CN102386297A - Light-emitting diode module - Google Patents
Light-emitting diode module Download PDFInfo
- Publication number
- CN102386297A CN102386297A CN2010102671943A CN201010267194A CN102386297A CN 102386297 A CN102386297 A CN 102386297A CN 2010102671943 A CN2010102671943 A CN 2010102671943A CN 201010267194 A CN201010267194 A CN 201010267194A CN 102386297 A CN102386297 A CN 102386297A
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- light
- emitting diode
- diode chip
- pedestal
- backlight unit
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Abstract
The invention provides a light-emitting diode module, which comprises a conductive frame, a seat body, a light-emitting diode chip, a fluorescent layer, a protection layer and a high-reflectivity material layer. The seat body is combined with the conductive frame, the light-emitting diode chip is arranged in a recessed portion of the seat body in erecting mode and electrically connected with the conductive frame, the fluorescent layer is formed on the light-emitting diode chip, the protection layer wraps the light-emitting diode chip, and the high-reflectivity material layer is formed in the recessed portion of the seat body. The light-emitting diode module can greatly improve light-emitting efficiency of a light-emitting diode and utilize the fluorescent layer to stimulate visible light.
Description
[technical field]
(Light Emitting Diode, LED) module particularly relate to a kind of the have light-emitting diode of vertical type setting and the light-emitting diode (LED) module of fluorescence coating to the present invention relates to a kind of light-emitting diode in order to the raising luminous efficiency.
[background technology]
It is low that light-emitting diode (LED) has operating voltage, and power consumption is little, and luminous efficiency is high, and the reaction time is short, and is photochromic pure, sound construction, and shock resistance, vibration resistance, stable and reliable for performance, in light weight, characteristics such as the little and cost of volume is low.Along with development of technology, the revealable brightness degree of LED is increasingly high, its application also more and more widely, for example: the large tracts of land picture and text show full-color screen, state indication, sign illumination, signal demonstration, Backlight For Liquid Crystal Display Panels or room light.
Existing LED cooperates plastics injection molding mode to produce pedestal with metallic conduction frame (Lead Frame), to form encapsulating structure.Conduction rack is in order to electrically connect the electrode of led chip.Pedestal is to form with the injection molding mode, uses to make encapsulating material coat and fix conduction rack.Form a notched region in the pedestal in order to place led chip.
Yet existing LED design still is difficult to satisfy the requirement of people for high-luminous-efficiency.
So, be necessary to provide a kind of light-emitting diode (LED) module, to solve the existing in prior technology problem.
[summary of the invention]
Main purpose of the present invention is to provide a kind of light-emitting diode (LED) module, it is characterized in that: said light-emitting diode (LED) module comprises:
Conduction rack;
Pedestal is incorporated into said conduction rack, and wherein said pedestal has recess and reflecting surface;
Light-emitting diode chip for backlight unit erectly is arranged in the said recess of said pedestal, and is electrically connected at said conduction rack;
Fluorescence coating is formed on the said light-emitting diode chip for backlight unit;
The highly reflective material layer is formed on the said reflecting surface of said pedestal; And
Protective layer is coated on the said light-emitting diode chip for backlight unit.
In one embodiment, the material of said pedestal is high-temperature resistance plastice, polyphthalamide, epoxy resin, glass fiber, titanium oxide, calcium oxide or ceramic material
Light-emitting diode (LED) module of the present invention can make light-emitting diode chip for backlight unit erectly be arranged in the recess of pedestal, thus can utilize simultaneously the two sides, front and back of light-emitting diode chip for backlight unit carry out luminous outside, and can have wider illumination range.Therefore, only use the single face light emitting source compared to the light-emitting diode chip for backlight unit of existing horizontal mode, the light-emitting diode chip for backlight unit of present embodiment can reach and fill part luminous efficiency of performance light-emitting diode.And light-emitting diode (LED) module can improve significantly luminous efficiency through the highly reflective material layer.Moreover light-emitting diode (LED) module fluorescence coating capable of using excites specific visible light.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts preferred embodiment, and cooperates appended graphicly, elaborates as follows:
[description of drawings]
Fig. 1 shows the generalized section according to the light-emitting diode (LED) module of one embodiment of the invention; And
Fig. 2 shows the generalized section according to the light-emitting diode chip for backlight unit of one embodiment of the invention.
[embodiment]
Below the explanation of each embodiment be with reference to additional graphic, can be in order to illustration the present invention in order to the specific embodiment of implementing.The direction term that the present invention mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward ", " side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to restriction the present invention.
In the drawings, the unit of structural similarity is to represent with same numeral.
Please with reference to Fig. 1, it illustrates the generalized section according to the light-emitting diode (LED) module of one embodiment of the invention.Light-emitting diode (LED) module of the present invention comprises conduction rack 100, light-emitting diode chip for backlight unit 200, fluorescence coating 201, pedestal 300, protective layer 400 and highly reflective material layer 500.Conduction rack 100 can be in order to carry light-emitting diode chip for backlight unit 200, and fluorescence coating 201 is to form on the what light-emitting diode chip for backlight unit 200.Conduction rack 100 can firmly be combined into one with pedestal 300, and to form light-emitting diode (LED) module, wherein pedestal 300 for example is to use with conduction rack 100 with the mode of ejection formation to form an encapsulating structure.Protective layer 400 is to be coated on the light-emitting diode chip for backlight unit 200, in order to protection light-emitting diode chip for backlight unit 200.
As shown in Figure 1, the conduction rack 100 of present embodiment is made by gold, silver, copper, iron, aluminium or its alloy material, and its manufacture for example can be and is made of one piece by the mode of sheet metal through punching press.
As shown in Figure 1, the light-emitting diode chip for backlight unit 200 of present embodiment can erectly be arranged in the recess 301 of pedestal 300, and can be electrically connected at conduction rack 100.Because light-emitting diode chip for backlight unit 200 can erectly be arranged in the recess 301 of pedestal 300, thus can utilize simultaneously the two sides, front and back of light-emitting diode chip for backlight unit 200 carry out luminous outside, and can have wider illumination range.Moreover, and, thereby can reduce traditional procedure with the metal routing because light-emitting diode chip for backlight unit 200 can be directly electrically connected with conduction rack 100, also the shortcoming that being prone to of being produced with routing blown, processing procedure is loaded down with trivial details is established in minimizing.
Please with reference to Fig. 2, it illustrates the generalized section according to the light-emitting diode chip for backlight unit of one embodiment of the invention.The fluorescence coating 201 of present embodiment can be phosphor material powder, and it can be excited by visible light or invisible light and send a visible light, and this fluorescent material material can be excited by the light of light-emitting diode chip for backlight unit 200 and send visible lights such as redness, yellow, green.In addition, fluorescence coating 201 also can be in order to form a white light.
As shown in Figure 1, the material of the pedestal 300 of present embodiment can for example be high-temperature resistance plastice, polyphthalamide (PPA), epoxy resin, glass fiber, titanium oxide, calcium oxide or ceramic material.Pedestal 300 is to utilize integrated mode (for example ejection formation) to be formed on the conduction rack 100, thereby forms the encapsulating structure in order to encapsulation LED chip 200.Wherein, Pedestal 300 can be cup-like structure; For example cross section is rectangle, polygon, circle or oval-shaped cup-like structure, and therefore, the bright dipping of the light-emitting diode chip for backlight unit 200 of present embodiment can form one than the specific light form of concentrating (rectangle, polygon, circle or ellipse).Pedestal 300 has recess 301 and reflecting surface 302, and reflecting surface 302 is to form in the what recess 301, in order to the light of reflection light-emitting diode chip for backlight unit 200.
As shown in Figure 1, the protective layer 400 of present embodiment is to be coated on the light-emitting diode chip for backlight unit 200, and forms optical lens on pedestal 300.Protective layer 400 can be formed in the pedestal 300 formed recesses 301, and envelopes light-emitting diode chip for backlight unit 200, in order to protection light-emitting diode chip for backlight unit 200.The material of this protective layer 400 can be the light transmission material, for example glass or high light transmittance resin.In the present embodiment; This high light transmittance resin can comprise epoxy resin (Epoxy), polystyrene (Polystyrene; PS), acrylonitrile-butadiene-phenylethylene polymer (Acrylonitrile-Butadene-Styrene; ABS), polymethyl methacrylate (Polymethyl methacrylate, PMMA), acryl (Acrylic resin) or silica gel (Silicone).
As shown in Figure 1, the highly reflective material layer 500 of present embodiment is to be formed on the surface of reflecting surface 302 (for example being to form to be coated with the mode of attaching), with the surface reflectivity of further increase reflecting surface 302, improves luminous efficiency.Highly reflective material layer 500 for example is to be formed by highly reflective material, and this highly reflective material for example is silver, aluminium, gold, chromium, copper, indium, iridium, nickel, platinum, rhenium, rhodium, tin, tantalum, tungsten, manganese, above-mentioned any alloy or anti-yellow and heat-resisting white reflecting paint vehicle (like titanium dioxide).Reflecting most lateral light, and reduce the luminous consume of light-emitting diode chip for backlight unit 200 aspect the side direction bright dipping.
From the above, light-emitting diode chip for backlight unit of the present invention can erectly be arranged in the recess of pedestal, thus can utilize simultaneously the two sides, front and back of light-emitting diode chip for backlight unit carry out luminous outside, and can have wider illumination range.Therefore, only use the single face light emitting source compared to the light-emitting diode chip for backlight unit of existing horizontal mode, the light-emitting diode chip for backlight unit of present embodiment can reach and fill part luminous efficiency of performance light-emitting diode.Moreover light-emitting diode (LED) module of the present invention can form fluorescence coating on light-emitting diode chip for backlight unit according to design requirement, to inspire specific visible light.
In sum; Though the present invention discloses as above with preferred embodiment; But above-mentioned preferred embodiment is not that those of ordinary skill in the art is not breaking away from the spirit and scope of the present invention in order to restriction the present invention; All can do various changes and retouching, so protection scope of the present invention is as the criterion with the scope that claim defines.
Claims (2)
1. light-emitting diode (LED) module, it is characterized in that: said light-emitting diode (LED) module comprises:
Conduction rack;
Pedestal is incorporated into said conduction rack, and wherein said pedestal has recess and reflecting surface;
Light-emitting diode chip for backlight unit erectly is arranged in the said recess of said pedestal, and is electrically connected at said conduction rack;
Fluorescence coating is formed on the said light-emitting diode chip for backlight unit;
The highly reflective material layer is formed on the said reflecting surface of said pedestal; And
Protective layer is coated on the said light-emitting diode chip for backlight unit.
2. light-emitting diode (LED) module according to claim 1 is characterized in that: the material of said pedestal is high-temperature resistance plastice, polyphthalamide, epoxy resin, glass fiber, titanium oxide, calcium oxide or ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102671943A CN102386297A (en) | 2010-08-27 | 2010-08-27 | Light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102671943A CN102386297A (en) | 2010-08-27 | 2010-08-27 | Light-emitting diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102386297A true CN102386297A (en) | 2012-03-21 |
Family
ID=45825493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102671943A Pending CN102386297A (en) | 2010-08-27 | 2010-08-27 | Light-emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102386297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280518A (en) * | 2013-06-17 | 2013-09-04 | 天津金玛光电有限公司 | Vertically suspended type LED |
| JP2021057385A (en) * | 2019-09-27 | 2021-04-08 | 日亜化学工業株式会社 | Light-emitting device |
-
2010
- 2010-08-27 CN CN2010102671943A patent/CN102386297A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280518A (en) * | 2013-06-17 | 2013-09-04 | 天津金玛光电有限公司 | Vertically suspended type LED |
| JP2021057385A (en) * | 2019-09-27 | 2021-04-08 | 日亜化学工業株式会社 | Light-emitting device |
| JP7361257B2 (en) | 2019-09-27 | 2023-10-16 | 日亜化学工業株式会社 | light emitting device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120321 |