CN102385254B - Photo-sensitivity resin composition - Google Patents
Photo-sensitivity resin composition Download PDFInfo
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- CN102385254B CN102385254B CN 201010271160 CN201010271160A CN102385254B CN 102385254 B CN102385254 B CN 102385254B CN 201010271160 CN201010271160 CN 201010271160 CN 201010271160 A CN201010271160 A CN 201010271160A CN 102385254 B CN102385254 B CN 102385254B
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Abstract
The invention provides a photo-sensitivity resin composition which comprises: (A) a polymer with more than three common blocks, (B) a monomer with at least one ethylenic unsaturated double bond, (C) a polyurethane resin oligomer with at least one reactive acrylic functional group, (D) an inorganic additive modified through the surface of organic silane, (E) organic acid anhydride, (F) a photoinitiator, (G) a functional silane coupling agent, and (H) an organic solvent, wherein each of the common blocks comprises: (A-1) an ethylenic unsaturated monomer containing an acid group, and (A-2) ethylenic unsaturated monomers except (A-1). On the basis of total weight of the photo-sensitivity resin composition, the content of (C) is between 1 weight percent and 20 weight percent.
Description
Technical field
The present invention relates to a kind of Photosensitve resin composition (photo-sensitivity resin composition), relate in particular to a kind of Photosensitve resin composition with good metal adhesion and high rigidity.
Background technology
More lightly change and more humane purpose in order to reach more convenient, volume, the input mode of many information products changes into and uses touch-control device as the mode of input by devices such as traditional keyboard or mouses.Touch-control device can be assembled on the flat-panel screens of all multiple types, so that flat-panel screens has the function of display frame and input operation information concurrently.With regard at present common touch-control device, capacitance type touch-control panel and electric resistance touch-control panel are the most universal.
In general contact panel processing procedure, usually can use Photosensitve resin composition (photoresistance) to be used as dielectric layer between the metal electrode or the protective seam of covering metal electrode.Therefore, above-mentioned Photosensitve resin composition must possess good metal adhesion and high rigidity, to avoid producing scratch and the problem of peeling off in processing procedure.Yet generally the Photosensitve resin composition as dielectric layer or protective seam does not have good metal adhesion, and often produces scratch because hardness is not enough in processing procedure yet, thereby causes the problem of low yield.
Summary of the invention
The invention provides a kind of Photosensitve resin composition, it has good metal adhesion and high rigidity.
The present invention proposes a kind of Photosensitve resin composition, it comprises that (A) has the polymkeric substance of the common block (block) more than three, and these common blocks comprise that (A-1) contains the ethylene unsaturated monomer of acidic group and (A-2) ethylene unsaturated monomer except (A-1); (B) has the monomer of at least one ethene unsaturated double-bond; (C) has at least one reactive acroleic acid functional group's urethane resin oligomer; (D) through the inorganic additive of organosilane surfaction; (E) organic acid anhydride; (F) light initiator; (G) functional silanes coupling agent; (H) organic solvent.With total restatement of this Photosensitve resin composition, content (C) is between between the 1wt% to 20wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (A) is for example between between the 10wt% to 15wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein take (A-1) and (A-2) summation as 100 weight portions, the content of above-mentioned (A-1) is for example between 10 weight portion to 90 weight portions.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein take (A-1) and (A-2) summation as 100 weight portions, the content of above-mentioned (A-2) is for example between 10 weight portion to 90 weight portions.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (B) is for example between between the 5wt% to 15wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (C) is for example between between the 1wt% to 20wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (D) is for example less than 5wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein take (A) as 100 weight portions, the content of above-mentioned (E) is for example between 0.1 weight portion to 100 weight portion.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein take (A) as 100 weight portions, the content of above-mentioned (F) is for example between 0.1 weight portion to 100 weight portion.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (G) is for example between between the 0.01wt% to 5wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, wherein with total restatement of Photosensitve resin composition, the content of above-mentioned (H) is for example between between the 60wt% to 80wt%.
According to the described Photosensitve resin composition of the embodiment of the invention, above-mentioned Photosensitve resin composition can be applicable to dielectric layer between the metal electrode in the contact panel or the protective seam of covering metal electrode.
Based on above-mentioned; has good tack between Photosensitve resin composition of the present invention and the metal; and has high rigidity; therefore in contact panel; can be used as the dielectric layer between metal electrode; with the phenomenon of avoiding dielectric layer and metal electrode to peel off, perhaps can be used as the protective seam of covering metal electrode, cause the problem of low yield to avoid protective seam to be subject to scratch.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate accompanying drawing to elaborate.
Embodiment
The invention provides a kind of Photosensitve resin composition, it has good tack for metal, and has high rigidity.Therefore; Photosensitve resin composition of the present invention can be applicable in the contact panel processing procedure; after exposure and developing; form the dielectric layer between metal electrode; to improve the tack between dielectric layer and the metal electrode; the phenomenon of avoiding dielectric layer and metal electrode to peel off perhaps forms the protective seam of covering metal electrode, causes the problem of low yield to avoid protective seam to be subject to scratch in processing procedure.
Photosensitve resin composition of the present invention comprises that (A) has the polymkeric substance of the common block more than three, (B) and have the monomer of at least one ethene unsaturated double-bond, urethane resin oligomer that (C) has at least one reactive acroleic acid functional group, (D) through inorganic additive, (E) organic acid anhydride, (F) light initiator, (G) functional silanes coupling agent, (H) organic solvent of organosilane surfaction.
Have in the polymkeric substance of the common block more than three at (A), these common blocks comprise that (A-1) contains the ethylene unsaturated monomer of acidic group and (A-2) ethylene unsaturated monomer except (A-1).That is to say, (A) be at least by (A-1) with (A-2) be polymerized.Certainly, (A) also can be to be formed with other monomer polymerizations by (A-1), (A-2).With total restatement of Photosensitve resin composition, content (A) is for example between between the 10wt% to 15wt%.
(A-1) ethylene unsaturated monomer that contains acidic group can be unsaturated monobasic acids, such as (methyl) acrylic acid, butenoic acid (crotonic acid), α-chlorine (methyl) acrylic acid, (ethyl) acrylic acid, cinnamic acid (cinnamic acid) etc.; Unsaturated dibasic acid/anhydrides, such as maleic acid, maleic anhydride (maleic anhydride), fumaric acid (fumaric acid), Yi Kang acid (itaconic acid), Yi Kang acid anhydrides (itaconic anhydride), citraconic acid (citraconic acid), citraconic anhydride (citraconic anhydride), mesaconic acid (mesaconic acid), mesaconic acid acid anhydride (mesaconic anhydride) etc.; Or the above unsaturated polybasic acids/anhydrides of trivalent.Take (A-1) and (A-2) summation as 100 weight portions, content (A-1) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-1) can use separately or mix several uses.When Photosensitve resin composition of the present invention during as the protective seam of the dielectric layer between the metal electrode or covering metal electrode, (A-1) can make Photosensitve resin composition of the present invention have good tack for metallic diaphragm.
(A-2) ethylene unsaturated monomer except (A-1) can be the vinyl compound that contains propenyl (allyl group), such as allyl methacrylate (allyl (meth) acrylate) etc.; The vinyl compound that contains two acrylics, ethylene glycol dimethacrylate (ethylene glycol di (meth) acrylate) for example, two cyclopentene dimethylacrylates (dicyclopentenyl di (meth) acrylate), propylene glycol dimethylacrylate (propylene glycol di (meth) acrylate), 2,2-dimethyl-1, ammediol dimethylacrylate (2,2-dimethyl-1,3-propylene glycol di (meth) acrylate), TEGDMA (triethylene glycol di (meth) acrylate), tetraethylene glycol dimethacrylate (tetraethylene glycol di (meth) acrylate), three (2-hydroxyethyl) isocyanic acid methacrylate (tri (2-hydroxyethyl) isocyanate di (meth) acrylate) etc.; The nitrilation vinyl compound, such as (methyl) vinyl cyanide ((meth) acrylonitrile), α-chlorine (methyl) vinyl cyanide (α-chloro (meth) acrylonitrile) etc.; Aromatic ethenyl compound, such as styrene (styrene), methyl styrene, methoxy styrene etc.; Other vinyl compounds are such as cyclic alkyl (methyl) acrylic acid of C6 to C12 etc.(A-2) be preferably methacrylic acid dicyclo pentyl ester (dicyclopentanylmethacrylate), styrene, Isooctyl acrylate monomer (iso-octylacrylate), propenyl (methyl acryl) (allylmethacrylate), methacrylonitrile (methacrylonitrile), 2,2-dimethyl-1, the two acryl (2 of ammediol, 2-dimethyl-1,3-propylene glycoldiacrylate).When (A-2) is styrene, can improve further thermotolerance and the endurance of Photosensitve resin composition of the present invention.Take (A-1) and (A-2) summation as 100 weight portions, content (A-2) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-2) can use separately or mix several uses.
The weight average molecular weight (Mw) that the polystyrene conversion that (A) measured with gel permeation chromatography obtains is better for 2 * 10
3To 1 * 10
5Between, better for 5 * 10
3To 5 * 10
4Between.When the weight average molecular weight of (A) is lower than 2 * 10
3The time; can produce the coarse problem of pattern by the formed dielectric layer of Photosensitve resin composition of the present invention or protective seam; and this dielectric layer or protective seam are through producing the problem of thickness attenuation after the high temperature process, meaning is that pattern form, the thermotolerance of dielectric layer or protective seam can occur deteriorated.When the weight average molecular weight of (A) is higher than 1 * 10
5The time, Photosensitve resin composition of the present invention can produce the problem that light sensitivity reduces, and also can reduce the degree of accuracy of dielectric layer or protective seam pattern.
(B) monomer that has at least one ethene unsaturated double-bond can be ethylene glycol dimethacrylate (ethylene glycol di (meth) acrylate); Polyethylene glycol dimethacrylate (polyethylene glycol di (meth) acrylate) with 2 to 14 Oxyranyles (ethyleneoxide group); Trihydroxymethyl propane dimethylacrylate (trimethylol propane di (meth) acrylate); Trihydroxymethyl propane trimethyl acrylic ester (trimethylol propane tri (meth) acrylate); Isoamyl tetrol trimethyl acrylic ester (pentaerythritol tri (meth) acrylate); Isoamyl tetrol tetramethyl acrylate (pentaerythritol tetra (meth) acrylate); Propylene glycol dimethylacrylate (propyleneglycol di (meth) acrylate) with 2 to 14 epoxypropane bases (propyleneoxide group); Dipentaerythritol pentamethyl acrylate (dipentaerythritol penta (meth) acrylate); Dipentaerythritol hexamethyl acrylate (dipentaerythritol hexa (meth) acrylate, DPHA); Trihydroxymethylpropanyltri diglycidyl ether acrylic acid adjuvant (trimethylolpropanetriglycidylether acrylic acid additives); Bisphenol A diglycidyl ether acrylic acid adjuvant (bisphenol A diglycidylether acrylic acid additives); (methyl) senecioate of phthalate esters-hydroxyl ethyl ester (phthalate diesters of β-hydroxyethyl (meth) acrylate); Toluene two different hydrogen acid ether (hydrogen acid ester) adjuvants (toluene diisocyanate additives) ((methyl) senecioate-hydroxyl ethyl ester (β-hydroxyethyl (meth) acrylate) for example; Monomer with ethene unsaturated link, therein ethylene unsaturated link are to be selected from by two trihydroxy methyl propane tetraacrylate (ditrimethylol propanetetraacrylate), the different hydracid triacrylate of ethoxylation trimerization (tris (2-acryloxyethyl) isocyanurate), contain ethoxy season pentitol tetraacrylate (ethoxylated pentaerylthritoltetraacrylate) (EO 4mol), season pentitol tetraacrylate (pentaerythritoltetraacrylate) (EO 35mol), contain ethoxy trimethylolpropane triacrylate (ethoxylated trimethylolpropanetriacrylate) (EO 9mol), contain ethoxy trimethylolpropane triacrylate (EO 3mol), contain propoxyl group trimethylolpropane triacrylate (propxylated pentaerythritoltetraacrylate) (PO 4mol), nine glycol diacrylates (nonaethylene glycol diacrylate), double pentaerythritol methacrylate (dipentaerythritolhexaacrylate-modified caprolactone) with the caprolactone upgrading, the group that trimethylolpropane propoxyl group triacrylate (trimethylolpropanepropoxylate triacrylate) forms.In addition, (B) also can be the general merchandise product, for example KAYARAD DPHA-40H (Japanese chemical drug (strain) is sold); U-4HA, U-6HA, U-6LPA, U-15HA, UA-32P, U-324A, U-4H, U-6H (Xin Zhong village chemical industry (strain) manufacturing); UN-9000H, UN-3320HA, UN-3320HB, UN-3320HC, UN-901, UN-1200TPK, UN-904 (industry (strain) is made on the root).With total restatement of Photosensitve resin composition, content (B) is for example between between the 5wt% to 15wt%, and is better for 10wt% to 13wt%.Above-mentioned (B) can use separately or mix several uses.
(C) have at least one reactive acroleic acid functional group's urethane resin oligomer, its acid value (mgKOH/g) can be between 0 to 100.The urethane resin segment of this urethane resin oligomer is to be polymerized by isocyanate and hydroxyl compound.Isocyanate can be fragrant diisocyanate, for example 2,4-toluene di isocyanate (2,4-tolylene diisocyanate), 2,6-toluene di isocyanate (2,6-tolylene diisocyanate), dimethylbenzene-1,4-diisocyanate (xylene-1,4-diisocyanate), dimethylbenzene-1,3-diisocyanate (xylene-1,3-diisocyanate), 4,4 '-diphenylmethane diisocyanate salt (4,4 '-diphenylmethane diisocyanate, MDI), 2,4 '-diphenylmethane diisocyanate salt (2,4 '-diphenylmethane diisocyanate), 4,4 '-diphenyl ether diisocyanate (4,4 '-diphenyl ether diisocyanate), 2-nitrogen oxygen diphenyl-4,4 '-diisocyanate (2-nitrodiphenyl-4,4 '-diisocyanate), 2,2 '-phenyl-propane-4,4 '-diisocyanate (2,2 '-diphenylpropane-4,4 '-diisocyanate), 3,3 '-dimethyl dipropyl methyl-4,4 '-diisocyanate (3,3 '-dimethyldiphenylmethane-4,4 '-diisocyanate), 4,4 '-dimethylpropane diisocyanate (4,4 '-diphenylpropane diisocyanate), meta-benzene diisocyanate (m-phenylene diisocyanate), face-the benzene diisocyanate (p-phenylene diisocyanate), naphthalene-1,4-diisocyanate (naphthylene-1,4-diisocyanate), naphthalene-1,5-diisocyanate (naphthylene-1,5-diisocyanate), 3,3 '-dimethoxy dimethylbenzene-4,4 '-diisocyanate (3,3 '-dimethoxydiphenyl-4,4 '-diisocyanate); Aliphatics diisocyanate (aliphatic diisocyanates), for example tetramethylene diisocyanate (tetramethylene diisocyanate), cyclohexane diisocyanate (hexamethylene diisocyanate, HDI), lysine di-isocyanate (lysine diisocyanate); Alicyclic ring diisocyanate (alicyclic diisocyanates), for example isophorone diisocyanate (isophorone diisocyanate), the toluene di isocyanate of hydrogenation (hydrogenated tolylene diisocyanate), the dimethylbenzene diisocyanate of hydrogenation (hydrogenated xylene diisocyanate), the diphenylmethane diisocyanate salt of hydrogenation (hydrogenated diphenylmethane diisocyanate), tetramethyl xylene diisocyanate (tetramethylxylene diisocyanate).Above-mentioned isocyanate only is used for explanation, but is not limited to this, and can be one or more mixing uses in order to the isocyanate of polymerization urethane resin segment.Hydroxyl compound in order to polymerization urethane resin segment can be glycol, ethylene glycol (ethylene glycol) for example, propylene glycol (propylene glycol), tetramethylene vinyl alcohol (tetramethylene glycol), 1,5-pentanediol (1,5-pentanediol), 1,6-butylene glycol (1,6-hexanediol), 1,10-certain herbaceous plants with big flowers glycol (1,10-decanediol), 1,4-two cyclohexenols (1,4-dihydroxycyclohexane), 1,4-two cyclohexene methylols (Isosorbide-5-Nitrae-dihydroxymethylcyclohexane), divinyl alcohol (diethylene glycol), trivinyl alcohol (triethylene glycol); Amino alcohol; Polymer polyol.Above-mentioned hydroxyl compound only is used for explanation, but is not limited to this, and also can be one or more mixing uses in order to the hydroxyl compound of polymerization urethane resin segment.With total restatement of Photosensitve resin composition, content (C) is between between the 1wt% to 20wt%, and is better between the 3wt% to 15wt%, better between the 5wt% to 10wt%.Above-mentioned (C) can use separately or mix several uses.When Photosensitve resin composition of the present invention during as the protective seam of the dielectric layer between the metal electrode or covering metal electrode, (C) can make Photosensitve resin composition of the present invention have high rigidity, and have good tack for metallic diaphragm.
(D) can be through the prepared organic and inorganic colloidal sol of sol gel reaction by organosilane and inorganic oxide through the inorganic additive of organosilane surfaction.This sol gel reaction can be undertaken by adding acid catalyst, and employed acid catalyst can be to be selected from by acetic acid (acetic acid), phosphoric acid (phosphoric acid), sulfuric acid (sulfuric acid), chloric acid (chloric acid), nitric acid (nitric acid), chlorosulfonic acid (chlorosulfonic acid), p-toluenesulfonic acid (p-toluene sulfonic acid), trichloroacetic acid (trichloroacetic acid), polyphosphoric acid (polyphosphoric acid), acid iodide (iodic acid), the group that iodic anhydride (iodic anhydride) and mistake chloric acid (perchloric acid) form.Above-mentioned acid catalyst can separately or mix several uses.Through the prepared organic and inorganic colloidal sol of sol gel reaction thus, the kind of the alcohols that its character is subject to the content of the kind of kind, acid catalyst of organosilane and concentration, acidity (pH value), temperature, water, use as hydrolysising solvent and kind and the concentration of concentration and salt affect.Particularly, therefore prepared organic and inorganic colloidal sol have the effect that improves hardness and wear resistance because containing inorganic oxide.The inorganic oxide that is used for sol gel reaction can be selected from the group that is comprised of titania, silicon dioxide, zirconia, tin ash, cerium sesquioxide, barium titanate, aluminium oxide and yttria.The organosilane that is used for sol gel reaction can be selected from by methyltrimethoxy silane (methyl trimethoxy silane), methyl triethoxysilane (methyl triethoxy silane), vinyltrimethoxy silane (vinyl trimethoxy silane), vinyltriethoxysilane (vinyl triethoxy silane), dimethyldimethoxysil,ne (dimethyl dimethoxy silane), dimethyldiethoxysilane (dimethyl diethoxy silane), vinyl methyl dimethoxysilane (vinyl methyl dimethoxy silane), butyl trimethoxy silane (butyl trimethoxy silane), diphenyl ethoxy ethylene base silane (diphenyl ethoxy vinyl silane), methyl three isopropoxy silane (methyl triisopropoxy silane), methyl triacetoxysilane (methyl triacetoxy silane), tetraphenoxy-silicane alkane (tetraphenoxy silane), the group that tetrapropoxysilane (tetrapropoxy silane) and vinyl silane triisopropoxide (vinyl triisopropoxy silane) form.Except with the synthetic organic and inorganic colloidal sol of said method, also can be the general merchandise product through the inorganic additive of organosilane surfaction, for example the 601A-35 of Changxing chemical industry, 601B-35,601C-35,601H-35,601Q-35; The BYK-UV3500 of BYK series, BYK-UV3510, BYK-UV333, BYK-UV3650; MEK-ST, the MEK-AC-2101 of daily output chemical industry.With total restatement of Photosensitve resin composition, content (D) is for example less than 5wt%.
(E) organic acid anhydride can be maleic anhydride (maleic anhydride, MA), Yi Kang acid anhydrides (itaconic anhydride), tetrahydrochysene acid phthalic anhydride (tetrahydrophthalic anhydride), citraconic anhydride (citraconic anhydride), mesaconic acid acid anhydride (mesaconic anhydride) etc.Take (A) as 100 weight portions, content (E) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned (E) can use separately or mix several uses.
(F) the light initiator can be phosphine oxide (phosphine oxide) based compound, carbonyl (carbonyl) based compound, amine carbonyl (aminocarbonyl) based compound, triazine (triazine) based compound, oxime (oxime) based compound, amine (amine) based compound, alkoxy a pair of horses going side by side anthracene (alkoxyantharcene) based compound, thioxanthene (thioxanthone) based compound.Take (A) as 100 weight portions, content (F) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned (F) can use separately or mix several uses.
The phosphine oxide based compound for example is fragrant phosphine oxide (arylphosphine oxide); acyl phosphine (acylphosphine oxide); two acyl phosphines (bisacylphosphine oxide); 2; 4; 6-trimethylbenzoyl-diphenyl phosphine oxide (2; 4; 6-trimethylbenzoyldiphenylphosphine oxide; TPO); 2; 6-diethylbenzene formoxyl-diphenyl phosphine oxide (2; 6-diethylbenzoyldiphenylphosphine oxide); 2; 6-dimethylbenzoyl-diphenyl phosphine oxide (2; 6-dimethoxybenzoyldiphenylphosphine oxide); 2; 6-dichloro-benzoyl base-diphenyl phosphine oxide (2; 6-dichlorobenzoyldiphenylphosphine oxide); 2; 3; 5; 6-tetramethylbenzene formoxyl-diphenyl phosphine oxide (2; 3; 5; 6-tetramethylbenzoyldiphenylphosphine oxide); benzoyl two (2; the 6-xylyl) (benzoyldi (2 for phosphonic acids; 6-dimethylphenyl) phosphonate); 2; 4; 6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester (2; 4; 6-trimethylbenzoylethoxyphenylphosphine oxide); two (2; 4; the 6-trimethylbenzoyl) phenyl phosphine oxide) (bis (2; 4,6-trimethylbenzoyl) phenylphosphine, I-819); two (2; 6-anisoyl base)-2; 4,4-trimethylphenyl phosphine oxide (bis (2,6-dimethoxybenzoyl)-2; 4,4-trimethylpentylphosphine oxide)) etc.
The carbonyl based compound; amine carbonyl based compound; the triazine based compound; oxime compound for example is acetophenone (acetophenone); benzophenone (benzophenone); diphenylketone (biphenylketone); 1-hydroxyl-1-cyclohexyl phenyl ketone (1-hydroxy-1-benzoylcyclohexane; I-184) Benzyl benzylacetone 2; 2-dimethoxy-1; (benzyldimethylketal 2 for 2-diphenylethane-1-ketone; 2-dimethoxy-1; 2-diphenylethane-1-one; I-651); 1-Benzyl base-1-dimethyl tertiary amine-1-(4-morpholine-benzoyl) propane (1-benzyl-1-dimethylamino-1-(4-morpholino-benzoyl) propane; I-369); 2-morpholine-2-(4-methyl mercapto) benzoyl propane (2-morpholyl-2-(4-methylmercapto) benzoylpropane; I-907); EAQ (ethylantraquinone); 4-benzoyl-4-methyldiphenyl thioether (4-benzoyl-4-methyldiphenylsulfide); benzoylphenyl carbinol butyl ether (benzoinbutylether); 2-hydroxyl-2-benzoyl propane (2-hydroxy-2-benzoylpropane); 2-hydroxyl-2-(4-isopropyl) benzoyl propane (2-hydroxy-2-(4-isopropyl) benzoylpropane); 4-butyl benzene formyl methenyl choloride (4-butylbenzoyltrichloromethane); 4-phenoxy group benzoyl methylene chloride (4-phenoxybenzoyldichloromethane); methyl benzoylformate (benzoylmethylformate); 1; two (9-acridinyl) heptane (1 of 7-; 7-bis (9-acridinyl) heptane); 9-n-butyl-3; two (2-morpholine-isobutyryl) carbazole (9-n-butyl-3 of 6-; 6-bis (2-morpholino-isobutyloyl) carbazole); 10-butyl-2-triphenyl ketone (10-butyl-2-chloroacridone); 2-[2-(4-methoxyl-phenyl)-vinyl]-4; 6-pair-trichloromethyl-[1; 3; 5] triazine (2-[2-(4-methoxy-phenyl)-vinyl]-4; 6-bis-trichloromethyl-[1; 3; 5] triazine); 2-(4-methoxyl-naphthalene-1-yl)-4; 6-pair-trichloromethyl-[1; 3; 5] triazine (2-(4-methoxy-naphthalen-1-yl)-4; 6-bis-trichloromethyl-[1; 3; 5] triazine); 2-toluene [1; 3] dioxole-5-base-4; 6-pair-trichloromethyl-[1; 3; 5] triazine (2-benzo[1; 3] dioxol-5-yl-4; 6-bis-trichloromethyl-[1; 3; 5] triazine); 2-methyl-4; two (the trichloromethyl)-s-triazine (2-methyl-4 of 6-; 6-bis (trichloromethyl)-s-triazine); 2-phenyl-4; two (the trichloromethyl)-s-triazine (2-phenyl-4 of 6-; 6-bis (trichloromethyl)-s-triazine); 2-naphthalene ester-4; two (the trichloromethyl)-s-triazine (2-naphthyl-4 of 6-; 6-bis (trichloromethyl)-s-triazine); 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-two suberyl methane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-two suberyl-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-adamantyl methane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-adamantyl methane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-tetrahydrofuran methylmethane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-tetrahydrofuran methylmethane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-Sai fen methylmethane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-Sai fen methylmethane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-code fen methylmethane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-code fen methylmethane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-ethane-1-ketoxime-O-two cyclo-butane acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-ethane-1-ketoxime-O-three ring principle alkanoic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H-carbazole-3-yl]-ethane-1-ketoxime-O-adamantate; 1; 2-octadione-1-[4-(thiophenyl) phenyl]-2-(O-benzoyl oximes); 1; 2-diacetyl-1-[4-(thiophenyl) phenyl]-2-(O-benzoyl oximes); 1; 2-diacetyl-1-[4-(thiophenyl) phenyl]-2-(O-acetyl group oxime); 1; 2-octadione-1-[4-(methyl mercapto) phenyl]-2-(O-benzoyl oximes); 1,2-octadione-1-[4-(thiophenyl) phenyl]-2-(O-methyl benzoyl oxime).
Amine compound for example is triethanolamine (triethanolamine), methyldiethanolamine (methyldiethanolamine), triisopropanolamine (triisopropylamine), 4-dimethylaminomethyl ethyl benzoate (4-dimethylaminomethyl benzoate), 4-dimethyl aminoethyl ethyl benzoate (4-dimethylaminoethyl benzoate), 4-dimethylamino isoamyl benzene ethyl formate (4-methylaminoisoamyl benzoate), 2-methylamino ethylamino benzonitrile acetoacetic ester (2-methylaminoethyl benzoate), 4-dimethylamino-2-ethylhexyl ethyl benzoate (4-dimethylamino-2-ethylhexyl benzoate), N, N-methyl para-totuidine (N, N-methylparatoluidine), 4,4 '-two (dimethylamino) benzophenone (4,4 '-bis (dimethylamino) benzophenone), 4,4 '-two (diethylamino) benzophenone (4,4 '-bis (diethylamino) benzophenone), 4,4 '-two (ethylmethylamino) benzophenone (4,4 '-bis (ethylmethylamino) benzophenone).
Alkoxy a pair of horses going side by side anthracene based compound for example is 9,10-dimethoxy anthracene (9,10-dimethoxyanthracene), 9,10-diethoxy anthracene (9,10-diethoxyanthracene), EDMO (2-ethyl-9,10-dimethoxyanthracene), 2-ethyl-9,10-diethoxy anthracene (2-ethyl-9,10-diethoxyanthracene).
The thioxanthene based compound for example is ITX (2-isopropyl thioxanthone), ITX (4-isopropylthioxanthone, IPTX), 2,4-diethyl thioxanthone (2,4-diethylthioxanthone, DETX), 2,4-three chloro thioxanthones (2,4-trichlorothioxanthone), 1-chloro-4-propyl group thioxanthones (1-chloro-4-propoxythioxanthone).
(G) the functional silanes coupling agent can be the siloxanyl monomers of tool silylation acryl monomer, tool epoxide functional groups, and it is such as being γ-glycidoxy trimethoxy silane etc.(G) can make and have good tack between Photosensitve resin composition of the present invention and metal, metal oxide or the glass baseplate.In addition, owing to (G) having hydrophobic property, therefore can make Photosensitve resin composition of the present invention when carrying out the reliability test, have the high anti-oxidation characteristic.With total restatement of Photosensitve resin composition, content (G) is for example between between the 0.01wt% to 5wt%.Above-mentioned (G) can use separately or mix several uses.
(H) organic solvent can be benzene (benzene), toluene (toluene), dimethylbenzene (xylene), methyl alcohol (methanol), ethanol (ethanol), ethanol list propyl ether (ethylene glycol monopropyl ether), diethylene glycol dimethyl ether (diethylene glycol dimethyl ether), diethylene glycol dimethyl ether (diethylene glycol methyl ether), methoxy methyl propionate (methyl methoxypropionate), ethoxyl ethyl propionate (ethyl ethoxypropionate), ethyl lactate (ethyllactate), tetrahydrofuran (tetrahydrofuran), ethanol monomethyl ether (ethylene glycol monomethyl ether), ethanol list ether (ethylene glycol monoethyl ether), the molten fine acetic acid esters of methyl (methyl cellosolve acetate), the molten fine acetic acid esters of ethyl (ethyl cellosolve acetate), diethanol monomethyl ether (diethylene glycol monomethyl ether), the single ether (diethylene glycol monoethyl ether) of diethanol, diethylene glycol monobutyl ether (diethylene glycol monobutyl ether), 1-Methoxy-2-propyl acetate (propylene glycol methyl ether acetate, PGMEA), propylene-glycol ethyl ether acetate (propylene glycol ethyl ether acetate), propylene glycol propyl ether acetate (propylene glycol propyl ether acetate), methyl isobutyl ketone (methyl isobutyl ketone), methyl ether ketone (methyl ether ketone), acetone (ketone), cyclohexanone (cyclohexanone), dimethyl formamide (dimethyl formamide, DMF), N, N-dimethyl acetamide (N, N-dimethylacetamide, DMAc), 1-METHYLPYRROLIDONE (N-Methyl pyrrolidone, NMP), gamma-butyrolacton (γ-butyrolactone).With total restatement of Photosensitve resin composition, content (H) is for example between between the 60wt% to 80wt%.Above-mentioned (H) can use separately or mix several uses.
Photosensitve resin composition of the present invention has high sensitivity, even at 400J/m
2Following exposure also can have good metal adhesion, high rigidity, good insulation characterisitic, good endurance, and can be used as dielectric layer between the metal electrode in the contact panel or the protective seam of covering metal electrode.
In sum, owing to have good tack between Photosensitve resin composition of the present invention and the metal, and have high rigidity, therefore can be applicable in the processing procedure of contact panel.When Photosensitve resin composition of the present invention through exposure with develop after; can form at the dielectric layer between the metal electrode and come to improve the tack between dielectric layer and the metal electrode; with the phenomenon of avoiding dielectric layer and metal electrode to peel off; perhaps can form the protective seam of covering metal electrode, cause the problem of low yield to avoid protective seam in processing procedure, to be subject to scratch.
Below will explain Photosensitve resin composition of the present invention with experimental example.
(A) have the synthetic polymer of the common block more than three:
At first, the 3-ethoxy-propionic acid second fat (ethyl 3-ethoxypropionate) with 95.673kg adds in the reactor as solvent.Then, pass into nitrogen and be stirred and heated to 130 ℃.Then, the methacrylic acid (methacrylic acid) of 24.451kg, the methacrylic acid phenylester (benzyl methacrylate) of 42.614kg, the isobornyl methacrylate (isobornyl methacrylate) of 42.443kg and three grades of butyl esters of benzoyl hydroperoxide (t-butyl perbenzoate) of 2.547kg are stirred, and splash in 130 ℃ the reactor (splashing into approximately 6 hours time).Afterwards, add the 3-ethoxy-propionic acid second fat of 72.195kg, and the temperature of reactor fallen be back to 50 ℃.Then, nitrogen is cut off, and add the glycidyl methacrylate (glycidyl methacrylate) of 6.636kg, the dimethylaminoethanol (dimethyl amino ethanol) (catalyzer) of 0.716kg, in air, stir the reaction 4 to 6 hours of stumbling.The solids content of the resin solution product of gained (solid content) is 41.4wt.%, and viscosity is 2650cps/25 ℃, and acid value (acidity) is 88.3mgKOH/g, and weight average molecular weight (Mw) is 12000.
In the Photosensitve resin composition of experimental example 1 and comparative example 1-4, other compositions except above-mentioned (A) as shown in Table 1.In addition, also show in the table one about pencil hardness test and metal adhesion test result.
Table one
As shown in Table 1, compare with general Photosensitve resin composition (comparative example 1-4), Photosensitve resin composition of the present invention (experimental example 1) has good metal adhesion and high rigidity.
Although the present invention discloses as above with embodiment; but it is not to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can change arbitrarily or be equal to replacement, therefore protection scope of the present invention should be as the criterion with the scope that the application's claim is defined.
Claims (2)
1. Photosensitve resin composition comprises:
(A) have the polymkeric substance of the common block more than three, described altogether block comprises: the ethylene unsaturated monomer that (A-1) contains acidic group; And (A-2) ethylene unsaturated monomer except (A-1), wherein (A-2) comprises cyclic alkyl (methyl) acrylic acid of the vinyl compound that contains propenyl, the vinyl compound that contains two acrylics, nitrilation vinyl compound, aromatic ethenyl compound or C6 to C12;
(B) has the monomer of at least one ethene unsaturated double-bond;
(C) has at least one reactive acroleic acid functional group's urethane resin oligomer;
(D) through the inorganic additive of organosilane surfaction;
(E) organic acid anhydride;
(F) light initiator;
(G) functional silanes coupling agent; And
(H) organic solvent,
Wherein with total restatement of this Photosensitve resin composition, (A) content is between between the 10wt% to 15wt%, (B) content is between between the 5wt% to 15wt%, (C) content is between between the 1wt% to 20wt%, (D) content is less than 5wt%, (G) content is between between the 0.01wt% to 5wt%, and content (H) is between between the 60wt% to 80wt%; Take (A) as 100 weight portions, content (E) is between 0.1 weight portion to 100 weight portion, and content (F) is between 0.1 weight portion to 100 weight portion; Take (A-1) and (A-2) summation as 100 weight portions, content (A-1) is between 10 weight portion to 90 weight portions, and content (A-2) is between 10 weight portion to 90 weight portions.
2. Photosensitve resin composition according to claim 1, wherein this Photosensitve resin composition is applied to dielectric layer between the metal electrode in the contact panel or the protective seam of covering metal electrode.
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| TWI480697B (en) * | 2013-06-10 | 2015-04-11 | Chi Mei Corp | Photosensitive resin composition and applications thereof |
| WO2017147185A1 (en) * | 2016-02-23 | 2017-08-31 | Board Of Regents The University Of Texas System | Block copolymers for sub-10 nm patterning |
| WO2021070520A1 (en) * | 2019-10-11 | 2021-04-15 | 富士フイルム株式会社 | Composition, method for producing composition, cured film, transfer film and method for manufacturing touch panel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0675412A1 (en) * | 1994-03-30 | 1995-10-04 | Japan Synthetic Rubber Co., Ltd. | Photosensitive resin composition |
| JP2000066391A (en) * | 1998-08-17 | 2000-03-03 | Tokyo Ohka Kogyo Co Ltd | Photosensitive composition for sandblast and photosensitive film using same |
| CN101078879A (en) * | 2006-05-24 | 2007-11-28 | Jsr株式会社 | Radiation sensitive resin composition, alternation compound and forming method thereof |
| CN101196686A (en) * | 2006-12-04 | 2008-06-11 | 旭化成电子材料元件株式会社 | Photosensitive resin composition and use of the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07271031A (en) * | 1994-03-28 | 1995-10-20 | Japan Synthetic Rubber Co Ltd | Photosensitive resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0675412A1 (en) * | 1994-03-30 | 1995-10-04 | Japan Synthetic Rubber Co., Ltd. | Photosensitive resin composition |
| JP2000066391A (en) * | 1998-08-17 | 2000-03-03 | Tokyo Ohka Kogyo Co Ltd | Photosensitive composition for sandblast and photosensitive film using same |
| CN101078879A (en) * | 2006-05-24 | 2007-11-28 | Jsr株式会社 | Radiation sensitive resin composition, alternation compound and forming method thereof |
| CN101196686A (en) * | 2006-12-04 | 2008-06-11 | 旭化成电子材料元件株式会社 | Photosensitive resin composition and use of the same |
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