CN102628580A - Light guide plate structure, backlight module and manufacturing method thereof - Google Patents
Light guide plate structure, backlight module and manufacturing method thereof Download PDFInfo
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Abstract
The invention relates to a light guide plate structure, a backlight module and a manufacturing method thereof, wherein the light guide plate structure comprises a light guide plate, a light conversion element and an optical moisture-proof layer. The light guide plate is provided with a light incident surface, and the optical moisture-proof layer covers on the light incident surface. The light conversion element is positioned on the light incident surface and between the light guide plate and the optical moisture-proof layer. The optical moisture-proof layer is used for isolating the light conversion element from the outside so as to prevent the light conversion element from being damped to accelerate the attenuation of the light conversion efficiency.
Description
Technical field
The present invention is about a kind of backlight module, particularly about a kind of light conducting plate structure, backlight module and manufacturing approach thereof.
Background technology
Liquid crystal indicator has been widely used in the electronic products such as personal digital assistant, notebook computer, digital camera, mobile phone, LCD TV.But because liquid crystal indicator is non-self-luminosity, so it need be by backlight module ability tool Presentation Function.
Liquid crystal indicator mainly is made up of a liquid crystal panel and a backlight module.Liquid crystal panel mainly comprises two transparency carriers and a liquid crystal layer, and this liquid crystal layer configuration is between this two transparency carrier.The exiting surface of backlight module to provide this liquid crystal panel required area source, causes liquid crystal indicator to reach the effect of demonstration towards liquid crystal layer.
Existing backlight module adopts the cold cathode fluorescent lamp pipe as light source mostly.In recent years, because the lifting of photoelectric cell technical level, (light emitting diode LED) has plurality of advantages such as small size, low operating current, low power consumption, life-span length and low preparation cost to light emitting diode.Therefore, use light emitting diode, become the another kind of new selection of backlight module as light source.
It should be noted that backlight module directly adopts white light emitting diode usually, or use a plurality of red light-emitting diodes, green light LED and blue light-emitting diode simultaneously with, in the hope of obtaining the white light source of suitable colour temperature as light emitting source.
General common white light emitting diode with red light-emitting diode wafer, green light LED wafer and blue light-emitting diode wafer package in single packing colloid, through ruddiness, green glow and blue light that each LED wafer sent with the formation white light.In this; In the white light emitting diode of this framework, must use minimum LED wafer more than three, and the LED wafer of different colours drives individually usually; Through controlling the electric current of the LED wafer that feeds different colours, to obtain the white light of suitable colour temperature.Therefore, the white light emitting diode of this framework not only cost can't reduce, and is also comparatively complicated on driving.
On another kind of framework, white light emitting diode can be that blue light-emitting diode wafer and fluorescent material are packaged in the single packing colloid.In this white light emitting diode, fluorescent material is blue-light excited by the part that the blue light-emitting diode wafer is sent, and further sends gold-tinted.Then, behind the abundant mixed light of blue light that gold-tinted that produces through fluorescent material and blue light-emitting diode wafer are sent, can produce white light.So; Because the packaging body of light emitting diode generally is to drop onto on the LED wafer with a glue mode; And form via being heating and curing; Therefore its surface is arc curve mostly, makes that the fluorescent material distributing homogeneity is wayward in the packaging body, and then causes formed white light source uniformity of luminance relatively poor and luminous efficiency is lower.Moreover, because the white light emitting diode of this framework needs the outer premium of amount paid on the implementation, therefore on manufacturing cost, also can't reduce effectively.
Summary of the invention
In certain embodiments, the present invention provides a kind of light conducting plate structure, and it comprises LGP, light conversion element and optics damp-proof layer.
LGP has an incidence surface, and the optics damp-proof layer is covered on the incidence surface.
The light conversion element position on the incidence surface and the position between LGP and optics damp-proof layer.
In certain embodiments, the present invention also provides a kind of backlight module, and it comprises aforesaid light conducting plate structure and at least one spot light.
The corresponding light conversion element of spot light and being provided with, and with respect to light conversion element and the position at the opposite side of optics damp-proof layer.
In certain embodiments, incidence surface can have at least one pothole.In this, the light conversion element position is in each pothole, and the optics damp-proof layer covers at least one pothole.
Wherein, spot light is provided with corresponding to pothole.
In certain embodiments, the present invention provides a kind of manufacturing approach of light conducting plate structure in addition, and it comprises formation one light conversion element on the incidence surface of a LGP, and has covering one optics damp-proof layer on the incidence surface of light conversion element.Wherein, the light conversion element position is between LGP and optics damp-proof layer.
In certain embodiments, the present invention also provides a kind of manufacturing approach of backlight module, and it comprises the manufacturing approach of aforesaid light conducting plate structure, and is arranged to the side of a little less light source at the incidence surface of LGP.
In certain embodiments, the manufacturing approach of light conducting plate structure can also comprise: on incidence surface, form at least one pothole.In this, light conversion element then is formed in each pothole.
Wherein, spot light then is provided with corresponding to pothole.
In sum, utilize the optics damp-proof layer that light conversion element is isolated from the outside, quicken the decay of its light conversion efficiency to avoid light conversion element to make moist according to light conducting plate structure of the present invention, backlight module and manufacturing approach thereof.
Description of drawings
Fig. 1 is the vertical view according to the backlight module of first embodiment of the invention;
Fig. 2 is the vertical view according to the backlight module of second embodiment of the invention;
Fig. 3 is the sectional view of tangent line I-I among the 1st and 2 figure;
Fig. 4 is the vertical view according to the backlight module of third embodiment of the invention;
Fig. 5 is the sectional view of tangent line II-II among Fig. 4;
Fig. 6 is the upward view according to the backlight module of fourth embodiment of the invention;
Fig. 7 is the sectional view of tangent line III-III among Fig. 6;
Fig. 8 is the upward view according to the backlight module of fifth embodiment of the invention;
Fig. 9 is the sectional view of tangent line IV-IV among Fig. 8;
Figure 10 is the sectional view of tangent line V-V among Fig. 1;
Figure 11 is the sectional view of tangent line VI-VI among Fig. 2;
Figure 12 is the vertical view according to the backlight module of sixth embodiment of the invention;
Figure 13 is the vertical view according to the backlight module of seventh embodiment of the invention;
Figure 14 is the sectional view of tangent line VII-VII among Figure 13.
Wherein, Reference numeral:
10 backlight modules
110 light conducting plate structures
112 LGPs
The 112a incidence surface
The 112b first surface
The 112c second surface
112d the 3rd surface
112e the 4th surface
1,121 first blocks
1,122 second blocks
113 potholes
114 light conversion elements
1141 smooth conversion particles
1143 printing opacity colloids
115 light diffusion elements
1151 diffusion particles
1153 printing opacity colloids
116 optics damp-proof layers
120 spot lights
The 120a light-emitting area
The specific embodiment
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Fig. 1 is the vertical view according to the backlight module of first embodiment of the invention.Fig. 2 is the vertical view according to the backlight module of second embodiment of the invention.And Fig. 3 is the sectional view of tangent line I-I in Fig. 1 and 2.Fig. 4 is the vertical view according to the backlight module of third embodiment of the invention, and Fig. 5 is the sectional view of tangent line II-II among Fig. 4.Fig. 6 is the upward view according to the backlight module of fourth embodiment of the invention, and Fig. 7 is the sectional view of tangent line III-III among Fig. 6.
Referring to figs. 1 through 7, backlight module 10 comprises light conducting plate structure 110 and at least one spot light 120.
Each spot light 120 all is provided with towards light conducting plate structure 110 with light-emitting area.
Light conducting plate structure 110 comprises LGP 112, light conversion element 114 and optics damp-proof layer 116.In the present embodiment, LGP 112 can be plate LGP, but the present invention is as limit, and LGP 112 also can be the wedge shape LGP.
In certain embodiments, LGP 112 can have opposite first 112b and second surface 112c,, is respectively upper surface and lower surface at Fig. 3, the LGP 112 shown in 5 and 7 that is.
In certain embodiments, backlight module 10 can be side incident type backlight module, but the present invention is as limit, and backlight module 10 also can be straight-down negative (Direct-Type) backlight module.
Referring to figs. 1 through 3, be example with side incident type backlight module, incidence surface 112a for example is the side surface of linking between first surface 112b and second surface 112c of LGP 112, the first surface 112b of LGP 112 is then as exiting surface.At this moment, 120 of spot lights are with towards the incidence surface 112a of LGP 112 and dispose.
In certain embodiments, with reference to Fig. 4,5,6 and 7, with direct type backlight module, exiting surface and incidence surface 112a then can be respectively the first surface 112b and the second surface 112c of LGP 112.At this moment, 120 of spot lights are with array way and towards the incidence surface 112a (being second surface 112c) of LGP 112 and dispose.
Refer again to Fig. 1 to 7,114 of light conversion elements are on incidence surface 112a.Optics damp-proof layer 116 is covered on the incidence surface 112a, and 114 of light conversion elements are between LGP 112 and optics damp-proof layer 116.
In this, spot light 120 corresponding light conversion elements 114 and being provided with, and with respect to light conversion element 114 and the position at the opposite side of optics damp-proof layer 116.That is to say spot light 120 and the relative both sides of light conversion element 114 difference positions at optics damp-proof layer 116.
In the present embodiment, each spot light 120 for example is a package structure for LED, and it has towards the light-emitting area 120a of incidence surface 112a.The light that spot light 120 is provided is by its light-emitting area 120a outgoing.
In this, spot light 120 is luminous towards light conducting plate structure 110, and is incident to light conversion element 114 or gets into LGP 112 via incidence surface 112a, and then by exiting surface (the being first surface 112b) outgoing of LGP 112, to form an area source.
In certain embodiments, be formed with at least one pothole 113 on the incidence surface 112a of LGP 112, shown in Fig. 1 to 7.114 of light conversion elements are formed in each pothole 113.In other words, light conversion element 114 is embedded in each pothole 113.
In certain embodiments, spot light 120 can be provided with by corresponding pothole 113, can be incident to really in the light conversion element 114 with the light that causes spot light 120 to be provided.
In certain embodiments, can man-to-man mode dispose (like Fig. 1, shown in 4 and 5) between each pothole 113 and the spot light 120, or the mode of one-to-many disposes (like Fig. 2, shown in 6 and 7).
In certain embodiments, with reference to Fig. 8 and 9, light conversion element 114 can extraly be arranged on the incidence surface 112a of LGP 112.
In certain embodiments, light conversion element 114 comprises light conversion particles 1141.
After treating the colloid mixture curing on the incidence surface 112a, promptly form light conversion element 114 on the incidence surface 112a of LGP 112.
In certain embodiments, printing opacity colloid 1143 can be UV (Ultraviolet; Ultraviolet ray) glue or hot-setting adhesive.UV glue is optical grade SVR (Super View Resin) glue for example, the liquid glue (like the model 3M 2175 of 3M company) of optical grade.Hot-setting adhesive is optics epoxy glue or silica gel for example.Light conversion particles 1141 for example is fluorescent material, quantum dot or light transformational substance.
For example, describing for ease, below is that example is carried out the example explanation with fluorescent material, so this non-restriction of the present invention, and following example also is applicable to quantum dot or light transformational substance.
In order to send white light, can select for use the blue light-emitting diode encapsulating structure as spot light 120, and the material of light conversion particles 1141 can corresponding be selected the fluorescent material of jaundice light for use.When the blue light that sends when part blue light-emitting diode encapsulating structure is projected to light conversion element 114, can make the fluorescent material of the jaundice light in the light conversion element 114 inspire gold-tinted.The gold-tinted that inspires is a white light with the blue light that spot light 120 sends again.
In another example, the material of light conversion particles 1141 can be selected the fluorescent material that glows and the fluorescent material of green light simultaneously for use.When the blue light that sends when part blue light-emitting diode encapsulating structure is projected to light conversion element 114, can make the fluorescent material that glows in the light conversion element 114 inspire ruddiness and make wherein that the fluorescent material of green light inspires green glow.Ruddiness that inspires and green glow are white light with the blue light that spot light 120 sends again.
In another example, spot light 120 is ultraviolet light (UV Light) package structure for LED, and the material correspondence of light conversion particles 1141 is selected the fluorescent material that glows, the fluorescent material of green light and the fluorescent material of blue light-emitting for use.Likewise, when the light that the ultraviolet light-emitting diodes encapsulating structure sends is projected to light conversion element 114, can make fluorescent material wherein inspire ruddiness, green glow and blue light respectively.The ruddiness that inspires, green glow and blue light are mixed into white light more each other, can send white light (white face light) with the light-emitting area 120a that causes LGP 112, promptly form area source.
In this, the content of light conversion particles 1141 can be according to the shape of the kind of spot light 120, light conversion element 114 and/or backlight module 10 required usefulness and is determined.
And, be covered in the optics damp-proof layer 116 on the light conversion element 114, can be with guaranteeing that the light conversion particles 1141 in the light conversion element 114 is isolated from the outside, and then avoid light conversion particles 1141 to make moist and quicken its decay.
In certain embodiments, the edge of optics damp-proof layer 116 can be fitted on the LGP 112, is sealed between LGP 112 and the optics damp-proof layer 116 to cause light conversion element 114.
In certain embodiments, with reference to Figure 10 and 11, the incidence surface 112a of LGP 112 can divide into one first block 1121 and one second block 1122.
1122 of second blocks are at the edge of incidence surface 112a and around whole first block 1121.
In certain embodiments, with reference to Fig. 8 and 9, when light conversion element 114 covered whole incidence surface 112a, 116 of optics damp-proof layers covered overall optical conversion element 114, and LGP 112 is fitted with the surface of incidence surface 112a adjacency.In this, four surfaces of optics damp-proof layer 116 and incidence surface 112a adjacency, promptly first surface 112b, second surface 112c, the 3rd surperficial 112d and the 4th surperficial 112e fit.In other words, optics damp-proof layer 116 can form the upper shield structure and cover on the light conversion element 114, and fits in the surface of the inner surface of upper shield structure and LGP 112.
In certain embodiments, optics damp-proof layer 116 can be a printing opacity colloid or an Obstruct membrane.
For example, when constituting optics damp-proof layer 116 with the printing opacity colloid, the printing opacity colloid that can directly be coated with specific thicknesses has on the incidence surface 112a of light conversion element 114, and covers light conversion element 114 fully.After the coating, the printing opacity colloid is being solidified to form the optics damp-proof layer.
In certain embodiments, light conversion element 114 can be identical material with optics damp-proof layer 116 employed printing opacity colloids, and so this is not restriction of the present invention, and promptly both also can be unlike material.
In certain embodiments, can be cured simultaneously, also can carry out respectively as the printing opacity colloid of optics damp-proof layer 116 with as the printing opacity colloid (colloid mixture) of light conversion element 114.
With Obstruct membrane during as optics damp-proof layer 116, can be after forming light conversion element 114 on the incidence surface 112a, directly Obstruct membrane is pasted on light conversion element 114 and with the edge and LGP 112 applyings of Obstruct membrane.
In addition,, in printing opacity colloid 1143, also can sneak into a plurality of diffusion particles 1151, to promote the dispersion effect of light in light conducting plate structure 110 with reference to Figure 12.
In this embodiment; The refractive index of these a little diffusion particles 1151 is different from the refractive index of printing opacity colloid 1143; With can be after causing light that spot light 120 provided in getting into light conversion element 114 by these diffusion particle 1151 scatterings; And the light that light conversion particles 1141 is sent also can be by these diffusion particle 1151 scatterings, thereby produce needed dispersion effect.For example, the refractive index of diffusion particle 1151 for example about 1.49 or 1.57, and the about 3～15um of size.In this, the refractive index of printing opacity colloid 1143 for example about 1.52.
In certain embodiments, with reference to Figure 13 and 14, these a little diffusion particles 1151 also can be arranged on the outside of light conversion element 114.
In certain embodiments, diffusion particle 1151 can be blended in another printing opacity colloid 1153, to solidify to form a light diffusion element 115.In this embodiment, the refractive index of these a little diffusion particles 1151 is different from the refractive index of the printing opacity colloid 1153 that is mixed.For example, the refractive index of diffusion particle 1151 for example about 1.49 or 1.57, and the about 3～15um of size.At this moment, the refractive index of printing opacity colloid 1153 for example about 1.52.
This light diffusion element 115 can be arranged between the incidence surface 112a of light conversion element 114 and LGP 112.
In certain embodiments, light diffusion element 115 can be identical material with light conversion element 114 employed printing opacity colloids, and so this is not restriction of the present invention, and promptly both also can be unlike material.Moreover light diffusion element 115 can be identical material with optics damp-proof layer 116 employed printing opacity colloids, and so this is not restriction of the present invention, and promptly both also can be unlike material.
In certain embodiments, backlight module 10 can also comprise a reflecting layer.The reflecting layer is arranged on the opposite side surface of LGP with respect to exiting surface.The light that the reflecting layer will get into LGP reflexes to exiting surface.
For example, as the first surface 112b of the LGP shown in Fig. 2 112 during as exiting surface, the reflecting layer then is arranged on the second surface 112c.
Moreover this reflecting layer can be a reflector plate of extra setting, and this reflector plate is fitted on the surface of LGP 112.In addition, this reflecting layer also can be and is formed directly into LGP 112 lip-deep metal coatings.
In certain embodiments, backlight module 10 can also comprise an optical diaphragm group.Optical diaphragm group is arranged on the exiting surface of LGP.Optical diaphragm group can be with the area source homogenising of exiting surface outgoing, and/or improves the brightness of area source.Optical diaphragm group for example is diffuser plate, prismatic lens, brightening piece or its combination.
For example, as the first surface 112b of Fig. 2, the LGP 112 shown in 5 and 7 during as exiting surface, optical diaphragm group then is arranged on the first surface 112b.
In sum, utilize the optics damp-proof layer that light conversion element is isolated from the outside, quicken the decay of its light conversion efficiency to avoid light conversion element to make moist according to light conducting plate structure of the present invention, backlight module and manufacturing approach thereof.
Though technology contents of the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Anyly have the knack of this art; Not breaking away from spirit of the present invention a little change and the retouching done, all should be covered by in the category of the present invention, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (27)
1. a light conducting plate structure is characterized in that, comprising:
One LGP has an incidence surface;
One optics damp-proof layer is covered on this incidence surface; And
One light conversion element, the position is on this incidence surface and between this LGP and this optics damp-proof layer.
2. light conducting plate structure according to claim 1 is characterized in that, this light conversion element comprises:
One printing opacity colloid; And
A plurality of smooth conversion particles are blended in this printing opacity colloid.
3. light conducting plate structure according to claim 2 is characterized in that, said smooth conversion particles is fluorescent material, quantum dot or its composition.
4. light conducting plate structure according to claim 2 is characterized in that, this light conversion element also comprises: a plurality of diffusion particles are blended in this printing opacity colloid.
5. light conducting plate structure according to claim 1 is characterized in that, also comprises: a plurality of diffusion particles, the position is on this incidence surface.
6. light conducting plate structure according to claim 1; It is characterized in that; This incidence surface is divided into one first block and one second block; This second block position is at the edge of this incidence surface and around whole this first block, and this light conversion element is arranged on this first block, and this optics damp-proof layer and the applying of this second block.
7. light conducting plate structure according to claim 1 is characterized in that, this light conversion element is distributed on whole this incidence surface, and this optics damp-proof layer and this LGP are fitted in abutting connection with other surfaces of this incidence surface.
8. light conducting plate structure according to claim 1 is characterized in that this incidence surface has at least one pothole, and said light conversion element position is in this at least one pothole, and this optics damp-proof layer covers this at least one pothole.
9. a backlight module is characterized in that, comprising:
As claim 1 to 7 with in each described light conducting plate structure; And
At least one spot light, to should light conversion element and be provided with, with respect to this light conversion element and the position at the opposite side of this optics damp-proof layer.
10. a backlight module is characterized in that, comprising:
Light conducting plate structure as claimed in claim 8; And
At least one spot light is corresponding to this at least one pothole, with respect to the opposite side of this incidence surface position at this optics damp-proof layer.
11. backlight module according to claim 10 is characterized in that, this at least one spot light and this at least one pothole are provided with mode one to one.
12. backlight module according to claim 10 is characterized in that, this at least one pothole and this at least one spot light are with the one-to-many manner setting.
13. the manufacturing approach of a light conducting plate structure is characterized in that, comprising:
Form a light conversion element on the incidence surface of a LGP; And
Have covering one optics damp-proof layer on this incidence surface of this light conversion element, wherein this light conversion element position is between this LGP and this optics damp-proof layer.
14. the manufacturing approach of light conducting plate structure according to claim 13 is characterized in that, this formation step comprises:
A plurality of smooth conversion particles are mixed with a printing opacity colloid, to form a colloid mixture; And
This colloid mixture is coated on this incidence surface.
15. the manufacturing approach of light conducting plate structure according to claim 14 is characterized in that, this formation step also comprises:
After coating is accomplished, solidify this colloid mixture, to form this light conversion element.
16. the manufacturing approach of light conducting plate structure according to claim 14 is characterized in that, this blend step also comprises:
A plurality of diffusion particles are mixed with this printing opacity colloid, to form this colloid mixture.
17. the manufacturing approach of light conducting plate structure according to claim 13; It is characterized in that; This covering step comprises: an Obstruct membrane is pasted at this light conversion element and with the edge of this Obstruct membrane and the applying of this LGP, with this Obstruct membrane as this optics damp-proof layer.
18. the manufacturing approach of light conducting plate structure according to claim 13 is characterized in that, this covering step comprises:
One printing opacity colloid of coating specific thicknesses has on this incidence surface of this light conversion element and is covering this light conversion element; And
Solidify this printing opacity colloid to form this optics damp-proof layer.
19. the manufacturing approach of light conducting plate structure according to claim 13 is characterized in that, also comprises: form a light diffusion element on this incidence surface of this LGP.
20. the manufacturing approach of light conducting plate structure according to claim 13 is characterized in that, also comprises: on this incidence surface, form at least one pothole, wherein should form step for forming this light conversion element in this at least one pothole.
21. the manufacturing approach of light conducting plate structure according to claim 13 is characterized in that, this formation step comprises:
On this incidence surface, form at least one pothole;
A plurality of smooth conversion particles are mixed with a printing opacity colloid, to form a colloid mixture; And this colloid mixture is filled in this at least one pothole.
22. the manufacturing approach of light conducting plate structure according to claim 21 is characterized in that, this formation step also comprises:
After filling completion, solidify this colloid mixture, to form this light conversion element.
23. the manufacturing approach of light conducting plate structure according to claim 21 is characterized in that, this blend step also comprises:
A plurality of diffusion particles are mixed with this printing opacity colloid, to form this colloid mixture.
24. the manufacturing approach of a backlight module is characterized in that, comprising:
Manufacturing approach like each the described light conducting plate structure in the claim 13 to 19; And be arranged to the side of a little less light source at this incidence surface of this LGP.
25. the manufacturing approach of a backlight module is characterized in that, comprising:
Manufacturing approach like each the described light conducting plate structure in the claim 20 to 23; And to being arranged to the side of a little less light source by at least one pothole at this incidence surface of this LGP.
26. the manufacturing approach of backlight module according to claim 25 is characterized in that, this is provided with step for for mode one to one this at least one spot light being set with this at least one pothole and this at least one spot light.
27. the manufacturing approach of backlight module according to claim 25 is characterized in that, this is provided with step for being this at least one spot light of one-to-many manner setting with this at least one pothole and this at least one spot light.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144034 | 2011-11-30 | ||
| TW100144034A TWI447450B (en) | 2011-11-30 | 2011-11-30 | Light guide panel, backlight module, and manufacturing method thereof |
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| CN102628580A true CN102628580A (en) | 2012-08-08 |
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| CN2012100668095A Pending CN102628580A (en) | 2011-11-30 | 2012-03-13 | Light guide plate structure, backlight module and manufacturing method thereof |
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| CN102937268A (en) * | 2012-11-15 | 2013-02-20 | 京东方科技集团股份有限公司 | Light guide plate, backlight module and display device |
| CN102980136A (en) * | 2012-09-24 | 2013-03-20 | 友达光电股份有限公司 | Direct type backlight module and light source diffusion structure thereof |
| CN103487857A (en) * | 2013-10-11 | 2014-01-01 | 张家港康得新光电材料有限公司 | Quantum dot film and backlight module |
| CN103499054A (en) * | 2013-10-11 | 2014-01-08 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display |
| CN103869391A (en) * | 2014-03-28 | 2014-06-18 | 明天 | Color reinforcing film, and utilization structure, utilization method and manufacturing method of the color reinforcing film |
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