CN102360730B - Lead frame-based discrete power inductor - Google Patents
Lead frame-based discrete power inductor Download PDFInfo
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- CN102360730B CN102360730B CN201110356562.6A CN201110356562A CN102360730B CN 102360730 B CN102360730 B CN 102360730B CN 201110356562 A CN201110356562 A CN 201110356562A CN 102360730 B CN102360730 B CN 102360730B
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil. The present invention has the advantages of providing a compact power inductor and maximizing inductance per unit area of the power inductor. The power inductor of the present invention also provides a power inductor which combines small physical size and minimum winding number and has a small cover area and a thin contour. In addition, the power inductor of the prevent invention can be produced with low cost and high yield by applying the present semiconductor packaging technology.
Description
This case is to divide an application
Original bill denomination of invention: the separated power inductor based on lead frame
Original bill application number: 200910003340.9
The original bill applying date: on January 15th, 2009
Technical field
The present invention relates generally to discrete inductance, particularly has the discrete inductance of top and bottom lead framework, and its inner pin that connects forms a coil around closed loop magnetic core.
Background technology
Look back discrete inductance of the prior art and represented various structures, comprise encapsulation wire-wound inductor, it has or the coiling around magnetic core of circle or plane.Typical magnetic core has toroidal core, " I " type cylinder magnetic core, T-shape cylinder magnetic core, and " E " type cylinder magnetic core.Other known structure comprises the coiling with magnetic powder core and metal alloy compressed-core.Formation one is provided with, around the surface of the coiling of magnetic core, discrete inductance is installed is also known.The manufacture of wire-wound inductor is a poor efficiency and complicated step.Open is particularly useful for making the coiling around cylinder magnetic core more convenient around axle.The in the situation that of toroidal core, coiling must repeat through centre bore.
The discrete inductance without coiling comprises solenoid conductor, for example, be entitled as United States Patent (USP) 6,930,584 and the composite bed inductance of " microminiature power converter (Microminiature Power Converter) ".The United States Patent (USP) 4 that is entitled as " chip-shaped inductance (Chip-type Inductor) ", 543,553, the United States Patent (USP) 5 that is entitled as " sheet-type inductance (Lamination Type Inductor) ", 032,815, the United States Patent (USP) 6 that is entitled as " method (Method for Producing Multi-layered Chip Inductor) of manufacturing composite bed chip inductance ", 630,881, typical composite bed inductance is all disclosed with the United States Patent (USP) 7,046,114 that is entitled as " thin plate inductance (Laminated Inductor) ".These discrete inductances without coiling require composite beds, and have complicated structure and be also inconvenient to manufacture.
Consider the restriction of prior art, in this technical field, have the demand for the separated power inductor that can use existing science and technology to manufacture in a large number easily.Also exist the requirement of discrete power device cheaply can be provided in the art.Also require in the art the per unit interval of separated power inductor to there is maximum induction coefficient and minimum resistance.Also need in the art a kind of compact separated power inductor that combines the less physical size with minimum winding number, so that less area occupied and thinner profile to be provided.
Summary of the invention
Separated power inductor provided by the present invention has overcome the shortcoming existing in prior art, by a kind of power inductance with top and bottom lead framework is provided, connects pin and form a coil around single closed loop magnetic core in it, reaches object of the present invention.Single core layer maximizes the inductance coefficent of each unit area of power inductance.
In one aspect of the invention, bottom lead framework comprises a plurality of bottom legs, and each bottom legs has the first and second linkage sections that are separately positioned in its respective end.Bottom lead framework also comprises the first end pin with the first linkage section and the second end pin with the second linkage section.Top lead framework comprises a plurality of tops pin, and each top pin has the first and second linkage sections that are separately positioned on its respective end.
In another aspect of the present invention, bottom lead framework comprises the first side and the second side, and the first and second sides are oppositely arranged.First group of pin forms the first side, and second group of pin forms the second side.First group of pin comprises the end pin with an inner linkage section.All the other pins in first group of pin comprise inside and outside linkage section.
Second group of pin of bottom lead framework comprises that one has the end pin of outside linkage section.All the other pins in second group of pin have inside and outside linkage section.
Bottom lead framework also comprises path pin, and it extends between the first side and the second side.Route pin has inside and outside linkage section.
Top lead framework comprises the first side and the second side, and the first and second sides are oppositely arranged.First group of pin forms the first side, and second group of pin forms the second side.Each top pin is comprised of an inner linkage section and an outside linkage section.
Coil around single closed-loop magnetic core forms the interior connection between the inside and outside linkage section on top and bottom lead framework, and magnetic core is clipped between top and bottom lead framework.One of them pin of top and bottom lead framework has general non-linear stepped construction, so that the pin on the bottom lead framework that the pin of top lead framework is coupled adjacent forms the coil around magnetic core.
In another aspect of this invention, magnetic core has a window or a hole in the middle of being patterned as, and with this, realizes the connection between the interior linkage section of top and bottom lead frame pin.
In another aspect of this invention, an inner connecting structure or chip are arranged in the window of magnetic core, to realize the connection between the inside linkage section of top and bottom lead frame pin.The inner chip that connects forms conductive path with the inner linkage section that is coupled.
In another aspect of this invention, a peripheral syndeton or chip are arranged at magnetic core around, to realize the connection between the outside linkage section of top and bottom lead frame pin.The peripheral chip that connects forms conductive path with the outside linkage section that is coupled.
In another aspect of this invention, magnetic core is solid, and conductive path is used to provide the connection between the inside linkage section of top and bottom lead frame pin.
In another aspect of this invention, magnetic core is solid, and conductive path is used to provide the connection between the inside and outside linkage section of top and bottom lead frame pin.
In another aspect of this invention, the pin of top and bottom lead framework is crooked, with this by the inside and outside linkage section on it be arranged at one with the parallel plane plane of lead frame on.
In another aspect of this invention, top pin is crooked, with this by the inside and outside linkage section on it be arranged at one with the parallel plane plane of lead frame on, and bottom legs is plane.
The invention has the advantages that: it provides the power inductance of a compactness and maximizes the inductance coefficent in unit area.Power inductance of the present invention also provides a kind of power inductance that little physical size is combined with minimum turn number, and it has less area coverage and thinner profile.In addition, power inductance of the present invention can be produced by the low-cost high yield of the existing semiconductor packaging of application ground simply.
So far, in order to understand better describing in detail for of the present invention hereinafter, quite broadly sketched the contours of more important feature of the present invention, and the contribution that this area is done also can be familiar with better.Certainly, the present invention also has other feature to narrate hereinafter, and its content that formation claim is limited.
For this reason, before describing a specific embodiment of the present invention in detail, will be appreciated that the present invention is not limited to the details of the function element in present specification and content that these elements are narrated hereinafter and the scope of accompanying drawing.The present invention can have other embodiment, and implements and realize with number of ways., also will be appreciated that meanwhile, grammer used herein and term and summary, it is intended to narrating content and can not be considered restriction.
Therefore, those skilled in the art will appreciate that, the content disclosed herein of usining can be used to the basis of design as other method and system easily, to reach some objects of the present invention.So importantly, in the situation that it does not depart from spirit of the present invention and scope, claim should be considered and comprise such equivalent structure.
Accompanying drawing explanation
These and other aspect of the present invention and feature will show those of ordinary skill in the art by narration and the following corresponding accompanying drawing for particular embodiment of the present invention hereinafter; Wherein:
Figure 1A is the vertical view of the first execution mode of the separated power inductor based on lead frame of the present invention;
In Figure 1B, with dotted line, shown the vertical view of the magnetic core of the separated power inductor based on lead frame in Figure 1A;
Fig. 1 C is the vertical view of magnetic core of the present invention;
Fig. 1 D is the vertical view of the magnetic core with a minor groove of the present invention;
Fig. 1 E is the vertical view of bottom lead framework of the present invention;
Fig. 1 F is the vertical view of top lead framework of the present invention;
Fig. 1 G is the end view of the separated power inductor based on lead frame in Figure 1A;
Fig. 1 H is the cutaway view of encapsulation completely of the separated power inductor based on lead frame in Figure 1A;
Fig. 2 A is the vertical view of the second execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 2 B is the end view of the separated power inductor based on lead frame in Fig. 2 A;
Fig. 2 C is the vertical view of bottom lead framework of the present invention;
Fig. 2 D is the cutaway view of encapsulation completely of the separated power inductor based on lead frame in Fig. 2 A;
Fig. 3 A is the vertical view of the third execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 3 B is the vertical view of top lead framework of the present invention;
Fig. 3 C is the end view of the separated power inductor based on lead frame in Fig. 3 A;
Fig. 3 D is the inner vertical view that connects chip of the present invention;
Fig. 3 E is the cutaway view that the inside in Fig. 3 D connects chip;
Fig. 4 A is the vertical view of the 4th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 4 B is the vertical view of bottom lead framework of the present invention;
Fig. 5 A is the vertical view of the 5th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 5 B is the end view of the separated power inductor based on lead frame in Fig. 5 A;
Fig. 5 C connects the vertical view of chip in periphery of the present invention;
Fig. 5 D is the vertical view of top lead framework of the present invention;
Fig. 6 A is the vertical view of the 6th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 6 B is the vertical view of magnetic core of the present invention;
Fig. 6 C is the end view of the separated power inductor based on lead frame in Fig. 6 A;
Fig. 6 D is the vertical view of bottom lead framework of the present invention;
Fig. 7 A is the vertical view of the 7th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 7 B is the end view of the separated power inductor based on lead frame in Fig. 7 A;
Fig. 8 A is the vertical view of the 8th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 8 B is the vertical view of magnetic core of the present invention;
Fig. 8 C is the end view of the separated power inductor based on lead frame in Fig. 8 A;
Fig. 9 A is the vertical view of the 9th kind of execution mode of the separated power inductor based on lead frame of the present invention;
Fig. 9 B is the vertical view of magnetic core of the present invention;
Fig. 9 C is the vertical view of bottom lead framework of the present invention; And
Fig. 9 D is the vertical view of top lead framework of the present invention.
Embodiment
Now describe by reference to the accompanying drawings the present invention in detail, it is given an example so that those skilled in the art can implement the present invention as of the present invention.It should be noted that accompanying drawing hereinafter and do not mean that for example limitation of the scope of the invention.Wherein some assembly of the present invention can partly or entirely be realized with known element, in these known elements, only for the part of understanding necessity of the present invention, will be set forth, and the details of remainder well known elements is described and will be omitted, in order to avoid content of the present invention is indefinite.In addition, the present invention by illustrated mode comprised existing and in the future known to the equivalence element herein relating to.
The invention provides a kind of separated power inductor based on lead frame.The specific embodiment of the present invention comprises that one has and is formed at the window at its center or the magnetic core of hole, thereby allows the interior linkage section of the pin of top and bottom lead framework to be connected, and with this, forms the coil of the power inductance further illustrating at this.The preferred loop configuration of magnetic core and thickness are less than 100 microns, to adapt to the application of thin inductance.Magnetic core can be made by ferrite or nano-crystal nickel ferroalloy in high-frequency application, can be by dilval in low-frequency application, and nickel zinc alloy or other applicable magnetic material are made.The main application of a kind of separated power inductor of setting forth is in this article for DC/DC power converter, its operating frequency range is 1MHz to 5MHz, output current 1A or less, the scope of inductance value is at 0.4 to 2.0 μ H, and DC series resistance is less than 0.15 Ω.According to the coil of the power inductance in the present invention, the linkage section of the pin of the top around magnetic core that it is connected by inside and bottom lead framework forms.Inner connection can comprise that scolder and the such standard semiconductor encapsulating material technology of conductor loops epoxy resins realize by use.The thickness of top and bottom lead framework is preferably between 100 to 200 microns, and by using the low electrical resistant material that comprises copper and other alloys in common use to make in the making of lead frame.After magnetic core combination, if needed, the gross thickness of power inductance provided by the present invention can be less than 1mm, and this just goes in the application apparatus of many for example hand-held devices and mobile electronic product.
The conventional design scheme 100 of the first execution mode of the separated power inductor based on lead frame as shown in Figure 1A.Inductance 100 comprises magnetic core 110, one top lead frameworks 120 and a bottom lead framework 160, and its pin connects around magnetic core 110 is inner.Lead frame 160 is made by conductor material, and preferred metal materials comprises copper, alloy 42, and copper facing.Magnetic core 110 comprises that one is formed at its middle window or hole 115 (Fig. 1 C).
With reference to figure 1D, shown magnetic core 110a has a minor groove 117.Groove 117 is for adjusting the characteristic of magnetic core 110a, and the final structure of magnetic core still provides the magnet ring of a sealing.The wherein part of groove 117 also can a similar pore, and extends to a side that passes completely through magnetic core.In all of the embodiments of the present invention, have or not the fluted magnetic core of tool can use.
Top and bottom lead framework 120 and 160 all comprise a plurality of pins.As Fig. 1 E illustrates, bottom lead framework 160 comprises first group of pin 160a, 160b and the 160c that is arranged at lead frame 160 first sides.Pin 160a, 160b and 160c have nonlinear hierarchic structure, to realize being connected between the pin with top lead framework 120, thereby form further disclosed coil in this article.Pin 160a is as end pin and have the inside linkage section 161a being positioned on plane C-C, and plane C-C is parallel to the base plane A-A of bottom lead framework 160, and the side of being located thereon.Fig. 1 G is the sketch plan of the side-looking direction of power inductance 100, has expressed plane and the pin configuration of institute's reference.In Fig. 1 G, omitted the magnetic core 110 of pin 160f and part, to provide that present embodiment is simplified and side profile more clearly.Similarly simplification is also applied in other end view of presents.Bottom legs 160b and 160c comprise respectively inside linkage section 161b and the 161c being arranged on plane C-C, and plane C-C is parallel to the plane B-B of pin 160b and 160c planar section, and the side of being located thereon.Bottom legs 160b and 160c also comprise respectively outside linkage section 163b and the 163c being positioned on plane C-C.Plane B-B and plane A-A are positioned at same plane or a little more than in plane A-A.
As shown in Fig. 1 E, bottom lead framework also comprises path pin 160d.Path pin 160d comprises an inner linkage section 161d and an outside linkage section 163d who is arranged in C-C plane.Route segment 165d (being arranged in B-B plane) coupling is arranged at the outside linkage section 163d and the inside linkage section 161d that is arranged at the second side of bottom lead framework 160 of the first side of bottom lead framework 160.
With reference to figure 1F, top lead framework 120 comprises first group of pin 120a, 120b and the 120c that is arranged at top lead framework 120 first sides.Top pin 120a, 120b and 120c have nonlinear hierarchic structure, to realize being connected between the pin with bottom lead framework 160, thereby form further disclosed coil in this article.Top pin 120a, 120b and 120c comprise respectively the inside linkage section 121a being arranged on plane D-D, 121b and 121c, plane D-D is parallel to top pin 120a, the plane E-E at the planar section place of 120b and 120c, and be positioned at its below.Top pin 120a, 120b and 120c also comprise respectively outside linkage section 123a, 123b and the 123c being positioned on plane D-D.
The coil forming around magnetic core 110 shows the most clearly in Figure 1B, and wherein magnetic core 110 is illustrated by the broken lines.By the window 115 of magnetic core 110, the pin 160a of bottom lead framework 160,160b, 160c, 160d, 160f, and the inside linkage section of 160g be coupled inner linkage section 121a, 121b, 121c, 121d, 121e and 121f.The pin 160b of bottom lead framework 160,160c, 160d, 160e, the outside linkage section coupling of 160f and 160g is around outside linkage section 123a, 123b, 123c, 123d, 123e and the 123f of the top lead framework 120 of magnetic core 110 peripheral edges.
The inside linkage section 121a of the inside linkage section 161a coupling pin 120a of pin 160a.The outside linkage section 163b of the outside linkage section 123a coupling adjacent leads 160b of pin 120a.The non-linear hierarchic structure of pin 120a can aim at and be coupled outside linkage section 123a and 163b.The inside linkage section 121b of the inside linkage section 161b coupling pin 120b of pin 160b.The inside linkage section 161b that the non-linear hierarchic structure of pin 160b can make pin 160b in window 115 with the adjacent setting of inner linkage section 161a.The outside linkage section 163c of the outside linkage section 123b coupling adjacent leads 160c of pin 120b.The same with the situation of pin 120a, the non-linear hierarchic structure of pin 120b can make its aligning and be coupled to outside linkage section 123b and 163c.The inside linkage section 121c of the inside linkage section 161c coupling pin 120c of pin 160c.The inside linkage section 161c that the non-linear hierarchic structure of pin 160c can make pin 160c in window 115 with the adjacent setting of inner linkage section 161b.The outside linkage section 163d of the outside linkage section 123c coupling adjacent leads 160d of pin 120c, the non-linear hierarchic structure of pin 120c can make its aligning and be coupled outside linkage section 123c and 163d.
The route segment 165d of path pin 160d provides with coil circuit and connects the inside linkage section 161d of pin 160d to the access path of the inside linkage section 121f of pin 120f.The outside linkage section 123f of pin 120f is coupled to the outside linkage section 163g of adjacent leads 160g.The non-linear hierarchic structure of pin 120f can make its aligning and be coupled outside linkage section 123f and 163g.The inside linkage section 121e of the inside linkage section 161g coupling pin 120e of pin 160g.The inside linkage section 161g that the non-linear hierarchic structure of pin 160g can make pin 160g in window 115 with the adjacent setting of inner linkage section 161d.The outside linkage section 163f of the outside linkage section 123e coupling adjacent leads 160f of pin 120e.The non-linear hierarchic structure of pin 120e can make its aligning and be coupled outside linkage section 123e and 163f.The inside linkage section 161f of pin 160f is coupled to the inside linkage section 121d of pin 120d.The inside linkage section 161f that the non-linear hierarchic structure of pin 160f can make pin 160f in window 115 with the adjacent setting of inner linkage section 161g.The outside linkage section 123d of pin 120d connects the outside linkage section 163e of adjacent end pin 160e.
As shown in Figure 2 A, wherein the part pin of bottom lead framework 260 dots in the general design 200 of the second execution mode of the separated power inductor based on lead frame.Power inductance 200 is consistent with power inductance 100 in all fields, and except as shown in the diagrammatic side views of power inductance 200 (Fig. 2 B), its bottom lead framework 260 is planes.
With reference to figure 2C, bottom lead framework 260 comprises first group of pin 260a, 260b and the 260c that is arranged at lead frame 260 first sides in detail.Pin 260a, 260b and 260c have non-linear hierarchic structure to realize and being connected of the pin of top lead framework 120, thereby form general's further disclosed coil in this article.Pin 260a is as end pin and have inner linkage section 261a.Bottom legs 260b and 260c comprise respectively inner linkage section 261b and 261c. Bottom legs 260b and 260c also comprise respectively outside linkage section 263b and 263c.
As shown in Figure 2 C, bottom lead framework 260 also comprises a path pin 260d.Path pin 260d comprises an inner linkage section 261d and an outside linkage section 263d.Route segment 265d is coupled to the outside linkage section 263d that is arranged at the first side of bottom lead framework 260 the inside linkage section 261d of the second side that is arranged at bottom lead framework 260.
As shown in Figure 2 A, around magnetic core 110, form coil.The pin 260a of bottom lead framework 260,260b, 260c, 260d, the inside linkage section of 260f and 260g is coupled to inner linkage section 121a, 121b, 121c, 121d, 121e and 121f by the window 115 of magnetic core 110.The pin 260b of bottom lead framework 260,260c, 260d, 260e, the outside linkage section coupling of 260f and 260g is around outside linkage section 123a, 123b, 123c, 123d, 123e and the 123f of the top lead framework 120 of magnetic core 110 peripheral edges.
The inside linkage section 121a of the inside linkage section 261a coupling pin 120a of pin 260a.The outside linkage section 263b of the outer portion part 123a coupling adjacent leads 260b of pin 120a.The non-linear hierarchic structure of pin 120a can make its aligning and be coupled outside linkage section 123a and 263b.The inside linkage section 121b of the inside linkage section 261b coupling pin 120b of pin 260b.The inside linkage section 261b that the non-linear hierarchic structure of pin 260b can make pin 260b in window 115 with the adjacent setting of inner linkage section 261a.The outside linkage section 263c of the outside linkage section 123b coupling adjacent leads 260c of pin 120b.The non-linear hierarchic structure of pin 120b can make its aligning and be coupled outside linkage section 123b and 263c.The inside linkage section 121c of the inside linkage section 261c coupling pin 120c of pin 260c.The inside linkage section 261c that the non-linear hierarchic structure of pin 260c can make pin 260c in window 115 with the adjacent setting of inner linkage section 261b.The outside linkage section 263d of the outside linkage section 123c coupling adjacent leads 260d of pin 120c.
As shown in Figure 3A, wherein the part pin of bottom lead framework 260 dots in the general design 300 of the third execution mode of the separated power inductor based on lead frame.Power inductance 300 comprises planar base lead frame 260, one top lead frameworks 320, and its pin connects around magnetic core 110 is inner.One connects chip 330 is arranged at (Fig. 3 C) in window 115, and can realize the connection between top and the inside linkage section of bottom lead framework pin.
With reference to figure 3B, top lead framework 320 comprises first group of pin 320a, 320b and the 320c that is arranged at top lead framework 320 first sides.Top pin 320a, 320b and 320c have nonlinear hierarchic structure, to realize being connected between the pin with bottom lead framework 260, thereby form further disclosed coil in this article.Top pin 320a, 320b and 320c comprise respectively and are arranged at top pin 320a, inside linkage section 321a, 321b and 321c on the plane A-A at the planar section place of 320b and 320c. Top pin 320a, 320b and 320c also comprise respectively the outside linkage section 323a being positioned on plane B-B, 323b and 323c, plane B-B is parallel to plane A-A and is positioned at its below.
As the inside of Fig. 3 D as shown in Fig. 3 E is connected chip 330, comprise the conductive through hole 330a being arranged for six minutes, 330b, 330c, 330d, 330e and 330f (in Fig. 3 A, being represented by dotted lines), it provides the inside between the inside linkage section of pin of top lead framework 320 and bottom lead framework 260 to connect.Solder projection 340 is preferably formed top and bottom surface in interior connection chip 330 to form interior connection.
Be the coil forming around magnetic core 110 as shown in Figure 3A.The pin 260a of bottom lead framework 260,260b, 260c, 260d, the inside linkage section of 260f and 260g is connected inside linkage section 321a, 321b, 321c, 321d, 321e and the 321f of chip 330 coupling top lead frameworks 320 by inside.The pin 260b of bottom lead framework 260,260c, 260d, 260e, the outside linkage section coupling of 260f and 260g is around outside linkage section 323a, 323b, 323c, 323d, 323e and the 323f of the top lead framework 320 of magnetic core 110 peripheral edges.
The inside linkage section 261a of lead-in wire 260a is by the inside linkage section 321a of conductive through hole 330a coupling pin 320a.The outside linkage section 263b of the outside linkage section 323a coupling adjacent leads 260b of pin 320a.The inside linkage section 261b of pin 260b is by the inside linkage section 321b of conductive through hole 330b coupling pin 320b.The outside linkage section 263c of the outside linkage section 323b coupling adjacent leads 260c of pin 320b.The inside linkage section 261c of pin 260c is by the inside linkage section 321c of conductive through hole 330c coupling pin 320c.The outside linkage section 263d of the outside linkage section 323c coupling adjacent leads 260d of pin 320c.Route segment 265d (Fig. 2 C) is provided with coil circuit and is connected the inside linkage section 261d of pin 260d to the access path of the inside linkage section 321f of pin 320f by conductive through hole 330f.The outside linkage section 263g of the outside linkage section 323f coupling adjacent leads 260g of pin 320f.The inside linkage section 261g of pin 260g is by the inside linkage section 321e of conductive through hole 330e coupling pin 320e.The outside linkage section 263f of the outside linkage section 323e coupling adjacent leads 260f of pin 320e.The inside linkage section 261f of pin 260f is by the inside linkage section 321d of conductive through hole 330d coupling pin 320d.The outside linkage section 263e of the outside linkage section 323d coupling adjacent leads 260e of pin 320d.As first and second embodiment, the non-linear hierarchic structure of top and bottom lead framework pin can make inside and outside linkage section aim at and reserve space.
As shown in Figure 4 A, wherein the part pin of bottom lead framework 460 dots in the general design 400 of the 4th kind of execution mode of the separated power inductor based on lead frame.Power inductance 400 is consistent with power inductance 300 in all fields, except bottom lead framework 460 (Fig. 4 B) comprises that one has the path pin 460d of route segment 465d, the end of route segment 465d is the inside linkage section 461d with the inside linkage section 461g parallel alignment of pin 460g.
As shown in Figure 5 A and 5B, wherein the part pin of bottom lead framework 260 dots in the general design 500 of the 5th kind of execution mode of the separated power inductor based on lead frame.Power inductance 500 comprises magnetic core 110, one top lead frameworks 520 (Fig. 5 D), and bottom lead framework 260, and its pin connects around magnetic core 110 is inner.Interior connection chip 330 is arranged at (Fig. 3 C) in window 115, and can realize the connection between top and the inside linkage section of bottom lead framework pin.The one peripheral interior chip 550 that connects can be realized the connection between top and the outside linkage section of bottom lead framework pin.
In peripheral, connect chip 550 and comprise that one has conductive through hole 550a, 550b, 550c, 550d, the rectangular configuration of 550e and 550f.Through hole 550a, 550b arranges along first paragraph 551 intervals that are connected chip 550 in periphery with 550c.Through hole 550d, 550e arranges along second segment 553 intervals that are connected chip 550 in periphery with 550f.Through hole 550a, 550b, 550c, 550d, the spacer structure of 550e and 550f provides the interior connection between the outside linkage section of pin of top lead framework 520 and bottom lead framework 260.
The coil forming around magnetic core 110 as shown in Figure 5A.The inside linkage section 261a of pin 260a is by the inside linkage section 521a of conductive through hole 330a coupling pin 520a.The outside linkage section 523a of pin 520a is by the outside linkage section 263a of through hole 550a coupling adjacent leads 260b.The inside linkage section 261b of pin 260b is by the inside linkage section 521b of conductive through hole 330b coupling pin 520b.The outside linkage section 523b of pin 520b is by the outside linkage section 263c of through hole 550b coupling adjacent leads 260c.The inside linkage section 261c of pin 260c is by the inside linkage section 521c of conductive through hole 330c coupling pin 520c.The outside linkage section 523c of pin 520c is by the outside linkage section 263d of through hole 550c coupling adjacent leads 260d.Route segment 265d (Fig. 2 C) provides coil circuit to connect the inside linkage section 261d of pin 260d and the inside linkage section 521f of pin 520f by conductive through hole 330f.The outside linkage section 523f of pin 520f is by the outside linkage section 263g of through hole 550f coupling adjacent leads 260g.The inside linkage section 261g of pin 260g is by the inside linkage section 521e of conductive through hole 330e coupling pin 520e.The outside linkage section 523e of pin 520e is by the outside linkage section 263f of through hole 550e coupling adjacent leads 260f.The inside linkage section 261f of pin 260f is by the inside linkage section 521d of conductive through hole 330d coupling pin 520d.The outside linkage section 523d of pin 520d is by the outside linkage section 263e of through hole 550d coupling adjacent leads 260e.As in the above-described embodiment, the non-linear hierarchic structure of top and bottom lead framework pin provides aligning and the gap between inside and outside linkage section.
As shown in Figure 6A, wherein the part pin of bottom lead framework 660 dots in the general design 600 of the 6th kind of execution mode of the separated power inductor based on lead frame.Power inductance 600 comprises magnetic core 610, top lead framework 320 and bottom lead framework 660, and its pin connects around magnetic core 610 is inner.Magnetic core 610 comprises six conductive through hole 610a, 610b, and 610c, 610d, 610e and 610f (in Fig. 6 A, being represented by dotted lines), its spacer structure provides the interior connection between the inside linkage section of pin of top lead framework 320 and bottom lead framework 660.
Specifically please refer to Fig. 6 D, bottom lead framework 660 comprises the first group of pin 660a that is arranged at lead frame 660 first sides, 660b and 660c, and be arranged at second group of pin 660e, 660f and 660g of lead frame 660 second sides.Pin 660a, as end pin, also comprises the inside linkage section 661a in the A-A plane that is positioned at bottom lead framework 660.Fig. 6 C is the end view of power inductance 600, has expressed the plane of institute's reference.Bottom legs 660b and 660c comprise respectively inside linkage section 661b and the 661c being arranged on plane A-A.Bottom legs 660b and 660c also comprise respectively outside linkage section 663b and the 663c being positioned on plane B-B, and plane B-B is parallel to plane A-A the side of being located thereon.
The pin 660e of bottom lead framework 660, as end pin, also comprises the outside linkage section 663e being positioned in B-B plane.Bottom legs 660f and 660g comprise respectively inside linkage section 661f and the 661g being arranged on plane A-A.Bottom legs 660f and 660g also comprise respectively outside linkage section 663f and the 663g being positioned on plane B-B.
The coil forming around magnetic core 610 as shown in Figure 6A.The inside linkage section 661a of pin 660a is by the inside linkage section 321a of through hole 610a coupling pin 320a.The outside linkage section 663a of the outside linkage section 323a coupling adjacent leads 660b of pin 320a.The inside linkage section 661b of pin 660b is by the inside linkage section 321b of through hole 610b coupling pin 320b.The outside linkage section 663c of the outside linkage section 323b coupling adjacent leads 660c of pin 320b.The inside linkage section 661c of pin 660c is by the inside linkage section 321c of through hole 610c coupling pin 320c.The outside linkage section 663d of the outside linkage section 323c coupling adjacent leads 660d of pin 320c.Pin 660d comprises route segment 665d (Fig. 6 D), and route segment 665d provides coil circuit to connect the inside linkage section 661d of pin 660d and the inside linkage section 321f of pin 320f by through hole 610f.The outside linkage section 663g of the outside linkage section 323f coupling adjacent leads 660g of pin 320f.The inside linkage section 661g of pin 660g is by the inside linkage section 321e of through hole 610e coupling pin 320e.The outside linkage section 663f of the outside linkage section 323e coupling adjacent leads 660f of pin 320e.The inside linkage section 661f of pin 660f is by the inside linkage section 321d of through hole 610d coupling pin 320d.The outside linkage section 323d of pin 320d connects the outside linkage section 663e of pin 660e.
The general design 700 of the 7th kind of execution mode of the separated power inductor based on lead frame is as shown in Fig. 7 A and 7B, and wherein the part pin of bottom lead framework 260 dots.Power inductance 700 comprises magnetic core 610, top lead framework 320 and bottom lead framework 260.Magnetic core 610 comprises six conductive through hole 610a, 610b, and 610c, 610d, 610e and 610f, its spacer structure provides the interior connection between the inside linkage section of pin of top lead framework 320 and bottom lead framework 260.
The coil forming around magnetic core 610 as shown in Figure 7 A.The inside linkage section 261a of pin 260a is by the inside linkage section 321a of through hole 610a coupling pin 320a.The outside linkage section 263a of the outside linkage section 323a coupling adjacent leads 260b of pin 320a.The inside linkage section 261b of pin 260b is by the inside linkage section 321b of through hole 610b coupling pin 320b.The outside linkage section 263c of the outside linkage section 323b coupling adjacent leads 260c of pin 320b.The inside linkage section 261c of pin 260c is by the inside linkage section 321c of through hole 610c coupling pin 320c.The outside linkage section 263d of the outside linkage section 323c coupling adjacent leads 260d of pin 320c.Pin 260d comprises route segment 265d (Fig. 2 C), and route segment 265d provides coil circuit to connect the inside linkage section 261d of pin 260d and the inside linkage section 321f of pin 320f by through hole 610f.The outside linkage section 263g of the outside linkage section 323f coupling adjacent leads 260g of pin 320f.The inside linkage section 261g of pin 260g is by the inside linkage section 321e of through hole 610e coupling pin 320e.The outside linkage section 263f of the outside linkage section 323e coupling adjacent leads 260f of pin 320e.The inside linkage section 261f of pin 260f is by the inside linkage section 321d of through hole 610d coupling pin 320d.The outside linkage section 263e of the outside linkage section 323d coupling pin 260e of pin 320d.
The general design 800 of the 8th kind of execution mode of the separated power inductor based on lead frame is as shown in Fig. 8 A and 8C, and wherein the part pin of bottom lead framework 260 dots.Power inductance 800 comprises magnetic core 810, top lead framework 520 and bottom lead framework 260.Magnetic core 810 comprises 12 conductive through hole 810a, 810b, 810c, 810d, 810e, 810f, 810g, 810h, 810i, 810j, 810k and 810m (in Fig. 8 A, being represented by dotted lines), its spacer structure provides the interior connection between the inside linkage section of pin of top lead framework 520 and bottom lead framework 260.
The coil forming around magnetic core 810 as shown in Figure 8 A.The inside linkage section 261a of pin 260a is by the inside linkage section 521a of through hole 810a coupling pin 520a.The outside linkage section 523a of pin 520a is by the outside linkage section 263a of through hole 810a coupling adjacent leads 260b.The inside linkage section 261b of pin 260b is by the inside linkage section 521b of through hole 810e coupling pin 520b.The outside linkage section 523b of pin 520b is by the outside linkage section 263c of through hole 810b coupling adjacent leads 260c.The inside linkage section 261c of pin 260c is by the inside linkage section 521c of through hole 810f coupling pin 520c.The outside linkage section 523c of pin 520c is by the outside linkage section 263d of through hole 810c coupling adjacent leads 260d.Pin 260d comprises route segment 265d (Fig. 2 C), and route segment 265d provides coil circuit to connect the inside linkage section 261d of pin 260d and the inside linkage section 521f of pin 520f by through hole 810i.The outside linkage section 263g of pin 260g is by the outside linkage section 523f of through hole 810m coupling adjacent leads 520f.The inside linkage section 521e of pin 520e is by the inside linkage section 261g of through hole 810h coupling pin 260g.The outside linkage section 263f of pin 260f is by the outside linkage section 523e of through hole 810k coupling adjacent leads 520e.The inside linkage section 521d of pin 520d is by the inside linkage section 261f of through hole 810g coupling pin 260f.The outside linkage section 523d of pin 520d is by the outside linkage section 263e of through hole 810j coupling pin 260e.
As shown in Figure 9 A, wherein the part pin of bottom lead framework 960 dots in the general design 900 of the 9th kind of execution mode of the separated power inductor based on lead frame.Power inductance 900 comprises magnetic core 910 (Fig. 9 B), a top lead framework 920 (Fig. 9 D), and bottom lead framework 960 (Fig. 9 C).Top and bottom lead framework 920 and 960 have additional pin (comparing with above-mentioned execution mode), with this, provide the coil turn of extra power inductance 900.The extra number of turn is arranged on the 3rd side of top and bottom lead framework 920 and 960 as shown in the figure.
Top lead framework 920 comprises pin 920a, 920b, 920c, 920d, 920e, 920f, 920g and 920h.Pin 920a, 920b, 920c, 920d, 920e, 920f, 920g and 920h comprise respectively internal plane linkage section 921a, 921b, 921c, 921d, 921e, 921f, 921g and 921h separately.Pin 920a, 920b, 920c, 920d, 920e, 920f, 920g and 920h also comprise respectively plane outside linkage section 923a, 923b, 923c, 923d, 923e, 923f, 923g and 923h separately.
The coil forming around magnetic core 910 as shown in Figure 9 A.The inside linkage section 961a of pin 960a is by the inside linkage section 921a of through hole 910d coupling pin 920a.The outside linkage section 923a of pin 920a is by the outside linkage section 963a of through hole 910a coupling pin 960b.The inside linkage section 961b of pin 960b is by the inside linkage section 921b of through hole 910e coupling pin 920b.The outside linkage section 923b of pin 920b is by the outside linkage section 963c of through hole 910b coupling pin 960c.The inside linkage section 961c of pin 960c is by the inside linkage section 921c of through hole 910f coupling pin 920c.The outside linkage section 923c of pin 920c is by the outside linkage section 963d of through hole 910c coupling pin 960d.The inside linkage section 961d of pin 960d is by the inside linkage section 921d of through hole 910g coupling pin 920d.The outside linkage section 923d of pin 920d is by the outside linkage section 963e of through hole 910h coupling pin 960e.The inside linkage section 961e of pin 960e is by the inside linkage section 921e of through hole 910q coupling pin 920e.The outside linkage section 923e of pin 920e is by the outside linkage section 963f of through hole 910i coupling pin 960f.The inside linkage section 961f of pin 960f is by the inside linkage section 921f of through hole 910p coupling pin 920f.The outside linkage section 923f of pin 920f is by the outside linkage section 963g of through hole 910j coupling pin 960g.The inside linkage section 961g of pin 960g is by the inside linkage section 921b of through hole 910o coupling pin 920b.The outside linkage section 923g of pin 920g is by the outside linkage section 963h of through hole 910k coupling pin 960h.The inside linkage section 961h of pin 960h is by the inside linkage section 921h of through hole 910n coupling pin 920h.The outside linkage section 923h of pin 920h is by through hole 910m coupling pin 960i.
Separated power inductor 900 comprises end pin 960a and 960i, is connected to form the coil through magnetic core 910 between top and bottom nead frame 920 and 960 pin.
Separated power inductor based on lead frame of the present invention provides the power inductance of a compactness and maximizes the inductance coefficent in unit area.Use has the high-efficiency enclosed magnet ring of single core structure to reach effective magnetic coupling.Power inductance of the present invention also provides a kind of power inductance that little physical size is combined with minimum turn number, and it has less area coverage and thinner profile.In addition, power inductance of the present invention can be produced by the low-cost high yield of the existing semiconductor packaging of application ground simply.
Can see that above-mentioned execution mode can make multiple change within the scope of the present invention.In addition, the many aspects of a special execution mode are in the situation that relate to the other side of present embodiment, comprise can be patented content.Have, the many aspects of different execution modes can combine again.Accordingly, scope of the present invention should be limited by claim and content of equal value thereof.
Claims (6)
1. the separated power inductor based on lead frame, comprising:
One has the top lead framework of a plurality of tops pin, and each top pin has the first linkage section that is positioned at its first end and the second linkage section that is positioned at its second end;
One has the bottom lead framework of a plurality of bottom legs, and each bottom legs has the first linkage section that is positioned at its first end and the second linkage section that is positioned at its second end;
One magnetic core, have one and run through the window that is opened in intermediate position, described magnetic core is arranged between top lead framework and bottom lead framework, with this, top lead framework is aimed to respective base lead frame with cross structure, wherein, each of a plurality of bottom legs the first linkage section is the first linkage section of the corresponding top pin of corresponding coupling one by one, and each of a plurality of bottom legs the second linkage section is the second linkage section of the corresponding top pin of corresponding coupling one by one, with this, forms the coil around magnetic core;
One is arranged on the syndeton in window, and this syndeton comprises a plurality of conductive through holes that run through formation, and conductive through hole is spaced apart so that interior connection the between a plurality of tops pin and a plurality of bottom legs to be provided, thereby forms the coil around magnetic core.
2. the separated power inductor based on lead frame as claimed in claim 1, is characterized in that: wherein bottom lead framework also comprises the first end pin with the first linkage section and the second end pin with the second linkage section.
3. the separated power inductor based on lead frame as claimed in claim 2, it is characterized in that: wherein each top pin of top lead framework has hierarchic structure, each first linkage section of each top pin is arranged at the staggered position of second linkage section corresponding to same top pin.
4. the separated power inductor based on lead frame as claimed in claim 2, it is characterized in that: wherein each top pin is crooked along a part for magnetic core, it is parallel with the top plan of top lead framework that its first linkage section and the second linkage section are arranged at, and be positioned in the plane of top plan below of top lead framework; Each bottom legs is plane.
5. the separated power inductor based on lead frame as claimed in claim 2, it is characterized in that: wherein each top pin is crooked along a part for magnetic core, its second linkage section is arranged at and the first linkage section place plane parallel, and is positioned in the plane of top pin the first plane below, linkage section place; Each bottom legs is plane.
6. the separated power inductor based on lead frame as claimed in claim 5, is characterized in that: the both sides of window are offered and be raised in to described conductive through hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/011,489 | 2008-01-25 | ||
| US12/011,489 US7884696B2 (en) | 2007-11-23 | 2008-01-25 | Lead frame-based discrete power inductor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910003340 Division CN101552093B (en) | 2008-01-25 | 2009-01-15 | Separated power inductor based on a lead frame |
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| Publication Number | Publication Date |
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| CN102360730A CN102360730A (en) | 2012-02-22 |
| CN102360730B true CN102360730B (en) | 2014-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110356115.0A Active CN102360729B (en) | 2008-01-25 | 2009-01-15 | Lead frame-based discrete power inductor |
| CN201110356096.1A Active CN102360728B (en) | 2008-01-25 | 2009-01-15 | Lead frame-based discrete power inductor |
| CN201110356562.6A Active CN102360730B (en) | 2008-01-25 | 2009-01-15 | Lead frame-based discrete power inductor |
| CN 200910003340 Active CN101552093B (en) | 2008-01-25 | 2009-01-15 | Separated power inductor based on a lead frame |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110356115.0A Active CN102360729B (en) | 2008-01-25 | 2009-01-15 | Lead frame-based discrete power inductor |
| CN201110356096.1A Active CN102360728B (en) | 2008-01-25 | 2009-01-15 | Lead frame-based discrete power inductor |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910003340 Active CN101552093B (en) | 2008-01-25 | 2009-01-15 | Separated power inductor based on a lead frame |
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| TW (1) | TWI419180B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8976561B2 (en) * | 2012-11-14 | 2015-03-10 | Power Integrations, Inc. | Switch mode power converters using magnetically coupled galvanically isolated lead frame communication |
| US8818296B2 (en) | 2012-11-14 | 2014-08-26 | Power Integrations, Inc. | Noise cancellation for a magnetically coupled communication link utilizing a lead frame |
| US9035435B2 (en) | 2012-11-14 | 2015-05-19 | Power Integrations, Inc. | Magnetically coupled galvanically isolated communication using lead frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614554A (en) * | 1968-10-24 | 1971-10-19 | Texas Instruments Inc | Miniaturized thin film inductors for use in integrated circuits |
| US4543553A (en) * | 1983-05-18 | 1985-09-24 | Murata Manufacturing Co., Ltd. | Chip-type inductor |
| US5032815A (en) * | 1988-12-23 | 1991-07-16 | Murata Manufacturing Co., Ltd. | Lamination type inductor |
| CN1610112A (en) * | 2003-10-24 | 2005-04-27 | 罗姆股份有限公司 | Semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05198440A (en) * | 1992-01-20 | 1993-08-06 | Amorphous Denshi Device Kenkyusho:Kk | Coil for thin-film magnetic element and wire wound type thin film transformer |
| TWI240286B (en) * | 2003-09-08 | 2005-09-21 | Chi-Shian Lin | Miniaturized power inductor and the miniaturization method |
| CN2821815Y (en) * | 2005-05-16 | 2006-09-27 | 珠海东金精密电子材料有限公司 | Insert type power inductance |
-
2009
- 2009-01-15 CN CN201110356115.0A patent/CN102360729B/en active Active
- 2009-01-15 CN CN201110356096.1A patent/CN102360728B/en active Active
- 2009-01-15 CN CN201110356562.6A patent/CN102360730B/en active Active
- 2009-01-15 CN CN 200910003340 patent/CN101552093B/en active Active
- 2009-01-16 TW TW98101484A patent/TWI419180B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614554A (en) * | 1968-10-24 | 1971-10-19 | Texas Instruments Inc | Miniaturized thin film inductors for use in integrated circuits |
| US4543553A (en) * | 1983-05-18 | 1985-09-24 | Murata Manufacturing Co., Ltd. | Chip-type inductor |
| US5032815A (en) * | 1988-12-23 | 1991-07-16 | Murata Manufacturing Co., Ltd. | Lamination type inductor |
| CN1610112A (en) * | 2003-10-24 | 2005-04-27 | 罗姆股份有限公司 | Semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平5-198440A 1993.08.06 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101552093A (en) | 2009-10-07 |
| CN102360729B (en) | 2014-03-26 |
| TW200933661A (en) | 2009-08-01 |
| CN102360729A (en) | 2012-02-22 |
| CN102360730A (en) | 2012-02-22 |
| CN101552093B (en) | 2012-01-04 |
| TWI419180B (en) | 2013-12-11 |
| CN102360728B (en) | 2014-03-26 |
| CN102360728A (en) | 2012-02-22 |
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