CN102654711A - Electronic paper unit and manufacturing method thereof - Google Patents

Electronic paper unit and manufacturing method thereof Download PDF

Info

Publication number
CN102654711A
CN102654711A CN2011104026384A CN201110402638A CN102654711A CN 102654711 A CN102654711 A CN 102654711A CN 2011104026384 A CN2011104026384 A CN 2011104026384A CN 201110402638 A CN201110402638 A CN 201110402638A CN 102654711 A CN102654711 A CN 102654711A
Authority
CN
China
Prior art keywords
electronic paper
unit
layer
electronic
ink layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011104026384A
Other languages
Chinese (zh)
Other versions
CN102654711B (en
Inventor
张展玮
吴和虔
彭佳添
胡至仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Prime View International Co Ltd
Original Assignee
AU Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AU Optronics Corp filed Critical AU Optronics Corp
Publication of CN102654711A publication Critical patent/CN102654711A/en
Application granted granted Critical
Publication of CN102654711B publication Critical patent/CN102654711B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laser Beam Processing (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

An electronic paper unit and a manufacturing method thereof are provided, wherein the electronic paper unit comprises a flexible substrate, a thin film transistor layer, an electronic ink layer, a waterproof layer and a frame glue. The thin film transistor layer is disposed on the flexible substrate. The electronic ink layer is disposed on a surface of the thin film transistor layer. The waterproof layer is disposed on the electronic ink layer. The end face of the waterproof layer and the end face of the electronic ink layer jointly form a side wall, and a first acute angle or a first obtuse angle is formed between the side wall and the surface. The frame glue is coated on the side wall and the surface. The manufacturing method of the electronic paper unit comprises the steps of providing a hard substrate; sequentially disposing a flexible substrate, a thin film transistor layer, an electronic ink layer and a waterproof layer on the hard substrate to form an electronic paper array; cutting the electronic paper array to form a plurality of electronic paper units; coating and curing frame glue around each electronic paper unit; and removing the electronic paper units from the hard substrate.

Description

The method for making of Electronic Paper unit and Electronic Paper unit
Technical field
The present invention relates to a kind of Electronic Paper and preparation method thereof, the method for making of particularly a kind of Electronic Paper unit and Electronic Paper unit.
Background technology
In recent years, Electronic Paper (E-paper) and e-book (E-book) are just flourish, have gentlier, display thinner and the deflection characteristic will become following main Development Trend.
Yet flexible base plate has the restriction of many materials own, therefore can't be suitable for present glass substrate technology fully.Therefore, improve like existing equipment how, just make its making that can be applicable to flexible base plate become the problem that the related personnel need solve.
Summary of the invention
Technical matters to be solved by this invention provides a kind of Electronic Paper unit, and it has preferable durability.Another technical matters to be solved by this invention provides the method for making of a kind of Electronic Paper unit, can produce the Electronic Paper unit with preferable durability.
To achieve these goals, the invention provides a kind of Electronic Paper unit, wherein, comprising:
One flexible base plate;
One membrane transistor layer is configured on this flexible base plate;
One electronic ink layer is configured on the surface of this membrane transistor layer;
One water barrier is configured on this electronic ink layer, and an end face of this water barrier and an end face of this electronic ink layer are common to constitute a sidewall, and this sidewall and this clip surface one first acute angle or one first obtuse angle; And
One frame glue, coating covers on this sidewall and this surface.
Above-mentioned Electronic Paper unit, wherein, an end face of this water barrier is in this surperficial frontal projected area, less than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
Above-mentioned Electronic Paper unit, wherein, an end face of this water barrier is in this surperficial frontal projected area, greater than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
Above-mentioned Electronic Paper unit wherein, also comprises an adhesive coating, is configured between this membrane transistor layer and this electronic ink layer.
Above-mentioned Electronic Paper unit, wherein, the angle of this first acute angle is greater than 80 degree and less than 90 degree.
Above-mentioned Electronic Paper unit, wherein, the angle at this first obtuse angle is greater than 90 degree and less than 100 degree.
In order to realize above-mentioned purpose better, the present invention also provides the method for making of a kind of Electronic Paper unit, wherein, comprising:
One rigid substrate is provided;
Dispose a flexible base plate, a membrane transistor layer, an electronic ink layer and a water barrier in regular turn on this rigid substrate, to form an Electronic Paper array;
Cut this Electronic Paper array to form a plurality of Electronic Paper unit;
Coating is also solidified frame glue around this Electronic Paper unit respectively; And
Take off those Electronic Paper unit from this rigid substrate.
The method for making of above-mentioned Electronic Paper unit, wherein, cut this Electronic Paper array and also comprise with the step that forms a plurality of Electronic Paper unit:
Cut and wear this water barrier and this electronic ink layer, to manifest a surface of this membrane transistor layer; And
Cut and wear this membrane transistor layer and this flexible base plate.
The method for making of above-mentioned Electronic Paper unit; Wherein, Cut and wear this water barrier and this electronic ink layer; This surperficial step to manifest this membrane transistor layer also comprises: cuts and wears this water barrier and this electronic ink layer, make an end face of this water barrier and an end face of this electronic ink layer constitute a sidewall jointly, and this clip surface one first acute angle or one first obtuse angle of this sidewall and this membrane transistor layer.
The method for making of above-mentioned Electronic Paper unit, wherein, cut this Electronic Paper array and also comprise with the step that forms a plurality of Electronic Paper unit:
Cut this rigid substrate and become a plurality of rigid unit.
The method for making of above-mentioned Electronic Paper unit wherein,, is heat-treated with the cut surface to each layer to cut this water barrier, this electronic ink layer, this membrane transistor layer and this flexible base plate through a laser cell.
The method for making of above-mentioned Electronic Paper unit wherein, also comprises:
Configuration one is left the shape layer between this rigid substrate and this flexible base plate.
The method for making of above-mentioned Electronic Paper unit, wherein, cut the step of wearing this membrane transistor layer and this flexible base plate and also comprise:
Cut and wear this from the shape layer.
The method for making of above-mentioned Electronic Paper unit wherein, also comprises:
Dispose an adhesive coating between this membrane transistor layer and this electronic ink layer.
The method for making of above-mentioned Electronic Paper unit wherein, is cut and is worn this water barrier and this electronic ink layer, also comprises with this surperficial step that manifests this membrane transistor layer:
Cut and wear this adhesive coating, to manifest this surface of this membrane transistor layer.
The method for making of above-mentioned Electronic Paper unit wherein, also comprises:
Cleaning also reclaims this rigid substrate.
Technique effect of the present invention is: Electronic Paper of the present invention unit has preferable durability; Method for making of the present invention cuts into the sidewall with obtuse angle or acute angle through cutting equipment with the Electronic Paper unit, takes place and reduces the situation that aqueous vapor is invaded electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the synoptic diagram according to a kind of Electronic Paper unit of one embodiment of the invention;
Fig. 2 is the synoptic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention;
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention;
Fig. 4 A is the process flow diagram according to the method for making of a kind of Electronic Paper of one embodiment of the invention;
Fig. 4 B is the process flow diagram of method for making of a kind of Electronic Paper of another embodiment of the present invention;
Fig. 5 A to Fig. 5 C is the synoptic diagram of Electronic Paper unit in the method for making of Fig. 4;
Fig. 5 D is the process flow diagram synoptic diagram of a step wherein of map 4B.
Wherein, Reference numeral
100,200 Electronic Paper unit
110 flexible base plates
120 membrane transistor layers
130,230 electronic ink layer
140 adhesive coatings
150,250 water barriers
160,260 frame glue
170 rigid substrates
The rigid unit of 170a
180 from the shape layer
300 cutting equipments
310 platforms
320 laser cells
330 cutters
340 catoptrons
350 absorption rollers
A1, A2 sidewall
B1, B2 bottom surface
C2 second obtuse angle
L1 bubble discharge path
M1 first obtuse angle
N1 first acute angle
The R1 laser beam
The S1 surface
T1, T2 end face
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
Fig. 1 is the synoptic diagram according to a kind of Electronic Paper unit of one embodiment of the invention.Please refer to Fig. 1, in the present embodiment, Electronic Paper unit 100 can comprise a flexible base plate 110, a membrane transistor layer 120, an electronic ink layer 130, an adhesive coating 140, a water barrier 150 and a frame glue 160.Flexible base plate 110 can be the film substrate of polyimide (Polyimide) material.Membrane transistor layer 120 is configured on the flexible base plate 110.Electronic ink layer 130 is configured on the surperficial S1 of membrane transistor layer 120; Wherein electronic ink layer 130 can link together through adhesive coating 140 with membrane transistor layer 120; Electronic ink layer 130 can be that (Electro Phoretic EP) shows film to electrophoresis-type, and adhesive coating 140 then can be transparent optical cement (Optical Clear Adhesive; OCA), adhesive coating 140 is configurable between membrane transistor layer 120 and electronic ink layer 130.Water barrier 150 is configured on the electronic ink layer 130; And the common formation of an end face of water barrier 150 and an end face of electronic ink layer 130 one sidewall A1; And sidewall A1 and surperficial S1 press from both sides one first obtuse angle M1, make water barrier 150 and electronic ink layer 130 have a up-narrow and down-wide trapezoidal cross-section structure respectively, and this first obtuse angle M1 is in fact greater than 90 degree and less than 100 degree; Water barrier 150 can be polyethylene terephthalate (Polyethylene Terephthalate, PET) waterproof membrane of material.In addition, water barrier 150 can be disposed on the electronic ink layer 130 with attaching, coating or other suitable way.160 coatings of frame glue cover on sidewall A1 and the surperficial S1.
In the present embodiment; One end face T1 of water barrier 150 is in the frontal projected area of surperficial S1; Less than a bottom surface B1 of electronic ink layer 130 frontal projected area at surperficial S1; That is the water barrier 150 of the Electronic Paper unit 100 of this moment presents up-narrow and down-wide trapezoidal cross-section structure with electronic ink layer 130 with respect to flexible base plate 110 and membrane transistor layer 120, and wherein the angle of the first obtuse angle M1 is greater than 90 degree and less than 100 degree.
In view of the above; When carrying out the coating of frame glue 160; Because water barrier 150 is all up-narrow and down-wide trapezoidal cross-section structure with electronic ink layer 130; The frame glue 160 at end face T1 place can run underneath to the surperficial S1 of membrane transistor layer 120 along sidewall A1, Electronic Paper unit 100 is at this moment become stride glue type structure, helps in the area of limited flexible base plate 110; The bubble that effectively frame glue 160 is produced in flow process is discharged corner (bubble discharge path L1 as shown in fig. 1), so can increase the air ability that blocks of frame glue 160.
Fig. 2 is the synoptic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention.Please refer to Fig. 2, in the present embodiment, different with the foregoing description is, the end face T2 of water barrier 250 is in the frontal projected area of surperficial S1, greater than the bottom surface B2 of electronic ink layer 230 frontal projected area at surperficial S1.At this; The common formation of one end face of water barrier 250 and an end face of electronic ink layer 230 one sidewall A2; And sidewall A2 and surperficial S1 press from both sides one first acute angle N1, and this first acute angle N1 is in fact greater than 80 degree and less than 90 degree, so that the water barrier 250 of Electronic Paper unit 200 presents trapezoidal cross-section structure wide at the top and narrow at the bottom with electronic ink layer 230; Frame glue 260 can be inserted sidewall A2 and surperficial S1 constitutes among the groove, and forms a strike-through type structure.The distance L 1 that this measure can make frame glue 260 coating backs cover at surperficial S1 is longer.In other words, the aqueous vapor in the external world just is not easy to invade to electronic ink layer 230 and causes Electronic Paper unit 200 to lose efficacy.Compared to Figure 1, though bottom corner possibly have bubble slightly and exists when coating frame glue 260, can be in the area of limited flexible base plate 110, increase the frame glue 260 gas distance L 1 that blocks water effectively, gas property is preferable so it blocks water.
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention.Please be simultaneously with reference to figure 2 and Fig. 3; In the present embodiment; Cutting equipment 300 can comprise a platform 310 and the laser cell 320 and the catoptron 340 that are provided with corresponding to platform 310, wherein disposes corresponding to platform 310 and laser cell 320 in adjustable angle through catoptron 340.When laser cell 320 penetrated a laser beam R1, laser beam R1 reflected via catoptron 340, and makes laser beam R1 and platform 310 folders one second obtuse angle C2.At this, the totalling of the second obtuse angle C2 and the first acute angle N1 is about 180 degree, that is in the Electronic Paper unit 200 of Fig. 2 sidewall A2 and the first folded acute angle N1 of surperficial S1 be via and platform 310 between press from both sides the second obtuse angle C2 laser beam R1 cut and form.
Likewise; In the present invention among another embodiment that does not illustrate; The user also can adjust the angle of catoptron 340, and makes folder one second acute angle between laser beam and the platform 310, in the Electronic Paper unit 100 after the correspondence cutting as shown in Figure 1; The first obtuse angle M1 that sidewall A1 and surperficial S1 are folded, and make the totalling of the first obtuse angle M1 and second acute angle also be about 180 degree.What need explanation is; The angle of catoptron control laser beam is a kind of control mode wherein; There are many kinds of modes can adjust laser beam angle; As this makes it can make sample edge form obtuse angle or acute angle perpendicular to sample surfaces as Gaussian distribution to utilize laser beam, but is not limited thereto, and can select suitable mode to adjust laser beam angle according to actual demand.
In addition, cutting equipment 300 also can comprise an absorption roller 350, liftable be provided with corresponding to platform 310 rotationally.After the Electronic Paper array is accomplished by laser cell 320 cuttings, can Electronic Paper unit 100 or 200 be taken off from platform 300 through this absorption roller 350.
In the present invention among another embodiment that does not illustrate; Can also replace above-mentioned laser cell 320 in a cutting knife unit; This cutting knife unit is suitable for cutting the high object of pliability; Its along perpendicular to platform 310 or with respect to platform 310 along inclination angle translations cut out Electronic Paper unit 100 or 200, can reach above-mentioned equally and cut out Electronic Paper unit 100 with inclination angle or 200 effect with laser cell 320.
Fig. 4 A is the process flow diagram according to the method for making of a kind of Electronic Paper of one embodiment of the invention, and Fig. 5 A to Fig. 5 C is the synoptic diagram of Electronic Paper unit in the method for making of Fig. 4 A.Please be simultaneously with reference to figure 4A and Fig. 5 A to Fig. 5 C, at this, present embodiment is that example describes with the embodiment of Fig. 1 only.At first, in step S401, a rigid substrate 170 is provided, it for example is a glass substrate.Then in step S402, configurable one leaves shape layer 180 on rigid substrate 170, and configuration mode can be coating, attaches or other modes.Then in step S403~S407; Configurable in regular turn flexible base plate 110, membrane transistor layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 are at rigid substrate 170 and on shape layer 180; So that above-mentioned each layer forms an Electronic Paper array 10 (shown in Fig. 5 A); Wherein, can be continuous rete, and membrane transistor layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 can be discontinuous rete from shape layer 180 and flexible base plate 110 based on the convenience of technology.
Then, desire cutting Electronic Paper array 10 can cut this Electronic Paper array 10 through cutting equipment as shown in Figure 3 to form a plurality of Electronic Paper unit 100.With figure below is that example is described with the Electronic Paper unit 100 of laser cell 320 and Fig. 1 only.Please be earlier with reference to figure 4A, 4B and Fig. 5 B; In step S408, can cut and wear water barrier 150, electronic ink layer 130 and adhesive coating 140, to manifest the surperficial S1 (like Fig. 1) of membrane transistor 120; In detail; Cut and wear water barrier 150 and electronic ink layer 130, make an end face of water barrier 150 and an end face of electronic ink layer 130 constitute sidewall A1 jointly, and the surperficial S1 of sidewall A1 and membrane transistor layer 120 presss from both sides the first obtuse angle M1.Then, in step S409 and Fig. 5 C, can cut and wear membrane transistor layer 120, flexible base plate 110 and leave shape layer 180.Then, in step S410, coating frame glue 160 is around each Electronic Paper unit 100, and curing frame glue 160 (see figure 1)s; And in step S411, can take off Electronic Paper unit 100 from rigid substrate 170 through absorption roller 350 shown in Figure 3.At last, in step S412, clean and reclaim rigid substrate 180, rigid substrate 180 can reclaim and re-use.Present embodiment is that example describes with the embodiment of Fig. 1 only, but method for making that can also be identical is accomplished the Electronic Paper unit embodiment of Fig. 2, does not give unnecessary details at this.
What this need explain be; In the present embodiment; Be attached on the rigid substrate 170 and do not peel off from shape layer 180 along with Electronic Paper unit 100; Right present embodiment is not limited to this, that is under the function that does not influence Electronic Paper unit 100, also can be from shape layer 180 along with Electronic Paper unit 100 is peeled off from rigid substrate 180 together.
In addition, present embodiment cuts through each rete of 320 pairs of above-mentioned Electronic Paper of laser cell unit 100, except accomplishing the above-mentioned cutting effect, in its cutting, also can heat-treat each rete.This measure can improve the stickability of each rete and improve the adhesion between the rete.This measure is the above-mentioned effect that is beyond one's reach when cutting the Electronic Paper array with cutting knife.Fig. 4 B is the process flow diagram of method for making of a kind of Electronic Paper of another embodiment of the present invention.Fig. 5 D is the process flow diagram synoptic diagram of a step wherein of map 4B.Please be simultaneously with reference to figure 4B and map 5A to Fig. 5 D; Different with the foregoing description is; Cutting equipment 300 also can comprise a cutter 330 (referring to Fig. 3); It for example is a flywheel knife that is used to cut rigid substrate 170, except translation, also can be suitable for the hard material of cutting along the cutter unit of cutter hub axle center rotation during the flywheel knife cutting.Behind completing steps 409; In step S413; Again with 170 one-tenth a plurality of rigid unit 170a of the cutter 330 rigid substrates of cutting; Then be to be coated with among the step S414 frame glue 160 around each Electronic Paper unit 100, and solidify frame glue 160 (see figure 1)s, and in step S415, take off Electronic Paper unit 100 from rigid unit 170a.This measure promptly is subject to board or process conditions in response to rigid substrate 170 and the corresponding flow process of being carried out can't reclaim the time, can reach effect same as the previously described embodiments equally.
In sum, in the above embodiment of the present invention, the Electronic Paper unit is cut into the sidewall with obtuse angle or acute angle, take place and reduce the situation that aqueous vapor is invaded electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue through cutting equipment.
In addition, cutting equipment can have laser cell or cutting knife unit, wherein laser cell can be in cutting to heat-treating between the flexible base plate of Electronic Paper unit and the adhesive coating, and then increase the stickability between each layer.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (16)

1. an Electronic Paper unit is characterized in that, comprising:
One flexible base plate;
One membrane transistor layer is configured on this flexible base plate;
One electronic ink layer is configured on the surface of this membrane transistor layer;
One water barrier is configured on this electronic ink layer, and an end face of this water barrier and an end face of this electronic ink layer are common to constitute a sidewall, and this sidewall and this clip surface one first acute angle or one first obtuse angle; And
One frame glue, coating covers on this sidewall and this surface.
2. Electronic Paper as claimed in claim 1 unit is characterized in that, an end face of this water barrier is in this surperficial frontal projected area, less than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
3. Electronic Paper as claimed in claim 1 unit is characterized in that, an end face of this water barrier is in this surperficial frontal projected area, greater than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
4. Electronic Paper as claimed in claim 1 unit is characterized in that, also comprises an adhesive coating, is configured between this membrane transistor layer and this electronic ink layer.
5. Electronic Paper as claimed in claim 1 unit is characterized in that, the angle of this first acute angle is greater than 80 degree and less than 90 degree.
6. Electronic Paper as claimed in claim 1 unit is characterized in that, the angle at this first obtuse angle is greater than 90 degree and less than 100 degree.
7. the method for making of an Electronic Paper unit is characterized in that, comprising:
One rigid substrate is provided;
Dispose a flexible base plate, a membrane transistor layer, an electronic ink layer and a water barrier in regular turn on this rigid substrate, to form an Electronic Paper array;
Cut this Electronic Paper array to form a plurality of Electronic Paper unit;
Coating is also solidified frame glue around this Electronic Paper unit respectively; And
Take off those Electronic Paper unit from this rigid substrate.
8. the method for making of Electronic Paper as claimed in claim 7 unit is characterized in that, cuts this Electronic Paper array and also comprises with the step that forms a plurality of Electronic Paper unit:
Cut and wear this water barrier and this electronic ink layer, to manifest a surface of this membrane transistor layer; And
Cut and wear this membrane transistor layer and this flexible base plate.
9. the method for making of Electronic Paper as claimed in claim 8 unit; It is characterized in that; Cut and wear this water barrier and this electronic ink layer; This surperficial step to manifest this membrane transistor layer also comprises: cuts and wears this water barrier and this electronic ink layer, make an end face of this water barrier and an end face of this electronic ink layer constitute a sidewall jointly, and this clip surface one first acute angle or one first obtuse angle of this sidewall and this membrane transistor layer.
10. the method for making of Electronic Paper as claimed in claim 7 unit is characterized in that, cuts this Electronic Paper array and also comprises with the step that forms a plurality of Electronic Paper unit:
Cut this rigid substrate and become a plurality of rigid unit.
11. the method for making of Electronic Paper as claimed in claim 7 unit is characterized in that,, heat-treats with the cut surface to each layer to cut this water barrier, this electronic ink layer, this membrane transistor layer and this flexible base plate through a laser cell.
12. the method for making of Electronic Paper as claimed in claim 8 unit is characterized in that, also comprises:
Configuration one is left the shape layer between this rigid substrate and this flexible base plate.
13. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, cuts the step of wearing this membrane transistor layer and this flexible base plate and also comprises:
Cut and wear this from the shape layer.
14. the method for making of Electronic Paper as claimed in claim 8 unit is characterized in that, also comprises:
Dispose an adhesive coating between this membrane transistor layer and this electronic ink layer.
15. the method for making of Electronic Paper as claimed in claim 14 unit is characterized in that, cuts and wears this water barrier and this electronic ink layer, also comprises with this surperficial step that manifests this membrane transistor layer:
Cut and wear this adhesive coating, to manifest this surface of this membrane transistor layer.
16. the method for making of Electronic Paper as claimed in claim 7 unit is characterized in that, also comprises:
Cleaning also reclaims this rigid substrate.
CN201110402638.4A 2010-12-17 2011-11-30 Electronic paper unit and manufacturing method thereof Active CN102654711B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099144527 2010-12-17
TW99144527 2010-12-17

Publications (2)

Publication Number Publication Date
CN102654711A true CN102654711A (en) 2012-09-05
CN102654711B CN102654711B (en) 2014-07-09

Family

ID=44173924

Family Applications (2)

Application Number Title Priority Date Filing Date
CN 201110026774 Pending CN102109728A (en) 2010-12-17 2011-01-20 Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit
CN201110402638.4A Active CN102654711B (en) 2010-12-17 2011-11-30 Electronic paper unit and manufacturing method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN 201110026774 Pending CN102109728A (en) 2010-12-17 2011-01-20 Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit

Country Status (1)

Country Link
CN (2) CN102109728A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112577539A (en) * 2020-12-07 2021-03-30 潍坊歌尔微电子有限公司 Waterproof sensor and electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108717832B (en) * 2018-06-04 2020-04-24 京东方科技集团股份有限公司 Display substrate mother board, preparation method and cutting method thereof, display substrate and display device
CN108828871B (en) * 2018-07-24 2021-08-24 上海天马微电子有限公司 Manufacturing method of flexible electronic paper and flexible electronic paper device thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460513A (en) * 1990-06-28 1992-02-26 Sharp Corp Production of liquid crystal display element
TW200632484A (en) * 2004-11-30 2006-09-16 Koninkl Philips Electronics Nv Electronic ink display device and method for manufacturing the same
JP2007322766A (en) * 2006-06-01 2007-12-13 Seiko Epson Corp Liquid crystal display device and electronic equipment
CN101833215A (en) * 2009-03-09 2010-09-15 财团法人工业技术研究院 Transfer structure of flexible electronic device and manufacturing method thereof
CN101872100A (en) * 2010-06-18 2010-10-27 友达光电股份有限公司 Electronic ink display and manufacturing method thereof
CN101877319A (en) * 2009-04-30 2010-11-03 乐金显示有限公司 Method of manufacturing flexible display device
CN101916022A (en) * 2010-07-06 2010-12-15 友达光电股份有限公司 Flexible display panel and manufacturing method thereof
CN101916733A (en) * 2010-07-12 2010-12-15 友达光电股份有限公司 Manufacturing method of display panel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460513A (en) * 1990-06-28 1992-02-26 Sharp Corp Production of liquid crystal display element
TW200632484A (en) * 2004-11-30 2006-09-16 Koninkl Philips Electronics Nv Electronic ink display device and method for manufacturing the same
JP2007322766A (en) * 2006-06-01 2007-12-13 Seiko Epson Corp Liquid crystal display device and electronic equipment
CN101833215A (en) * 2009-03-09 2010-09-15 财团法人工业技术研究院 Transfer structure of flexible electronic device and manufacturing method thereof
CN101877319A (en) * 2009-04-30 2010-11-03 乐金显示有限公司 Method of manufacturing flexible display device
CN101872100A (en) * 2010-06-18 2010-10-27 友达光电股份有限公司 Electronic ink display and manufacturing method thereof
CN101916022A (en) * 2010-07-06 2010-12-15 友达光电股份有限公司 Flexible display panel and manufacturing method thereof
CN101916733A (en) * 2010-07-12 2010-12-15 友达光电股份有限公司 Manufacturing method of display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112577539A (en) * 2020-12-07 2021-03-30 潍坊歌尔微电子有限公司 Waterproof sensor and electronic device

Also Published As

Publication number Publication date
CN102654711B (en) 2014-07-09
CN102109728A (en) 2011-06-29

Similar Documents

Publication Publication Date Title
CN102768439B (en) Manufacturing method for motherboard orientation film, transfer printing panel and orientation liquid
CN101517438B (en) Surface protection film and optical film with surface protection film
US20120033304A1 (en) Data Security Screen and Manufacturing Method Thereof
CN102057313B (en) Method for processing substrate of mother board
CN104321696A (en) Electrochromic window fabrication methods
JP5267955B2 (en) Method for manufacturing electrophoretic display device
CN101251669A (en) Methods for making LCD panel display unit and structure thereof
KR101274852B1 (en) Floor panel having adhesive applied sheet
CN102629015A (en) Flexible display device and manufacturing method thereof
CN102654711A (en) Electronic paper unit and manufacturing method thereof
CN109445000B (en) Protective film, mother film, polarizer assembly, preparation method of polarizer assembly, mother film assembly and preparation method of display module
CN101356471A (en) Method for manufacturing surface protection board for liquid crystal display device and method for manufacturing liquid crystal display device
KR101191485B1 (en) Cutter and device for cutting and peeling film
US20120154897A1 (en) Electronic paper unit and method for fabricating electronic paper unit
CN104035244A (en) Liquid-crystal display panel and manufacturing method thereof
JP2012013790A (en) Manufacturing method and manufacturing apparatus of electronic paper
CN102830542A (en) Polaroid and manufacturing methods of display panel and polaroid
CN101206328A (en) Optical film and manufacturing method thereof as well as substrate structure and display panel using the optical film
CN101172780A (en) Method of depositing functional films on substrates such as glass sheets and film-coating machine for implementing said method
US20090314421A1 (en) Decorative architectural glass panel method and apparatus
CN109678353B (en) Single-side multi-sheet glass thinning processing method
US9283585B2 (en) Sheet of masking means
CN112646509A (en) OCA optical cement and preparation method thereof
US20150036208A1 (en) Electrophoretic display device
TWI698657B (en) Manufacturing method of optical laminate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151013

Address after: Taiwan, China Hsinchu science and Technology Park Road, No. 3

Patentee after: Yuantai Science and Technology Industry Co., Ltd.

Address before: Taiwan, China Hsinchu science and Technology Industrial Park, Hsinchu Road, No. two, No. 1

Patentee before: AU Optronics Corporation