CN102623620A - LED (Light-Emitting Diode) encapsulation structure in light-emitting keyboard and production process thereof - Google Patents
LED (Light-Emitting Diode) encapsulation structure in light-emitting keyboard and production process thereof Download PDFInfo
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- CN102623620A CN102623620A CN2012101250946A CN201210125094A CN102623620A CN 102623620 A CN102623620 A CN 102623620A CN 2012101250946 A CN2012101250946 A CN 2012101250946A CN 201210125094 A CN201210125094 A CN 201210125094A CN 102623620 A CN102623620 A CN 102623620A
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Abstract
The invention provides an LED (Light-Emitting Diode) encapsulation structure in a light-emitting keyboard and a production process thereof. The LED encapsulation structure comprises a printed circuit board which is provided with printed circuits, wherein the printed circuit board is fixedly provided with an LED chip through a bonding layer, and one side face of the LED chip is provided with pin bumps which are pressed into the printed circuits. A layer of light-transmitting colloid is further coated outside the LED chip so that the LED chip is arranged inside the light-transmitting colloid. During production, the LED chip is firstly bonded onto the printed circuit board, the pin bumps are pressed into the printed circuits, and then, the layer of light-transmitting colloid is coated outside the fixed LED chip. The LED encapsulation structure is simple in structure and production process, and the keyboard employing the LED encapsulation structure is light and thin and has a good pressing hand-feel.
Description
Technical field
The present invention relates to LED encapsulating structure and production technology thereof in a kind of illuminated keyboard.
Background technology
Therefore illuminated keyboard adopts illuminated keyboard owing to can be convenient for people under dark situations, use in increasing computer.The following three kinds of structures of the many employings of existing illuminated keyboard:
1. below keyboard, place LGP, will be positioned at the light that the light-emitting diode of LGP side sends and import, through the leaded light refraction point under each button, be refracted on button and the character again, reach the effect of illuminated keyboard from LGP with scissors leg structure.But the illuminated keyboard of this kind structure since in LGP is housed, so the integral keyboard structure is thicker.
Below each button through respectively adorning the LED of a SMD (surface mount device), promptly LED is installed through a kind of surperficial technology for applying.Wherein this LED concrete structure is as shown in fig. 1; Include substrate 1; Substrate 1 is fixed on the printed substrate 7 through adhesive layer 9, and the led chip 3 that is provided with lead-in wire 2 is located on the substrate 1, and is provided with a containment vessel 4 in led chip 3 outsides; Simultaneously be provided with pin 5 in substrate 1 lower surface, pin 5 is connected with printed wire 6.Because this structure keyboard adopts the film attachment process that LED is mounted, to LED be fixed on the printed substrate 7 through coating one deck printing opacity colloid 10 in the LED outside.Though therefore need not use LGP at the illuminated keyboard of this structure; But the height of the LED in this structure has comprised the thickness of printed substrate 7, substrate 1, led chip 3, containment vessel 4 and printing opacity colloid 10; The thickness of its whole LED is thicker, and therefore whole keyboard structure is also thicker.
3. adopt LGP equally, but LGP is placed on above the thin film switch, such keyboard does not adopt the scissors pin; With the mode of Metedome (metal clips) as the conducting button; Can accomplish very thin, but its keyboard to push feel bad, therefore fail mass selling on market.
Along with the competition in market, for computer particularly notebook computer require Bao Yuehao more, the notebook computer for adopting illuminated keyboard just needs illuminated keyboard frivolous.But there are two kinds of structures thicker in three kinds of illuminated keyboards of existing structure, other a kind of mass selling of then failing, therefore inventing illuminated keyboard a kind of not only frivolous but also that can satisfy market is the direction that each producer makes great efforts.
Under above background, for solving gentlier, more approach the demand of keyboard, the applicant improves at the structural LED technology for applying of the 2nd kind of leaded light keyboard, and a kind of LED encapsulating structure and production technology thereof that reduces keyboard structure researched and developed in design.
Summary of the invention
First purpose of the present invention provides the encapsulating structure of LED in a kind of illuminated keyboard, adopts the illuminated keyboard structure of this LED encapsulating structure frivolous, and pushes good hand touch.
The technical scheme that adopts is:
The encapsulating structure of LED in the illuminated keyboard; Comprise the printed substrate that is provided with printed wire; The part of corresponding button is installed with led chip through adhesive layer on the printed substrate, and wherein a side of led chip is provided with the pin salient point, and this pin salient point is pressed in the printed wire.Also coat one deck printing opacity colloid in the led chip outside, make led chip place the printing opacity colloid inner.
Said printed wire is the elargol printed wire.
Said adhesive layer is a hot melt adhesive layer.
Said pin salient point is the metal pins salient point.
Said pin salient point is a gold pin salient point.
Said printing opacity colloid is insulation printing opacity colloid.
In the printing opacity colloid, insert fluorescent material.
Second purpose of the present invention provides the production technology of above-mentioned LED encapsulating structure, and this production technology is simple, can realize a large amount of productions of industry.
The technical scheme that adopts is:
The production technology of the LED encapsulating structure in the above-mentioned illuminated keyboard may further comprise the steps;
(1) the lead-out wire cut-out that led chip is gone between and gets the place ready, reserved lead is got ready, and this lead-in wire is got ready and is the pin salient point.
(2) printing elargol conducting wire on printed substrate.
(3) wait that on printed substrate the place of pasting led chip applies one deck PUR, this PUR is coated between the space of printed wire.
(4) one side that led chip is had a pin salient point is attached on the PUR, and the pin salient point is pressed in the printed wire.
(5) the heating cure PUR is fixed on chip on the printed substrate.
(6) the outside one deck printing opacity colloid that coats of the led chip after fixing places the printing opacity colloid inner led chip.
Said printing opacity colloid is insulation printing opacity colloid.
Beneficial effect of the present invention: the luminescence chip with LED among the present invention is potted directly on the printed substrate in the keyboard structure; Reduced the use of LED substrate and containment vessel in the prior art; Thereby reduced the thickness of LED light-emitting zone, and then can reduce the thickness of whole keyboard.Simultaneously pin of chip directly is pressed in the printed wire, has also reduced taking of space.Therefore adopt the illuminated keyboard of the LED encapsulating structure among the present invention that its keyboard integral thickness is reduced, can satisfy on the market needs frivolous illuminated keyboard.
Description of drawings
Fig. 1 is a prior art LED structural representation;
The sketch map of LED encapsulating structure in Fig. 2 keyboard of the present invention;
Among the figure: 1. substrate, 2. lead-in wire, 3.LED chip, 4. containment vessel, 5. pin, 6. printed wire, 7. printed substrate, 8. pin salient point, 9. adhesive layer, 10. printing opacity colloid.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is explained further details.
Under the LED packaging technology of prior art, mostly the LED height is 0.35mm～0.7mm, under this height, adds the specific (special) requirements of film attachment process, need on LED, wrap one deck colloid again, with fixing this LED.The height of LED will reach 0.55～0.9mm so here, therefore causes the thickness of whole illuminated keyboard thicker.
What in fact LED was true luminous is middle luminescence chip, and its lead-in wire all is can be connected with the circuit of outside for luminescence chip with pin.According to present actual conditions, can with on the printed substrate as the base plate for packaging of LED, printed wire as pin, directly is encapsulated in led chip 3 on the printed substrate, form new LED encapsulating structure among the present invention.
LED encapsulating structure concrete structure in the illuminated keyboard of the present invention is following:
LED encapsulating structure in the illuminated keyboard as shown in Figure 2 comprises the printed substrate 7 that is provided with elargol printed wire 6, and the part of corresponding button is installed with led chip 3 through adhesive layer 9 on the printed substrate.Wherein a side of led chip 3 is provided with pin salient point 8, and this pin salient point 8 is pressed in the printed wire 6.Adhesive layer 9 in the present embodiment is the thermosol glue-line; And produce for convenient; Hot melt adhesive layer is coated in the space of printed wire 6, so promptly can conveniently led chip 3 be sticked on the printed substrate 7, prevents again between pin salient point 8 and printed wire 6, to speckle with hot melt adhesive layer.Also coat one deck printing opacity colloid 10 in led chip 3 outsides, make led chip 3 place printing opacity colloid 10 inside.
Above-mentioned pin salient point 8 is that the lead-in wire on the original led chip is got ready, in this patent original lead-in wire is cut off, and only stays the lead-in wire point, i.e. pin salient point 8 in this patent.In this patent, pin salient point 8 is in order to carry out conducting with printed wire 6, to solve the contact problems of led chip 3 and printed wire 6.Its pin salient point 8 effects are equivalent to the lead-in wire of led chip in the prior art, and the printed wire 6 in this patent is equivalent to the pin of prior art.Therefore, can have good conducting effect for making pin salient point 8 and printed wire 6, make the led chip 3 can be normally luminous, pin salient point 8 be the metal pins salient point, the pin salient point that wherein preferably prepares with gold.In fact the pin salient point also can adopt other electric conducting material preparations, like conductive rubber.
Be the fail safe that guarantees that keyboard uses, said printing opacity colloid 10 is insulation printing opacity colloid.If led chip 3 adopts blue chip, the white for making the blue chip luminous coloration become to want can also add an amount of fluorescent material in the printing opacity colloid.In fact also can add some color phosphors, the light that LED is sent demonstrates the color that the user likes.
In the whole keyboard structure in the present embodiment; Pin salient point 8 can be accomplished the height of 5～15 μ m, and printed wire 6 has the thickness of 7 ± 3 μ m, therefore can be pressed onto pin salient point 8 in the printed wire 6 and go; Guarantee that led chip 3 is good with contacting of printed wire 6, reduced taking of space simultaneously.And the height of led chip 3 is less than 0.1mm; The thickness of printed wire 6 and PUR is respectively 7 ± 3 μ m and 10 ± 3 μ m; The height of adding the outside colloid of LED is less than 0.1mm, thus the height of whole LED luminous zone 0.2mm ± 0.05mm only, its keyboard integral thickness attenuation.
The concrete production stage of above-mentioned LED encapsulating structure is following:
(1) the lead-out wire cut-out that led chip is gone between and gets the place ready, reserved lead is got ready, and this lead-in wire is got ready and is the pin salient point;
(2) printing elargol conducting wire on printed substrate;
(3) wait that on printed wire the place of pasting led chip applies one deck PUR, this PUR is coated between the space of printed wire;
(4) one side that led chip is had a pin salient point is attached on the PUR, and the pin salient point is pressed in the printed wire;
(5) heating cure PUR is fixed on chip on the printed wire;
(6) the outside one deck printing opacity colloid that coats of the led chip after fixing places the printing opacity colloid inner led chip.
When being used for keyboard, printed substrate and the keyboard miscellaneous part of above-mentioned packaged LED are combined the formation illuminated keyboard.
Claims (9)
1. the LED encapsulating structure in the illuminated keyboard; Comprise the printed substrate that is provided with printed wire; It is characterized in that: the part of corresponding button is installed with led chip through adhesive layer on the printed substrate, and wherein a side of led chip is provided with the pin salient point, and this pin salient point is pressed in the printed wire; Also coat one deck printing opacity colloid in the led chip outside, make led chip place the printing opacity colloid inner.
2. the LED encapsulating structure in the illuminated keyboard described in claim 1, it is characterized in that: said printed wire is the elargol printed wire.
3. the LED encapsulating structure in the illuminated keyboard described in claim 1, it is characterized in that: said adhesive layer is a hot melt adhesive layer.
4. the LED encapsulating structure in the illuminated keyboard described in claim 1, it is characterized in that: said pin salient point is the metal pins salient point.
5. the LED encapsulating structure in the illuminated keyboard described in claim 4, it is characterized in that: said pin salient point is a gold pin salient point.
6. the LED encapsulating structure in the illuminated keyboard described in claim 1 is characterized in that: said printing opacity colloid is insulation printing opacity colloid.
7. the LED encapsulating structure in the illuminated keyboard described in claim 6 is characterized in that: in the printing opacity colloid, insert fluorescent material.
8. like the production technology of arbitrary described LED encapsulating structure in the claim 1 to 7, it is characterized in that: may further comprise the steps;
(1) the lead-out wire cut-out that led chip is gone between and gets the place ready, reserved lead is got ready, and this lead-in wire is got ready and is the pin salient point;
(2) printing elargol conducting wire on printed substrate;
(3) wait that on printed substrate the place of pasting led chip applies one deck PUR, this PUR is coated between the space of printed wire;
(4) one side that led chip is had a pin salient point is attached on the PUR, and the pin salient point is pressed in the printed wire;
(5) heating cure PUR is fixed on chip on the printed substrate;
(6) the outside one deck printing opacity colloid that coats of the led chip after fixing places the printing opacity colloid inner led chip.
9. the production technology described in claim 7 is characterized in that: said printing opacity colloid is insulation printing opacity colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101250946A CN102623620A (en) | 2012-04-25 | 2012-04-25 | LED (Light-Emitting Diode) encapsulation structure in light-emitting keyboard and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101250946A CN102623620A (en) | 2012-04-25 | 2012-04-25 | LED (Light-Emitting Diode) encapsulation structure in light-emitting keyboard and production process thereof |
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| CN102623620A true CN102623620A (en) | 2012-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101250946A Pending CN102623620A (en) | 2012-04-25 | 2012-04-25 | LED (Light-Emitting Diode) encapsulation structure in light-emitting keyboard and production process thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065848A (en) * | 2013-01-07 | 2013-04-24 | 薛志勇 | Micro-touch switch |
| CN105655174A (en) * | 2016-03-29 | 2016-06-08 | 郑建娜 | Luminous patch-type elastic button |
| CN106461164A (en) * | 2014-05-19 | 2017-02-22 | 特里多尼克有限两合公司 | Illuminant comprising an LED |
| CN110267435A (en) * | 2019-07-01 | 2019-09-20 | 江门市华浦照明有限公司 | A kind of production method and flexible circuit board of substrate |
| CN113013308A (en) * | 2021-04-08 | 2021-06-22 | 深圳市柯瑞光电科技有限公司 | Flip chip mounting process of keyboard lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| US20070200133A1 (en) * | 2005-04-01 | 2007-08-30 | Akira Hashimoto | Led assembly and manufacturing method |
| JP2010147033A (en) * | 2008-12-16 | 2010-07-01 | Panasonic Corp | Flip-chip mounting method and flip-chip mounting device |
| CN102339930A (en) * | 2010-07-14 | 2012-02-01 | 夏普株式会社 | Light emitting device |
-
2012
- 2012-04-25 CN CN2012101250946A patent/CN102623620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| US20070200133A1 (en) * | 2005-04-01 | 2007-08-30 | Akira Hashimoto | Led assembly and manufacturing method |
| JP2010147033A (en) * | 2008-12-16 | 2010-07-01 | Panasonic Corp | Flip-chip mounting method and flip-chip mounting device |
| CN102339930A (en) * | 2010-07-14 | 2012-02-01 | 夏普株式会社 | Light emitting device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065848A (en) * | 2013-01-07 | 2013-04-24 | 薛志勇 | Micro-touch switch |
| CN106461164A (en) * | 2014-05-19 | 2017-02-22 | 特里多尼克有限两合公司 | Illuminant comprising an LED |
| CN106461164B (en) * | 2014-05-19 | 2019-11-26 | 特里多尼克有限两合公司 | Illuminator including LED |
| CN105655174A (en) * | 2016-03-29 | 2016-06-08 | 郑建娜 | Luminous patch-type elastic button |
| CN110267435A (en) * | 2019-07-01 | 2019-09-20 | 江门市华浦照明有限公司 | A kind of production method and flexible circuit board of substrate |
| CN113013308A (en) * | 2021-04-08 | 2021-06-22 | 深圳市柯瑞光电科技有限公司 | Flip chip mounting process of keyboard lamp |
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Application publication date: 20120801 |