CN102453325A - Preparation method of polyimide composite material with high heat conductivity - Google Patents
Preparation method of polyimide composite material with high heat conductivity Download PDFInfo
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- CN102453325A CN102453325A CN2010105293405A CN201010529340A CN102453325A CN 102453325 A CN102453325 A CN 102453325A CN 2010105293405 A CN2010105293405 A CN 2010105293405A CN 201010529340 A CN201010529340 A CN 201010529340A CN 102453325 A CN102453325 A CN 102453325A
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Abstract
The invention relates to a preparation method of a polyimide composite material with high heat conductivity. The method comprises the following steps: preparing electrodes according to the arrangement requirement of heat conduction filler orientation; dissolving monomer diamine in a solvent in which heat conduction fillers are uniformly dispersed, then adding monomer dianhydride with molar ratio equal to that of the monomer diamine, stirring the materials to disperse the materials uniformly and reacting for 4-24 hours to prepare polyamide acid composite material solution; putting the polyamide acid composite material solution between the electrodes, electrifying the electrodes to ensure the orientation of the heat conduction fillers in the electric filed and heating the polyamide acid composite material solution to carry out solvent removal treatment in the heat conduction filler orientation process to prepare a heat conduction filler oriented polyamide acid composite material; and carrying out imidization on the prepared heat conduction filler oriented polyamide acid composite material to obtain the heat conduction filler oriented polyimide composite material. The preparation method has the following beneficial effect: the heat conduction fillers are regularly arranged in the polymer under the action of the electric field, thus preparing the polymer composite material with low heat conduction filler content and high heat conductivity.
Description
Technical field
The invention belongs to macromolecule thermal-conducting material technology field, be specifically related to a kind of preparation method who is applicable to the high thermal conductivity coefficient composite polyimide material of industries such as electronics, machinery.
Background technology
At present; Be to use metallic substance as thermally conductive material in that heat conduction, heat radiation are traditional in the industry; Yet the metal heat-conducting goods usually very heaviness and machining cost high, be easy to corrosion, so the polymer composites of heat conduction has received very big concern because of its good processing properties and lower density, better chemical stability etc.
Outstanding over-all propertieies such as good heat resistance, chemicalstability are good, good mechanical property have been widely used in fields such as various motors, extraordinary electrical equipment, high temperature resistant base material to polyimide because of having.But common polyimide is because of poor thermal conductivity (0.18Wm
-1k
-1) make it the difficult dissipation of heating, parts intensification phenomenon in application process, occur, influence the work-ing life and the stability of device, thereby influenced the use properties of product.
Therefore, the polyimide material of high heat conduction can obtain demand and application widely.Prior art (CN200710132525.0) preparation high thermal conductivity coefficient composite polyimide material is when the addition of heat conductive filler is 3wt%-8wt%, and its thermal conductivity only can reach 0.6Wm
-1k
-1-0.8Wm
-1k
-1, improve DeGrain.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, a kind of preparation method of high thermal conductivity coefficient composite polyimide material is provided.
The present invention utilizes electric field controls heat conductive filler orientation to improve thermal conductivity, may further comprise the steps:
(1) arrangement that is orientated according to heat conductive filler requires the preparation electrode;
(2) heat conductive filler is scattered in the solvent, it is uniformly dispersed through ultrasonic;
(3) the monomer diamines being dissolved in homodisperse has in the solvent of heat conductive filler, the monomer dianhydride of mol ratios such as adding and monomer diamines, and stirring is uniformly dispersed it, reacts 4-24 hour, makes polyamic acid matrix material solution;
(4) the polyamic acid matrix material solution that makes is placed between the electrode of step (1) preparation, electrifying electrodes is orientated heat conductive filler in electric field; In the heat conductive filler orientation process, polyamic acid matrix material solution heating carrying out desolventizing is handled, made the polyamic acid matrix material of heat conductive filler orientation;
(5) the polyamic acid matrix material of heat conductive filler orientation carries out imidization, obtains the composite polyimide material of heat conductive filler orientation.
Described heat conductive filler is one or more of nano graphite flakes, carbon nanotube or nano metal line, and the addition of heat conductive filler is 1wt%-10wt%, preferred 3wt%-8wt%.
The monomer of polyamic acid is diamines and dianhydride, and wherein the monomer diamines is a kind of in 4,4 ' diaminodiphenyl oxide, MDA or the Ursol D; The monomer dianhydride is a pyromellitic acid anhydride, 3, a kind of in 3 '-4,4 ' bibenzene tetracarboxylic dianhydride or the benzophenone tetracarboxylic dianhydride.
The shape and structure of the electrode of filler orientation is parallel plate shape or parallel clavate.Electric field is alternating-electric field or DC electric field, and strength of electric field is 100v/cm-20000v/cm, preferred 5000v/cm-10000v/cm.
Said solvent is N, one or more of dinethylformamide, DMAC N,N or N-Methyl pyrrolidone.
The desolventizing temperature that said desolventizing is handled is between 40-200 ℃, preferred 60-100 ℃; The desolventizing time is 3-24 hour, preferred 4-10 hour.The imidization temperature is 300-480 ℃, imidization time 2-8h.
Ultimate principle of the present invention is in polyamic acid solution, to add conductive heat conductive filler; Make heat conductive filler regular arrangement in polymkeric substance through effect of electric field; Thereby under low loading level, improved the thermal conductivity of polymer composites greatly, thermal conductivity of composite materials can reach 0.8Wm when the addition of heat conductive filler was 3wt%-8wt%
-1k
-1-1.2Wm
-1k
-1, thermal conductivity of composite materials also can reach 0.3Wm when the addition of heat conductive filler is merely 1wt%
-1k
-1Because the filler of dosing is the conductivity type heat conductive filler, therefore the polyimide heat-conductive composite material of preparation also has bigger application prospect at antistatic material even electro-conductive material field simultaneously.
Description of drawings
Fig. 1 is the vertical orientated device synoptic diagram of heat conductive filler.
Fig. 2 is the parallel-oriented device synoptic diagram of heat conductive filler.
Embodiment:
Used medicine and reagent among the embodiment:
A) monomer: 4,4 ' diaminodiphenyl oxide: Co., Ltd among the SIGMA-Aldrich; MDA: Chemical Reagent Co., Ltd., Sinopharm Group; Ursol D: Chemical Reagent Co., Ltd., Sinopharm Group; Pyromellitic acid anhydride: Chemical Reagent Co., Ltd., Sinopharm Group; 3,3 '-4,4 ' bibenzene tetracarboxylic dianhydride: Co., Ltd among the SIGMA-Aldrich; Benzophenone tetracarboxylic dianhydride: Co., Ltd among the SIGMA-Aldrich.
B) solvent: DMAC N,N: Chemical Reagent Co., Ltd., Sinopharm Group; N-Methyl pyrrolidone: Chemical Reagent Co., Ltd., Sinopharm Group; N, dinethylformamide (DMF): Chemical Reagent Co., Ltd., Sinopharm Group.
C) heat conductive filler: nano-graphite piece preparation method: the commercialization expansible black lead is placed 300 ℃ of baking ovens, and constant temperature 2min makes nano graphite flakes; Expansible black lead: Yichang newly becomes graphite Ltd; Carbon nanotube: Chengdu Organical Chemical Co., Ltd., Chinese Academy of Sciences; Nano-silver thread: Jiangsu is received and is novel material Science and Technology Ltd..
Testing method:
Thermal conductivity test: DRL-III thermal conductivity tester, Xiangtan City instrument ltd.
Embodiment 1:
0.036g nano graphite flakes is scattered in the N of 30ml, in the dinethylformamide, behind the ultra-sonic dispersion 2h; 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein, and stirring is dissolved it fully; Slowly add the 1.88g pyromellitic acid anhydride, reaction 20h gets polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode; Electrifying electrodes, adjusting strength of electric field is 5000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 4h under 60 ℃; Obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out imidization in 4 hours, obtain composite polyimide material; The addition of heat conductive filler is 1wt%, and recording its thermal conductivity is 0.3Wm
-1k
-1
Embodiment 2:
0.18g nano graphite flakes is scattered in the N of 30ml, in the dinethylformamide, behind the ultra-sonic dispersion 2h; 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein, and stirring is dissolved it fully; Slowly add the 1.88g pyromellitic acid anhydride, reaction 24h gets polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode; Electrifying electrodes, adjusting strength of electric field is 10000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 4h under 80 ℃; Obtain the polyamic acid matrix material, be placed in the vacuum drying oven 450 ℃ and keep carrying out imidization in 4 hours, obtain composite polyimide material; The addition of heat conductive filler is 5wt%, and recording its thermal conductivity is 0.8Wm
-1k
-1
Embodiment 3:
0.252g nano graphite flakes is scattered in the N of 30ml, in the dinethylformamide, behind the ultra-sonic dispersion 2h; 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein, and stirring is dissolved it fully; Slowly add the 1.88g pyromellitic acid anhydride, reaction 8h gets polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode; Electrifying electrodes, adjusting strength of electric field is 10000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 4h under 100 ℃; Obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out imidization in 4 hours, obtain composite polyimide material; The addition of heat conductive filler is 6.5wt%, and recording its thermal conductivity is 1.01Wm
-1k
-1
Embodiment 4:
0.36g carbon nanotube is scattered in the N-Methyl pyrrolidone of 30ml, behind the ultra-sonic dispersion 2h, with 4 of 1.38g; 4 ' diaminodiphenyl oxide adds wherein, stirs it is dissolved fully, slowly adds the 2.223g benzophenone tetracarboxylic dianhydride; The reaction 20h get polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode, electrifying electrodes; Adjusting strength of electric field is 5000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 24h under 120 ℃, obtains the polyamic acid matrix material; Be placed in the vacuum drying oven 350 ℃ and keep carrying out in 8 hours imidization; Obtain composite polyimide material, the addition of heat conductive filler is 9wt%, and recording its thermal conductivity is 0.92Wm
-1k
-1
Embodiment 5:
0.18g nano graphite flakes and 0.18g carbon nanotube are scattered in the N of 30ml, in the dinethylformamide, behind the ultra-sonic dispersion 2h; 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein, and stirring is dissolved it fully; Slowly add the 1.88g pyromellitic acid anhydride, reaction 24h gets polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode; Electrifying electrodes, adjusting strength of electric field is 10000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 12h under 60 ℃; Obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out imidization in 4 hours, obtain composite polyimide material; The addition of heat conductive filler is 9.5wt%, and recording its thermal conductivity is 1.25Wm
-1k
-1
Embodiment 6:
0.36g nano graphite flakes is scattered in the N of 30ml, in the mixed solvent of dinethylformamide and DMAC N,N; Behind the ultra-sonic dispersion 2h, 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein; Stirring is dissolved it fully, slowly adds the 2.54g pyromellitic acid anhydride, and reaction 20h gets polyamic acid matrix material solution; With polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode, electrifying electrodes, adjusting strength of electric field is 10000V/cm; Under 60 ℃ desolventizing is carried out in polyamic acid matrix material solution heating and handle 4h, obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out in 4 hours imidization; Obtain composite polyimide material, the addition of heat conductive filler is 8wt%, and recording its thermal conductivity is 1.1Wm
-1k
-1
Embodiment 7:
0.21g nano-silver thread is scattered in the N of 30ml, in the dinethylformamide, behind the ultra-sonic dispersion 2h, with 4 of 1.707g; 4 '-MDA adds wherein, stirs it is dissolved fully, slowly adds 3 of 2.54g; 3 '-4,4 ' bibenzene tetracarboxylic dianhydride, reaction 20h gets polyamic acid matrix material solution; With polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode, electrifying electrodes, adjusting strength of electric field is 10000V/cm; Under 60 ℃ desolventizing is carried out in polyamic acid matrix material solution heating and handle 4h, obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out in 4 hours imidization; Obtain composite polyimide material, the addition of heat conductive filler is 5wt%, and recording its thermal conductivity is 1.01Wm
-1k
-1
Embodiment 8:
0.21g nano graphite flakes is scattered in the DMAC N,N of 30ml, behind the ultra-sonic dispersion 2h; The 0.75g Ursol D is added wherein, and stirring is dissolved it fully, slowly adds the 1.88g pyromellitic acid anhydride; The reaction 24h get polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on the sheet glass that is placed between the electrode, electrifying electrodes; Adjusting strength of electric field is 10000V/cm, polyamic acid matrix material solution heating carrying out desolventizing is handled 18h under 100 ℃, obtains the polyamic acid matrix material; Be placed in the vacuum drying oven 350 ℃ and keep carrying out in 8 hours imidization; Obtain composite polyimide material, the addition of heat conductive filler is 7wt%, and recording its thermal conductivity is 1.21Wm
-1k
-1
Comparative Examples 1:
0.18g nano graphite flakes is scattered in the N of 30ml, in the dinethylformamide, and ultra-sonic dispersion 2h; 4, the 4 ' diaminodiphenyl oxide of 1.724g is added wherein, and stirring is dissolved it fully; Slowly add the 1.88g pyromellitic acid anhydride, reaction 20h gets polyamic acid matrix material solution, with polyamic acid matrix material drips of solution on sheet glass; Under 60 ℃ desolventizing is carried out in polyamic acid matrix material solution heating and handle 4h, obtain the polyamic acid matrix material, be placed in the vacuum drying oven 350 ℃ and keep carrying out in 4 hours imidization; Obtain composite polyimide material, the addition of heat conductive filler is 5wt%, and recording its thermal conductivity is 0.31Wm
-1k
-1
Comparative Examples 2:
4, the 4 ' diaminodiphenyl oxide of 1.724g is added the N of 30ml, in the dinethylformamide; Stirring is dissolved it fully, slowly adds the 1.88g pyromellitic acid anhydride, and reaction 20h gets polyamic acid solution; Polyamic acid solution is dripped on sheet glass, polyamic acid solution heating carrying out desolventizing is handled 4h under 60 ℃, be placed in the vacuum drying oven 350 ℃ again and keep carrying out in 4 hours imidization; Obtain polyimide material, recording its thermal conductivity is 0.18Wm
-1k
-1
Claims (9)
1. the preparation method of a high thermal conductivity coefficient composite polyimide material is characterized in that: may further comprise the steps:
(1) arrangement that is orientated according to heat conductive filler requires the preparation electrode;
(2) heat conductive filler is scattered in the solvent, it is uniformly dispersed through ultrasonic;
(3) the monomer diamines being dissolved in homodisperse has in the solvent of heat conductive filler, adds the monomer dianhydride with mol ratios such as monomer diamines then, stirs it is uniformly dispersed, and reacts 4-24 hour, makes polyamic acid matrix material solution;
(4) the polyamic acid matrix material solution that makes is placed between the electrode of step (1) preparation, electrifying electrodes is orientated heat conductive filler in electric field; In the heat conductive filler orientation process, polyamic acid matrix material solution heating carrying out desolventizing is handled, made the polyamic acid matrix material of heat conductive filler orientation;
(5) the polyamic acid matrix material of heat conductive filler orientation carries out imidization, obtains the composite polyimide material of heat conductive filler orientation.
2. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in the claim 1, it is characterized in that: described heat conductive filler is one or more of nano graphite flakes, carbon nanotube or nano metal line.
3. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: the addition of said heat conductive filler is 1wt%-10wt%.
4. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: said monomer diamines is a kind of in 4,4 ' diaminodiphenyl oxide, MDA or the Ursol D; Said monomer dianhydride is a pyromellitic acid anhydride, 3, a kind of in 3 '-4,4 ' bibenzene tetracarboxylic dianhydride or the benzophenone tetracarboxylic dianhydride.
5. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: the shape and structure of said electrode is parallel plate shape or parallel clavate.
6. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: said electric field is alternating-electric field or DC electric field, and strength of electric field is 100v/cm-20000v/cm.
7. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: said solvent is N, one or more of dinethylformamide, DMAC N,N or N-Methyl pyrrolidone.
8. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: the desolventizing temperature that described desolventizing is handled is 40-200 ℃; The desolventizing time is 3-24 hour.
9. according to the preparation method of the high thermal conductivity coefficient composite polyimide material described in claim 1 or 2, it is characterized in that: said imidization temperature is 300-480 ℃, imidization time 2-8h.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1893803A (en) * | 2005-06-30 | 2007-01-10 | 保力马科技株式会社 | Heat radiation member and production method for the same |
| CN101074318A (en) * | 2007-05-25 | 2007-11-21 | 南京工业大学 | Thermoplastic polyimide composite material and its production |
-
2010
- 2010-10-22 CN CN2010105293405A patent/CN102453325A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1893803A (en) * | 2005-06-30 | 2007-01-10 | 保力马科技株式会社 | Heat radiation member and production method for the same |
| CN101074318A (en) * | 2007-05-25 | 2007-11-21 | 南京工业大学 | Thermoplastic polyimide composite material and its production |
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| CN103755984A (en) * | 2013-12-30 | 2014-04-30 | 宁波工程学院 | Method for preparing macromolecular nano composite membrane enriching inorganic filler on surface |
| CN103755984B (en) * | 2013-12-30 | 2016-06-29 | 宁波工程学院 | A kind of method of the high molecular nanometer composite membrane preparing surface enrichment inorganic filler |
| CN103923330A (en) * | 2014-04-30 | 2014-07-16 | 山东中天华德科技发展有限公司 | Method for preparing high-thermal conductivity polyimide/magnesium oxide composite film |
| CN104744715A (en) * | 2015-04-03 | 2015-07-01 | 宁波工程学院 | Method for preparing hydrophilic nylon film |
| CN109896782A (en) * | 2019-04-11 | 2019-06-18 | 广西鼎康科技股份有限公司 | A kind of heat preservation diatomite plate of good flame retardation effect and preparation method thereof |
| CN111825347A (en) * | 2020-07-03 | 2020-10-27 | 广东工业大学 | Device and method for orienting glass flakes by electric field |
| WO2022001300A1 (en) * | 2020-07-03 | 2022-01-06 | 广东工业大学 | Device and method for electric field orientation of glass flakes |
| CN112812567A (en) * | 2021-01-28 | 2021-05-18 | 中南大学 | Preparation method of carbon nano tube/polydimethylsiloxane conductive composite material |
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Application publication date: 20120516 |