CN102749157B - Flexible multi-parameter sensor and manufacture method thereof - Google Patents
Flexible multi-parameter sensor and manufacture method thereof Download PDFInfo
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- CN102749157B CN102749157B CN201210265331.9A CN201210265331A CN102749157B CN 102749157 B CN102749157 B CN 102749157B CN 201210265331 A CN201210265331 A CN 201210265331A CN 102749157 B CN102749157 B CN 102749157B
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Abstract
The invention relates to a flexible multi-parameter sensor and a manufacture method thereof and belongs to the technical field of flexible electrons and sensors. The flexible multi-parameter sensor comprises a flexible substrate, and a detection sensitive area is arranged above the flexible substrate. The detection sensitive area comprises a pressure sensitive layer, a humidity sensitive layer and a temperature sensitive layer which are located above the flexible substrate. The humidity sensitive layer covers the pressure sensitive layer, the temperature sensitive layer covers the humidity sensitive layer, and a protection layer covers the temperature sensitive layer. A plurality of contact windows used for detecting external environment humidity are arranged in the detection sensitive area, the contact windows penetrate through the corresponding protection layer and the temperature sensitive layer which are arranged in the detection sensitive layer and stretch to the surface of the humidity sensitive layer. The flexible multi-parameter sensor is simple in structure, capable of being manufactured in batch in a roll-to-roll printing method, capable of detecting pressure and relative humidity and temperature signals, wide in suitable range, convenient to use, safe and reliable.
Description
Technical field
The present invention relates to a kind of sensor and manufacture method thereof, especially a kind of flexible multi-parameter sensor and manufacture method thereof, belong to the technical field of flexible electronic and sensor.
Background technology
Flexible electronic product have quality gently, not cracky, light transmission is good, quality is soft, applicable and irregular surface, low in energy consumption, be easy to extensive manufacture in batches, the feature such as with low cost, there have been at present the products such as flexible display, flexible touch screen, flexible light emitting diode, flexible radio frequency identity label and flexible sensor both at home and abroad, progressively replaced traditional silica-based electronic product.Wherein, flexible sensor is started late with respect to traditional silicon based sensor, and 1985, the people such as P. W. Barth proposed a kind of flexibility temperature sensor based on silicon diode, and this is also the blank of current flexible sensor structure.Subsequently, along with the development of macromolecule polymer material and micro-nano process technology, for detection of the flexible sensor of various external environment condition signals just consumer electronics, medical electronics, technology of Internet of things, robot bionic technology, military affairs even aerospace field be widely used.Yet, traditional sensor can only be surveyed for certain specific signal, if will survey multi-signal simultaneously, need the sensor of multiple different purposes to be integrated in same specific region and to use, not only use loaded down with trivial details, and cannot maximally utilise the useful area of product, produce and the cost safeguarded all higher.So the multi-parameter sensor that exploitation realizes multiple measuring ability becomes the focus of domestic and international research.
More typical, at home, electronics research institute of the Chinese Academy of Sciences proposes a kind of multiparameter (temperature integrated on rigid substrates in once, pressure, humidity) sensor, Xi'an Communications University is used similar manufacturing process, produce and a kind ofly can measure temperature simultaneously, pressure, the multiparameter rigidity sensor of humidity and acceleration signal, Hefei Intelligent Machinery Inst., Chinese Academy of Scineces has the patent of invention of independent three-axis force and temperature compliant sensor, HeFei University of Technology once proposed a kind of sense of touch and temperature sensitive two parameter multifunction flexible sensors, Shanghai micro-system research institute of the Chinese Academy of Sciences once developed a kind of two axle power flexible touch sensation sensors.In the world, Australian RMIT and proposed a kind of three parameter Multifunction Sensors that can survey ozone, humidity and temperature for 2000, but be rigidity sensor; 2003, Univ Michigan-Ann Arbor USA invented a kind of can detecting temperature, the condenser type multi-parameter sensor of pressure, relative humidity, but be also rigid device; 2005 Nian， Tokyo Univ Japans proposed a kind of based on transistorized can detection pressure and the multiparameter flexible sensor of temperature; Nearest, 2012 Nian， Korea S Cheng Jun shop universities utilize organism transistor equally, have made the sensor component of transparent pressure and temperature sensitivity on flexible base, board.
Analyze above-mentioned domestic and international research situation known, at present in the existing technology that can survey three kinds of even more external signals of rigidity sensor field; But in flexible sensor field, the simple one-parameter sensor of multiple principle is failed effective integration and is integrated and realizes multiparameter and survey, what adopt new structure multiparameter flexible sensor can only survey two kinds of outer signals at most simultaneously, and need to manufacture complicated transistor arrangement and output signal is separated to coupling, the inconvenience of not only manufacture craft relative complex, and use.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of flexible multi-parameter sensor and manufacture method thereof are provided, it is simple in structure, easily manufactured, and energy detection pressure, relative humidity, temperature signal are applied widely, easy to use, safe and reliable.
According to technical scheme provided by the invention, described flexible multi-parameter sensor, comprise flexible substrate, the top of described flexible substrate is provided with surveys sensitizing range, described detection sensitizing range comprises presser sensor layer, humidity-sensitive layer and the responsive to temperature layer that is positioned at flexible substrate top, described humidity-sensitive layer is covered on presser sensor layer, and responsive to temperature layer is covered in humidity-sensitive layer, on responsive to temperature layer, is coated with protective seam; Survey and in sensitizing range, to be provided with somely for surveying the contact window of external environment humidity, described contact window connects surveys in sensitizing range protective seam and responsive to temperature layer accordingly, and extends to the surface of humidity-sensitive layer.
Described flexible substrate is provided with flexible base, board smooth layer, and presser sensor layer is arranged in flexible substrate by flexible base, board smooth layer.
Described detection sensitizing range comprises first area, second area, the 3rd region and the 4th region, first area and the 3rd region are symmetrical region, second area and the 4th region are symmetrical region, and first area, second area, the 3rd region and the 4th region connect the rectangular-shaped region of rear formation successively; After sensitizing range in first area, second area, the 3rd region and the 4th region isolates by isolated groove, all rectangular zigzag distributes; Presser sensor layer, the responsive to temperature layer surveyed in sensitizing range are connected with presser sensor layer contact plate, the responsive to temperature layer contact plate surveyed outside sensitizing range respectively, and described responsive to temperature layer contact plate, presser sensor layer contact plate are all positioned at the top of flexible substrate.
Described detection is provided with printing lithographic pesudo-structure in sensitizing range, described printing lithographic pesudo-structure connect protective seam, responsive to temperature layer, humidity-sensitive layer and the presser sensor layer surveyed in sensitizing range until surface.
The material of described flexible substrate is polyethylene terephthalate, gathers naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gathers one or more in 4-Vinyl phenol, benzocyclobutene, polyethersulfone, photoresist, silicon rubber.
Described presser sensor layer contact plate and presser sensor layer are same manufacture layer, and responsive to temperature layer contact plate and responsive to temperature layer are same manufacture layer.
A manufacture method for flexible multi-parameter sensor, described flexible multi-parameter sensor manufacture method comprises the steps:
A, provide flexible substrate, and in flexible substrate, set gradually presser sensor layer, humidity-sensitive layer, responsive to temperature layer and printing lithographic glue-line;
B, utilize technique graphical and corrosion; successively printing lithographic glue-line, responsive to temperature layer, humidity-sensitive layer and presser sensor layer are carried out to graphical treatment; to form required detection sensitizing range and protective seam in flexible substrate; described detection sensitizing range comprises some for surveying the contact window of external environment humidity; described contact window connects surveys corresponding protective seam and responsive to temperature layer in sensitizing range, until the surface of humidity-sensitive layer.
In described step b, comprise the steps:
B1, utilize printing lithographic template to carry out UV Printing photoetching to printing lithographic glue-line, using and in printing lithographic glue-line, form the three-dimensional structure as following etching process mask;
B2, peel off printing lithographic template, printing lithographic glue-line to above-mentioned formation three-dimensional structure carries out anisotropic etch, and presser sensor layer, humidity-sensitive layer, responsive to temperature layer are corroded successively, to form isolated groove above flexible substrate, described isolated groove connects printing lithographic glue-line, responsive to temperature layer, humidity-sensitive layer and presser sensor layer, and extends to the surface of flexible substrate;
B3, above-mentioned printing lithographic glue-line is carried out to anisotropic etch again, remove printing lithographic glue-line, responsive to temperature layer and the humidity-sensitive layer of respective regions on presser sensor layer, with mineralization pressure sensitive layer contact plate;
B4, above-mentioned printing lithographic glue-line is carried out to anisotropic etch for the third time, remove printing lithographic glue-line and the responsive to temperature layer of respective regions in humidity-sensitive layer, to be formed for contacting the contact window of external environment in humidity-sensitive layer;
B5, above-mentioned printing lithographic glue-line is carried out to anisotropic etch the 4th time, remove the printing lithographic glue-line of respective regions on responsive to temperature layer, with formation temperature sensitive layer contact plate, printing lithographic glue-line corresponding on responsive to temperature layer forms protective seam.
A technical scheme, a kind of manufacture method of flexible multi-parameter sensor, the manufacture method of described flexible multi-parameter sensor comprises the steps:
S1, provide flexible substrate, and required presser sensor layer material is set in flexible substrate, optionally shelter and etching presser sensor layer material, with mineralization pressure sensitive layer in flexible substrate, isolated groove and presser sensor layer contact plate, described presser sensor layer contact plate is connected with presser sensor layer;
S2, humidity sensitive layer material is set on presser sensor layer, optionally shelters and etching humidity sensitive layer material, remove the humidity sensitive layer material on presser sensor layer contact plate, to form the humidity-sensitive layer consistent with presser sensor layer shape;
S3, in above-mentioned humidity-sensitive layer set temperature sensitive layer material, optionally shelter and etching temperature sensitive layer material, with the contact window of formation temperature sensitive layer and some perforation responsive to temperature layers;
S4, on said temperature sensitive layer, apply photoresist layer, optionally shelter and etching photoresist layer, to expose contact window and required responsive to temperature layer contact plate, and the layer that is protected.
In described step s1, after flexible substrate is provided, in flexible substrate, apply and curing flexible base, board smooth layer, presser sensor layer is formed on flexible base, board smooth layer.
Advantage of the present invention:
The structure of a kind of flexible multi-parameter sensor that 1, the present invention proposes is the flexible structure of detection pressure, relative humidity, these three parameters of temperature simultaneously; What pressure was surveyed utilization is film microstrain meter principle, what relative humidity was surveyed utilization is that plane-parallel capacitor structure dielectric matter causes the different principle of capacitance in different humidity environment medium dielectric constant microwave medium difference, temperature sensing utilization be the principle of thin-film electro resistive thermometer, three kinds of sensitive materials form simple plane-parallel capacitor structure, and implementation method is simple.
2, the present invention proposes a kind of structure of flexible multi-parameter sensor, and pressure, relative humidity and temperature parameter are measured respectively by different sensing units, without output signal being separated to coupling; Different according to the sensitive material using, the measuring unit of a certain signal also may have response to other signals, and this extra response can compensate and proofread and correct by the feedback of other signals of opposing, thus improving measurement accuracy.
3, a kind of structure of flexible multi-parameter sensor is proposed in the present invention, not only can use traditional CMOS processing line to manufacture, and compatible volume to volume typography line, can realize the production in enormous quantities that repeatability is very high, thereby the performance uniformity coefficient of boost device, and the manufacturing cost of reduction flexible sensor.
Accompanying drawing explanation
Fig. 1 is the vertical view of flexible multi-parameter sensor of the present invention.
Fig. 2 ~ Fig. 6 is the concrete implementing process step cut-open view of the embodiment of the present invention 1, wherein:
Fig. 2 is that the present invention utilizes printing lithographic template to carry out the cut-open view of UV Printing photoetching.
Fig. 3 is that the present invention obtains the cut-open view after isolated groove.
Fig. 4 is that the present invention obtains the cut-open view after presser sensor layer contact plate.
Fig. 5 is that the present invention obtains the cut-open view after contact window.
Fig. 6 is that the present invention obtains the cut-open view after responsive to temperature layer contact plate and protective seam.
Fig. 7 ~ Figure 11 is the concrete implementing process cut-open view of the embodiment of the present invention 2, wherein:
Fig. 7 is that the present invention arranges the cut-open view after flexible base, board smooth layer in flexible substrate.
Fig. 8 is that the present invention arranges presser sensor layer on flexible base, board smooth layer and etching obtains the cut-open view after isolated groove and presser sensor layer contact plate.
Fig. 9 is that the present invention obtains the cut-open view after humidity-sensitive layer.
Figure 10 is that the present invention obtains the cut-open view after responsive to temperature layer.
Figure 11 is that the present invention obtains the cut-open view after responsive to temperature layer contact plate and protective seam.
Description of reference numerals: 1-printing lithographic glue-line, 2-humidity-sensitive layer, 3-printing lithographic pesudo-structure, 4-flexible base, board smooth layer, 5-responsive to temperature layer, 6-presser sensor layer, 7-flexible substrate, 8-printing lithographic template, 9-contact window, 10-isolated groove, 11-responsive to temperature layer contact plate, 12-presser sensor layer contact plate, 13-protective seam, 14-first area, 15-second area, 16-the 3rd region and 17-the 4th region.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Figure 1: for the present invention forms the vertical view of flexible multi-parameter sensor.The flexible multi-parameter sensor of the present invention is gaging pressure simultaneously, relative humidity and temperature signal, in order to realize above-mentioned functions, the present invention includes flexible substrate 7, the top of described flexible substrate 7 is provided with flexible base, board smooth layer 4, flexible base, board smooth layer 4 tops are provided with surveys sensitizing range, described detection sensitizing range comprises the presser sensor layer 6 that is positioned at flexible base, board smooth layer 4 tops, humidity-sensitive layer 2 and responsive to temperature layer 5, described humidity-sensitive layer 2 is covered on presser sensor layer 6, responsive to temperature layer 5 is covered in humidity-sensitive layer 2, on responsive to temperature layer 5, be coated with protective seam 13, survey and in sensitizing range, to be provided with somely for surveying the contact window 9 of external environment humidity, described contact window 9 connects surveys corresponding protective seam 13 and responsive to temperature layer 5 in sensitizing ranges, and extends to the surface of humidity-sensitive layer 2.In flexible substrate 7, by being set, flexible base, board smooth layer 4 obtains better presser sensor layer 6, humidity-sensitive layer 2 and responsive to temperature layer 5.
In the embodiment of the present invention, described detection sensitizing range comprises first area 14, second area 15, the 3rd region 16 and the 4th region 17, first area 14 and the 3rd region 16 are symmetrical region, second area 15 and the 4th region 17 are symmetrical region, after first area 14, second area 15, the 3rd region 16 and the 4th region 17 connect successively, form rectangular-shaped region; First area 14, second area 15, the 3rd region 16 and the 4th 17Nei sensitizing range, region by isolated groove 10 isolation after all rectangular zigzag distribute; Presser sensor layer 6, the responsive to temperature layer 5 surveyed in sensitizing range are connected with presser sensor layer contact plate 12, the responsive to temperature layer contact plate 11 surveyed outside sensitizing range respectively, and described responsive to temperature layer contact plate 11, presser sensor layer contact plate 12 are all positioned at the top of flexible substrate 7 and flexible base, board smooth layer 4.Responsive to temperature layer contact plate 11 is same manufacture layer with responsive to temperature layer 5, and presser sensor layer contact plate 12 is same manufacture layer with presser sensor layer 6.Presser sensor layer 6 in first area 14 is connected with one of them presser sensor layer contact plate 12, presser sensor layer 6 in the 4th region 17 is connected with another presser sensor layer contact plate 12 wherein, to form two connecting electrodes that presser sensor layer 6 is outwards connected; In like manner, the interior responsive to temperature layer 5 in first area 14 is connected with one of them responsive to temperature layer contact plate 11, responsive to temperature layer 5 in the 4th region 17 is connected with another responsive to temperature layer contact plate 11 wherein, to form two electrodes that outwards connect, responsive to temperature layer 5 in second area 15, the 3rd region 16 and the corresponding connection of responsive to temperature layer 5 in first area 14, the 4th region 17, the type of attachment of presser sensor layer 6 is identical with responsive to temperature layer 5, and responsive to temperature layer 5, presser sensor layer 6 and the shape of humidity-sensitive layer 2 above flexible substrate 7 are consistent.
By detection sensitizing range being divided into the structure in first area 14, second area 15, the 3rd region 16 and the 4th region 17, and formation symmetry is rectangular-shaped, in each region, by isolated groove 10, form the jagged distributed architecture of rectangle, can increase the sensitivity of measurement, improve the precision detecting.By isolated groove 10 can by survey sensitizing range and non-sensitive separate from.
Described detection is provided with printing lithographic pesudo-structure 3 in sensitizing range, and protective seam 13, responsive to temperature layer 5, humidity-sensitive layer 2 and presser sensor layer 6 in described printing lithographic pesudo-structure 3 perforation detection sensitizing ranges are until the surface of flexible base, board smooth layer 4.Described printing lithographic pesudo-structure 3 is structurally not influential to multi-parameter sensor, and just technique forms needs, and by the art, personnel are known, and no longer describe in detail herein.
The material of described flexible substrate 7 is polyethylene terephthalate, gathers naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gathers one or more in 4-Vinyl phenol, benzocyclobutene, polyethersulfone, photoresist, silicon rubber; The thickness of flexible substrate 7 is 5 microns to 2 millimeters.
Described presser sensor layer 6 is the film microstrain meter structure that parallel rectangle jaggies bar forms, as the bottom electrode of plane-parallel capacitor, the material of presser sensor layer 6 is the combination of gold, platinum, aluminium, constantan Magno, Karma nickel-cadmium, palladium evanohm or the above-mentioned material of conduction; The thickness of presser sensor layer 6 is 10 nanometers to 10 micron, in the serrate lines of microstrain meter, and long 20 microns to 2 centimetres of each sawtooth, wide 2 microns to 200 microns, 2 microns to 200 microns of jaggy pitch.
Described humidity-sensitive layer 2 is identical with presser sensor layer 6 shape and overlap, medium as plane-parallel capacitor, the material of humidity-sensitive layer 2 is aluminium oxide, titanium dioxide, monox, spinel complex oxide, the manganese tungsten ore of lithium chloride doping, boron phosphate, tin oxide, zinc paste, indium oxide, perovskite composite oxides, high molecular polymer based on polyelectrolyte, polyacetylene, polyphenyl, polyaniline, poly-diethynylbenzene, polyphenyl acid alkynes propyl ester, to diethynylbenzene-propargyl alcohol, phenylacetylene-propargyl alcohol, polyimide, polymethylmethacrylate, cellulose acetate-butyrate, polyvinyl acetate, polyethylene terephthalate, polyethersulfone, polysulfone resin, benzocyclobutene, the combination of hexamethyl two silicon azane or above-mentioned material, the thickness of humidity-sensitive layer 2 is 200 nanometers to 200 micron.
Described responsive to temperature layer 5 and presser sensor layer 6, humidity-sensitive layer 2 shapes are identical and overlap, and on its serrate lines, be made with the contact window 9 of humidity-sensitive layer and environmental exposure, the shape of contact window 9, size and number coring demand and different, form thin-film electro resistive thermometer, as the top electrode of plane-parallel capacitor; The material of responsive to temperature layer 5 is the combination of platinum, gold, copper, nickel, silver, tungsten or above-mentioned material; The thickness of responsive to temperature layer 5 is 10 nanometers to 10 micron.
Described protective seam 13 has identical shape and coincidence with responsive to temperature layer 5, and responsive to temperature layer material is based on polyethylene terephthalate, the poly-combination to naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, poly-4-Vinyl phenol, benzocyclobutene, polyethersulfone, photoresist, silicon rubber or above-mentioned material; The thickness of protective seam 13 is 200 nanometers to 2 millimeter.
Below by two kinds of preparation technologies that form structures of the present invention of embodiment 1 and embodiment 2 difference, wherein, embodiment 1 is for adopting typography to prepare, and embodiment 2 is for to obtain by the manufacture of ultraviolet carving technology.
Embodiment 1
As shown in Fig. 2 ~ Fig. 6: the technique of the flexible multi-parameter sensor of preparing in the present embodiment comprises the steps, is specially:
Step 1, the poly-of 125 micron thickness, a side of the flexible substrate 7 of naphthalenedicarboxylic acid second diester is carried out to following material stacks step successively: 5 microns of SU-8 of spin coating, 3005 photoresist flexible base, board smooth layers 4 also solidify, the golden presser sensor layer 6 of sputter 100 nanometers, the humidity-sensitive layer 2 of spin coating 800 nanometer benzocyclobutenes (CYCLOTENE 3000) is also solidified, the platinum responsive to temperature layer 5 of sputter 50 nanometers, evenly spray the UV Printing photoresist 1 of 475 nanometers based on polymethylmethacrylate, and use quartz glass printing lithographic template 8 to carry out UV Printing photoetching, in printing lithographic glue 1, form three-dimensional structure as the mask of following etching process, as shown in Figure 2,, in the present embodiment, the material selection of presser sensor layer 6 is golden, the material selection platinum of responsive to temperature layer 5, and printing lithographic template 8 is according to required structure preparation, and by the art, personnel are known, and no longer describe in detail herein, by printing lithographic template 8, undertaken after printing lithographic, can effectively form follow-up required isolated groove 10 and contact window 9,
Step 2, peel off printing lithographic template 8, carry out the anisotropic etch of the 1st printing lithographic glue 1, expose the figure of the isolated groove 10 of isolating device, herein all materials in material heap are carried out to selective corrosion successively, form the isolated groove 10 of isolating device, as shown in Figure 3; The shape that forms isolated groove 10 is herein consistent with the shape of surveying sensitizing range profile in Fig. 1, form the isolated groove 10 in first area 14, second area 15, the 3rd region 16 and the 4th region 17 simultaneously, isolated groove 10 is rectangle zigzag in each region, and the jagged parameter of rectangle as mentioned above;
Step 4, carry out the anisotropic etch of the 3rd printing lithographic glue 1, the figure that exposes the contact window 9 of humidity-sensitive layer and external environment, herein the humidity sensitive material in material heap is carried out to selective corrosion, in responsive to temperature layer 5, form the window 9 that humidity-sensitive layer 2 contacts with external environment, as shown in Figure 5;
Step 5, carry out the anisotropic etch of the 4th printing lithographic glue 1, the electricity contact plate 11 of formation temperature sensitive layer 5, the structure of whole flexible sensor completes immediately, 1 protective seam 13 as this sensor of remaining printing lithographic glue, as shown in Figure 6.
Wherein, the process conditions of ultraviolet imprint lithography are: impression pressure is 7500 handkerchiefs, and temperature conditions is 21 degrees Celsius of room temperatures, and ultraviolet dosage is 80 milli Jiao/square centimeters, and the process time is 3 seconds.Etching process is specially: using oxygen gas plasma is that 1.3 handkerchiefs and temperature are to carry out selective corrosion in the chamber of 60 degrees Celsius to printing lithographic glue 1 at pressure, use potassium iodide-iodine water (1:1) solution 21 degrees Celsius of room temperatures, to carry out selective corrosion to the gold of presser sensor layer 6, use the Primary Stripper A of Dow company at 95 degrees Celsius, to carry out selective corrosion to the benzocyclobutene of humidity-sensitive layer 2 (CYCLOTENE 3000), use hydrochloric acid-nitric acid (8:1) solution at 70 degrees Celsius, to carry out selective corrosion for the platinum of responsive to temperature layer 5.
Using oxygen gas plasma to carry out in the technique of anisotropic corrosion printing lithographic glue 1, using laser film thickness measuring to carry out the real-time detection of printing lithographic glue thickness, to determine the terminal of each corrosion.
Embodiment 2
As shown in figure 11; structure in the present embodiment in the structure of related flexible multi-parameter sensor and embodiment 1 is similar; and except protective seam 13, select identical material, but the present embodiment is introduced a kind of above-mentioned flexible multi-parameter sensor method of employing ultraviolet carving technology manufacture, specific as follows:
Step t1, also curing at the poly-photoresist flexible base, board smooth layer 4 to 5 microns of SU-8 3005 of a side coating of the flexible substrate 7 of naphthalenedicarboxylic acid second diester of 125 micron thickness, as shown in Figure 7;
Step t2, on flexible base, board smooth layer 4, use gold that sputtering method deposits 100 nanometer thickness as presser sensor layer 6, use the method for ultraviolet lithography to carry out graphically presser sensor layer 6, make its formation comprise the structure of device isolation groove 10 and presser sensor layer contact plate 12 figures, as shown in Figure 8;
Step t3, on presser sensor layer 6, apply the humidity-sensitive layer 2 of 800 nanometer benzocyclobutenes (CYCLOTENE 3000) and solidify, use the method for ultraviolet lithography to carry out graphically it, to remove the material above presser sensor layer contact plate 12, as shown in Figure 9;
Step t4, in the humidity-sensitive layer 2 of benzocyclobutene (CYCLOTENE 3000), use platinum that sputtering method deposits 50 nanometer thickness as TEMPERATURE FORCE sensitive layer 5, use the method for ultraviolet lithography to carry out graphically it, make its formation comprise the structure of the contact window 9 of humidity-sensitive layer and external environment, as shown in figure 10;
Step t5, on responsive to temperature layer, applying 2 microns of SU-8 2002 photoresists and use the technology of ultraviolet lithography to make can the electricity contact plate 11 of Exposure Temperature sensitive layer 5 and the structure of the contact window 9 of humidity-sensitive layer and external environment, as the protective seam 13 of resulting devices.
As shown in Fig. 1, Fig. 6 and Figure 11: presser sensor layer 6, responsive to temperature layer 5 and humidity-sensitive layer 2 have identical outline figure, and rectangular sawtooth lines wriggle on flexible base, board 7, form common two dimensional surface film microstrain meter shape; In the responsive to temperature layer 5 of metal platinum, be made with contact window 9, so that humidity-sensitive layer 2 contacts with external environment.Meanwhile, presser sensor layer 6 and responsive to temperature layer 5 form two pole plates up and down of plane-parallel capacitor structure, and humidity-sensitive layer 2 is as the dielectric medium of capacitor.
When this sensor of outer bound pair applies pressure straight down, this pressure can make golden presser sensor layer 6 produce strains and cause the variation of resistance value, although the more traditional silicon materials of strain constant of gold are lower, but due to the poly-flexible substrate 7 to naphthalenedicarboxylic acid second diester, the flexible base, board smooth layer 4 of SU-8 and the UV Printing photoresist 1 of polymethylmethacrylate all have very low Young modulus with respect to traditional silicon material, so the sensitivity of the film microstrain meter that employing gold thin film and high molecular polymer form and traditional silicon strainometer are in same level, thereby can extrapolate exerted pressure size with the measurement of presser sensor layer 6 strain to gold thin film, meanwhile, the responsive to temperature layer 5 of making due to metal platinum equally to external world applied pressure signal can produce strain, and this extra response can be used for the response of golden presser sensor layer 6 to compensate and proofread and correct, and improves the precision of this measuring unit.
When measuring the relative humidity of external environment, hydrone is absorbed by the humidity-sensitive layer 2 of benzocyclobutene by the contact window 9 in responsive to temperature layer 5, thereby cause the relative dielectric constant of humidity-sensitive layer 2 to change, so the capacitance of this plane-parallel capacitor changes compared with original state, the capacitance of this variation is just detected and can extrapolate the rh value in external environment.
When ambient temperature changes, can there is the variation of resistance value in the responsive to temperature layer 5 that is positioned at the metal platinum film at sensor top, so temperature signal is converted into the electric signal that is easy to measurement; Meanwhile, the presser sensor layer 6 of making due to metallic gold also to external world the variation of temperature have the response in resistance value, this extra response can be used for the response of platinum responsive to temperature layer 5 to compensate and proofread and correct, and improves the measuring accuracy of this unit.
The structure of a kind of flexible multi-parameter sensor that the present invention proposes is the flexible structure of detection pressure, relative humidity, these three parameters of temperature simultaneously; What pressure was surveyed utilization is film microstrain meter principle, what relative humidity was surveyed utilization is that plane-parallel capacitor structure dielectric matter causes the different principle of capacitance in different humidity environment medium dielectric constant microwave medium difference, temperature sensing utilization be the principle of thin-film electro resistive thermometer, three kinds of sensitive materials form simple plane-parallel capacitor structure, and implementation method is simple.
The present invention proposes a kind of structure of flexible multi-parameter sensor, and pressure, relative humidity and temperature parameter are measured respectively by different sensing units, without output signal being separated to coupling; Different according to the sensitive material using, the measuring unit of a certain signal also may have response to other signals, and this extra response can compensate and proofread and correct by the feedback of other signals of opposing, thus improving measurement accuracy.
A kind of structure of flexible multi-parameter sensor is proposed in the present invention, not only can use traditional CMOS processing line to manufacture, and compatible volume to volume typography line, can realize the production in enormous quantities that repeatability is very high, thereby the performance uniformity coefficient of boost device, and the manufacturing cost of reduction flexible sensor.
This embodiment can be used for structure of the present invention and manufacture process are described, but enforcement of the present invention never only limits to this embodiment.Within not departing from the scope of the present invention and appended claim, various replacements, variation and modification are all possible.Therefore, protection scope of the present invention is not limited to embodiment and the disclosed content of accompanying drawing.
Claims (10)
1. a flexible multi-parameter sensor, it is characterized in that: comprise flexible substrate (7), the top of described flexible substrate (7) is provided with surveys sensitizing range, described detection sensitizing range comprises presser sensor layer (6), humidity-sensitive layer (2) and the responsive to temperature layer (5) that is positioned at flexible substrate (7) top, described humidity-sensitive layer (2) is covered on presser sensor layer (6), it is upper that responsive to temperature layer (5) is covered in humidity-sensitive layer (2), is coated with protective seam (13) on responsive to temperature layer (5); Survey and in sensitizing range, to be provided with somely for surveying the contact window (9) of external environment humidity, described contact window (9) connects surveys corresponding protective seam (13) and responsive to temperature layer (5) in sensitizing range, and extends to the surface of humidity-sensitive layer (2).
2. flexible multi-parameter sensor according to claim 1, is characterized in that: described flexible substrate (7) is provided with flexible base, board smooth layer (4), and presser sensor layer (6) is arranged in flexible substrate (7) by flexible base, board smooth layer (4).
3. flexible multi-parameter sensor according to claim 1, it is characterized in that: described detection sensitizing range comprises first area (14), second area (15), the 3rd region (16) and the 4th region (17), first area (14) is symmetrical region with the 3rd region (16), second area (15) is symmetrical region with the 4th region (17), after first area (14), second area (15), the 3rd region (16) and the 4th region (17) connect successively, forms rectangular-shaped region; Sensitizing range in first area (14), second area (15), the 3rd region (16) and the 4th region (17) is all rectangular zigzag distributions after isolating by isolated groove (10); Presser sensor layer (6), the responsive to temperature layer (5) surveyed in sensitizing range are connected with presser sensor layer contact plate (12), the responsive to temperature layer contact plate (11) surveyed outside sensitizing range respectively, and described responsive to temperature layer contact plate (11), presser sensor layer contact plate (12) are all positioned at the top of flexible substrate (7).
4. flexible multi-parameter sensor according to claim 1; it is characterized in that: in described detection sensitizing range, be provided with printing lithographic pesudo-structure (3), described printing lithographic pesudo-structure (3) connects the surface of surveying protective seam (13), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6) in sensitizing range.
5. flexible multi-parameter sensor according to claim 1, is characterized in that: the material of described flexible substrate (7) is polyethylene terephthalate, gathers naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gathers one or more in 4-Vinyl phenol, benzocyclobutene, polyethersulfone, photoresist, silicon rubber.
6. flexible multi-parameter sensor according to claim 3, is characterized in that: described presser sensor layer contact plate (12) is same manufacture layer with presser sensor layer (6), and responsive to temperature layer contact plate (11) is same manufacture layer with responsive to temperature layer (5).
7. a manufacture method for flexible multi-parameter sensor, is characterized in that, described flexible multi-parameter sensor manufacture method comprises the steps:
(a), flexible substrate (7) is provided, and in flexible substrate (7), set gradually presser sensor layer (6), humidity-sensitive layer (2), responsive to temperature layer (5) and printing lithographic glue-line (1);
(b), utilize technique graphical and corrosion; successively printing lithographic glue-line (1), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6) are carried out to graphical treatment; above to form required detection sensitizing range and protective seam (13) in flexible substrate (7); described detection sensitizing range comprises some for surveying the contact window (9) of external environment humidity; described contact window (9) connects surveys corresponding protective seam (13) and responsive to temperature layer (5) in sensitizing range, until the surface of humidity-sensitive layer (2).
8. the manufacture method of flexible multi-parameter sensor according to claim 7, is characterized in that, in described step (b), comprises the steps:
(b1), utilize printing lithographic template (8) to carry out UV Printing photoetching to printing lithographic glue-line (1), using in printing lithographic glue-line (1) and to form the three-dimensional structure as following etching process mask;
(b2), peel off printing lithographic template (8), printing lithographic glue-line (1) to above-mentioned formation three-dimensional structure carries out anisotropic etch, and presser sensor layer (6), humidity-sensitive layer (2), responsive to temperature layer (5) are corroded successively, with the top in flexible substrate (7), form isolated groove (10), described isolated groove (10) connects printing lithographic glue-line (1), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6), and extends to the surface of flexible substrate (7);
(b3), above-mentioned printing lithographic glue-line (1) is carried out to anisotropic etch again, remove printing lithographic glue-line (1), responsive to temperature layer (5) and the humidity-sensitive layer (2) of the upper respective regions of presser sensor layer (6), with mineralization pressure sensitive layer contact plate (12);
(b4), above-mentioned printing lithographic glue-line (1) is carried out to anisotropic etch for the third time, remove printing lithographic glue-line (1) and the responsive to temperature layer (5) of the upper respective regions of humidity-sensitive layer (2), to be formed for contacting the contact window (9) of external environment in humidity-sensitive layer (2);
(b5), above-mentioned printing lithographic glue-line (1) is carried out to anisotropic etch the 4th time; remove the printing lithographic glue-line (1) of the upper respective regions of responsive to temperature layer (5); with formation temperature sensitive layer contact plate (11), the upper corresponding printing lithographic glue-line (1) of responsive to temperature layer (5) forms protective seam (13).
9. a manufacture method for flexible multi-parameter sensor, is characterized in that, the manufacture method of described flexible multi-parameter sensor comprises the steps:
(s1), provide flexible substrate (7), and required presser sensor layer material is set in flexible substrate (7), optionally shelter and etching presser sensor layer material, with mineralization pressure sensitive layer (6), isolated groove (10) and presser sensor layer contact plate (12) in flexible substrate (7), described presser sensor layer contact plate (12) is connected with presser sensor layer (6);
(s2), on presser sensor layer (6), humidity sensitive layer material is set, optionally shelter and etching humidity sensitive layer material, remove the humidity sensitive layer material on presser sensor layer contact plate (12), to form the humidity-sensitive layer (2) consistent with presser sensor layer (6) shape;
(s3), at the upper set temperature sensitive layer material of above-mentioned humidity-sensitive layer (2), optionally shelter and etching temperature sensitive layer material, with the contact window (9) of formation temperature sensitive layer (5) and some perforation responsive to temperature layers (5);
(s4), at the upper photoresist layer that applies of said temperature sensitive layer (5), optionally shelter and etching photoresist layer, to expose contact window (9) and required responsive to temperature layer contact plate (11), and the layer (13) that is protected.
10. the manufacture method of flexible multi-parameter sensor according to claim 9, it is characterized in that: in described step (s1), after flexible substrate (7) is provided, at the upper coating of flexible substrate (7) curing flexible base, board smooth layer (4), presser sensor layer (6) is formed on flexible base, board smooth layer (4).
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| CN112097946B (en) * | 2020-09-15 | 2021-09-28 | 大连理工大学 | Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement |
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| CN202770473U (en) * | 2012-07-27 | 2013-03-06 | 江苏物联网研究发展中心 | Flexible multi-parameter sensor |
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