CN102634829A - Meshed-plate mould with patterns and method for forming patterns on a workpiece - Google Patents
Meshed-plate mould with patterns and method for forming patterns on a workpiece Download PDFInfo
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- CN102634829A CN102634829A CN2011100388865A CN201110038886A CN102634829A CN 102634829 A CN102634829 A CN 102634829A CN 2011100388865 A CN2011100388865 A CN 2011100388865A CN 201110038886 A CN201110038886 A CN 201110038886A CN 102634829 A CN102634829 A CN 102634829A
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Abstract
The invention discloses a meshed-plate mould with patterns and a method for forming patterns on a workpiece. The meshed-plate mould with patterns comprises a porous base material and a covering pattern layer arranged on the porous base material. The covering pattern layer comprises a patterning covering area which covers a part of the porous base material. In the process of electroplating or etching, the meshed-plate mould with patterns is pressed against the workpiece, the patterning covering area covers a part of the surface of the workpiece, and the workpiece and the meshed-plate mould with patterns are put in a plating bath or an etching bath to perform electroplating or etching reaction on the part of the workpiece which is not covered by the patterning covering area, so that electroplating patterns or etching patterns are formed on the workpiece. A meshed structure can be clamped between the porous base material and the covering pattern layer. The method for forming patterns by virtue of the meshed-plate mould with patterns has the advantages that the manufacture process is simplified, the manufacture time is greatly reduced and the product yield is improved.
Description
Technical field
The present invention is applied to electroplate and etched mould and use this mould and electroplate or the method for etched pattern to form about a kind of, and particularly a kind of have the web plate mould of pattern and use this to have the web plate mould of pattern and on workpiece, form method of patterning.
Background technology
Electroplate with etching be the complete processing that many products all need be used, handle, make plating and etching of circuit in manufacturing and the circuit card of manufacturing, IC foot rest of outward appearance etching lines, inscription plate or the like like outward appearance.Each industry is mostly similar with etched method of manufacture for the plating that needs specific pattern or circuit at present; Fig. 1 a to Fig. 1 e is depicted as existing a kind of electro-plating method schema that on workpiece, forms pattern; Shown in Fig. 1 a, can prevent the sensitive materials 12 that plates or carry out pad pasting prior to printing on the workpiece 10 or coating one deck; Then shown in Fig. 1 b, use photomask 14 to make public, and shown in Fig. 1 c, carry out developing procedure, so that patterning sensitive materials 12 manifests the workpiece surface 101 of desiring to adhere to electrolytic coating with pattern; Afterwards shown in Fig. 1 d, workpiece 10 placed together with patterning sensitive materials 12 carry out electroplating work procedure in the plating tank (not shown), use in the workpiece surface that appears 101 and form an electrolytic coating 16; Carry out stripping at last, sensitive materials 12 is removed, shown in Fig. 1 e, patterned electricity coating 16 promptly is formed on the workpiece 10.
Fig. 2 a to Fig. 2 e is depicted as existing a kind of engraving method schema that on workpiece, forms pattern; Shown in Fig. 2 a, prior to printing on the workpiece 10 or being coated with one deck sensitive materials 12 against corrosion or carrying out pad pasting, then shown in Fig. 2 b; The photomask 14 that use has pattern makes public; And shown in Fig. 2 c, carry out developing procedure, with the patterning sensitive materials 12 cover parts etched workpiece surface 101 of desire not; Afterwards shown in Fig. 2 d, workpiece 10 placed together with patterning sensitive materials 12 carry out etching work procedure in the etching bath (not shown), the workpiece surface of using being covered by sensitive materials 12 101 does not carry out etching and forms groove 18; Carry out stripping at last, sensitive materials 12 is removed, shown in Fig. 2 e, promptly on workpiece 10, etch specific groove 18 patterns.
No matter above-mentioned is to electroplate or etching work procedure, mainly all is warp printing earlier or coating sensitive materials, exposure, development, electroplates then or etching, and stripping is to remove anti-plating or sensitive materials against corrosion again; In these processes; In order to limit the zone of plating or etching action,, also need repeat to be coated with sensitive materials, exposure, development again and again even if manufacture identical pattern to produce required specific pattern or circuit; Reach high temperature, high humidity, strong acid, alkaline operations such as stripping; Process complexity is high, and needs to use a large amount of water power and all kinds of chemical, and is bigger to the injury of environment.
Summary of the invention
In order to address the above problem, the present invention seeks to propose a kind ofly to have the web plate mould of pattern and use this to have the web plate mould of pattern and on workpiece, form method of patterning, to simplify production process, significantly to shorten manufacturing lead time and promote the product yield; Also can reduce cost, reduce the user demand of water power and all kinds of chemical, significantly reduce injury environment.
In order to achieve the above object; A kind of web plate mould with pattern is provided according to an aspect of the present invention; Comprise: a web plate structure comprises the skeleton construction that one deck reticulated structure and frame at least are located at a cancellated periphery, and reticulated structure includes a relative first surface and a second surface; One covers patterned layer, is connected in cancellated first surface or extends on the second surface, covers patterned layer and comprises a cancellated patterning shelterarea, cover part; One porous substrate is arranged at cancellated second surface, and porous substrate has that hole flows in hole for a reaction liquid and the reticulated structure of flowing through is not patterned the shelterarea region covered.
A kind of web plate mould with pattern is provided according to a further aspect of the invention, comprises: a porous substrate, it has hole and flows in hole for a reaction liquid; And one cover patterned layer, is connected in a side of porous substrate and stretches in the porous substrate, covers patterned layer and comprise cover part, patterning shelterarea porous substrate.
According to another aspect of the invention a kind of method of patterning that on workpiece, forms is provided, comprises: a workpiece is provided, has a working-surface; Provide one have a pattern the web plate mould, it comprises a porous substrate and is arranged at one on the porous substrate and covers patterned layer, covers patterned layer and includes a patterning shelterarea; Setting has the web plate mould of pattern on workpiece, makes patterning shelterarea shaded portions workpiece surface; The web plate mould of putting workpiece and having pattern makes flow through porous substrate and be not patterned the part workpiece surface that covers the shelterarea and carry out chemical reaction of a reaction liquid in the reactive tank in a reactive tank; And remove web plate mould with pattern.
The invention has the beneficial effects as follows: repeat to be coated with sensitive materials, exposure, development, baking in the instead traditional technology, and complicated procedures of forming such as the high temperature of stripping, high humidity, strong acid, highly basic.As far as the yield production type product, so can minus many production process, significantly shorten manufacturing lead time, promote the product yield, and the demand of saving many water power and chemical, can effectively reduce cost, significantly reduce injury to environment.
Description of drawings
Fig. 1 a to Fig. 1 e is depicted as existing a kind of electro-plating method schema that on workpiece, forms pattern.
Fig. 2 a to Fig. 2 e is depicted as existing a kind of engraving method schema that on workpiece, forms pattern.
The web plate mould synoptic diagram that has pattern for one embodiment of the invention shown in Figure 3.
The web plate mould synoptic diagram that has pattern for further embodiment of this invention shown in Figure 4.
Shown in Figure 5 is that one embodiment of the invention forms the method for patterning schematic flow sheet on workpiece.
Fig. 6 a to Fig. 6 e is depicted as first embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section.
Fig. 7 a to Fig. 7 e is depicted as second embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section.
Fig. 8 a to Fig. 8 e is depicted as third embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section.
Fig. 9 a to Fig. 9 e is depicted as fourth embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section, and it is in order to carry out the etching of circuit board line pattern.
Figure 10 a to Figure 10 g is depicted as fifth embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section.
Embodiment
Shown in Figure 3 for one embodiment of the invention has the web plate mould synoptic diagram of pattern, as shown in Figure 3, the web plate mould 20 with pattern comprises a web plate structure 22, and covers a patterned layer 24 and a porous substrate 26, and constitutes a three layers structure.Web plate structure 22 comprises one or more layers reticulated structure 221, and the periphery of reticulated structure 221 is established with a skeleton construction 222 frames, and reticulated structure 221 includes a relative first surface 223 and a second surface 224; Cover the first surface 223 that patterned layer 24 is connected in reticulated structure 221; Cover patterned layer 24 and comprise a patterning shelterarea 241 of cover part reticulated structure 221; Wherein patterning shelterarea 241 is to form with mechanical workout, laser processing or chemical process mode; In another embodiment, cover the first surface 223 that patterned layer 24 can be connected in reticulated structure 22 and extend to second surface 224; Porous substrate 26 is arranged at the second surface 224 of reticulated structure 221, and porous substrate 26 has the hole (not shown) and is not patterned not shelterarea 242 of patterning that shelterarea 241 covers for a reaction liquid (not shown) unrestricted flow and the reticulated structure 221 of flowing through in hole.
When using this web plate mould 20 in an electroplating work procedure or etching work procedure with pattern; Be that this web plate mould 20 with pattern is pressure bonded on the workpiece (not shown) of desire formation pattern; Make patterning shelterarea 241 shaded portions workpiece surface; And workpiece inserted in plating tank or the etching bath together with the web plate mould 20 with pattern; Be not patterned in the reticulated structure 221 patterning that shelterarea 241 covers not shelterarea 242 tolerable electroplate liquids or etching solution shuttle back and forth, do not electroplate or etching reaction being patterned the part workpiece surface that covers shelterarea 241, and on workpiece, form plated pattern or etched pattern.Wherein the material of porous substrate 26 and the material that covers patterned layer 24 are the erosive materials of all selecting to resist electroplate liquid or etching solution.
Above-mentioned explanation continues; When electroplating or during chemical operation such as etching; Be to utilize 222 pairs of reticulated structures 221 of skeleton construction that a tension force is provided,, produce fold or displacement when avoiding operation to keep reticulated structure 221 and the smooth and dimensional precision of covering patterned layer 24 that combines; Moreover; When carrying out operation; The 26 pairs of reticulated structures 221 of porous substrate that are positioned at reticulated structure 221 second surfaces 224 apply a pressure; Make reticulated structure 221 drives cover patterned layer 24 and fit tightly, use on the localized area of workpiece and accomplish covering protection, so can carry out the plating or the etching operation of pattern or circuit with workpiece; Separable or the tight annexation that is configured to of porous substrate 26 and reticulated structure 221 wherein.
The web plate mould synoptic diagram that has pattern for further embodiment of this invention shown in Figure 4; As shown in Figure 4; Web plate mould 20 with pattern comprises a porous substrate 26 and and covers patterned layer 24; This covers patterned layer 24 and is arranged at a side of porous substrate 26 and stretches in the porous substrate; And constitute one or two layered structures, and cover patterned layer 24 and comprise a patterning shelterarea 241 with patterning cover part porous substrate 26, wherein patterning shelterarea 241 is to form with mechanical workout, laser processing or chemical process mode.
When using the web plate mould 20 with pattern shown in Figure 4 in electroplating work procedure or etching work procedure; Shelterarea 242 tolerable electroplate liquids or etching solution do not shuttle back and forth not to be patterned patterning that shelterarea 241 covers in the porous substrate 26; Do not electroplate or etching reaction being patterned the part workpiece (not shown) surface of covering shelterarea 241, and on workpiece, form plated pattern or etched pattern.
Above-mentioned explanation continues; When workpiece surface has height when rising and falling; Porous substrate 26 surface and on patterned shielding 24 can form one and have the structure of fluctuating three-dimensional structure; With the high end fluctuating coupling of workpiece surface, to use when the web plate mould 20 with pattern is pressure bonded to workpiece, the patterning shelterarea 241 of covering patterned layer 24 fits tightly with workpiece surface.
In the present invention; Web plate mould 20 with pattern can adopt two laminars or triple layer designs respectively according to the dimensional precision demand of workpiece pattern; The design of two laminars can be adopted to the not high product of pattern accuracy requirement, then triple layer designs can be adopted pattern accuracy requirement high product.No matter being that the web plate mould 20 with pattern of two laminars or three-layer type is all reusable desires to be manufactured with on the workpiece of identical patterns in each; And the web plate mould 20 that only need will have pattern is pressed on the workpiece can be electroplated or etching; Improve existing need and repeat to be coated with sensitive materials, exposure, development to each workpiece; And complicated procedures of forming such as the high temperature of stripping, high humidity, strong acid, highly basic could form the disappearance of pattern on each workpiece, and compared to traditional technology, the present invention can be minused many production process; Significantly shorten manufacturing lead time; Promote the product yield, and the demand of saving many water power and chemical, for reducing cost and environment protection all is very helpful.On the other hand, when cooperating the continuity production demand of coiled strip, it is one cylindric that the web plate mould with pattern also can be made as, and through the dimensional precision of covering patterned layer on the tangential direction of control cylinder make one have high pattern precision product.
Shown in Figure 5 is that one embodiment of the invention forms the method for patterning schematic flow sheet on workpiece; As shown in the figure; The web plate mould that provides a workpiece and to have pattern, this is a step 30, wherein workpiece has a workpiece surface; And the web plate mould with pattern can be the three layers structure that comprises the web plate structure, covers patterned layer and porous substrate shown in Figure 3, or covers two layered structures of patterned layer and porous substrate for shown in Figure 4 comprising; The web plate mould that then will have pattern is pressed on the workpiece, and covers cover part, the patterning shelterarea workpiece surface of patterned layer, and this is a step 32; The web plate mould of putting workpiece afterwards and having pattern makes flow through porous substrate and be not patterned the part workpiece surface that covers the shelterarea and carry out chemical reaction of a reaction liquid in the reactive tank in a reactive tank, this is a step 34; After chemical reaction is accomplished, remove the web plate mould with pattern at last, this is a step 36.
In an embodiment, above-mentioned reactive tank is a plating tank, and reaction liquid is an electroplate liquid, and chemical reaction is not form a plated pattern in being patterned the part workpiece surface that covers the shelterarea.In another embodiment, reactive tank is a chemical milling groove or electrolytically etching groove, and reaction liquid is an etching solution, and chemical reaction is not form an etched pattern in being patterned the part workpiece surface that covers the shelterarea.The above-mentioned on the other hand web plate mould with pattern and the pressing of workpiece can be carried out in plating tank or etching bath.
For making the object of the invention, feature and advantage more obviously understandable, below propose five kinds and use the diagrammatic cross-section that on workpiece, forms method of patterning of the present invention.
Fig. 6 a to Fig. 6 e is depicted as first embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section.At first, shown in Fig. 6 a, prepare the web plate mould 20 with pattern of two laminars, it comprises a porous substrate 26 and and covers patterned layer 24; Then shown in Fig. 6 b, the web plate mould 20 that will have pattern presses together with workpiece 40, makes patterning shelterarea 241 shaded portions workpiece surface 401; Place the plating tank (not shown) to electroplate workpiece 40 and web plate mould 20 with pattern afterwards, shown in Fig. 6 c, form an electrolytic coating 42 in being patterned the part workpiece surface 401 that covers shelterarea 241; Then shown in Fig. 6 d, the web plate mould 20 that will have pattern was opened with workpiece in 40 minutes, and accomplished electrolytic coating 42 patterns as Fig. 6 e shown on the workpiece surface 401 this moment; The web plate mould 20 with pattern after separating then presses together in order to the workpiece 40 with another replacing, repeats the step of Fig. 6 b to Fig. 6 d, can accomplish electrolytic coating 42 patterns shown in Fig. 6 e once more.
Fig. 7 a to Fig. 7 e is depicted as second embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section, and etching is carried out in its localized area that is used to workpiece.At first, shown in Fig. 7 a, prepare the web plate mould 20 with pattern of two laminars, it comprises a porous substrate 26 and and covers patterned layer 24; Then shown in Fig. 7 b, the web plate mould 20 that will have pattern presses together with workpiece 40, makes patterning shelterarea 241 shaded portions workpiece surface 401; Place the etching bath (not shown) to carry out etching workpiece 40 and web plate mould 20 with pattern afterwards, shown in Fig. 7 c, do not cover 241 part workpiece surface 401 and form an etched recesses in being patterned the shelterarea; Then shown in Fig. 7 d, the web plate mould 20 that will have pattern was opened with workpiece in 40 minutes, and accomplished etched recesses 44 patterns as Fig. 7 e shown on the workpiece surface 401 this moment; The web plate mould 20 with pattern after separating then presses together in order to the workpiece 40 with another replacing, repeats the step of Fig. 7 b to Fig. 7 d, can accomplish etched recesses 44 patterns shown in Fig. 7 e once more.
Fig. 8 a to Fig. 8 e is depicted as third embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section, is to be example with the plating of carrying out circuit card secondary copper at this.At first, shown in Fig. 8 a, prepare the web plate mould 20 with pattern of three-layer type, it comprises a web plate structure 22, and covers a patterned layer 24 and a porous substrate 26; Then shown in Fig. 8 b, the web plate mould 20 that will have pattern presses together with workpiece 40, makes patterning shelterarea 241 shaded portions workpiece surface 401, and wherein workpiece 40 is circuit cards; Place the plating tank (not shown) to electroplate workpiece 40 and web plate mould 20 with pattern afterwards, shown in Fig. 8 c, form an electrolytic coating 42 in being patterned the part workpiece surface 401 that covers shelterarea 241; Then shown in Fig. 8 d, the web plate mould 20 that will have pattern was opened with workpiece in 40 minutes, and accomplished electrolytic coating 42 patterns as Fig. 8 e shown on the workpiece surface 401 this moment; The web plate mould 20 with pattern after separating then presses together in order to the workpiece 40 with another replacing, repeats the step of Fig. 8 b to Fig. 8 d, can accomplish electrolytic coating 42 patterns shown in Fig. 8 e once more.Wherein circuit card ought be accomplished boring, platingization copper earlier, electroplate a step such as copper before the processing that imposes secondary copper is electroplated, and also must apply other operation in addition after accomplishing this plating processing.
Fig. 9 a to Fig. 9 e is depicted as fourth embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section, and it is in order to carry out the etching of circuit board line pattern.At first, shown in Fig. 9 a, prepare the web plate mould 20 with pattern of three-layer type, it comprises a web plate structure 22, and covers a patterned layer 24 and a porous substrate 26; Then shown in Fig. 9 b, the web plate mould 20 that will have pattern presses together with workpiece 40, makes patterning shelterarea 241 shaded portions workpiece surface 401, and wherein workpiece 40 is circuit cards, and wherein workpiece 40 is circuit cards; Place the etching bath (not shown) to carry out etching workpiece 40 and web plate mould 20 with pattern afterwards, shown in Fig. 9 c, form an etched recesses 44 in being patterned the part workpiece surface 401 that covers shelterarea 241; Then shown in Fig. 9 d, the web plate mould 20 that will have pattern was opened with workpiece in 40 minutes, and accomplished etched recesses 44 patterns as Fig. 9 e shown on the workpiece surface this moment; The web plate mould 20 with pattern after separating then presses together in order to the workpiece 40 with another replacing, repeats the step of Fig. 9 b to Fig. 9 d, can accomplish etched recesses 44 patterns shown in Fig. 9 e once more.
Figure 10 a to Figure 10 g is depicted as fifth embodiment of the invention and on workpiece, forms the method for patterning diagrammatic cross-section, and it is a conducting wire pattern of electroplating circuit board manufacturing with indirect additive process.At first, shown in Figure 10 a, prepare the web plate mould 20 with pattern of three-layer type, it comprises a web plate structure 22, and covers a patterned layer 24 and a porous substrate 26; Then shown in Figure 10 b; The web plate mould 20 that will have pattern presses together with workpiece 40; Make patterning shelterarea 241 shaded portions workpiece surface 401, wherein the material of workpiece 40 is difficult plating materials, that is the metal in workpiece 40 and the plating has lower bonding force; Place the plating tank (not shown) to electroplate workpiece 40 and web plate mould 20 with pattern afterwards, shown in Figure 10 c, do not form an electrolytic coating 42 for as a metallic conduction circuit in being patterned the part workpiece surface 401 that covers shelterarea 241; Then shown in Figure 10 d, the web plate mould 20 that will have pattern was opened with workpiece in 40 minutes, and accomplished electrolytic coating 42 patterns as Figure 10 e shown on the workpiece surface 401 this moment; Afterwards shown in Figure 10 f, with workpiece 40 and a dielectric material 46 pressings, and more than the glass transition temperature with temperature increase to dielectric material 46, reduce temperature again to glass transition temperature after keeping appropriate time; Separate workpiece 40 and dielectric material 46 at last, originally be plated on the electrolytic coating 42 on the workpiece 40 this moment, and promptly the metallic conduction circuit is transferred on the dielectric material 46, shown in Figure 10 g, can make a basic circuit plate 50.This can press together the workpiece 40 that electrolytic coating 42 shifts with the web plate mould 20 with pattern after above-mentioned the separation once more again, repeats the step of Figure 10 b to Figure 10 d, can accomplish the metallic conduction circuit shown in Figure 10 e once more; And the step that repeats Figure 10 f to Figure 10 g, can make a basic circuit plate 50 once more.
In the above embodiments all with single-sided process as demonstration; Must add man-hour as if two-sided; Can manufacture the figuratum web plate mould of two tacklings respectively, two-sidedly all cover required web plate mould man-hour, get into again in plating tank or the etching bath and process with pattern in adding.
The method of patterning that on workpiece, forms of the present invention repeats to be coated with sensitive materials, exposure, development, baking in the instead traditional technology, and complicated procedures of forming such as the high temperature of stripping, high humidity, strong acid, highly basic.As far as the yield production type product, so can minus many production process, significantly shorten manufacturing lead time, promote the product yield, and the demand of saving many water power and chemical, can effectively reduce cost, significantly reduce injury to environment.
Above-described embodiment only is explanation technological thought of the present invention and characteristics; Its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this; When not limiting claim of the present invention with it; Be that every equalization of doing according to disclosed spirit changes or modification, must be encompassed in the claim of the present invention.
Claims (16)
1. the web plate mould with pattern is characterized in that, comprises:
One web plate structure, it comprises an one deck reticulated structure and a skeleton construction at least, and this skeleton construction frame is located at this cancellated periphery, and this reticulated structure includes a relative first surface and a second surface;
One covers patterned layer, is linked to this cancellated this first surface, and this covers patterned layer and comprises this cancellated patterning shelterarea, cover part; And
One porous substrate is arranged at this cancellated this second surface, and this porous substrate has hole and flows in this hole for a reaction liquid and flow through that this is cancellated not by this patterning shelterarea region covered.
2. the web plate mould with pattern according to claim 1 is characterized in that, this covers patterned layer and is connected in this cancellated this first surface and extends to this second surface.
3. the web plate mould with pattern according to claim 1 is characterized in that this skeleton construction provides a tension force to this reticulated structure, covers the smooth of patterned layer to keep this.
4. the web plate mould with pattern according to claim 1 is characterized in that, this reaction liquid is an electroplate liquid or an etching solution.
5. the web plate mould with pattern according to claim 4 is characterized in that, this material that covers patterned layer is anti-plating or material against corrosion.
6. the web plate mould with pattern according to claim 1 is characterized in that, the patterning shelterarea is to form with mechanical workout, laser processing or chemical process.
7. the web plate mould with pattern is characterized in that, comprises:
One porous substrate, it has hole, flows in this hole for a reaction liquid; And
One covers patterned layer, is connected in a side of this porous substrate and stretches in this porous substrate, and this covers the patterning shelterarea that patterned layer comprises this porous substrate of cover part.
8. the web plate mould with pattern according to claim 7 is characterized in that, this reaction liquid is an electroplate liquid or an etching solution.
9. the web plate mould with pattern according to claim 8 is characterized in that, this material that covers patterned layer is anti-plating or material against corrosion.
10. the web plate mould with pattern according to claim 7 is characterized in that, this patterning shelterarea is to form with mechanical workout, laser processing or chemical process.
11. one kind forms method of patterning on workpiece, it is characterized in that, comprises:
One workpiece is provided, has a working-surface;
Provide one have a pattern the web plate mould, it comprises a porous substrate and is arranged at one on this porous substrate and covers patterned layer, this covers patterned layer and includes a patterning shelterarea;
Setting has the web plate mould of pattern on this workpiece, makes this patterning shelterarea this workpiece surface of shaded portions;
Put this workpiece and this web plate mould in a reactive tank, make a reaction liquid in this reactive tank flow through this porous substrate and this workpiece surface of part of not covered by this patterning shelterarea carries out chemical reaction with pattern; And
Remove the web plate mould that this has pattern.
12. the method for patterning that on workpiece, forms according to claim 11; It is characterized in that; This reactive tank is a plating tank, and this reaction liquid is an electroplate liquid, and this chemical reaction is to form a plated pattern in this workpiece surface of part that is not covered by this patterning shelterarea.
13. the method for patterning that on workpiece, forms according to claim 11; It is characterized in that; This reactive tank is an etching bath, and this reaction liquid is an etching solution, and this chemical reaction is to form an etched pattern in this workpiece surface of part that is not covered by this patterning shelterarea.
14. the method for patterning that on workpiece, forms according to claim 11 is characterized in that, this web plate mould with pattern also comprises and is arranged at this porous substrate and this covers the web plate structure between the patterned layer.
15. the method for patterning that on workpiece, forms according to claim 14; It is characterized in that; This web plate structure comprises the skeleton construction that one deck reticulated structure and frame at least are located at this cancellated periphery; This reticulated structure covers patterned layer with this and combines, and this skeleton construction provides a tension force to this reticulated structure, covers the smooth of patterned layer to keep this.
16. the method for patterning that on workpiece, forms according to claim 11 is characterized in that, this material that covers patterned layer is anti-plating or material against corrosion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100388865A CN102634829A (en) | 2011-02-10 | 2011-02-10 | Meshed-plate mould with patterns and method for forming patterns on a workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100388865A CN102634829A (en) | 2011-02-10 | 2011-02-10 | Meshed-plate mould with patterns and method for forming patterns on a workpiece |
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| Publication Number | Publication Date |
|---|---|
| CN102634829A true CN102634829A (en) | 2012-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100388865A Pending CN102634829A (en) | 2011-02-10 | 2011-02-10 | Meshed-plate mould with patterns and method for forming patterns on a workpiece |
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| CN (1) | CN102634829A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400098A (en) * | 2016-05-26 | 2017-02-15 | 区佩金 | Novel etching solution and process thereof |
| CN109234687A (en) * | 2018-10-10 | 2019-01-18 | 合肥联宝信息技术有限公司 | A kind of forming method of figure and texture |
| CN109692795A (en) * | 2018-11-20 | 2019-04-30 | 吴江市格瑞福金属制品有限公司 | A kind of metallic insulation pad process for surface coating |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4242401A (en) * | 1978-01-24 | 1980-12-30 | Mitani Electronics Industry Corp. | Screen-printing mask |
| JPH04255395A (en) * | 1991-02-07 | 1992-09-10 | Mitsumi Electric Co Ltd | Screen for printing and forming method therefor |
| US6123023A (en) * | 1997-09-22 | 2000-09-26 | Riso Kagaku Corporation | Stencil printing method and apparatus |
| JP2001113850A (en) * | 1999-10-19 | 2001-04-24 | Matsushita Electric Ind Co Ltd | Screen printing plate |
| CN101318401A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Screen printing plate and manufacturing method thereof |
| CN101360849A (en) * | 2005-11-18 | 2009-02-04 | 莱里斯奥鲁斯技术公司 | Method for forming multi-layer structure |
| JP2009297925A (en) * | 2008-06-10 | 2009-12-24 | Noritake Co Ltd | Screen mask |
-
2011
- 2011-02-10 CN CN2011100388865A patent/CN102634829A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4242401A (en) * | 1978-01-24 | 1980-12-30 | Mitani Electronics Industry Corp. | Screen-printing mask |
| JPH04255395A (en) * | 1991-02-07 | 1992-09-10 | Mitsumi Electric Co Ltd | Screen for printing and forming method therefor |
| US6123023A (en) * | 1997-09-22 | 2000-09-26 | Riso Kagaku Corporation | Stencil printing method and apparatus |
| JP2001113850A (en) * | 1999-10-19 | 2001-04-24 | Matsushita Electric Ind Co Ltd | Screen printing plate |
| CN101360849A (en) * | 2005-11-18 | 2009-02-04 | 莱里斯奥鲁斯技术公司 | Method for forming multi-layer structure |
| CN101318401A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Screen printing plate and manufacturing method thereof |
| JP2009297925A (en) * | 2008-06-10 | 2009-12-24 | Noritake Co Ltd | Screen mask |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400098A (en) * | 2016-05-26 | 2017-02-15 | 区佩金 | Novel etching solution and process thereof |
| CN109234687A (en) * | 2018-10-10 | 2019-01-18 | 合肥联宝信息技术有限公司 | A kind of forming method of figure and texture |
| CN109692795A (en) * | 2018-11-20 | 2019-04-30 | 吴江市格瑞福金属制品有限公司 | A kind of metallic insulation pad process for surface coating |
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Application publication date: 20120815 |