CN102408089A - Micro electronmechanical sensor capable of simultaneously measuring acceleration and pressure - Google Patents
Micro electronmechanical sensor capable of simultaneously measuring acceleration and pressure Download PDFInfo
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- CN102408089A CN102408089A CN201010289314XA CN201010289314A CN102408089A CN 102408089 A CN102408089 A CN 102408089A CN 201010289314X A CN201010289314X A CN 201010289314XA CN 201010289314 A CN201010289314 A CN 201010289314A CN 102408089 A CN102408089 A CN 102408089A
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Abstract
The invention discloses a micro electronmechanical sensor capable of simultaneously measuring acceleration and pressure, which comprises a framework, a mass block and a plurality of elastic support arms, wherein the elastic support arms are connected between the framework and the mass block, the mass block can be suspended in the framework, and in addition, the mass block is provided with a pressure sensing film and a sealed cavity positioned below the film. Through the micro electronmechanical sensor, the mass block per se can be used a movable sensing element for acceleration measurement, and the pressure measuring function can be provided through the pressure sensing film and the cavity arranged in the mass block.
Description
Technical field
The present invention relates to micro electronmechanical (micro-e1ectro-mechanical systems; Hereinafter to be referred as MEMS) sensor, particularly about a kind of micro-electro-mechanical sensors that has a movable sensing element (moveable sensing element) and can measure acceleration and pressure simultaneously.
Background technology
Micro-electro-mechanical sensors (MEMS sensor) of a great variety for example all belong to it such as the inertial sensor of gyroscope or accelerometer etc., pressure sensor, gas sensor etc., and its application is too numerous to enumerate especially.A lot of micro-electro-mechanical sensors (for example gyroscope or accelerometer) all has movable sensing element (moveable sensing element); That is the mass that is commonly called as (proof mass); For example the U.S. the 4th, 905, and No. 523 patents disclose has a kind of pressure resistance type strength and moment detector (force detector and moment detector); The principle of utilizing the mass displacement will cause resistance value to change indirectly, the variation that can record external force indirectly through the change that measures resistance value.
In some electronic product (like notebook computer), possibly use multiple micro-electro-mechanical sensors simultaneously; For example simultaneously working pressure sensor and accelerometer, however the existing practice is that independently pressure sensor and accelerometer are separately positioned in the product respectively with two; Though so can reach the function that measures pressure and acceleration simultaneously; But thus, for light, thin, short, the little day by day electronic product of demand, there is cost to increase and the excessive shortcoming of volume.
Summary of the invention
The object of the present invention is to provide a kind of micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously, can measure acceleration and pressure simultaneously.
Another object of the present invention is to provide a kind of micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously; Can the movable sensing element (moveable sensing element) that the measurement acceleration is used be integrated with the long-pending body of pressure sensing element, to reduce the volume of this micro-electro-mechanical sensors.
For reaching above-mentioned purpose, technical solution of the present invention is:
A kind of micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously, it includes:
One framework;
A plurality of resilient support arms, respectively an end of this resilient support arms is connected in this framework;
One mass is connected in the other end of this resilient support arms respectively and is suspended in this framework the sealing chamber that this mass has a pressure-sensing film and is positioned at this film below.
Described micro-electro-mechanical sensors, it includes the top layer that a bottom and is incorporated into this bottom; This top layer has this resilient support arms, and one is connected and has the central part of this pressure-sensing film with the other end of this resilient support arms; This bottom have one with this top layer central part corresponding central position; Through this; The central part of this top layer and the central part of this bottom form this mass, and should seal chamber between the pressure-sensing film and this bottom central part of this top layer central part.
Described micro-electro-mechanical sensors, its said each resilient support arms are provided with the resistance in order to the measurement acceleration, and this pressure-sensing film is provided with in order to measure the resistance of pressure.
Described micro-electro-mechanical sensors; Its said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this top layer central part accordingly respectively; And one second pair of resilient support arms, linearly shape is corresponding and vertically be connected two relative sides in addition in this top layer central part respectively with this first pair of resilient support arms.
Described micro-electro-mechanical sensors; Its said first pair of resilient support arms is provided with one group four in order to measure the resistance of acceleration; This second pair of resilient support arms is provided with two groups, every group four resistance in order to the measurement acceleration, and this pressure-sensing film is provided with one group four in order to measure the resistance of pressure.
Described micro-electro-mechanical sensors; Its said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this mass accordingly respectively; And one second pair of resilient support arms, linearly shape is corresponding and vertically be connected two relative sides in addition in this mass respectively with this first pair of resilient support arms.
Described micro-electro-mechanical sensors; Its said first pair of resilient support arms is provided with one group four in order to measure the resistance of acceleration; This second pair of resilient support arms is provided with two groups every group four resistance in order to the measurement acceleration, and this pressure-sensing film is provided with one group four in order to measure the resistance of pressure.
Described micro-electro-mechanical sensors, it includes the top layer that a bottom and is incorporated into this bottom; This top layer has this resilient support arms, and one is connected and has the central part of this pressure-sensing film with the other end of this resilient support arms, and one around this central part and the peripheral position that is connected with this central part; This bottom have one with this top layer central part corresponding central position; And one with corresponding peripheral position, this top layer periphery position; Through this; The central authorities of this top layer and the central authorities of peripheral position and this bottom and peripheral position form this mass, and should seal chamber between the pressure-sensing film and this bottom central part of this top layer central part.
Described micro-electro-mechanical sensors, the central authorities and the peripheral position of its said top layer are provided with the capacitance electrode in order to the measurement acceleration, and this pressure-sensing film is provided with in order to measure the capacitance electrode of pressure.
Described micro-electro-mechanical sensors, it also includes a lid, is incorporated into the end face of this top layer, and the bottom surface of this lid is provided with an earth electrode, and this earth electrode compartment of terrain is in the face of this capacitance electrode of this top layer.
Described micro-electro-mechanical sensors; Its said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this top layer central part accordingly respectively; And one second pair of resilient support arms, linearly shape is corresponding and vertically be connected two relative sides in addition in this top layer central part respectively with this first pair of resilient support arms.
The advantage of micro-electro-mechanical sensors provided by the present invention is; To integrate to be arranged in order to the sealing chamber that measures pressure and pressure-sensing film and measure in the mass that acceleration uses; Therefore the sensor that is provided has the function that pressure measures and acceleration measures concurrently; Also, therefore can reduce volume relatively because need not adopt two micro-electro-mechanical sensors that measure pressure and acceleration respectively.
Description of drawings
The schematic perspective view of the micro-electro-mechanical sensors that Fig. 1 is provided for the present invention's first preferred embodiment;
Fig. 2 is the top view of Fig. 1;
Fig. 3 is along the cross-sectional schematic of hatching line 3-3 direction among Fig. 2;
Fig. 4 A is the schematic top view of a manufacturing step of the micro-electro-mechanical sensors that provided for the present invention's first preferred embodiment, forms a depression in order to be shown in one first silicon chip end face;
Fig. 4 B is the cross-sectional schematic of Fig. 4 A along hatching line A-A direction;
Fig. 5 is a cross-sectional schematic, shows that one second silicon chip is fixedly arranged on this first silicon chip end face;
Fig. 6 is a cross-sectional schematic, shows that this second silicon chip is by thinning;
Fig. 7 A is a schematic top view, shows that the second silicon chip end face cloth is implanted with the resistance of measurement speed and pressure;
Fig. 7 B is the cross-sectional schematic of Fig. 7 A along hatching line B-B direction;
Fig. 8 A is to be a schematic top view, shows that second silicon chip forms four openings around its centre;
Fig. 8 B is the cross-sectional schematic of Fig. 8 A along hatching line C-C direction;
Fig. 9 A is to be a schematic top view, is shown in first silicon chip and forms four openings around its centre;
Fig. 9 B is the cross-sectional schematic of Fig. 9 A along hatching line D-D direction;
Figure 10 A is the schematic top view of a manufacturing step of the micro-electro-mechanical sensors that provided for the present invention's second preferred embodiment, is shown in the capacitance electrode that the second silicon chip end face is provided with measurement speed and pressure;
Figure 10 B is the cross-sectional schematic of Figure 10 A along hatching line E-E direction;
Figure 10 C is the cross-sectional schematic of Figure 10 A along hatching line F-F direction;
Figure 11 A is a schematic top view, is shown in the opening that second silicon chip forms four tool given shapes and centers on its centre;
Figure 11 B is the cross-sectional schematic of Figure 11 A along hatching line G-G direction;
Figure 11 C is the cross-sectional schematic of Figure 11 A along hatching line H-H direction;
Figure 12 A is a schematic top view, is shown in to form four tool given shapes and run through this first silicon chip opening;
Figure 12 B is the cross-sectional schematic of Figure 12 A along hatching line I-I direction;
Figure 12 C is the cross-sectional schematic of Figure 12 A along hatching line J-J direction;
Figure 13 is to be to look sketch map in an end, shows that the bottom surface of one the 3rd chip is provided with an earth electrode;
Figure 14 is the schematic side view of the 3rd chip;
Figure 15 is Figure 12 B roughly the same, only shows that the 3rd chip is fixedly arranged on the aspect on this second chip;
Figure 16 is Figure 12 C roughly the same, only shows that the 3rd chip is fixedly arranged on the aspect on this second chip.
The main element symbol description
10 micro-electro-mechanical sensors, 12 frameworks
14 mass 14a pressure-sensing films
20 bottom 20a bottom central parts
22 top layer 22a top layer central parts
30 first silicon chip 30a, the first silicon chip end face
30b depression 30c base layer perimeter position
32 second silicon chip 32a openings
32c top layer periphery position 40 the 3rd silicon chip
42 viscoses C1～C6 capacitance electrode
RX1～RX4 resistance R Y1～RY4 resistance
RZ1～RZ4 resistance R P1～RP4 resistance
The specific embodiment
Relevant detailed construction, characteristics, assembling or the occupation mode that can measure the micro-electro-mechanical sensors of acceleration and pressure simultaneously provided by the present invention will be described in follow-up embodiment specifies.Yet in field of the present invention, having common knowledge the knowledgeable should be able to understand, and the specific embodiment that this detailed description and embodiment of the present invention are cited only is to be used to explain the present invention, is not in order to limit patent claim of the present invention.
A kind of micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously; Include a framework, a mass and a plurality of resilient support arms that is connected between this framework and this mass; This mass can be suspended in this framework; In addition, this mass sealing chamber of having a pressure-sensing film and being positioned at this film below.Through this; This mass measures the movable sensing element (moveable sensing element) that acceleration uses except itself can be used as; Through being located at sealing chamber and this pressure-sensing film in this mass; The function that can provide pressure to measure, and the element of sensing acceleration and pressure integrates one, can reduce the overall volume of this micro-electro-mechanical sensors.
The micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously of the present invention; Can be used as a three axis accelerometer (three-axis accelerometer); For this reason, this resilient support arms can include one first pair of resilient support arms, is that linearly shape is connected two relative sides in this mass accordingly respectively; And one second pair of resilient support arms, be that linearly shape is corresponding and vertically be connected two relative sides in addition in this mass respectively with this first pair of resilient support arms.
The micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously of the present invention; Be to can be pressure resistance type (piezo-resistive type) or capacitance type sensor; With regard to regard to piezoresistive transducer; Respectively can be provided with resistance on this resilient support arms, and can be provided with on this pressure-sensing film in order to measure the resistance of pressure in order to the measurement acceleration.
With regard to capacitance type sensor; This top layer more can comprise one and connect and around the peripheral position of its central part; And the central authorities and the peripheral position of this top layer are provided with the capacitance electrode in order to the measurement acceleration, and this pressure-sensing film is provided with in order to measure the capacitance electrode of pressure.In addition, described micro-electro-mechanical sensors more includes a lid, is the end face that is incorporated into this top layer, and the bottom surface of this lid is provided with an earth electrode, and this earth electrode is this capacitance electrode that this top layer is faced in the compartment of terrain.
The applicant at first this explanation, the following embodiment that will introduce and graphic in, identical reference number is represented identical or similar elements or its architectural feature.
Please consult Fig. 1 to Fig. 3 earlier; The micro-electro-mechanical sensors that the present invention's first preferred embodiment is provided; Label 10 shown in figure mainly is to embody with the pressure resistance type micro-electro-mechanical sensors that can measure a 3-axis acceleration and an absolute pressure (absolute pressure) simultaneously, yet; What must at first explain is, the micro-electro-mechanical sensors kind that can use the technical characterictic that the present invention discloses is not as limit.As shown in the figure, this sensor 10 consists predominantly of a framework 12, a mass 14 and four resilient support arms 16a～16d that are connected between this framework 12 and this mass 14, and this mass 14 can be suspended in this framework 12.In addition, this mass 14 have one be positioned at its end face pressure-sensing film 14a, and one be positioned at this film 14a below sealing chamber 14b.
Detailed it, in the present embodiment, this micro-electro-mechanical sensors 10 is to be the pair of lamina structure, that is it has a bottom 20 and a secure bond in the top layer 22 of this bottom 20.This top, bottom 20,22 have four rectangular frames, form the framework 12 of this sensor 10 through this.As for the actual manufacture of this sensor 10, below other is warded off the length detailed description.
Secondly; This top layer 22 has this a resilient support arms 16a～16d and a central part 22a; Wherein, Respectively the end of this resilient support arms 16a～16d is that one is connected in the middle section position of 22 4 frames of this top layer, and respectively the other end of this resilient support arms 16a～16d is that one is connected in this top layer central part 22a.Further speech; This resilient support arms 16a～16d can be distinguished into one first couple of resilient support arms 16a, 16b; And the one second couple of resilient support arms 16c, 16d; Wherein, first couple of resilient support arms 16a, 16b are that linearly shape is connected respectively in two relative sides of this top layer 22 central part 22a accordingly, and this second couple of resilient support arms 16c, 16d also linearly shape be connected two relative sides in addition accordingly respectively in this top layer 22 central part 22a; Through this, first couple of resilient support arms 16a, 16b are to be the quadrature shape that is perpendicular to one another with the extension line of second couple of resilient support arms 16c, 16d.In addition, the center of this top layer 22 central part 22a can define rectangular this pressure-sensing film 14a.
In addition; This bottom 20 is except having four frames that constitute this sensor frame; Have more one with this top layer 22 central part 22a corresponding central position 20a, through this, the central part 22a of this top layer 22 and the central part 20a of this bottom 20 form aforesaid mass 14.Secondly, the central part 20a of this bottom 20 has a depression 20b, through this, can form aforementioned sealing chamber 14b between the pressure-sensing film 14a of this top layer 22 central part 22a and this bottom 20 central part 20a.
More than be the detailed description of the frame for movement part of micro-electro-mechanical sensors 10 provided by the present invention, and, below will introduce the circuit design part of this sensor 10 in order to reach the function that measures 3-axis acceleration and pressure.
In brief; Respectively this resilient support arms 16a～16d is provided with and can forms three groups of Hui Sideng electric bridges (Wheatstone bridge) and be used for measuring the piezoresistance (piezoresistance) of the acceleration of X, Y and Z-direction through this, and this pressure-sensing film 14a is provided with and can forms one group of Hui Sideng electric bridge and in order to measure the piezoresistance of pressure.Further speech, this first couple of resilient support arms 16a, 16b are provided with one group of four piezoresistance RY1～RY4; This second couple of resilient support arms 16c; 16d is provided with two groups every group four piezoresistance RX1～RX4 and RZ1～RZ4, and this pressure-sensing film 14a is provided with one group of four piezoresistance RP1～RP4, belongs to known technology because these acceleration are taken into account the circuit design of pressure and measured principle; And be not main technical characterictic of the present invention, so do not give unnecessary details at this.
Can know by above statement; The micro-electro-mechanical sensors 10 that the present invention disclosed, the resistance through resilient support arms, mass and acceleration measurement usefulness can be used as three axis accelerometer and uses; In addition; Through being located at sealing chamber and this pressure-sensing film in this mass, micro-electro-mechanical sensors provided by the present invention can use as pressure gauge simultaneously, and; The element that pressure sensor is used is to be integrated in to measure in the mass that acceleration uses, and therefore can reduce the overall volume of this micro-electro-mechanical sensors.
The manufacturing approach of the micro-electro-mechanical sensors that below will further introduce first embodiment of the invention and disclosed is to explain exploitativeness of the present invention.
Please consult Fig. 4 A, Fig. 4 B earlier, at first, can take the silicon silicon chip 30 that a thickness is about 400 μ m,, below will be referred to as with first silicon chip 30 for ease of explanation.Secondly, utilize etching technique to etch the depression 30b that the square and degree of depth of about 500 μ m is about 10～50 μ m, with as pressure chamber in this silicon chip 30 end face 30a.
Secondly, as shown in Figure 5, cover and affixed another N type silicon silicon chip 32 in this first silicon chip end face 30a, and, below will be referred to as with second silicon chip 32 for ease of explanation.As for the affixed method of silicon chip, capable of using fusing (fusion bonding) or other feasible mode.
As shown in Figure 6; After first silicon chip 30 and second silicon chip 32 are affixed; Second silicon chip 32 is thinned to thickness is about 5～10 μ m; Through this, the position that 32 pairs of second silicon chips should the first silicon chip depression 30b promptly forms a pressure-sensing film 14a, and can form a sealing chamber 14b between the depression 30b of this first silicon chip and this pressure-sensing film 14a.What this need explain be, the shape of this sealing chamber 14b (that is shape of this film 14a) is not exceeded with rectangle, and it can be circular or other suitable shape.In addition, the technology of thinning second silicon chip does not also limit especially, and mechanical lapping capable of using, cmp, dry chemical etching or other suitable manner are reached.
Afterwards, shown in Fig. 7 A, Fig. 7 B, plant required piezoresistance RX1～RX4, RY1～RY4, RZ1～RZ4 and RP1～RP4 in this second silicon chip ad-hoc location cloth.The generation type of this piezoresistance is to belong to common technology, and existing detailed exposure in the specification of the U.S.'s the 4th, 905,5235 patents is not so give unnecessary details at this.
Afterwards; See also Fig. 8 A, Fig. 8 B; Utilize etching technique in this second silicon chip form four around its centre, the space, have given shape and penetrate the opening 32a of this second silicon chip top, bottom surface; Through this, this second silicon chip 32 can form four resilient support arms 16a～16d and a central part 22a.
At last; Shown in Fig. 9 A, Fig. 9 B; Utilize etching dorsad (backside etching) that the part that 30 pairs of first silicon chips should 32 4 opening 32a of second silicon chip is removed, the pressure resistance type micro-electro-mechanical sensors 10 that can measure acceleration and pressure simultaneously of promptly accomplishing first embodiment of the invention and being provided.That is, these first silicon chip, 30 last bottom 20 parts that constitute above-mentioned micro-electro-mechanical sensors 10, and these second silicon chip, 32 last top layer 22 parts that constitute above-mentioned micro-electro-mechanical sensors 10.
In the above embodiments, micro-electro-mechanical sensors provided by the present invention is to embody with a pressure resistance type micro-electro-mechanical sensors, yet, mandatory declaration be that the micro-electro-mechanical sensors kind that can use technical characterictic of the present invention is not as limit.For example, can be for measuring the condenser type micro-electro-mechanical sensors of 3-axis acceleration and pressure simultaneously.Below will be through Figure 10 to Figure 16, introduce the manufacturing approach of the micro-electro-mechanical sensors that the present invention's second preferred embodiment provided.
See also Figure 10 A to Figure 10 C; Form depression, second silicon chip, 32 fixed engagement in first silicon chip, 30 end faces at first silicon chip 30; And second silicon chip 32 is thinned to after the predetermined thickness; Can be in the end face of this second silicon chip 32 mode with jet-plating metallization (for example aluminium), the tool given shape is set and in order to measure the capacitance electrode C1～C6 of acceleration and pressure.
Afterwards; See also Figure 11 A to Figure 11 C; Utilize etching technique in this second silicon chip form four around its centre, the space, have given shape and penetrate the opening 32a of this second silicon chip top, bottom surface; Through this, this second silicon chip 32 can form four resilient support arms 16a～16d, a central part 22a, and the peripheral position 32c with four blocks; Wherein be respectively equipped with a capacitance electrode on each block, and four blocks are to be connected round this central part 22a and with this central part 22a one at interval.
Please consult Figure 12 A to Figure 12 C again; Utilize etching dorsad that the part that 30 pairs of first silicon chips should 32 4 opening 32a of second silicon chip is removed; Can form the primary structure of the micro electronmechanical sensor chip of condenser type that second embodiment of the invention provides; That is this first silicon chip 30 and this second silicon chip 32 constitute the bottom 20 and top layer 22 parts of micro-electro-mechanical sensors respectively, and this bottom 20 have one with this top layer 22 central part 22a corresponding central position 20a; And one with the corresponding peripheral position 30c of this top layer periphery position 32c; Through this, the central 22a of this top layer and the central 20a of peripheral position 32c and this bottom and peripheral position 30c form a mass, and are formed with a sealing chamber 14b between the pressure-sensing film 14a of this top layer central part 22a and this bottom central part 22a.
At last, take one the 3rd silicon chip 40, and form an earth electrode GND (like Figure 13 and shown in Figure 14) with sputter or chemical vacuum deposition or other suitable manner in the bottom surface of the 3rd silicon chip 40; Then; Like Figure 15 and shown in Figure 16, the 3rd silicon chip 40 is incorporated into the end face of this second silicon chip 32 through viscose 42, make the 3rd silicon chip 40 can form one be incorporated into this micro-electro-mechanical sensors top layer 22 the protection lid; And make this earth electrode GND can be at interval and aspectant mode be located at the top of this capacitance electrode C1～C6 of this second silicon chip 32; Through this, this earth electrode GND and this capacitance electrode C1～C6 can form six electric capacity, and pass through the matched combined of six electric capacity; Can form one group of pressure-sensing and use capacitance group, and three groups are used capacitance group in order to the acceleration sensing that measures X, Y and Z-direction respectively.Mandatory declaration be, in this embodiment, each capacitance electrode the position is set, be merely a kind of example description, any electric capacity layout designs that measures 3-axis acceleration and pressure of reaching all can be applicable among the present invention.
To sum up institute is old; The major technique of micro-electro-mechanical sensors provided by the present invention is characterised in that; To integrate to be arranged in order to the sealing chamber that measures pressure and pressure-sensing film and measure in the mass that acceleration uses; Therefore the sensor that is provided has the function that pressure measures and acceleration measures concurrently, also because need not adopt two micro-electro-mechanical sensors that measure pressure and acceleration respectively, therefore can reduce volume relatively.
At last, must explain once more that the present invention is in the composed component of preceding taking off among the embodiment to be disclosed; Be merely and illustrate; Be not to be used for limiting scope of the present invention, the alternative or variation of other equivalence element, the protection domain that also should be claims of the present invention is contained.
Claims (11)
1. the micro-electro-mechanical sensors that can measure acceleration and pressure simultaneously is characterized in that, includes:
One framework;
A plurality of resilient support arms, respectively an end of this resilient support arms is connected in this framework;
One mass is connected in the other end of this resilient support arms respectively and is suspended in this framework the sealing chamber that this mass has a pressure-sensing film and is positioned at this film below.
2. micro-electro-mechanical sensors as claimed in claim 1 is characterized in that, includes the top layer that a bottom and is incorporated into this bottom; This top layer has this resilient support arms, and one is connected and has the central part of this pressure-sensing film with the other end of this resilient support arms; This bottom have one with this top layer central part corresponding central position; Through this; The central part of this top layer and the central part of this bottom form this mass, and should seal chamber between the pressure-sensing film and this bottom central part of this top layer central part.
3. micro-electro-mechanical sensors as claimed in claim 2 is characterized in that, said each resilient support arms is provided with the resistance in order to the measurement acceleration, and this pressure-sensing film is provided with in order to measure the resistance of pressure.
4. micro-electro-mechanical sensors as claimed in claim 2; It is characterized in that; Said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this top layer central part accordingly respectively, and one second pair of resilient support arms, and linearly shape is corresponding and vertically be connected two relative sides in addition in this top layer central part respectively with this first pair of resilient support arms.
5. micro-electro-mechanical sensors as claimed in claim 4; It is characterized in that; Said first pair of resilient support arms is provided with one group four in order to measure the resistance of acceleration; This second pair of resilient support arms is provided with two groups, every group four resistance in order to the measurement acceleration, and this pressure-sensing film is provided with one group four in order to measure the resistance of pressure.
6. micro-electro-mechanical sensors as claimed in claim 1; It is characterized in that; Said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this mass accordingly respectively, and one second pair of resilient support arms, and linearly shape is corresponding and vertically be connected two relative sides in addition in this mass respectively with this first pair of resilient support arms.
7. micro-electro-mechanical sensors as claimed in claim 6; It is characterized in that; Said first pair of resilient support arms is provided with one group four in order to measure the resistance of acceleration; This second pair of resilient support arms is provided with two groups every group four resistance in order to the measurement acceleration, and this pressure-sensing film is provided with one group four in order to measure the resistance of pressure.
8. micro-electro-mechanical sensors as claimed in claim 1 is characterized in that, includes the top layer that a bottom and is incorporated into this bottom; This top layer has this resilient support arms, and one is connected and has the central part of this pressure-sensing film with the other end of this resilient support arms, and one around this central part and the peripheral position that is connected with this central part; This bottom have one with this top layer central part corresponding central position; And one with corresponding peripheral position, this top layer periphery position; Through this; The central authorities of this top layer and the central authorities of peripheral position and this bottom and peripheral position form this mass, and should seal chamber between the pressure-sensing film and this bottom central part of this top layer central part.
9. micro-electro-mechanical sensors as claimed in claim 8 is characterized in that, the central authorities and the peripheral position of said top layer are provided with the capacitance electrode in order to the measurement acceleration, and this pressure-sensing film is provided with in order to measure the capacitance electrode of pressure.
10. micro-electro-mechanical sensors as claimed in claim 9 is characterized in that, also includes a lid, is incorporated into the end face of this top layer, and the bottom surface of this lid is provided with an earth electrode, and this earth electrode compartment of terrain is in the face of this capacitance electrode of this top layer.
11. micro-electro-mechanical sensors as claimed in claim 8; It is characterized in that; Said resilient support arms includes one first pair of resilient support arms; Linearly shape is connected two relative sides in this top layer central part accordingly respectively, and one second pair of resilient support arms, and linearly shape is corresponding and vertically be connected two relative sides in addition in this top layer central part respectively with this first pair of resilient support arms.
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| CN110015632A (en) * | 2017-11-30 | 2019-07-16 | 台湾积体电路制造股份有限公司 | Senser element and its manufacturing method |
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