CN102543774B - Method for packaging chip based on epoxy resin type adhesive - Google Patents
Method for packaging chip based on epoxy resin type adhesive Download PDFInfo
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- CN102543774B CN102543774B CN201210047272.8A CN201210047272A CN102543774B CN 102543774 B CN102543774 B CN 102543774B CN 201210047272 A CN201210047272 A CN 201210047272A CN 102543774 B CN102543774 B CN 102543774B
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Abstract
The invention relates to a method for packaging a chip based on an epoxy resin type adhesive, belonging to the technical field of packaging electronic components. The method comprises the following steps of: adhering the chip onto an upper chip of a packaging substrate by the epoxy resin type adhesive through frequency-sweeping vibration, and carrying out contact vibration and stress removal vibration treatments. When the frequency-sweeping vibration is carried out on a sheet-level package structure, the chip and the packaging substrate are fully in contact with the epoxy resin type adhesive to the maximum extent, the chip is firmly fixed on the packaging substrate, and thermal residual stress of the chip is lower. According to the method for packaging the chip based on the epoxy resin type adhesive, disclosed by the invention, the chip keeps excellent mechanical stability when bearing temperature change, vibration impaction and the like under the conditions that types and structures of the chip, the packaging substrate and an adhesive are not regulated, thus the reliability of sheet-level package devices is improved.
Description
Technical field
The invention belongs to electronic devices and components encapsulation technology field, relate to the method for packing of chip.
Background technology
The encapsulation of electronic devices and components develops the very complicated AS of today from the simple glass shell encapsulation of early stage radio tube, developed into one of core technology of integrated circuit of new generation now.Due to the Moore's Law that semi-conductor industry is followed, the complexity of integrated circuit is increasing, and operating rate is more and more higher, and the size of chip is also more and more less simultaneously, and these are all had higher requirement to encapsulation technology.In integrated circuit and MEMS technical field, packaging cost all will account for 50% to 80% of device total cost, should this find a set of complete reliable encapsulation scheme for integrated circuit, and MEMS system etc. is all very important.
Many device normal operations all need the environment in a vacuum by chip package, and chip is connected with package substrate by certain mode.After chip package completes, the stress existing on chip is the problem that needs are considered forever, and this is even more important for some accurate devices, and desirable package substrate material should have identical thermo-mechanical property with chip.Yet consider packaging cost, the package substrate of many potteries or metal material is not mated with the thermal expansion of silicon base chip, so conventional solution is to add some binder materials between chip and package substrate, not only can fixed chip but also can be so that chip tolerates certain heat, mechanical stress.
Epoxy resin binding agent is the conventional a kind of chip attach agent in Electronic Packaging field, is conventionally added on and in epoxy resin, adds some physical and chemical parameters that some modifier change resin to meet different bonding demands, as conductivity, thermal insulation and thermal conductivity etc.Conventionally adopt the mode of hot curing by chip and package substrate bonding, yet because temperature after solidifying drops to room temperature, binding agent volume can shrink, make to produce on chip many stress; Moreover, if contacting with chip, binding agent not exclusively can make to have certain bubble in binding agent, in the time of variations in temperature, the inhomogeneous chip that also can make of binding agent change in volume produces larger stress.When above-mentioned situation all makes chip at tolerance external vibration and impacts, the stability of chip greatly weakens, and chip may occur warpage, distortion, even tear, and these all will cause great impact even to lose efficacy on device performance.
Summary of the invention
The present invention is for a kind of chip packaging method based on epoxyn, the method is on the basis of chip and package substrate structure not being done to change, by external drive and binding agent, make chip and package substrate obtain good contacting and lower residual stress, when bearing vibration and impacting, show lower mechanical stress.
A chip packaging method based on epoxyn, as shown in Figure 1, 2, comprises the following steps:
Step 1: the chip installation site in the package substrate through polishing, cleaning applies epoxyn, on adhesive, put the chip that needs encapsulation, and transverse reciprocating moving chip for several times, make the larger contact area of maintenance between package substrates and chip and adhesive, form sheet class encapsulation structure, then sheet class encapsulation structure is fixed on to vibration machine.
Step 2: the vibration frequency of adjusting vibration machine and vibration amplitude, control time of vibration, plane normal direction at sheet class encapsulation structure is carried out contact vibration processing to sheet class encapsulation structure, to remove the bubble that may exist between epoxyn and package substrates or chip as far as possible, and expand as far as possible the contact area between dress substrate and chip and adhesive.
Step 3: after vibration contact is finished dealing with, the position of chip in package substrate should not have notable difference with target installation site, as position and the target installation site of fruit chip in package substrate exists notable difference, chip should be moved to target installation site.
Step 4: select proper temperature to carry out hot curing processing according to the particular type of epoxyn; Detailed process is: first the sheet class encapsulation structure after step 3 is processed is warming up to the heat curing temperature of epoxyn, then carries out heat preservation hot and solidify processing, be finally cooled to room temperature; Encapsulating structure is carried out the destressing vibration processing of the plane normal direction of encapsulating structure in whole hot curing processing procedure.
In technique scheme, should be noted that: 1) the present invention is applicable to size range in (0.5～2) * 10
1the chip package of mm; 2) processing of contact vibration described in step 2 concrete technology is: oscillatory type is simple harmonic vibration, and vibration frequency is 1.5～1.8KHz, and vibrating 2 times of amplitudes is 1.5mm, and time of vibration is 5min; 3) vibration processing of destressing described in step 4 concrete technology is: oscillatory type is simple harmonic vibration, and vibration frequency is 250～350Hz, and vibrating 2 times of amplitudes is 1.0mm; 4) epoxyn described in the present invention can be various high temperature or in warm cured epoxy resin class adhesive, described chip can be various silica-based or germanium base chips, described package substrate can be aluminium oxide ceramics, aluminium nitride ceramics and low thermal coefficient of expansion can valve alloy etc.
Chip packaging method based on epoxyn provided by the invention, do not changing under the structural condition of chip and package substrate, by external vibration, process (comprising contact vibration processing and destressing vibration processing), make chip keep good contacting with package substrate and binding agent, and chip obtains lower residual stress, after completing, chip package presents lower mechanical stress when bearing external drive to a certain degree and impacting.The encapsulating structure that does not add the epoxy resin thermosetting bonding of vibration processing with tradition is compared, bonded areas and cavity obviously do not reduce to the invention enables in sheet class encapsulation structure binding material, after hot curing, binding agent has good uniformity, and between chip and binding agent, residual stress remains on lower level.The present invention is applicable to the encapsulation of high accuracy chip (or device), can directly improve stability and the reliability of high accuracy chip (or device) encapsulating structure.
Accompanying drawing explanation
The chip package schematic flow sheet of Fig. 1 tradition based on epoxyn.
The schematic flow sheet of Fig. 2 chip packaging method based on epoxyn provided by the invention.
Embodiment
A chip packaging method based on epoxyn, as shown in Figure 1, 2, comprises the following steps:
Step 1: the chip installation site in the package substrate through polishing, cleaning applies epoxyn, on adhesive, put the chip that needs encapsulation, and transverse reciprocating moving chip for several times, make the larger contact area of maintenance between package substrates and chip and adhesive, form sheet class encapsulation structure, then sheet class encapsulation structure is fixed on to vibration machine.
Step 2: the vibration frequency of adjusting vibration machine and vibration amplitude, control time of vibration, plane normal direction at sheet class encapsulation structure is carried out contact vibration processing to sheet class encapsulation structure, to remove the bubble that may exist between epoxyn and package substrates or chip as far as possible, and expand as far as possible the contact area between dress substrate and chip and adhesive.
Step 3: after vibration contact is finished dealing with, the position of chip in package substrate should not have notable difference with target installation site, as position and the target installation site of fruit chip in package substrate exists notable difference, chip should be moved to target installation site.
Step 4: select proper temperature to carry out hot curing processing according to the particular type of epoxyn; Detailed process is: first the sheet class encapsulation structure after step 3 is processed is warming up to the heat curing temperature of epoxyn, then carries out heat preservation hot and solidify processing, be finally cooled to room temperature; Encapsulating structure is carried out the destressing vibration processing of the plane normal direction of encapsulating structure in whole hot curing processing procedure.
In technique scheme, should be noted that: 1) the present invention is applicable to size range in (0.5～2) * 10
1the chip package of mm; 2) processing of contact vibration described in step 2 concrete technology is: oscillatory type is simple harmonic vibration, and vibration frequency is 1.5～1.8KHz, and vibrating 2 times of amplitudes is 1.5mm, and time of vibration is 5min; 3) vibration processing of destressing described in step 4 concrete technology is: oscillatory type is simple harmonic vibration, and vibration frequency is 250～350Hz, and vibrating 2 times of amplitudes is 1.0mm; 4) epoxyn described in the present invention can be various high temperature or in warm cured epoxy resin class adhesive, described chip can be various silica-based or germanium base chips, described package substrate can be aluminium oxide ceramics, aluminium nitride ceramics and low thermal coefficient of expansion can valve alloy etc.
Claims (7)
1. the chip packaging method based on epoxyn, comprises the following steps:
Step 1: the chip installation site in the package substrate through polishing, cleaning applies epoxyn, on adhesive, put the chip that needs encapsulation, and transverse reciprocating moving chip for several times, make the larger contact area of maintenance between package substrate and chip and adhesive, form sheet class encapsulation structure, then sheet class encapsulation structure is fixed on to vibration machine;
Step 2: the vibration frequency of adjusting vibration machine and vibration amplitude, control time of vibration, plane normal direction at sheet class encapsulation structure is carried out contact vibration processing to sheet class encapsulation structure, to remove the bubble that may exist between epoxyn and package substrate or chip as far as possible, and expand as far as possible the contact area between package substrate and chip and adhesive;
Step 3: after contact vibration is finished dealing with, the position of chip in package substrate should not have notable difference with target installation site, as position and the target installation site of fruit chip in package substrate exists notable difference, chip should be moved to target installation site;
Step 4: select proper temperature to carry out hot curing processing according to the particular type of epoxyn; Detailed process is: first the sheet class encapsulation structure after step 3 is processed is warming up to the heat curing temperature of epoxyn, then carries out heat preservation hot and solidify processing, be finally cooled to room temperature; Encapsulating structure is carried out the destressing vibration processing of the plane normal direction of encapsulating structure in whole hot curing processing procedure.
2. the chip packaging method based on epoxyn according to claim 1, is characterized in that, described chip is that size range is in (0.5～2) * 10
1the chip of mm.
3. the chip packaging method based on epoxyn according to claim 1, it is characterized in that, contact vibration described in step 2 is processed concrete technology and is: oscillatory type is simple harmonic vibration, and vibration frequency is 1.5～1.8KHz, vibrating 2 times of amplitudes is 1.5mm, and time of vibration is 5min.
4. the chip packaging method based on epoxyn according to claim 1, it is characterized in that, the vibration processing of destressing described in step 4 concrete technology is: oscillatory type is simple harmonic vibration, and vibration frequency is 250～350Hz, and vibrating 2 times of amplitudes is 1.0mm.
5. the chip packaging method based on epoxyn according to claim 1, is characterized in that, described epoxyn be various high temperature or in warm cured epoxy resin class adhesive.
6. the chip packaging method based on epoxyn according to claim 1, is characterized in that, described chip is various silica-based or germanium base chips.
7. the chip packaging method based on epoxyn according to claim 1, is characterized in that, described package substrate be aluminium oxide ceramics, aluminium nitride ceramics or low thermal coefficient of expansion can valve alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047272.8A CN102543774B (en) | 2012-02-28 | 2012-02-28 | Method for packaging chip based on epoxy resin type adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047272.8A CN102543774B (en) | 2012-02-28 | 2012-02-28 | Method for packaging chip based on epoxy resin type adhesive |
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| CN102543774A CN102543774A (en) | 2012-07-04 |
| CN102543774B true CN102543774B (en) | 2014-02-26 |
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| CN201210047272.8A Expired - Fee Related CN102543774B (en) | 2012-02-28 | 2012-02-28 | Method for packaging chip based on epoxy resin type adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105399344B (en) * | 2015-12-07 | 2018-05-04 | 上海现代先进超精密制造中心有限公司 | The method that paraffin bubble-free is bonded flat glass |
| CN106128746B (en) * | 2016-08-19 | 2018-11-27 | 浙江艾默可科技有限公司 | A kind of curing method reducing amorphous iron core internal stress |
| CN107221542B (en) * | 2017-05-27 | 2021-03-23 | 中国电子科技集团公司第十三研究所 | Ceramic shell for packaging linear array charge coupled device and manufacturing method thereof |
| CN107221504B (en) * | 2017-05-27 | 2020-08-18 | 中国电子科技集团公司第十三研究所 | Ceramic shell for packaging area array charge coupled device and manufacturing method thereof |
| CN110189993A (en) * | 2018-02-23 | 2019-08-30 | 东莞新科技术研究开发有限公司 | The method of semiconductor surface elimination internal stress |
| CN109049445B (en) * | 2018-09-19 | 2023-09-08 | 河北科技大学 | High-precision optical fiber ring curing and packaging equipment and treatment process |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462474A (en) * | 2001-03-12 | 2003-12-17 | 索尼公司 | Method of manufacturing semiconductor device |
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| JP3949031B2 (en) * | 2002-02-05 | 2007-07-25 | 東レエンジニアリング株式会社 | Chip mounting method |
| JP2005264109A (en) * | 2004-03-22 | 2005-09-29 | Hitachi Chem Co Ltd | Film-shaped adhesive and manufacturing method of semiconductor device using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1462474A (en) * | 2001-03-12 | 2003-12-17 | 索尼公司 | Method of manufacturing semiconductor device |
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| JP特开2003-303853A 2003.10.24 |
| JP特开2005-264109A 2005.09.29 |
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