: described the second radiating fin group is arranged by some the second fin and is formed, each second fin comprises that body reaches the flanging by the relative two lateral bucklings extension of body, described the first radiating fin group is arranged by some the first fin and is formed, each first fin comprises that body reaches the flanging by the relative two lateral bucklings extension of body, the body of described the second fin is shorter than the body of the first fin in a side of inlet air face, the body of described the second fin also extends an extension to the direction of inlet air face, and described notch shape is formed between the body and extension of described the second fin.
5. heat abstractor as claimed in claim 4 is characterized in that: described extension is stretched out by the top of the body of the second fin and forms.
6. such as any one described heat abstractor of claim 1 to 5, it is characterized in that: described radiator fan is a centrifugal fan, and described high wind district and weak wind district are positioned at respectively the relative both sides at air outlet place, and described otch is one, and is positioned at a side of radiator.
7. such as any one described heat abstractor of claim 1 to 5, it is characterized in that: described radiator fan is a centrifugal fan, and described high wind district is positioned at the both sides of air outlet, and described weak wind district is positioned at the centre at air outlet place, described otch is two, and lays respectively at the relative two side ends of radiator.
8. heat abstractor, comprise radiator, be located at the radiator fan of this radiator one side and the heat pipe that is connected with radiator, the corresponding radiator of this radiator fan is provided with an air outlet, this radiator fan has at least one high wind district and weak wind district in the air outlet place, described radiator comprises that the inlet air face of close radiator fan reaches the outlet air surface away from radiator fan, described radiator is arranged by some fin and is formed, form gas channel between every adjacent two fin, described radiator is provided with an accepting groove of accommodating heat pipe, described accepting groove by inlet air towards interior recessed, it is characterized in that: described radiator is provided with the otch in corresponding high wind district, described otch is offered and is positioned at the below of accepting groove to the inside by the outermost fin of radiator, described otch is extended towards the direction of outlet air surface by inlet air, in the air-flow that described radiator fan is blown out by air outlet with dust flow to the outside of radiator by described otch.
9. heat abstractor as claimed in claim 8, it is characterized in that: described otch is connected with accepting groove.
10. heat abstractor as claimed in claim 8, it is characterized in that: described radiator fan is a centrifugal fan, and described high wind district is positioned at the both sides of air outlet, and described weak wind district is positioned at the centre at air outlet place, described otch is two, and lays respectively at the relative two side ends of radiator.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110260210.0A CN102984915B (en) | 2011-09-05 | 2011-09-05 | Heat abstractor |
| TW100132355A TWI510896B (en) | 2011-09-05 | 2011-09-08 | Heat dissipation device |
| US13/456,240 US20130056182A1 (en) | 2011-09-05 | 2012-04-26 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110260210.0A CN102984915B (en) | 2011-09-05 | 2011-09-05 | Heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102984915A true CN102984915A (en) | 2013-03-20 |
| CN102984915B CN102984915B (en) | 2016-11-23 |
Family
ID=47752225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110260210.0A Expired - Fee Related CN102984915B (en) | 2011-09-05 | 2011-09-05 | Heat abstractor |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130056182A1 (en) |
| CN (1) | CN102984915B (en) |
| TW (1) | TWI510896B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104214747A (en) * | 2013-05-29 | 2014-12-17 | 深圳市海洋王照明工程有限公司 | Heat dissipation device |
| CN107023517A (en) * | 2016-02-02 | 2017-08-08 | 宏碁股份有限公司 | Blower module and electronic installation |
| US10208767B2 (en) | 2015-11-27 | 2019-02-19 | Acer Incorporated | Fan module and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576038B (en) * | 2011-07-13 | 2017-03-21 | 鴻準精密工業股份有限公司 | Heat sink |
| CN108398993B (en) * | 2018-04-28 | 2023-12-05 | 中科寒武纪科技股份有限公司 | Heat dissipation device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2741097Y (en) * | 2004-09-30 | 2005-11-16 | 仁宝电脑工业股份有限公司 | Radiator with dust-collecting mechanism |
| JP3143316U (en) * | 2008-05-07 | 2008-07-17 | 葉嘉銘 | Heat dissipation module |
| US20090034196A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
| US20090044927A1 (en) * | 2007-08-17 | 2009-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin unit thereof |
| JP2009076708A (en) * | 2007-09-21 | 2009-04-09 | Hitachi Ltd | Air cooling device |
| CN101546215A (en) * | 2008-03-25 | 2009-09-30 | 株式会社东芝 | Cooling device and electronic apparatus having the cooling device |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102238857A (en) * | 2010-04-30 | 2011-11-09 | 索尼公司 | Cooling unit, electronic device, and heat sink |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101242723A (en) * | 2007-02-09 | 2008-08-13 | 富准精密工业(深圳)有限公司 | Spring slice fixing structure and heat radiation module |
| CN101621902B (en) * | 2008-07-04 | 2011-09-28 | 富准精密工业(深圳)有限公司 | Fixing device and heat sink using same |
| CN101853823B (en) * | 2009-03-31 | 2013-01-23 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
| CN101861076A (en) * | 2009-04-08 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device |
| CN101861078A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
| CN102238846A (en) * | 2010-04-27 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Radiating device |
| TWI536899B (en) * | 2011-05-16 | 2016-06-01 | 鴻準精密工業股份有限公司 | Heat dissipation device and electronic device having the same |
-
2011
- 2011-09-05 CN CN201110260210.0A patent/CN102984915B/en not_active Expired - Fee Related
- 2011-09-08 TW TW100132355A patent/TWI510896B/en not_active IP Right Cessation
-
2012
- 2012-04-26 US US13/456,240 patent/US20130056182A1/en not_active Abandoned
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2741097Y (en) * | 2004-09-30 | 2005-11-16 | 仁宝电脑工业股份有限公司 | Radiator with dust-collecting mechanism |
| US20090034196A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
| US20090044927A1 (en) * | 2007-08-17 | 2009-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin unit thereof |
| JP2009076708A (en) * | 2007-09-21 | 2009-04-09 | Hitachi Ltd | Air cooling device |
| CN101546215A (en) * | 2008-03-25 | 2009-09-30 | 株式会社东芝 | Cooling device and electronic apparatus having the cooling device |
| JP3143316U (en) * | 2008-05-07 | 2008-07-17 | 葉嘉銘 | Heat dissipation module |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102238857A (en) * | 2010-04-30 | 2011-11-09 | 索尼公司 | Cooling unit, electronic device, and heat sink |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104214747A (en) * | 2013-05-29 | 2014-12-17 | 深圳市海洋王照明工程有限公司 | Heat dissipation device |
| CN104214747B (en) * | 2013-05-29 | 2017-06-23 | 深圳市海洋王照明工程有限公司 | Radiator |
| US10208767B2 (en) | 2015-11-27 | 2019-02-19 | Acer Incorporated | Fan module and electronic device |
| CN107023517A (en) * | 2016-02-02 | 2017-08-08 | 宏碁股份有限公司 | Blower module and electronic installation |
| CN107023517B (en) * | 2016-02-02 | 2019-02-01 | 宏碁股份有限公司 | Blower module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI510896B (en) | 2015-12-01 |
| US20130056182A1 (en) | 2013-03-07 |
| CN102984915B (en) | 2016-11-23 |
| TW201312328A (en) | 2013-03-16 |
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Legal Events
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| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20180905 |
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| CF01 | Termination of patent right due to non-payment of annual fee |