CN102353467B - System and method for verifying detection accuracy of internal core temperature of chip - Google Patents
System and method for verifying detection accuracy of internal core temperature of chip Download PDFInfo
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- CN102353467B CN102353467B CN201110153878.5A CN201110153878A CN102353467B CN 102353467 B CN102353467 B CN 102353467B CN 201110153878 A CN201110153878 A CN 201110153878A CN 102353467 B CN102353467 B CN 102353467B
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Abstract
The invention relates to a data communication equipment technology, which solves the problem of larger deviations between the internal core temperature which is calculated by a method for verifying the detection accuracy of the internal core temperature of the conventional chip and an actual temperature, and provides a system and a method for verifying the detection accuracy of the internal core temperature of a chip. According to the technical scheme, the system for verifying the detection accuracy of the internal core temperature of the chip consists of a measured chip, an I2C bus, an analog-to-digital converter and a data acquisition device, wherein a PN node inside the measured chip is connected with the analog-to-digital converter; and the data acquisition device is connected with the analog-to-digital converter through the I2C bus and a power wire. The invention has the advantages that: the accuracy is improved, and the system and the method are suitable for verifying the detection accuracy of the internal core temperature of the chip of data communication equipment.
Description
Technical field
The present invention relates to data communications equipment technology, particularly the verification technique of data communications equipment chip core temperature detection accuracy.
Background technology
The inner important chip of at present a lot of communication facilitiess (comprising computing machine), as: processor chips, exchanges data chip etc. all have kernel temperature detecting function, in the performance history of product, need the interior nuclear temperature of these important chip that test subscriber's operation interface shows whether accurate.If extraneous factor or chip cause chip temperature to raise extremely in addition, we need to set a temperature protection value so, and when temperature a bit just disconnects the power supply of chip higher than certain, prerequisite is exactly that the temperature value of this test must be accurately.The acquisition scheme of existing chip core temperature, the general temperature measuring device adopting can only test chip surface temperature, can not test interior nuclear temperature, need to be by the surface temperature of test chip, and then calculate chip core temperature according to the thermal resistance of the heating power of chip and chip.Therefore, the interior nuclear temperature of reckoning and the deviation of actual temperature are larger.
Summary of the invention
Object of the present invention is exactly the larger shortcoming of deviation that overcomes interior nuclear temperature that the verification method of current chip kernel temperature detection accuracy extrapolates and actual temperature, and verification system and the method for a kind of chip core temperature detection accuracy is provided.
The present invention solves its technical matters, the technical scheme adopting is, the verification system of chip core temperature detection accuracy, comprise chip under test, A/D converter and data acquisition unit, the inner PN junction of described chip under test (position of diode P type and n type material combination) is connected with A/D converter, and described data acquisition unit is connected with A/D converter by I 2C bus;
Described data acquisition unit for the temperature data that reads A/D converter output by I2C bus to offer tester, and for powering to A/D converter;
Described A/D converter is used to the inside PN junction of chip under test that current source is provided, and after the electric current that detects the inner PN junction transmission of chip under test, is converted to digital signal and is transferred to data acquisition unit.
Concrete, described data acquisition unit is a single-chip microcomputer, and the temperature data collecting is shown by LED digital display tube.
Further, described chip under test is processor chips or exchanges data chip.
The verification method of chip core temperature detection accuracy, is characterized in that, comprises the following steps:
A. chip under test does not power on, and by A/D converter, is that the inner PN junction of chip under test is powered;
B. the size of current of the inner PN junction of chip under test is followed the inner PN junction temperature variation of chip under test;
C. A/D converter will be converted to digital signal after the inner PN junction electric current of detected chip under test;
D, chip under test is placed in to the temperature test chamber of controlled temperature, serviceability temperature tester is confirmed chip under test surface temperature, and data acquisition unit reads the temperature data of A/D converter transmission simultaneously;
E. the chip under test surface temperature contrast that the temperature data data acquisition unit recording under same temperature in temperature test chamber being read and temperature measuring device are confirmed, obtains accuracy.
Concrete, described steps d comprises the following steps:
D1. chip under test is placed in to the temperature test chamber of controlled temperature, change successively the temperature value of temperature test chamber, temperature changes each time equal serviceability temperature tester and confirms chip under test surface temperature, and data acquisition unit reads the temperature data of A/D converter transmission simultaneously.
Further, described temperature value range of choice is 0～125 ℃.
Concrete, described temperature value is chosen as 0 ℃, 10 ℃, 20 ℃, 30 ℃, 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃, 90 ℃, 100 ℃, 110 ℃, 120 ℃, 125 ℃.
The invention has the beneficial effects as follows, by verification system and the method for the accuracy of said chip kernel temperature detection, because it adopts data acquisition unit, it is A/D converter power supply, and the inner PN junction of chip under test is powered by A/D converter, chip under test does not need to power on, chip under test does not power on, and it does not generate heat, for athermic object in the situation that equalized temperature environment temperature is constant, interior of articles is consistent with external temperature, therefore in chip under test, nuclear temperature is identical with surface temperature, now serviceability temperature tester can obtain the interior nuclear temperature of chip under test accurately, avoided the larger problem of kernel temperature deviation of calculating, improved accuracy.
Accompanying drawing explanation
Fig. 1 is the verification system example structure block diagram of chip core temperature detection of the present invention accuracy.
Embodiment
Below in conjunction with embodiment and accompanying drawing, describe technical scheme of the present invention in detail.
The structured flowchart of the verification system embodiment of chip core temperature detection of the present invention accuracy is referring to Fig. 1.The verification system of the chip core temperature detection accuracy of the embodiment of the present invention is connected with A/D converter by the inner PN junction of chip under test, data acquisition unit is connected with A/D converter by I 2C bus, data acquisition unit connects to form by power lead and A/D converter, wherein, data acquisition unit is for reading the temperature data of A/D converter output by I2C bus, and power to A/D converter by power lead, after the electric current of A/D converter for detection of inner PN junction transmission, be converted to digital data transmission to data acquisition unit, and provide current source for the inside PN junction of chip under test.In the verification method of chip core temperature detection of the present invention accuracy, first chip under test does not power on, by data acquisition unit, by power lead, be that A/D converter is powered, by A/D converter, provide current source for chip under test inside PN junction again, size of current is followed the inner PN junction temperature variation of chip under test, then chip under test is placed in to the temperature test chamber of controlled temperature, serviceability temperature tester is confirmed chip under test surface temperature, data acquisition unit reads the temperature data of A/D converter transmission simultaneously, the chip under test surface temperature contrast that the temperature data finally data acquisition unit recording under same temperature in temperature test chamber being read and temperature measuring device are confirmed, obtain accuracy.
Embodiment
The verification system structured flowchart of the chip core temperature detection accuracy of the present embodiment is referring to Fig. 1.The verification system of the chip core temperature detection accuracy of the present embodiment is by being connected with A/D converter by the inner PN junction of chip under test, data acquisition unit is connected with A/D converter by I 2C bus, data acquisition unit connects to form by power lead and A/D converter, wherein, after the electric current of A/D converter for detection of inner PN junction transmission, be converted to digital data transmission to data acquisition unit, and be the inside PN junction power supply of chip under test, data acquisition unit is for reading the temperature data of A/D converter output by I2C bus, and power to A/D converter by power lead, data acquisition unit consists of single-chip microcomputer, and provide test data is shown by LED digital display tube, facilitate tester directly to observe and reading out data, the chip under test here can have for processor chips or exchanges data chip etc. the chip of kernel temperature detection.
During test, first chip under test does not power on, by data acquisition unit, by power lead, be that A/D converter is powered, by A/D converter, provide current source for chip under test inside PN junction again, size of current is followed the inner PN junction temperature variation of chip under test, then chip under test is placed in to the temperature test chamber of controlled temperature, change successively the temperature value of temperature test chamber, temperature changes each time equal serviceability temperature tester and confirms chip under test surface temperature, data acquisition unit reads the temperature data of A/D converter transmission simultaneously, the chip under test surface temperature contrast that the temperature data finally data acquisition unit recording under same temperature in temperature test chamber being read and temperature measuring device are confirmed, obtain accuracy.
Due to normally 0～70 ℃ of chip application environment temperature for business, normally 125 ℃ of the high workload junction temperatures of chip, storing temperature is the highest can arrive 150 ℃, therefore by temperature requirement above, can show that common chip normal working temperature is at 0～125 ℃.And due to the wider range of temperature sensing circuit test, need to carry out accuracy validation to whole range sampling temperature spot, be to verify 0～125 ℃ of scope, therefore the temperature value range of choice in temperature test chamber is roughly 0～125 ℃, take 10 ℃ carry out sample testing as example as stepping gradient, be that the temperature value in temperature test chamber is chosen as to 0 ℃ successively, 10 ℃, 20 ℃, 30 ℃, 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃, 90 ℃, 100 ℃, 110 ℃, 120 ℃, 125 ℃, serviceability temperature tester is confirmed chip under test surface temperature respectively, utilize data acquisition unit to read the temperature data of A/D converter transmission simultaneously, and contrast, obtain accuracy.And during test, need to confirm that all devices of tested device interior can bear the temperature within the scope of selected temperature value, otherwise carry out respective handling (for example: plastics connector cannot bear high temperature, before test, it being taken off).
Claims (8)
1. the verification system of chip core temperature detection accuracy, it is characterized in that, comprise chip under test, temperature test chamber, temperature measuring device, I2C bus and A/D converter and data acquisition unit, the inner PN junction of described chip under test is connected with A/D converter, described data acquisition unit is connected with A/D converter by I2C bus and power lead, and chip under test is placed in temperature test chamber;
Described data acquisition unit for the temperature data that reads A/D converter output by I2C bus to offer tester, and for powering to A/D converter;
Described A/D converter is used to the inside PN junction of chip under test that current source is provided, and after the electric current of inside PN junction transmission that chip under test detected, is converted to digital signal and is transferred to data acquisition unit;
Described temperature test chamber is for changing successively its temperature value;
Described temperature measuring device is used for confirming chip under test surface temperature.
2. the verification system of chip core temperature detection accuracy as claimed in claim 1, is characterized in that, described data acquisition unit is a single-chip microcomputer, and the temperature data collecting is shown by LED digital display tube.
3. the verification system of chip core temperature detection accuracy as claimed in claim 1 or 2, is characterized in that, described chip under test is processor chips or exchanges data chip.
4. the verification method of chip core temperature detection accuracy, is characterized in that, comprises the following steps:
A., the verification system of chip core temperature detection accuracy is installed, comprise chip under test, I2C bus and A/D converter and data acquisition unit, the inner PN junction of described chip under test is connected with A/D converter, described data acquisition unit is connected with A/D converter by I2C bus and power lead, test starts, chip under test does not power on, and by data acquisition unit, by power lead, is that A/D converter is powered, and A/D converter is the inner PN junction power supply of chip under test;
B. the size of current of the inner PN junction of chip under test is followed the inner PN junction temperature variation of chip under test;
C. A/D converter will be converted to digital signal after the inner PN junction electric current of detected chip under test;
D. chip under test is placed in to the temperature test chamber of controlled temperature, serviceability temperature tester is confirmed chip under test surface temperature, and data acquisition unit reads the temperature data of A/D converter transmission simultaneously;
E. the chip under test surface temperature contrast that the temperature data data acquisition unit recording under same temperature in temperature test chamber being read and temperature measuring device are confirmed, obtains accuracy.
5. the verification method of chip core temperature detection accuracy as claimed in claim 4, is characterized in that, described steps d comprises the following steps:
D1. chip under test is placed in to the temperature test chamber of controlled temperature, change successively the temperature value of temperature test chamber, temperature changes each time equal serviceability temperature tester and confirms chip under test surface temperature, and data acquisition unit reads the temperature data of A/D converter transmission simultaneously.
6. the verification method of chip core temperature detection accuracy as described in claim 4 or 5, is characterized in that, data acquisition unit reads the temperature data of A/D converter transmission, and shows by pilot lamp, for tester, checks.
7. the verification method of chip core temperature detection accuracy as claimed in claim 5, is characterized in that, described temperature value range of choice is 0～125 ℃.
8. the verification method of chip core temperature detection accuracy as claimed in claim 5, it is characterized in that, described temperature value is chosen as 0 ℃, 10 ℃, 20 ℃, 30 ℃, 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃, 90 ℃, 100 ℃, 110 ℃, 120 ℃, 125 ℃.
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| CN108461486B (en) * | 2017-12-14 | 2020-02-21 | 天津津航计算技术研究所 | SiP chip with temperature control function |
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
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| CN85200004U (en) * | 1985-04-01 | 1985-11-10 | 天津大学 | Digital thermometer sensor with p-n junction |
| FR2845767B1 (en) * | 2002-10-09 | 2005-12-09 | St Microelectronics Sa | INTEGRATED DIGITAL TEMPERATURE SENSOR |
| CN100389308C (en) * | 2004-05-26 | 2008-05-21 | 鸿富锦精密工业（深圳）有限公司 | Chip temperature measurement device and method |
| CN2869815Y (en) * | 2005-09-20 | 2007-02-14 | 深圳兆日技术有限公司 | Circuit for detecting chip temperature in safety chip |
| CN102082107B (en) * | 2009-12-01 | 2013-11-27 | 中芯国际集成电路制造(上海)有限公司 | Method for measuring temperature of chip |
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