CN102412215A - Thermal module and electronic device adopting same - Google Patents
Thermal module and electronic device adopting same Download PDFInfo
- Publication number
- CN102412215A CN102412215A CN2010102904892A CN201010290489A CN102412215A CN 102412215 A CN102412215 A CN 102412215A CN 2010102904892 A CN2010102904892 A CN 2010102904892A CN 201010290489 A CN201010290489 A CN 201010290489A CN 102412215 A CN102412215 A CN 102412215A
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- China
- Prior art keywords
- heat
- radome
- euthermic chip
- electromagnetic interference
- conducting element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses an electronic device. The electronic device comprises a circuit board and a thermal module; the circuit board is provided with a heating chip and an electromagnetic interference source; the thermal module comprises a heat conduction component and a shielding case with electricity and heat conduction performance; the electromagnetic interference source is arranged in the shielding case so as to perform electromagnetic shielding on the electromagnetic interference source; one end of the heat conduction component is connected with the heating chip; and the other end of the heat conduction component is connected with the shielding case in a heat conduction way, so heat which is produced by the heating chip is transmitted to the shielding case and is dispersed by the shielding case. The shielding case has the double functions of electromagnetic shielding and heat dissipation.
Description
Technical field
The present invention relates to a kind of heat radiation module, relate in particular to a kind of a kind of electronic installation that is used for the heat radiation module that heat-generating electronic elements is dispelled the heat and adopts this heat radiation module.
Background technology
At electronic installation for example in computer or the communication product, because improving constantly of the power of chip need be provided with a heat radiation module usually and come chip is dispelled the heat.But existing heat radiation module only can play single thermolysis.Along with electronic installation towards lightening, the heat radiation module space that can occupy will be restricted, and how can make the module multifunction and reducing cost of dispelling the heat, and be the problem of needing solution badly.
Summary of the invention
In view of this, be necessary to provide a kind of tool multifunction and the module that dispels the heat cheaply.
A kind of heat radiation module; A radome that comprises a heat conducting element and tool conduction and heat conductivility; One end of this heat conducting element is used for being connected with an euthermic chip heat conduction; The other end of this heat conducting element is connected with this radome heat conduction, and this radome is provided with a receiving space, is used for accommodating an electromagnetic interference source so that this electromagnetic interference source is carried out electromagnetic shielding.
A kind of electronic installation; Comprise a circuit board and a heat radiation module; This circuit board is provided with an euthermic chip and an electromagnetic interference source; This heat radiation module comprises a radome of a heat conducting element and tool conduction and heat conductivility, and so that electromagnetic interference source is carried out electromagnetic shielding, an end of this heat conducting element was connected with euthermic chip heat conduction in this radome covered at electromagnetic interference source; The other end of this heat conducting element is connected with radome heat conduction, reaches radome and is distributed by radome with the heat that euthermic chip is produced.
Compare prior art; The radome tool electromagnetic shielding in the above-mentioned heat radiation module and the double effects of heat radiation; Not only can shield to prevent other element generation electromagnetic interference on electromagnetic interference source and the circuit board, can also be used to euthermic chip is dispelled the heat electromagnetic interference source.Therefore, need not again the extra radiator that is provided with and distribute heat, saved the quantity of element through heat pipe transmission, make heat radiation module tool multi-functional with advantage cheaply.
Description of drawings
With reference to the accompanying drawings, in conjunction with embodiment the present invention is further described.
Fig. 1 is the three-dimensional assembly diagram of electronic installation one preferred embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of electronic installation shown in Figure 1.
Fig. 3 is the inverted view of Fig. 2.
The main element symbol description
Electronic installation 100
Euthermic chip 11
Electromagnetic interference source 12
Opening 122
Holder 13
Heat radiation module 20
Groove 213
Through hole 214
Radome 23
Top board 231
Sidewall 232
Receiving space 233
Fixture 24
Embodiment
Fig. 1 is extremely shown in Figure 3 to be a preferred embodiment of electronic installation 100 of the present invention.This electronic installation 100 comprises a circuit board 10 and a heat radiation module 20.
This circuit board 10 is provided with an euthermic chip 11 and an electromagnetic interference source 12.11 centre positions of being located at circuit board 10 of this euthermic chip are the main heater element on the circuit board 10.
This electromagnetic interference source 12 near a side setting of circuit board 10 and with this euthermic chip 11 separately.Said electromagnetic interference source 12 can be any outwards element of launching electromagnetic wave, the for example connector of the pin of integrated circuit, cable and electronic component etc.In the present embodiment, this electromagnetic interference source 12 is a cable receptacles, be used for a holding wire 121 for example television signal line 121 be electrically connected with circuit board 10.During electronic installation 100 work; This electromagnetic interference source 12 is launching electromagnetic wave outwards; Can produce interference phenomenon after the element effect of the outwards launching electromagnetic wave on said electromagnetic wave and the circuit board 10, promptly take place electromagnetic interference (Electro Magnetic Interference, EMI).Be equipped with a holder 13 around this electromagnetic interference source 12, this holder 13 is the rectangle frame of a hollow, and said holder 13 is fixed on the circuit board 10 and with electromagnetic interference source 12 accommodates wherein.The outside of this holder 13 wears for holding wire 121 being provided with an opening 122 by holding wire 121.
This heat radiation module 20 is used for this euthermic chip 11 is dispelled the heat, and simultaneously electromagnetic interference source 12 is carried out electromagnetic shielding.Said heat radiation module 20 comprises a radiator 21, a heat conducting element 22 and a radome 23.This radiator 21 is attached on the euthermic chip 11, is used for euthermic chip 11 is dispelled the heat, and heat conducting element 22 is carried out heat conduction with euthermic chip 11 is connected.Said radiator 21 comprises a base plate 211 and is located at the some fin 212 on the end face of this base plate 211.This base plate 211 is provided with two through hole 214 (shown in Figure 3), thereby wear for two fixtures 24 radiator 21 is fixed on the euthermic chip 11.One bottom surface of base plate 211 is provided with a groove 213, in order to accommodate an end of heat conducting element 22.
One end of this heat conducting element 22 is connected with euthermic chip 11 heat conduction, and its other end is connected with radome 23 heat conduction, so that euthermic chip 11 heat that produced is reached on the radome 23.In the present embodiment, this heat conducting element 22 is a heat pipe, has an evaporation section 221 and a condensation segment 222, and the evaporation section 221 of heat pipe is contained in the groove 213 of base plate 211 of radiator 21, and the condensation segment 222 of heat pipe is attached on the radome 23.
This radome 23 comprises the top board 231 of a rectangle and by the periphery of this top board 231 sidewall 232 to an annular that extends below, and surrounds a receiving space 233 (shown in Figure 3) by this top board 231 with sidewall 232.This radome 23 is through sidewall 232 and holder 13 sockets, so that electromagnetic interference source 12 is contained in the receiving space 233.In other embodiment, radome 23 also can be directly fixed on the circuit board 10, thereby holder 13 need not be set.Said sidewall 232 is provided with a breach 234 in the position of respective signal line 121, wear for holding wire 121.This radome 23 is processed by the tool conduction and the material of heat conductivility, for example for by the metal material cover cap processed such as copper, aluminium, steel, copper alloy and aluminium alloy particularly, electromagnetic interference source 12 is shielded and the tool heat sinking function.
Install should heat radiation module 20 in 10 last times of circuit board, the evaporation section 221 of heat pipe is attached on the euthermic chip 11 and is contained on the base plate 211 of radiator 21 in the set groove 213.Through fixture 24 evaporation section 221 of radiator 21 together with heat pipe is fixed on the euthermic chip 11.Radome 23 is sheathed on the holder 13, thereby in electromagnetic interference source 12 covered at.The condensation segment 222 of heat pipe is attached on the top board 231 of radome 23.
During work; The part that euthermic chip 11 produces in the heat reaches fin 212 and by fin 212 heat is distributed through the base plate 211 of radiator 21; Another part that euthermic chip 11 is produced in the heat then reaches condensation segment 222 via the evaporation section 221 of heat pipe, reaches radome 23 by the condensation segment 222 of heat pipe again and by radome 23 heat is distributed.
In the above-mentioned heat radiation module 20; The double effects of radome 23 tool electromagnetic shieldings and heat radiation; Not only can shield to prevent other element generation electromagnetic interference on electromagnetic interference source 12 and the circuit board 10, can also be used to euthermic chip 11 is dispelled the heat electromagnetic interference source 12.Therefore, need not again the extra radiator that is provided with and distribute heat, saved the quantity of element through heat pipe transmission, make heat radiation module 20 tools multi-functional with advantage cheaply.
In the above-mentioned electronic installation 100; If the caloric value of euthermic chip 11 is relatively low; Radiator 21 in the heat radiation module 20 also can omit; And adopting shell fragment that the evaporation section 221 of heat pipe is connected with euthermic chip 11 heat conduction, the heat that euthermic chip 11 is produced reaches radome 23 and is distributed by radome 23 through heat pipe.
Claims (12)
- One kind the heat radiation module; Comprise a heat conducting element; It is characterized in that: also comprise a radome of tool conduction and heat conductivility, an end of this heat conducting element is used for being connected with an euthermic chip heat conduction, and the other end of this heat conducting element is connected with this radome heat conduction; This radome is provided with a receiving space, is used for accommodating an electromagnetic interference source so that this electromagnetic interference source is carried out electromagnetic shielding.
- 2. heat radiation module as claimed in claim 1 is characterized in that: this radome is a cover of meter hood.
- 3. heat radiation module as claimed in claim 1 is characterized in that: this radome comprises a top board and by the periphery of this top board sidewall to an annular that extends below, surrounds said receiving space by this top board and sidewall.
- 4. heat radiation module as claimed in claim 1 is characterized in that: also comprise a radiator, the end that this heat conducting element is connected with euthermic chip heat conduction is connected with radiator heat conduction.
- 5. like claim 1 or 4 described heat radiation modules, it is characterized in that: this heat conducting element is a heat pipe, and this heat pipe has an evaporation section and a condensation segment, and the evaporation section of heat pipe is used for being connected with euthermic chip heat conduction, and the condensation segment of heat pipe is connected with radome heat conduction.
- 6. electronic installation; Comprise a circuit board and a heat radiation module; This circuit board is provided with an euthermic chip and an electromagnetic interference source; It is characterized in that: this heat radiation module comprises a radome of a heat conducting element and tool conduction and heat conductivility, and so that electromagnetic interference source is carried out electromagnetic shielding, an end of this heat conducting element was connected with euthermic chip heat conduction in this radome covered at electromagnetic interference source; The other end of this heat conducting element is connected with radome heat conduction, reaches radome and is distributed by radome with the heat that euthermic chip is produced.
- 7. electronic installation as claimed in claim 6 is characterized in that: this heat conducting element is a heat pipe, and this heat pipe has an evaporation section and a condensation segment, and the evaporation section of heat pipe is connected with euthermic chip heat conduction, and the condensation segment of heat pipe is connected with radome heat conduction.
- 8. electronic installation as claimed in claim 7 is characterized in that: this heat radiation module also comprises a radiator that is attached on the euthermic chip, and the evaporation section of this heat pipe is connected with radiator heat conduction.
- 9. electronic installation as claimed in claim 8; It is characterized in that: this radiator comprises the some fin on the end face that is attached at the base plate on the euthermic chip and is located at this base plate; One bottom surface of this base plate is provided with a groove, and the evaporation section of heat pipe is contained in the groove of this base plate and is attached on the euthermic chip.
- 10. electronic installation as claimed in claim 6 is characterized in that: also be provided with a holder on this circuit board, this holder is located in the periphery of electromagnetic interference source, and this radome is socketed on this holder.
- 11. electronic installation as claimed in claim 6 is characterized in that: this radome is a cover of meter hood.
- 12. electronic installation as claimed in claim 6 is characterized in that: this radome comprises a top board and by the periphery of this top board sidewall to an annular that extends below, surrounds this receiving space by this top board and sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102904892A CN102412215A (en) | 2010-09-23 | 2010-09-23 | Thermal module and electronic device adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102904892A CN102412215A (en) | 2010-09-23 | 2010-09-23 | Thermal module and electronic device adopting same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102412215A true CN102412215A (en) | 2012-04-11 |
Family
ID=45914222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102904892A Pending CN102412215A (en) | 2010-09-23 | 2010-09-23 | Thermal module and electronic device adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102412215A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117440A1 (en) * | 2014-08-20 | 2015-08-13 | 中兴通讯股份有限公司 | Terminal heat dissipation apparatus and mobile terminal |
| CN105208307A (en) * | 2015-10-29 | 2015-12-30 | 安徽理工大学 | Television heat dissipation device |
| CN105592676A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | EMI-prevention shielding structure for electronic element |
| CN105592677A (en) * | 2014-11-14 | 2016-05-18 | 奇鋐科技股份有限公司 | Shielding structure for preventing electronic component from electromagnetic interference |
| CN107333448A (en) * | 2017-07-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
| CN108111718A (en) * | 2016-11-25 | 2018-06-01 | 三星电机株式会社 | Vehicle-mounted pick-up head module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1178064A (en) * | 1995-03-06 | 1998-04-01 | Ast研究公司 | Movable heat pipe apparatus for reducing heat built up in electronic devices |
| US5949648A (en) * | 1998-02-26 | 1999-09-07 | Compal Electronics Inc. | Heat radiating device capable of reducing electromagnetic interference |
| US6122169A (en) * | 1999-07-22 | 2000-09-19 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| US6401805B1 (en) * | 1999-12-22 | 2002-06-11 | Ncr Corporation | Integrated venting EMI shield and heatsink component for electronic equipment enclosures |
| US20040008491A1 (en) * | 2002-07-11 | 2004-01-15 | Yung-Shun Chen | Heat dissipation apparatus |
| TW200709777A (en) * | 2005-08-26 | 2007-03-01 | Hon Hai Prec Ind Co Ltd | Electronic devices and heat sink for preventing electromagnetic interference thereof |
-
2010
- 2010-09-23 CN CN2010102904892A patent/CN102412215A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1178064A (en) * | 1995-03-06 | 1998-04-01 | Ast研究公司 | Movable heat pipe apparatus for reducing heat built up in electronic devices |
| US5949648A (en) * | 1998-02-26 | 1999-09-07 | Compal Electronics Inc. | Heat radiating device capable of reducing electromagnetic interference |
| US6122169A (en) * | 1999-07-22 | 2000-09-19 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| US6401805B1 (en) * | 1999-12-22 | 2002-06-11 | Ncr Corporation | Integrated venting EMI shield and heatsink component for electronic equipment enclosures |
| US20040008491A1 (en) * | 2002-07-11 | 2004-01-15 | Yung-Shun Chen | Heat dissipation apparatus |
| TW200709777A (en) * | 2005-08-26 | 2007-03-01 | Hon Hai Prec Ind Co Ltd | Electronic devices and heat sink for preventing electromagnetic interference thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117440A1 (en) * | 2014-08-20 | 2015-08-13 | 中兴通讯股份有限公司 | Terminal heat dissipation apparatus and mobile terminal |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN105472940B (en) * | 2014-08-20 | 2018-08-17 | 南京中兴新软件有限责任公司 | Heat dissipation of terminal device and mobile terminal |
| US10219410B2 (en) | 2014-08-20 | 2019-02-26 | Xi'an Zhongxing New Software Co., Ltd. | Device for terminal heat dissipation and mobile terminal |
| CN105592676A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | EMI-prevention shielding structure for electronic element |
| CN105592677A (en) * | 2014-11-14 | 2016-05-18 | 奇鋐科技股份有限公司 | Shielding structure for preventing electronic component from electromagnetic interference |
| CN105592677B (en) * | 2014-11-14 | 2019-09-20 | 奇鋐科技股份有限公司 | The masking structure of the anti-electromagnetic interference of electronic component |
| CN105208307A (en) * | 2015-10-29 | 2015-12-30 | 安徽理工大学 | Television heat dissipation device |
| CN108111718A (en) * | 2016-11-25 | 2018-06-01 | 三星电机株式会社 | Vehicle-mounted pick-up head module |
| CN107333448A (en) * | 2017-07-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120411 |