CN102623801B - Surface-patch-type multi-band antenna module - Google Patents
Surface-patch-type multi-band antenna module Download PDFInfo
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- CN102623801B CN102623801B CN201110032645.XA CN201110032645A CN102623801B CN 102623801 B CN102623801 B CN 102623801B CN 201110032645 A CN201110032645 A CN 201110032645A CN 102623801 B CN102623801 B CN 102623801B
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Abstract
A surface-patch-type multi-band antenna module comprises: a substrate and a carrier. The substrate possesses a first grounding metal surface and a first microstrip line. One side of the first grounding metal surface is connected with a second microstrip line. There is a gap between the second microstrip line and the first microstrip line. The other surface of the substrate is provided with the second grounding metal surface. The carrier is made of a ceramic material with a high dielectric constant and possesses a first radiation metal portion, a second radiation metal portion and a third radiation metal portion. When the carrier is electrically connected to the substrate, the junction of the first radiation metal portion and the second radiation metal portion is electrically connected to the first microstrip line, and the third radiation metal portion is electrically connected to the second microstrip line so as to form the multi-band antenna module.
Description
Technical field
The present invention relates to a kind of antenna, relate in particular to a kind of multifrequency antenna module of high-gain multiband.
Background technology
Along with the development of wireless telecommunications science and technology, the portable electronic devices such as electronic product such as mobile computer, mobile phone, personal digital assistant (PDA) are are all designed and developed towards lightening.In order to receive and dispatch the antenna size relative decrease of electric wave signal, or change antenna structure kenel, can be built in the inner use of electronic product.
The multifrequency antenna of common multiband is inverted-F antenna (Planar Inverted-F Antenna, PIFA) on the market at present.This antenna has adopted simple two-dimensional design, directly process for copper is imprinted on printed circuit board (PCB) by printed circuit board (PCB) (PCB) manufacturing process, to form the multifrequency antenna of a tabular multiband, or utilize stamping technology sheet metal punching press formation one to be there is to the multifrequency antenna of three dimensional design.
Because PIFA antenna structure can change the antenna geometry on printed circuit board (PCB) two dimension or sheet metal, to reach the even above transmitting-receiving effect of three frequencies of double frequency.But in order to meet signal transmitting and receiving quality, and the impact of avoiding surrounding environment causes its frequency coordination misalignment, therefore the antenna of this printed circuit board (PCB) or the drawing of sheet metal institute certainly will have a certain size volume, for install this PIFA antenna structure should and electronic installation inside also must be reserved a suitable space and settles this PIFA antenna structure, certainly will run counter to thus the demand of electronic installation towards compact Miniaturization Design.
Summary of the invention
Therefore, main purpose of the present invention, be to solve traditional disappearance, be located on the ceramic monolith of ceramic material one-tenth of this high-k, to form a multifrequency antenna that can directly carry out the high efficiency multiband of surface mount engineering so provide a kind of metal pattern by the multifrequency antenna of multiband to carry.Also form the built-in multifrequency antenna that can surface label chip of a compact miniaturization simultaneously.
For reaching above-mentioned object, the invention provides a kind of multifrequency antenna module of surface label chip, include:
One substrate, there is a first surface and second surface, on this first surface, there is one first grounding metal plane and one first microstrip line, on this first microstrip line one end, there is a perforation, this first microstrip line with the segment section of perforation extends in this first grounding metal plane, and and this first grounding metal plane between form a gap, one side of this first grounding metal plane is connected with one second microstrip line, it is arranged side by side that this second microstrip line and this first microstrip line other end are parallel relation, between this first microstrip line and this second microstrip line, has a spacing; Separately, on this first surface, there are one group of two corresponding fixed contact, and on this second surface, there is one second grounding metal plane;
One carrier, make a cuboid with the ceramic material of high-k, on it, there is the first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion, this the first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion are with not identical rectangular metal pattern and vertical element metal pattern composition, and be located at this carrier at least one or two more than surface, this the first radiation metal portion and this second radiation metal portion are electric connection, and this first radiation metal portion and the second radiation metal portion and the 3rd radiation metal portion are electrically connected;
Wherein, when this carrier is connected with this electrical property of substrate, two fixed contacts on the first surface of this first radiation metal portion and this second radiation metal portion and this substrate are electrically connected, this carrier can be fixed on the first surface of this substrate, this the first radiation metal portion and this second radiation metal portion junction and this first microstrip line are electrically connected, the 3rd radiation metal portion and this second microstrip line are electrically connected, to be combined into a multifrequency antenna module.
The present invention is carried the metal pattern of the multifrequency antenna of multiband on the ceramic monolith of ceramic material one-tenth of being located at this high-k, to form a multifrequency antenna that can directly carry out the high efficiency multiband of surface mount engineering.Also form the built-in multifrequency antenna that can surface label chip of a compact miniaturization simultaneously.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 multifrequency antenna module decomposing schematic representation of the present invention;
The decomposing schematic representation at another visual angle of Fig. 2 multifrequency antenna module of the present invention;
The decomposing schematic representation at the another visual angle of Fig. 3 multifrequency antenna module of the present invention;
Fig. 4 multifrequency antenna module stereoscopic of the present invention schematic diagram;
The conspectus of Fig. 5 multifrequency antenna module circuit of the present invention;
The use view of Fig. 6 multifrequency antenna module of the present invention;
Fig. 7 is the side cross-sectional schematic of Fig. 6;
Fig. 8 a frequency response curve schematic diagram of the present invention (one);
Fig. 8 b frequency response curve schematic diagram of the present invention (two).
Wherein, Reference numeral
The first grounding metal plane 13
The first microstrip line 14
The second microstrip line 16
Spacing 17
Fixed contact 18
The second grounding metal plane 19
The first radiation metal portion 21
The second radiation metal portion 22
The 3rd radiation metal portion 23
Signal feed-in probe 41
Screw thread 43
Embodiment
Hereby relevant the technical content and a detailed description, now coordinate accompanying drawing to be described as follows:
Refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, decomposition and the stereoscopic schematic diagram at multifrequency antenna module decomposition of the present invention, the decomposition at another visual angle, another visual angle.As shown in the figure: the multifrequency antenna module of a kind of surface label chip of the present invention, includes: a substrate 1 and a carrier 2.
This substrate 1, has a first surface 11 and second surface 12.On this first surface 11, there is one first grounding metal plane 13 and one first microstrip line 14, these the first microstrip line 14 tool one leading portion 141 and back segments 142, on this leading portion 141, there is a perforation 143, the leading portion 141 of this first microstrip line 14 extends in this first grounding metal plane 13, and and this first grounding metal plane 13 between form a gap 15.One side of this first grounding metal plane 13 is connected with one second microstrip line 16, it is arranged side by side that the back segment 142 of this second microstrip line 16 and this first microstrip line 14 is parallel relation, and there is a spacing 17 between the back segment 142 of this first microstrip line 14 and this second microstrip line 16, spacing 17 width that form between the back segment 142 of this first microstrip line 14 and the second microstrip line 16, can adjust coupling capacitance, make the first grounding metal plane 13 can form the resonance point of high frequency, use the use that increases frequency range.Separately, have one group of two corresponding fixed contact 18 on this first surface 11, this two fixed contact 18 is in order to affixed this carrier 2.On this second surface 12, have again one second grounding metal plane 19, this second grounding metal plane 19 is that confession is electrically connected with the grounding parts (not shown) of the joint of coaxial cable line.
This carrier 2, is to make a cuboid with the ceramic material of high-k, has the first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23 on it.This first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23 be located at this carrier 2 with not identical rectangular metal pattern and vertical element metal pattern at least one or two more than surface, make the volume of antenna with microminiaturization.This first radiation metal portion 21 is electric connection with this second radiation metal portion 22, this the first radiation metal portion 21 and the second radiation metal portion 22 are not electrically connected (, this first radiation metal portion 21 and the second radiation metal portion 22 are insulation with the 3rd radiation metal portion 23) with the 3rd radiation metal portion 23.In the time that this carrier 2 is electrically connected with this substrate 1, two fixed contacts 18 on the first surface 11 of this first radiation metal portion 21 and this second radiation metal portion 22 and this substrate 1 are electrically connected, and this carrier 2 can be fixed on the first surface 11 of this substrate 1.And junction and this first microstrip line 14 of this first radiation metal portion 21 and this second radiation metal portion 22 are electrically connected, the 3rd radiation metal portion 23 is electrically connected with this second microstrip line 16, to be combined into a multifrequency antenna module.
Refer to Fig. 4, Fig. 5, the conspectus of multifrequency antenna module stereoscopic of the present invention and circuit.As shown in the figure: after this first radiation metal portion 21 and this second radiation metal portion 22 and 14 electric connections of this first microstrip line, form the first antenna with this first radiation metal portion 21, this the second radiation metal portion 22 forms the second antenna, and the 3rd radiation metal portion 23 and this second microstrip line 16 form the multifrequency antenna module of the multiband of third antenna.
After signal source 3 is inputted by the first microstrip line 14, flow through this first radiation metal portion 21 and the second radiation metal portion 22 form the structure of low-and high-frequency branch resonance.Spacing 17 width to be formed between this first microstrip line 14 and this second microstrip line 16, can adjust coupling capacitance again, make the first grounding metal plane 13 can form the resonance point of high frequency, use the use that increases frequency range.
Refer to Fig. 6, Fig. 7, the use state of multifrequency antenna module of the present invention and the side cross-sectional schematic of Fig. 6.As shown in the figure: in the time that the present invention uses, the perforation 143 by the signal feed-in probe 41 of the connector 4 of connection coaxial cable line 5 through this first microstrip line 14, is electrically connected with this first microstrip line 14.Housing 42 and this second grounding metal plane 19 of this connector 4 are electrically connected.
In the time that multifrequency antenna module uses, by the joint of coaxial cable line 5 51 interlockings on the screw thread 43 of the housing 42 of this connector 4, and accept the signal of different frequency range by the first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23, to reach the multifrequency antenna module can multiband using.
Refer to Fig. 8 a～Fig. 8 b, frequency response curve schematic diagram of the present invention (), (two) and refer to the frequency response table that table one is Fig. 8 a and Fig. 8 b.As shown in Fig. 8 a, Fig. 8 b and table one: when multifrequency antenna module of the present invention is during at 700MHZ, the reflection loss (Return Loss) of this antenna is-3.98, and standing-wave ratio (SWR) is 4.20.
When multifrequency antenna module of the present invention is during at 824MHZ, the reflection loss of this antenna is-11.66, and standing-wave ratio is 1.73.
When multifrequency antenna module of the present invention is during at 960MHZ, the reflection loss of this antenna is-5.57, and standing-wave ratio is 3.02.
When multifrequency antenna module of the present invention is during at 1710MHZ, the reflection loss of this antenna is-10.39, and standing-wave ratio is 1.76.
When multifrequency antenna module of the present invention is during at 2170MHZ, the reflection loss of this antenna is-6.38, and standing-wave ratio is 2.88.
Table one
| ? | 700MHz | 824MHz | 960MHz | 1710MHz | 2170MHz |
| Reflection loss (Reture Loss) | -3.98 | -11.66 | -5.57 | -10.39 | -6.38 |
| Standing-wave ratio (SWR) | 4.20 | 1.73 | 3.02 | 1.76 | 2.88 |
Table two
Refer to table two, the peak gain parameter declaration (LTE ANTENNA Peak Gain Parameter Summary) of long-term evolution antenna of the present invention.As shown in Table 2: therefore, multifrequency antenna module of the present invention can provide the antenna module structure of current long-term evolution antenna (LONG TERM EVOLUTION ANTENNA, LTE ANTENNA) technology and the required compact small multi-frequency section high efficiency built-in SMD (SMT) of the 4th generation communication system.And this multiband has been contained 700～960MHZ and 1710～2170MHZ etc., for LTE, global system for mobile communications (Global System for Mobile Communications, GSM), digital communication system (Digital Communications System, DCS), person communication system (Personal Communication System, PCS), the system frequency range such as broadband code division multiple access (Wideband Code Division Multiple Access, WCDMA) is required.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (6)
1. a multifrequency antenna module for surface label chip, is characterized in that, comprising:
One substrate, on it, there is a first surface and second surface, on this first surface, there are one group of two corresponding fixed contact, on this first surface, there is one first grounding metal plane and one first microstrip line, this first microstrip line has a leading portion and a back segment, on this leading portion, there is a perforation, this leading portion extend in this first grounding metal plane and and this first grounding metal plane between form a gap, one side of this first grounding metal plane is connected with one second microstrip line, this second microstrip line is parallel with this first microstrip line and is set up in parallel, between this first microstrip line and this second microstrip line, there is a spacing, the spacing width forming is used for adjusting coupling capacitance, make this first grounding metal plane can form the resonance point of high frequency,
One carrier, on it, there is the first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion, this the first radiation metal portion and this second radiation metal portion are electric connection, this the first radiation metal portion and the second radiation metal portion and the 3rd radiation metal portion are insulation, and the first radiation metal portion of this carrier and this second radiation metal portion are fixed on this two fixed contact;
Wherein, in the time that this carrier is connected with this electrical property of substrate, the junction that this first radiation metal portion and this second radiation metal portion are electrically connected and this first microstrip line are electrically connected, and the 3rd radiation metal portion and this second microstrip line are electrically connected, to form the multifrequency antenna module of multiband.
2. the multifrequency antenna module of surface label chip according to claim 1, is characterized in that, has one second grounding metal plane on this second surface.
3. the multifrequency antenna module of surface label chip according to claim 2, is characterized in that, this carrier is made a cuboid with the ceramic material of high-k.
4. the multifrequency antenna module of surface label chip according to claim 3, it is characterized in that, this first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion form and are located on this carrier with a rectangular metal pattern and vertical element metal pattern separately respectively.
5. the multifrequency antenna module of surface label chip according to claim 4, is characterized in that, this rectangular metal pattern and vertical element metal pattern be located at this carrier at least one more than surface.
6. the multifrequency antenna module of surface label chip according to claim 5, is characterized in that, also has a connector, this connector has a housing, in this housing, have a signal feed-in probe, this signal feed-in probe passes the perforation of the first microstrip line, and is electrically connected with this first microstrip line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110032645.XA CN102623801B (en) | 2011-01-27 | 2011-01-27 | Surface-patch-type multi-band antenna module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110032645.XA CN102623801B (en) | 2011-01-27 | 2011-01-27 | Surface-patch-type multi-band antenna module |
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| Publication Number | Publication Date |
|---|---|
| CN102623801A CN102623801A (en) | 2012-08-01 |
| CN102623801B true CN102623801B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110032645.XA Active CN102623801B (en) | 2011-01-27 | 2011-01-27 | Surface-patch-type multi-band antenna module |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI525906B (en) | 2012-08-10 | 2016-03-11 | 鴻海精密工業股份有限公司 | Multi-band antenna |
| CN106602228B (en) * | 2015-10-20 | 2020-03-31 | 锐锋股份有限公司 | Ten-frequency-band antenna |
| CN107293858B (en) * | 2016-03-31 | 2021-04-23 | 上海莫仕连接器有限公司 | Antenna device |
| CN109103593A (en) * | 2018-09-21 | 2018-12-28 | 深圳华大北斗科技有限公司 | Built-in all frequency bands antenna |
| TWI713259B (en) * | 2019-12-05 | 2020-12-11 | 和碩聯合科技股份有限公司 | Antenna structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1485950A (en) * | 2002-08-23 | 2004-03-31 | 株式会社村田制作所 | Antenna unit and communication device including same |
| CN1518783A (en) * | 2002-07-05 | 2004-08-04 | ̫���յ���ʽ���� | Dielectric antenna, antenna-mounted substrate and mobile communication deivce |
| CN101308950A (en) * | 2007-05-18 | 2008-11-19 | 英资莱尔德无线通信技术（北京）有限公司 | Antenna device |
| CN201994418U (en) * | 2011-01-27 | 2011-09-28 | 太盟光电科技股份有限公司 | Surface mounted multi-frequency antenna module |
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- 2011-01-27 CN CN201110032645.XA patent/CN102623801B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1518783A (en) * | 2002-07-05 | 2004-08-04 | ̫���յ���ʽ���� | Dielectric antenna, antenna-mounted substrate and mobile communication deivce |
| CN1485950A (en) * | 2002-08-23 | 2004-03-31 | 株式会社村田制作所 | Antenna unit and communication device including same |
| CN101308950A (en) * | 2007-05-18 | 2008-11-19 | 英资莱尔德无线通信技术（北京）有限公司 | Antenna device |
| CN201994418U (en) * | 2011-01-27 | 2011-09-28 | 太盟光电科技股份有限公司 | Surface mounted multi-frequency antenna module |
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| CN102623801A (en) | 2012-08-01 |
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