CN102877040A - Air-supply device and chemical vapor deposition device using air-supply device - Google Patents
Air-supply device and chemical vapor deposition device using air-supply device Download PDFInfo
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- CN102877040A CN102877040A CN2012103279991A CN201210327999A CN102877040A CN 102877040 A CN102877040 A CN 102877040A CN 2012103279991 A CN2012103279991 A CN 2012103279991A CN 201210327999 A CN201210327999 A CN 201210327999A CN 102877040 A CN102877040 A CN 102877040A
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Abstract
The invention relates to an air-supply device and a chemical vapor deposition device using the air-supply device. The air-supply device comprises a plurality of reactant pipelines and a plurality of temperature control pipelines, wherein a plurality of reactant pipelines bear a plurality of reactants respectively; and a plurality of temperature control pipelines are in contact with a plurality of reactant pipelines to control the temperature of a plurality of reactants.
Description
Technical field
The present invention relates to a kind of chemical vapor deposition unit, and be particularly related to a kind of air feeder of cooling process and use the chemical vapor deposition unit of this device.
Background technology
Chemical vapor deposition (CVD) is a kind of semiconductor process techniques, in order to form film.Chemical vapor deposition unit comprises air feeder (showerhead), load plate (susceptor) and well heater (heater).Reactant offers to be located on the load plate via air feeder and reacts, and produces at last Shen and amasss in disk, and well heater then provides and carries out the required temperature of chemical vapour deposition reaction.
Yet reactant need to be kept stable low-temperature condition before air feeder does not spray, and therefore how to cool off air feeder internal reaction thing, becomes important issue.
Summary of the invention
The object of the invention is to, a kind of air feeder is provided and uses the chemical vapor deposition unit of this device, can make air feeder maintain a samming scope, and can avoid and/or reduce the buckling deformation of air feeder, also can make the settling of reactant keep stable sedimentation velocity.
According to one embodiment of the invention, a kind of air feeder is proposed.Air feeder comprises a plurality of reactant pipelines and a plurality of temperature control pipeline.A plurality of reactant pipelines carry respectively a plurality of reactants, and a plurality of temperature control pipeline contacts with a plurality of reactant pipelines, and control a plurality of temperature of charges.
According to another embodiment of the present invention, a kind of chemical vapor deposition unit is proposed.Chemical vapor deposition unit comprises a load plate and an air feeder.Load plate carries at least one substrate.Form a reaction compartment between load plate and the air feeder, air feeder produces at least one resultant to substrate after providing a plurality of reactants to carry out a reaction to reaction compartment.Air feeder comprises a plurality of reactant pipelines and a plurality of temperature control pipeline.A plurality of reactant pipelines carry respectively a plurality of reactants, and a plurality of temperature control pipeline contacts with a plurality of reactant pipelines, and control a plurality of temperature of charges.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 illustrates the sectional view according to the chemical vapor deposition unit of one embodiment of the invention;
Fig. 2 illustrates the temperature gradient distribution figure of the air feeder of Fig. 1;
Fig. 3 illustrates the vertical view of the air feeder of Fig. 1;
Fig. 4 illustrates the vertical view according to the air feeder of another embodiment of the present invention;
Fig. 5 illustrates the vertical view according to the air feeder of another embodiment of the present invention;
Fig. 6 illustrates the vertical view according to the air feeder of another embodiment of the present invention;
Fig. 7 illustrates the vertical view according to the air feeder of another embodiment of the present invention;
Fig. 8 illustrates the flow control schematic diagram according to one embodiment of the invention.
Wherein, Reference numeral
100: chemical vapor deposition unit
110: the chamber wall
120: lid
130: load plate
130u: first surface
130b: second
140: well heater
150: air feeder
151: spray nozzle of the gas supply
152: body
152s: side
152u: upper surface
154: the temperature control pipeline
1541: delivery port
1542: the input aperture
153: temperature sensor
155: flowrate control valve
156: common delivery port
157: common input aperture
160: the reactant pipeline
170: flow director
A': zone
G: reactant
L: lineal layout
RS: reaction compartment
S1: temperature distribution history
W1: substrate
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
Please refer to Fig. 1, it illustrates the sectional view according to the chemical vapor deposition unit of one embodiment of the invention.Chemical vapor deposition unit 100 can be organic chemical vapor deposition (MOCVD) device, and the right embodiment of the invention is not limited to this.
Chemical vapor deposition unit 100 comprises chamber wall 110, lid 120, load plate 130, well heater 140 and air feeder 150.
Lid 120 is positioned at air feeder 150 tops, is both separate modes herein, and wherein lid 120 also can design with air feeder 150 and combine, and reactant is delivered to reactant pipeline 160 by the outside by lid 120 under separate mode.
Definition one reaction compartment RS between load plate 130, air feeder 150 and the chamber wall 110.Load plate 130 has relative first surface 130u and second 130b, and between well heater 140 and air feeder 150.But load plate 130 bearing substrate W1, wherein substrate W1 for example is that disk or other need the element of deposit epitaxial layers.
Well heater 140 is towards second 130b of load plate 130, and the reaction compartment temperature that RS is reacted is provided.
Chemical vapor deposition unit 100 also comprises at least one reactant pipeline 160, and it passes lid 120 and is connected in air feeder 150.Multiple reactant is sent to for apparatus by different pipelines, be sent to air feeder 150 with a reactant G wherein via reactant pipeline 160 at this, provide reactant G to react to reaction compartment RS and other reactants by nozzle 151 again, reactant G trimethyl indium (TMIn) for example wherein, trimethyl aluminium (TMAl), trimethyl-gallium (TMGa), two luxuriant magnesium (Cp2Mg), triethyl-gallium (TEGa) etc. wherein one or more, with other reactant ammonias (NH3), PH3 etc. react, and then produce a resultant and deposit to substrate W1 on the load plate 130.
Wherein, it is long that a plurality of temperature control pipelines 154 can disperse to reduce single pipeline, the uneven problem of radiating effect, and a plurality of temperature control pipelines 154 are respectively the position in the different zones of air feeder 150, we can be located at temperature sensor 153 in the temperature control pipeline 154, temperature in order to sensing temperature keyholed back plate road 154 inner fluids or refrigerant, with the reference of adjusting as required flow or the temperature of different zones control fluid or refrigerant, certainly we can design one or more temperature sensor 153 in the appropriate location, such as in the middle of the temperature control pipeline 154 or terminal etc.In addition, temperature sensor 153 also can be located at vicinity or be contacted with the temperature of reactant pipeline 160 sensing reactants, with the flow of control temperature control pipeline 154 refrigerants that provided or the reference of temperature adjustment, certainly we can design one or more temperature sensor 153 in the appropriate location, such as in the middle of the reactant pipeline 160 or terminal etc.
The area configurations of temperature sensor 153 corresponding temperature control pipelines 154, in this example, half length part of the corresponding temperature control pipeline 154 in the position of temperature sensor 153, the measured temperature value in this position passes through the delivery port of temperature control pipeline 154 and the medial temperature of input aperture near refrigerant, so that the temperature value that temperature sensor 153 provides has reference value.In addition, the quantity of temperature sensor 153 can be same as the quantity of temperature control pipeline 154, and namely two temperature control pipelines 154 are provided with two temperature sensors 153, so also can be greater or less than the quantity of temperature control pipeline 154.For example increase temperature control pipeline 154 contact reacts property management roads 160, with the temperature of control reactant G.These a little temperature control pipelines 154 lay respectively at a plurality of zones of body 152, and are located at independently of one another in the body 152, so that the refrigerant in each temperature control pipeline 154 does not mix mutually, avoid affecting the cooling control to indivedual temperature control pipelines 154.In addition, temperature control pipeline 154 contacts with spray nozzle of the gas supply 151 but is not connected.The quantity system of the temperature control pipeline 154 of the present embodiment take two groups as example explanation, so also can be more than two groups.In addition, at least the two the length of those temperature control pipelines 154 is identical in fact, and is better but non-exclusively, at least the two distribution length in body 152 of those temperature control pipelines 154 is identical in fact, so also can be different.
As shown in Figure 1, each temperature control pipeline 154 comprises delivery port 1541 and the input aperture 1542 that is arranged in body 152, wherein refrigerant flows in the body 152 from input aperture 1542, and after the temperature of cooling body 152 and/or control reactant G, flows out outside the body 152 from delivery port 1541.Temperature control pipeline 154 can be a closed system, and it can be connected in a heat-removal system (not illustrating), and wherein refrigerant flows out by heat-removal system is loose warm thus from delivery port 1541, and then enters in the body 152 from input aperture 1542.In addition, refrigerant as referred to herein for example is gas or liquid.
In this example, delivery port 1541 and input aperture 1542 all are arranged in the upper surface 152u of body 152, and the right embodiment of the invention is not limited to this.Among other embodiment, delivery port 1541 can be arranged in side 152s or the upper surface 152u of body 152, and input aperture 1542 also can be arranged in side 152s or the upper surface 152u of body 152.
Please refer to Fig. 2, it illustrates the temperature gradient distribution figure of the air feeder of Fig. 1.Except being positioned at different zones, above-mentioned many group temperature control pipelines 154 carry out simultaneously the temperature control, we can design each temperature control pipeline leading portion and back segment has the different tube diameters design, for example the close input aperture of pipeline front end part is because of fluid or the low less water pipe of caliber mouth that uses of coolant temperature, and pipeline uses the caliber mouth than big pipe away from the input aperture part, under the identical water yield, the less water pipe of caliber mouth has high flow velocities, and the caliber mouth has low flow velocity than big pipe, because second half section fluid or coolant temperature are higher, but in the large and low flow rate control of caliber mouth, the heat energy control that can strengthen absorbing, and high flow rate reaches same effect with the less water pipe of caliber mouth, therefore can reach the samming result.Because the design of many groups temperature control pipeline 154 of the present embodiment, make the trend of temperature distribution history S1 gentle to linear state, make air feeder 150 maintain a samming scope, therefore can avoid and/or reduce the buckling deformation of air feeder 150, in addition because many group temperature control pipelines 154 use the design of different tube diameters, add to be divided into different zones control, so the greenhouse cooling effect is more accurate, also can make the settling of reactant keep stable sedimentation velocity.
Please refer to Fig. 3, it illustrates the vertical view of the air feeder of Fig. 1.Each temperature control pipeline 154 is own along at least one extends in rectilinear direction and the direction of a curve, and wherein curve for example is circular at least a portion, oval-shaped at least a portion or other curved shape.For instance, the temperature control pipeline 154 of Fig. 3 extends behind the segment distance along an arc reflexed along rectilinear direction, and then extends along rectilinear direction, and is circuitous shape.In addition, those temperature control pipelines 154 can be arranged in a straight line distribution, curve distribution and/or matrix distribution, those temperature control pipelines 154 of the present embodiment be the distribution L1 that is arranged in a straight line be the example explanation.Because input aperture 1542 temperature are lower than delivery port 1541, therefore in design we can to design 1542 pipeline intervals, input aperture larger, namely disperse near the line distribution of input aperture, anti-delivery port 1541 parts are then higher because of temperature, need that the interval is less to absorb heat energy than long lines, namely away from the line distribution comparatively dense of corresponding those input apertures.
Please refer to Fig. 4, it illustrates the vertical view according to the air feeder of another embodiment of the present invention.In the present embodiment, temperature control pipeline 154 extends back and forth along circuitous shape, and those temperature control pipelines 154 around the center of body 152 with etc. central angle or do not wait the mode of central angle to arrange.In addition, a upper surface 152u who is arranged in body 152 of the delivery port of temperature control pipeline 154 1541 and input aperture 1542, and another of delivery port 1541 and input aperture 1542 is arranged in the side 152s of body 152.
Among one embodiment, in Fig. 4, one delivery port 1541 of these a little temperature control pipelines 154 is adjacent to the input aperture 1542 of adjacent temperature control pipeline 154, and thus, the temperature difference in the zone of these adjacent two temperature control pipelines 154 can be dwindled.Further specify with regional A ', because the input aperture 1542 of low temperature and delivery port 1541 disposed adjacent in regional A ' of high temperature, under the effect of heat biography, the temperature difference of regional A ' can be dwindled on the contrary.
Among one embodiment, in Fig. 4, six temperature control pipelines 154 lay respectively at six zones, according to setting temperature sensor (with reference to figure 1) in different six differing temps situations that the zone is measured, a corresponding flow speed or the temperature of adjusting its inner fluid of each temperature control pipeline maintains in the fixed temperature scope with the control temperature of charge.
Please refer to Fig. 5, it illustrates the vertical view according to the air feeder of another embodiment of the present invention.In the present embodiment, temperature control pipeline 154 extends back and forth along circuitous shape, and those temperature control pipelines 154 around the center of body 152 with etc. central angle or do not wait the mode of central angle to arrange.Different from the embodiment of Fig. 4 is that the delivery port 1541 of the temperature control pipeline 154 of Fig. 5 and input aperture 1542 all are arranged in the side 152s of body 152.Identical with Fig. 4, different four the differing temps situations that the zone is measured of Fig. 5, a corresponding flow speed or the temperature of adjusting its inner fluid of each temperature control pipeline maintains in the fixed temperature scope with the control temperature of charge.
Please refer to Fig. 6, it illustrates the vertical view according to the air feeder of another embodiment of the present invention.Temperature control pipeline 154 extends behind the segment distance along an arc reflexed along rectilinear direction, and then extends along rectilinear direction.In addition, these a little temperature control pipelines 154 distribution L1 that is arranged in a straight line.In this example, the delivery port 1541 of temperature control pipeline 154 and input aperture 1542 all are arranged in the side 152s of body 152, and so in another example, the delivery port 1541 of temperature control pipeline 154 and input aperture 1542 also can all be arranged in the upper surface 152u of body 152; Perhaps, the delivery port 1541 of temperature control pipeline 154 and a upper surface 152u that can be arranged in body 152 of input aperture 1542, and the side 152s of another be arranged in body 152 of delivery port 1541 and input aperture 1542.
Please refer to Fig. 7, it illustrates the vertical view according to the air feeder of another embodiment of the present invention.It is 3 * 2 rectangular that several temperature control pipelines 154 are arranged in, and so also can be arranged in n * m, and wherein n and m are any positive integer, and the value of n can equal or be different from m.
Although the extension kenel of all temperature control pipelines 154 is identical among above-mentioned indivedual embodiment, the extension kenel of appointing the two of these a little temperature control pipelines 154 among the right same embodiment also can be fully different.
Utilize the extension of design temperature control pipeline and/or the distribution that arrangement mode can improve body 152 interior thermogrades.In addition, the flow by control temperature control pipeline 154 interior refrigerants also can reach similar effect.On the specific implementation, can utilize control valve, as, at least some the out of the ordinary or integral body of controlling those temperature control pipelines such as flowrate control valve, pressure controlled valve or other suitable control valve flows to/outflow rate, below further illustrates.
Please refer to Fig. 8, it illustrates the flow control schematic diagram according to one embodiment of the invention.In the present embodiment, air feeder 150 comprises one or more flowrate control valves 155, a common delivery port 156 and a common input aperture 157, wherein common input aperture 157 is connected in the input aperture 1542 of at least some temperature control pipelines 154, wherein another flowrate control valve 155 is connected in common input aperture 157, flows to the total flux of input aperture 1542 with control.Similarly, common delivery port 156 is connected in the delivery port 1541 of at least some temperature control pipelines 154, and one of these a little flowrate control valves 155 is connected in common delivery port 156, flows out the total flux of delivery port 1541 with control.
Utilize the design of above-mentioned flowrate control valve 155, when the temperature departure one samming scope of body 152, but the flow of refrigerant in flowrate control valve 155 pilot piping, with the temperature of control body 152 and reactant G.
As shown in Figure 8, air feeder 150 also comprises a flow director 170, it is connected in common input aperture 157, and control the flow velocity of common input aperture 157 interior refrigerants, for example, when the temperature departure one samming scope of body 152, flow director 170 can increase the flow velocity of common input aperture 157 interior refrigerants, with the control temperature of charge.Among another embodiment, flow director 170 also can be connected in common delivery port 156, to control the flow velocity of common delivery port 156 interior refrigerants.Among the another embodiment, two flow directors 170 are connected to common delivery port 156 and common input aperture 157, to control the flow velocity of common delivery port 156 and common input aperture 157 interior refrigerants.Perhaps, a flow director 170 also can be connected in a temperature control pipeline 154, or a plurality of flow director 170 can be connected in a plurality of temperature control pipelines 154 accordingly.
In summary, the design of many groups of the present embodiment temperature control pipeline make temperature distribution history near a straight line, so the temperature oscillation amplitude is very little.Thus, can make air feeder maintain a samming scope, therefore can avoid and/or reduce the buckling deformation of air feeder, also can make the settling of reactant keep stable sedimentation velocity.Samming scope herein is between Celsius approximately between 20 to 65 degree, depending on each reactant and corresponding the adjustment.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (16)
1. an air feeder is characterized in that, comprising:
A plurality of reactant pipelines carry respectively a plurality of reactants; And
A plurality of temperature control pipelines, those temperature control pipelines contact with those reactant pipelines, to control the temperature of those reactants.
2. air feeder according to claim 1 is characterized in that, each those temperature control pipeline leading portion and back segment have different tube diameters.
3. air feeder according to claim 1 is characterized in that, also comprises at least one temperature sensor on each those temperature control pipeline.
4. air feeder according to claim 1 is characterized in that, also comprises at least one temperature sensor on each those reactant pipeline.
5. air feeder according to claim 1 is characterized in that, each those temperature control pipeline lays respectively at a plurality of zones, according to the different zones situation, and a corresponding flow speed or the fluid temperature (F.T.) of adjusting an inner fluid of each those temperature control pipeline.
6. air feeder according to claim 1 is characterized in that, those temperature control pipeline correspondences have a plurality of input apertures, and those input apertures are connected to a common input aperture, and the input of a fluid is controlled in this common input aperture with a flow director.
7. air feeder according to claim 1 is characterized in that, those temperature control pipelines disperse from the line distribution of corresponding those input apertures than those temperature control tube great distances near the line distribution of corresponding those input apertures.
8. a chemical vapor deposition unit is characterized in that, comprising:
One load plate carries at least one substrate; And
One air feeder forms a reaction compartment between this load plate and this air feeder, this air feeder produces at least one resultant to this at least one substrate after providing a plurality of reactants to carry out a reaction to this reaction compartment, and this air feeder comprises:
A plurality of reactant pipelines carry respectively those reactants; And
A plurality of temperature control pipelines, those temperature control pipelines contact with those reactant pipelines, to control the temperature of those reactants.
9. chemical vapor deposition unit according to claim 8 is characterized in that, each those temperature control pipeline leading portion and back segment have different tube diameters.
10. chemical vapor deposition unit according to claim 8 is characterized in that, also comprises:
One well heater provides the temperature of this reaction that this reaction compartment carries out, and this load plate is between this well heater and this air feeder.
11. chemical vapor deposition unit according to claim 8 is characterized in that, also comprises:
One lid is positioned at this air feeder top, and those reactants are delivered to those reactant pipelines by this lid outside by this lid.
12. chemical vapor deposition unit according to claim 8 is characterized in that, also comprises at least one temperature sensor on each those temperature control pipeline.
13. chemical vapor deposition unit according to claim 8 is characterized in that, also comprises at least one temperature sensor on each those reactant pipeline.
14. chemical vapor deposition unit according to claim 8, it is characterized in that, each those temperature control pipeline lays respectively at a plurality of zones, according to the different zones situation, and a corresponding flow speed or the fluid temperature (F.T.) of adjusting an inner fluid of each those temperature control pipeline.
15. chemical vapor deposition unit according to claim 8 is characterized in that, those temperature control pipeline correspondences have a plurality of input apertures, and those input apertures are connected to a common input aperture, and the input of a fluid is controlled in this common input aperture with a flow director.
16. chemical vapor deposition unit according to claim 8 is characterized in that, those temperature control pipelines disperse from the line distribution of corresponding those input apertures than those temperature control tube great distances near the line distribution of corresponding those input apertures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103279991A CN102877040A (en) | 2012-09-06 | 2012-09-06 | Air-supply device and chemical vapor deposition device using air-supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103279991A CN102877040A (en) | 2012-09-06 | 2012-09-06 | Air-supply device and chemical vapor deposition device using air-supply device |
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| CN102877040A true CN102877040A (en) | 2013-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103279991A Pending CN102877040A (en) | 2012-09-06 | 2012-09-06 | Air-supply device and chemical vapor deposition device using air-supply device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105648425A (en) * | 2014-11-20 | 2016-06-08 | 理想能源设备(上海)有限公司 | Chemical vapor deposition device and temperature control method thereof |
| CN113370195A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨科能熔敷科技股份有限公司 | Mechanical arm applied to high-temperature working condition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08157296A (en) * | 1994-12-05 | 1996-06-18 | Fujitsu Ltd | Device for supplying raw material or gas |
| CN101517704A (en) * | 2006-09-16 | 2009-08-26 | 派松尼克斯株式会社 | Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof |
-
2012
- 2012-09-06 CN CN2012103279991A patent/CN102877040A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08157296A (en) * | 1994-12-05 | 1996-06-18 | Fujitsu Ltd | Device for supplying raw material or gas |
| CN101517704A (en) * | 2006-09-16 | 2009-08-26 | 派松尼克斯株式会社 | Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105648425A (en) * | 2014-11-20 | 2016-06-08 | 理想能源设备(上海)有限公司 | Chemical vapor deposition device and temperature control method thereof |
| CN105648425B (en) * | 2014-11-20 | 2018-06-26 | 理想能源设备(上海)有限公司 | A kind of chemical vapor deposition unit and its temperature control method |
| CN113370195A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨科能熔敷科技股份有限公司 | Mechanical arm applied to high-temperature working condition |
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Application publication date: 20130116 |