CN102207785A - Touch control panel - Google Patents
Touch control panel Download PDFInfo
- Publication number
- CN102207785A CN102207785A CN2010101421141A CN201010142114A CN102207785A CN 102207785 A CN102207785 A CN 102207785A CN 2010101421141 A CN2010101421141 A CN 2010101421141A CN 201010142114 A CN201010142114 A CN 201010142114A CN 102207785 A CN102207785 A CN 102207785A
- Authority
- CN
- China
- Prior art keywords
- touch
- contact panel
- light shield
- disposed
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Position Input By Displaying (AREA)
Abstract
The invention relates to a touch control panel which is provided with a transparent area and a peripheral area surrounding the transparent area. The touch control panel comprises a transparent cover plate, a touch control element, a light shield layer, a conductor layer and a touch control chip, wherein the transparent cover plate is provided with a touch surface and an element mounting surface which are opposite each other; the touch control element is arranged on the element mounting surface and at least located in the transparent area; the light shield layer is arranged on the transparent cover plate and located in the peripheral area; the conductor layer is arranged on the element mounting surface and located in the peripheral area and electrically connected with the touch control element; and the touch control chip is arranged on the conductor layer by using a bonding process of a chip on glass.
Description
Technical field
The present invention relates to a kind of contact panel, particularly a kind of contact panel with light shield layer.
Background technology
Known touch-control display panel comprises that a display panel, is disposed at contact panel and on the display panel and is disposed at transparent cover plate on the contact panel, and wherein transparent cover plate is in order to protect contact panel and the display panel under it.The user operates signal that touch-control display panel produces will be passed to touch-control wafer on the bendable printed circuit board (PCB), and the touch-control wafer can be analyzed the signal that receives and judge the position that the user touches touch-control display panel.
In order to transmit these signals, the periphery of contact panel is provided with the cabling district that layout has many leads.But, when contact panel combines with display panel, for outside the cabling district that avoids contact panel is revealed in, can add one deck cover plate usually, the position at place, corresponding cabling district often disposes black ink layer to cover these leads on its cover plate.Therefore, the layer group structure that how to reduce contact panel promptly becomes exploitation purpose of the present invention to reduce cost of manufacture.
Summary of the invention
The invention provides a kind of contact panel, it is disposed at the touch-control wafer can firmly be connected touch-control wafer and conductor layer with conductive particle between the lead.
The invention provides a kind of contact panel, the quality of its light shield layer is comparatively hard and be difficult for subsiding.
The present invention proposes a kind of contact panel and has a photic zone and a surrounding zone that centers on photic zone, and contact panel comprises a transparent cover plate, a touch control component, a light shield layer, a conductor layer and a touch-control wafer.Transparent cover plate has a relative touching face and an element installed surface (device mounting surface).Touch control component is disposed on the element installed surface, and is arranged in photic zone at least.Light shield layer is disposed on the transparent cover plate, and is arranged in the surrounding zone.Conductor layer is disposed on the element installed surface, and is arranged in the surrounding zone, and electrically connects touch control component.The touch-control wafer relies on the glass flip chip connection process, and (chip on glass COG) is disposed on the conductor layer.
Described contact panel, wherein, configuration one anisotropy conducting film between this conductor layer and this touch-control wafer.
Described contact panel, wherein, this anisotropy conducting film comprises a plurality of conductive particles, and the diameter of these a plurality of conductive particles is greater than the thickness sum of thickness and this conductor layer of this light shield layer.
Described contact panel, wherein, the thickness of this light shield layer is 0.5 μ m to 6 μ m.
Described contact panel, wherein, this light shield layer is disposed on this element installed surface, and is sandwiched between this conductor layer and this transparent cover plate.
Described contact panel, wherein, this light shield layer is disposed on this touching face.
Described contact panel, wherein, this light shield layer is the made decorative layer of class diamond carbon, black resin or white resin.
Described contact panel, wherein, this touch control component comprises:
A plurality of first touch-control electrodes are disposed on this element installed surface along a first direction; And
A plurality of second touch-control electrodes are disposed on this element installed surface along a second direction, and interconnected with these a plurality of first touch-control electrodes, and wherein this first direction is vertical with this second direction.
Described contact panel, wherein, these a plurality of first touch-control electrodes and this a plurality of second touch-control electrodes more comprise a plurality of transparent connection pads that are overlying on this conductor layer.
Described contact panel, wherein, this touch-control wafer more comprises a plurality of contacts, is electrically connected at this a plurality of transparent connection pads.
Based on above-mentioned, the present invention is the bond strength that improves touch-control wafer and conductor layer in the glass flip chip connection process by thickness that reduces light shield layer or the mode that increases the hardness of light shield layer.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
The contact panel that Figure 1A illustrates one embodiment of the invention is disposed at the sectional view on the display panel;
Figure 1B illustrates the partial top view of photic zone of the contact panel of Figure 1A;
Fig. 2 A illustrates a kind of sectional view that changes structure of the contact panel of Figure 1A;
Fig. 2 B illustrates the partial top view of photic zone of the contact panel of Fig. 2 A;
Fig. 2 C is a kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X ';
Fig. 2 D is the another kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X ';
The contact panel that Fig. 3 illustrates one embodiment of the invention is disposed at the sectional view on the display panel;
The contact panel that Fig. 4 A illustrates one embodiment of the invention is disposed at the sectional view on the display panel;
Fig. 4 B illustrates the vertical view of the contact panel of Fig. 4 A;
Fig. 5 illustrates a kind of vertical view that changes structure of the contact panel of Fig. 4 B.
100,200, the 300-contact panel description of reference numerals:; 110,310-transparent cover plate; 112,312-touching face; 114,314-element installed surface; 120,320-touch control component; 122, the 322-first touch-control electrode; 124,324-insulation course; 124a, 324a-surface; 126, the 326-second touch-control electrode; 130,330-light shield layer; 140,360-conductor layer; 142: transparent connection pad; 150,340-touch-control wafer; 152: contact; The 160-conductive particle; 170, the bendable printed circuit board (PCB) of 350-; 180: insulation course; 190: protective seam; 192: opening; The A1-photic zone; The A2-surrounding zone; B1, B2: rhombus pattern; C1, C2: connecting line; The D-diameter; The G-glue-line; I-anisotropy conducting film; The S-display panel; T, T1, T2-thickness; The V1-first direction; The V2-second direction.
Embodiment
The contact panel that Figure 1A illustrates one embodiment of the invention is disposed at the sectional view on the display panel, and Figure 1B illustrates the partial top view of photic zone of the contact panel of Figure 1A.Fig. 2 A illustrates a kind of sectional view that changes structure of the contact panel of Figure 1A, Fig. 2 B illustrates the partial top view of photic zone of the contact panel of Fig. 2 A, Fig. 2 C is a kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X ', and Fig. 2 D is the another kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X '.
Please be simultaneously with reference to Figure 1A and Figure 1B, the contact panel 100 of present embodiment has a photic zone A1 and a surrounding zone A2 who centers on photic zone A1, and wherein surrounding zone A2 for example is a lighttight zone.In contact panel 100, transparent element (for example transparent touch-control electrode) is configurable in photic zone A1, and opaque element (for example conductor layers such as touch-control wafer and transfer wire) is configurable in the A2 of surrounding zone, influences the visual effect of user when watching contact panel 100 to avoid these opaque elements.
Contact panel 100 comprises a transparent cover plate 110, a touch control component 120, a light shield layer 130, a conductor layer 140 and a touch-control wafer 150.Transparent cover plate 110 has a relative touching face 112 and an element installed surface (device mounting surface) 114, wherein touches face 112 and is suitable for directly being touched by the user.Light shield layer 130 is disposed on the element installed surface 114, and is arranged in surrounding zone A2.In the present embodiment, the thickness T 1 of light shield layer 130 is about 0.5 μ m to 6 μ m.The material of light shield layer 130 comprises lighttight insulating material, and for example resin, and resin can be the resin or the white resin of black.Conductor layer 140 is disposed on the light shield layer 130, and the material of conductor layer 140 for example is metal (for example chromium, aluminium, copper, molybdenum, molybdenum aluminium alloy, titanium, titanium-aluminium alloy, silver, silver palladium alloy or aforesaid combination).
Touch control component 120 is disposed on the element installed surface 114, and is arranged in photic zone A1 at least, and touch control component 120 is electrically connected to conductor layer 140.Specifically, in the present embodiment, touch control component 120 comprises a plurality of first touch-control electrodes 122, an insulation course 124 and a plurality of second touch-control electrode 126.The first touch-control electrode 122 is disposed on the element installed surface 114 along a first direction V1.Insulation course 124 is disposed on the element installed surface 114 and covers the first touch-control electrode 122.The second touch-control electrode 126 is disposed on the surperficial 124a away from the first touch-control electrode 122 of insulation course 124 along a second direction V2, and first direction V1 is perpendicular to one another the first touch-control electrode 122 and the overlapping of the second touch-control electrode, 126 parts with second direction V2.The first touch-control electrode 122 and the second touch-control electrode 126 for example are strip shaped electric poles.In the present embodiment, conductor layer 140 can have many leads (not illustrating), and respectively first touch-control electrode 122 is electrically connected to corresponding lead, and each second touch-control electrode 126 is electrically connected to corresponding lead.
The material of the first touch-control electrode 122 and the second touch-control electrode 126 comprises transparent conductive material, for example the combination of tin indium oxide (ITO), cadmium tin (CTO), zinc oxide aluminum (AZO), indium zinc oxide (IZO), zinc paste (ZnO), tin oxide (SnO) or previous materials.
It should be noted that present embodiment is that touch control component 120 is formed directly on the transparent cover plate 110, and needn't be additionally at touch control component 120 and 110 transparency carriers that use other of transparent cover plate, so can reduce the cumulative volume and the cost of manufacture of contact panel 100.In other embodiments, the first touch-control electrode 122a and the second touch-control electrode 126a also can be disposed at respectively on two opposing substrates.
Touch-control wafer 150 relies on glass flip chip connection process (chip on glass, COG) directly be engaged on the conductor layer 140, wherein dispose an anisotropy conducting film I between touch-control wafer 150 and the conductor layer 140, anisotropy conducting film I has a glue-line G and is scattered in a plurality of conductive particles 160 among the glue-line G, and touch-control wafer 150 can rely on and sees through the conductive particle 160 among the anisotropy conducting film I and be electrically connected to conductor layer 140.
It should be noted that touch-control wafer 150 is disposed in the process of conductor layer 140, light shield layer 130 can subside because of the pressure in the processing procedure produces.In case the degree of depth of subsiding is excessive, conductive particle 160 can't positively be connected between conductor layer 140 and the touch-control wafer 150.Thus, conductor layer 140 has the not good problem of reliability with the situation that engages of touch-control wafer 150.Present embodiment relies on the thickness T 1 of attenuate light shield layer 130, and the diameter D of conductive particle 160 is greater than the thickness T 1 of light shield layer 130 and thickness T 2 sums of conductor layer 140.Therefore, the diameter D of conductive particle 160 is enough big and be enough to fill up subsiding that light shield layer 130 taken place in the process that engages touch-control wafer 150.That is to say that present embodiment can guarantee that conductive particle 160 can connect touch-control wafer 150 and conductor layer 140 simultaneously in the process that engages touch-control wafer 150, and then can promote process rate, and reduces cost of manufacture.
In addition, in the present embodiment, contact panel 100 also can comprise a bendable printed circuit board (PCB) 170, and it connects the edge of transparent cover plate 110, and electrically connects conductor layer 140.In addition, in the present embodiment, contact panel 100 is configurable on a display panel S (for example display panels, electric slurry display panel, Electronic Paper display panel or sharp motor light emitting display panel etc. is arranged), and display panel S optionally is electrically connected to touch-control wafer 150.When touch-control wafer 150 calculated the user and touches the position of transparent cover plate 110, touch-control wafer 150 can transmit one and drive signal to display panel S, showed corresponding picture to drive display panel S.
In other embodiments, please refer to Fig. 2 A and Fig. 2 B, touch control component 120a comprises a plurality of first touch-control electrode 122a and a plurality of second touch-control electrode 126a.The first touch-control electrode 122a is disposed on the element installed surface 114 along a first direction V1, and the second touch-control electrode 126a is disposed on the element installed surface 114 along a second direction V2, and wherein the second touch-control electrode 126a and the first touch-control electrode 122a are interconnected.First direction V1 is vertical with second direction V2.Specifically, the first touch-control electrode 122a and the second touch-control electrode 126a are all the electrode tandem of being made up of a plurality of rhombus pattern B1, B2, and wherein rhombus pattern B1, B2 are coplanar configuration, and rely on many connecting line C1, C2 to connect respectively.
In above embodiment, conductor layer 140 is formed at before argyle design B1, the B2.Conductor layer 140 generally is made with metal material, and argyle design B1, B2 generally are made by the electrically conducting transparent material.Therefore, if guarantee that the continuity of conductor layer 140, the patterning process of argyle design B1, B2 must use relatively mild etching solution to avoid the patterning process injury conductor layer 140 of argyle design B1, B2.So the transparency conducting layer that constitutes argyle design B1, B2 need be made with low temperature process.Yet the transparency conducting layer of low temperature process made is relatively poor relatively and be unfavorable for the application of contact panel 100 on light peneration.Therefore, can be shown in Fig. 2 C and Fig. 2 D for the quality conductor layer 140 that improves element with the configuration mode of argyle design B1, B2.
Fig. 2 C is a kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X '.Please refer to Fig. 2 C, dispose light shield layer 130, conductor layer 140, the first touch-control electrode 122a and the second touch-control electrode 126a on the transparent cover plate 110, wherein the first touch-control electrode 122a is connected in series with connecting line C1 by argyle design B1 and forms, and the second touch-control electrode 126a only connecting line C2 illustrated out.In addition, be electrically insulated in order to make connecting line C1 and connecting line C2, insulation course 180 more is disposed between connecting line C1 and the connecting line C2.What deserves to be mentioned is that the conductor layer 140 and the connecting line C1 of present embodiment are made by metal material, and be positioned at terminal argyle design B1 and extend to conductor layer 140 positions to form transparent connection pad 142.That is to say that the element that conductor layer 140 and connecting line C1 intactly are insulated layer 180 and electrically conducting transparent material made covers.In addition, in order to protect touch control component, be coated with protective seam 190 on the transparent cover plate 110; and protective seam 190 is provided with a plurality of openings 192; expose a plurality of transparent connection pads 142,, and electrically connect with a plurality of contacts (bump) 152 of wafer 150 so that transparent connection pad 142 sees through anisotropy conducting film I.
Particularly, after light shield layer 130 is formed at transparent cover plate 110, will continues and be made a patterned metal layer to constitute connecting line C1 and conductor layer 140.Then, form the transparency conducting layer of insulation layer patterned 180 and patterning in regular turn, wherein the transparency conducting layer of patterning comprises argyle design B1, B2, connecting line C2 and transparent connection pad 142.Then, the opening 192 that forms protective seam 190 and expose transparent connection pad 142 is roughly to finish contact panel.In the present embodiment, in the patterning process of transparency conducting layer, conductor layer 140 can not be exposed and be not easy etched liquid damage.So present embodiment can adopt high temperature process to make transparency conducting layer, and makes conductor layer 140 have good quality and reliability, makes argyle design B1, B2 also have good light penetration character simultaneously.
Fig. 2 D is the another kind of partial cutaway schematic that the contact panel of Fig. 2 B illustrates along hatching line X-X '.Please refer to Fig. 2 D, Fig. 2 C mainly is with the difference of Fig. 2 D: transparent connection pad 144 directly is not connected the argyle design B1 that is positioned at end, and the opening 192 of protective seam 190 entirely comes out transparent connection pad 144 haply.What deserves to be mentioned is that conductor layer 140 all fully is insulated layer 180 and patterning in Fig. 2 C and Fig. 2 D transparency conducting layer covers.So conductor layer 140 is difficult for being subjected to the etching solution infringement in the patterning process of transparency conducting layer, and can adopt high temperature process to make transparency conducting layer to improve the light peneration matter of transparency conducting layer.
Contact panel 100 of the present invention need to be not limited to fit with display panel S and constitute touch-control display panel.In other embodiments, also can dispose a transparency carrier or a protective seam (not illustrating) on element installed surface 114, wherein touch control component 120 is between transparency carrier that does not illustrate and transparent cover plate 110.That is to say that the contact panel 100 of present embodiment can use separately or be assembled into a touch-control display panel with other display device (for example display panel S).
By as can be known aforementioned, for solving the not good problem of connectivity between known touch-control wafer and conductor layer, the embodiment of Figure 1A reduces the influence of light shield layer 130 for the process that engages touch-control wafer 150 by the thickness that reduces light shield layer 130, and then conductor layer 140 and touch-control wafer 150 can positively be electrically connected, certainly, the settling mode that also has other, for example: can adopt the higher material of hardness to form light shield layer 130, to improve the anchorage force of light shield layer 130, will at length introduce this kind embodiment at the embodiment of Fig. 3.
The contact panel that Fig. 3 illustrates one embodiment of the invention is disposed at the sectional view on the display panel.Please refer to Fig. 3, the contact panel 200 of present embodiment is similar in appearance to the contact panel 100 of Figure 1A, and both difference parts are that the material of the light shield layer 130 of contact panel 200 is class diamond carbon (diamond-likecarbon).It should be noted that because the class diamond carbon is considerably hard therefore, when with the class diamond carbon during as light shield layer 130, light shield layer 130 is difficult for subsiding in the process that engages touch-control wafer 150, thus process rate can be promoted, and the reduction cost of manufacture.In the present embodiment, the material of conductor layer 140 comprises aluminium, copper, molybdenum, molybdenum aluminium alloy, titanium, titanium-aluminium alloy, silver, silver palladium alloy or aforesaid combination.
It should be noted that because the light-proofness of class diamond carbon is good therefore, the thickness of light shield layer 130 can considerably approach and still have a good shaded effect.For example, the thickness of light shield layer 130 (for example being 0.5 μ m to 6 μ m) can be less than the cognizable thickness of the sense of touch of hand (for example being 0.5 μ m to 6 μ m).Thus, light shield layer 130, can also be disposed on the touching face 112 on element installed surface 114 except configurable, and the sense of touch can not influence the user and operate contact panel the time.Fig. 4 A～Fig. 4 B will be described in detail at the embodiment that light shield layer is disposed on the touching face.
The contact panel that Fig. 4 A illustrates one embodiment of the invention is disposed at the sectional view on the display panel, and Fig. 4 B illustrates the vertical view of the contact panel of Fig. 4 A.Fig. 5 illustrates a kind of vertical view that changes structure of the contact panel of Fig. 4 B.
Please be simultaneously with reference to Fig. 4 A and Fig. 4 B, the contact panel 300 of present embodiment has a photic zone A1 and a surrounding zone A2 who centers on photic zone A1.Contact panel 300 comprises a transparent cover plate 310, a touch control component 320, a light shield layer 330, a touch-control wafer 340 and a conductor layer 360.
In the present embodiment, for covering lighttight touch-control wafer 340, can be configured in light shield layer 330 on the touching face 312 and be located among the A2 of surrounding zone, wherein the material of light shield layer 330 be the class diamond carbon.Because the compact structure of class diamond carbon and considerably hard is so its light-proofness is good and surface abrasion resistance is good, so light shield layer 330 can considerably approach and still have good shaded effect.Therefore, when being arranged on light shield layer 330 on the touching face 312, light shield layer 330 can not influence the sense of touch of user when operation contact panel 300.
Thus, the conductor layer 360 of present embodiment can directly be configured on the element installed surface 314 to promote the process rate that engages touch-control wafer 340 and to reduce cost of manufacture.Moreover present embodiment can rely on the shape that changes light shield layer 330 to present difform photic zone A1 (as Fig. 4 B or shown in Figure 5).
In sum, the present invention is formed directly into touch control component on the transparent cover plate, and needn't be between touch control component and transparent cover plate additional configuration one transparency carrier, so can reduce the cumulative volume and the cost of manufacture of contact panel.Moreover the gross thickness of light shield layer of the present invention and conductor layer is less than the diameter of conductive particle.So the diameter of conductive particle is enough to fill up subsiding of conductor layer enough greatly, thereby can guarantee can connect conductor layer and touch-control wafer really in the glass flip chip connection process.In addition, light shield layer of the present invention can adopt the quite hard class diamond carbon of quality to be made, so light shield layer can have enough anchorage forces and wearing quality and is suitable for being disposed on element installed surface or the touching face.Moreover, when the material of light shield layer was the good class diamond carbon of shaded effect, the thickness of light shield layer can quite approach and still have good shaded effect, therefore, when light shield layer is arranged on the touching face of transparent cover plate, the sense of touch that light shield layer can not influence the user when operating contact panel.
The above person only, only be preferred embodiment of the present invention, when can not limiting scope of the invention process, so the displacement of the change of numerical value or equivalent elements such as with this, or, all should still belong to the category that patent of the present invention contains according to equalization variation and modification that the present patent application claim is done.
Claims (10)
1. a contact panel is characterized in that, has a photic zone and a surrounding zone that centers on this photic zone, and this contact panel comprises:
One transparent cover plate has a relative touching face and an element installed surface;
One touch control component is disposed on this element installed surface, and is arranged in this photic zone at least;
One light shield layer is disposed on this transparent cover plate, and is arranged in this surrounding zone;
One conductor layer is disposed on this element installed surface, and is arranged in this surrounding zone, and electrically connects this touch control component; And
One touch-control wafer relies on the glass flip chip connection process to be disposed on this conductor layer.
2. contact panel as claimed in claim 1 is characterized in that, configuration one anisotropy conducting film between this conductor layer and this touch-control wafer.
3. contact panel as claimed in claim 2 is characterized in that, this anisotropy conducting film comprises a plurality of conductive particles, and the diameter of these a plurality of conductive particles is greater than the thickness sum of thickness and this conductor layer of this light shield layer.
4. contact panel as claimed in claim 3 is characterized in that, the thickness of this light shield layer is 0.5 μ m to 6 μ m.
5. contact panel as claimed in claim 1 is characterized in that, this light shield layer is disposed on this element installed surface, and is sandwiched between this conductor layer and this transparent cover plate.
6. contact panel as claimed in claim 1 is characterized in that this light shield layer is disposed on this touching face.
7. contact panel as claimed in claim 1 is characterized in that, this light shield layer is the made decorative layer of class diamond carbon, black resin or white resin.
8. contact panel as claimed in claim 1 is characterized in that, this touch control component comprises:
A plurality of first touch-control electrodes are disposed on this element installed surface along a first direction; And
A plurality of second touch-control electrodes are disposed on this element installed surface along a second direction, and interconnected with these a plurality of first touch-control electrodes, and wherein this first direction is vertical with this second direction.
9. contact panel as claimed in claim 8 is characterized in that, these a plurality of first touch-control electrodes and this a plurality of second touch-control electrodes more comprise a plurality of transparent connection pads that are overlying on this conductor layer.
10. contact panel as claimed in claim 9 is characterized in that, this touch-control wafer more comprises a plurality of contacts, is electrically connected at this a plurality of transparent connection pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010142114 CN102207785B (en) | 2010-03-30 | 2010-03-30 | Touch control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010142114 CN102207785B (en) | 2010-03-30 | 2010-03-30 | Touch control panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102207785A true CN102207785A (en) | 2011-10-05 |
| CN102207785B CN102207785B (en) | 2013-03-13 |
Family
ID=44696653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010142114 Expired - Fee Related CN102207785B (en) | 2010-03-30 | 2010-03-30 | Touch control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102207785B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508576A (en) * | 2011-11-14 | 2012-06-20 | 友达光电(厦门)有限公司 | Touch panel and manufacturing method for touch panel |
| WO2013127318A1 (en) * | 2012-03-01 | 2013-09-06 | 祥达光学（厦门）有限公司 | Touch control device and manufacturing method |
| WO2013155910A1 (en) * | 2012-04-17 | 2013-10-24 | 宸鸿科技(厦门)有限公司 | Lens touch device and manufacturing method therefor |
| WO2013170684A1 (en) * | 2012-05-16 | 2013-11-21 | 宸鸿科技(厦门)有限公司 | Touch panel and touch display device using same |
| CN103513812A (en) * | 2012-06-14 | 2014-01-15 | 和鑫光电股份有限公司 | Touch control display device |
| CN103543859A (en) * | 2012-07-12 | 2014-01-29 | 云辉科技股份有限公司 | Manufacturing method and structure of touch module signal connecting end |
| WO2014015716A1 (en) * | 2012-07-24 | 2014-01-30 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN103677388A (en) * | 2012-09-03 | 2014-03-26 | 胜华科技股份有限公司 | Touch control panel |
| CN103677422A (en) * | 2013-10-31 | 2014-03-26 | 友达光电股份有限公司 | Touch panel |
| CN104423664A (en) * | 2013-08-22 | 2015-03-18 | 恒颢科技股份有限公司 | Touch electrode device |
| CN106155399A (en) * | 2015-04-24 | 2016-11-23 | 宸鸿科技(厦门)有限公司 | Contactor control device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5847690A (en) * | 1995-10-24 | 1998-12-08 | Lucent Technologies Inc. | Integrated liquid crystal display and digitizer having a black matrix layer adapted for sensing screen touch location |
| US20020180671A1 (en) * | 2001-05-30 | 2002-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of driving the same |
| US20100007627A1 (en) * | 2008-07-09 | 2010-01-14 | Chi Hsin Electronics Corp. | Touch signal transmission circuit and liquid crystal display using the same |
-
2010
- 2010-03-30 CN CN 201010142114 patent/CN102207785B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5847690A (en) * | 1995-10-24 | 1998-12-08 | Lucent Technologies Inc. | Integrated liquid crystal display and digitizer having a black matrix layer adapted for sensing screen touch location |
| US20020180671A1 (en) * | 2001-05-30 | 2002-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of driving the same |
| US20100007627A1 (en) * | 2008-07-09 | 2010-01-14 | Chi Hsin Electronics Corp. | Touch signal transmission circuit and liquid crystal display using the same |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508576A (en) * | 2011-11-14 | 2012-06-20 | 友达光电(厦门)有限公司 | Touch panel and manufacturing method for touch panel |
| CN102508576B (en) * | 2011-11-14 | 2015-09-02 | 友达光电(厦门)有限公司 | A kind of contact panel and contact panel manufacture method |
| TWI476655B (en) * | 2012-03-01 | 2015-03-11 | Tpk Glass Solutions Xiamen Inc | Touch device and method for fabricating the same |
| WO2013127318A1 (en) * | 2012-03-01 | 2013-09-06 | 祥达光学（厦门）有限公司 | Touch control device and manufacturing method |
| WO2013155910A1 (en) * | 2012-04-17 | 2013-10-24 | 宸鸿科技(厦门)有限公司 | Lens touch device and manufacturing method therefor |
| WO2013170684A1 (en) * | 2012-05-16 | 2013-11-21 | 宸鸿科技(厦门)有限公司 | Touch panel and touch display device using same |
| US10488991B2 (en) | 2012-05-16 | 2019-11-26 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel comprising a sensing electrode layer and touch sensing display using the same |
| CN103513812A (en) * | 2012-06-14 | 2014-01-15 | 和鑫光电股份有限公司 | Touch control display device |
| CN103513812B (en) * | 2012-06-14 | 2016-08-17 | 和鑫光电股份有限公司 | Touch control display device |
| CN103543859A (en) * | 2012-07-12 | 2014-01-29 | 云辉科技股份有限公司 | Manufacturing method and structure of touch module signal connecting end |
| TWI476656B (en) * | 2012-07-24 | 2015-03-11 | Tpk Touch Solutions Xiamen Inc | Touch panel and manufacturing method thereof |
| WO2014015716A1 (en) * | 2012-07-24 | 2014-01-30 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN103677388A (en) * | 2012-09-03 | 2014-03-26 | 胜华科技股份有限公司 | Touch control panel |
| CN104423664A (en) * | 2013-08-22 | 2015-03-18 | 恒颢科技股份有限公司 | Touch electrode device |
| CN103677422A (en) * | 2013-10-31 | 2014-03-26 | 友达光电股份有限公司 | Touch panel |
| CN103677422B (en) * | 2013-10-31 | 2017-02-08 | 友达光电股份有限公司 | Touch panel |
| CN106155399A (en) * | 2015-04-24 | 2016-11-23 | 宸鸿科技(厦门)有限公司 | Contactor control device |
| CN106155399B (en) * | 2015-04-24 | 2023-05-16 | 宸鸿科技(厦门)有限公司 | Touch control device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102207785B (en) | 2013-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102207785B (en) | Touch control panel | |
| US9552101B2 (en) | Touch screen assembly | |
| US9778782B2 (en) | Single-layer projected capacitive touch panel and method of manufacturing the same | |
| US8730195B2 (en) | Touch-sensitive device and touch-sensitive display device | |
| CN108228002B (en) | Touch panel and touch display device using same | |
| US10175813B2 (en) | Touch panel board with guard portion and flexible wiring board connecting guard portion to ground wire | |
| US20180210575A1 (en) | Touch screen, method for manufacturing touch screen, and touch display device | |
| US20110298750A1 (en) | Touch-sensitive device and fabrication method thereof and touch-sensitive display device | |
| US8946578B2 (en) | Touch panel and a manufacturing method thereof | |
| US9626019B2 (en) | Touch panel | |
| TWI574367B (en) | Touch panel, manufacturing method thereof and display device using the same | |
| TW201530400A (en) | Touch device | |
| CN113366419B (en) | Touch sensor, window laminate including the same, and image display device | |
| TWI524236B (en) | Touch panel with conductive protection layer and method for manufacturing the same | |
| CN106484165B (en) | Touch panel and manufacturing method thereof | |
| CN114510167B (en) | Touch sensing panel | |
| CN106886325B (en) | Touch panel and electronic device | |
| CN103455186A (en) | Touch panel, touch panel manufacturing method and display device applying touch panel | |
| KR102187925B1 (en) | Touch panel | |
| KR20200090868A (en) | Input device | |
| KR20100118681A (en) | Menufacthuring method of touch panel sensor and touch panel sensor | |
| CN216286615U (en) | Touch structure and touch screen | |
| CN112181198A (en) | Touch module and electronic equipment | |
| TWM481448U (en) | Touch device | |
| CN209388281U (en) | The encapsulating structure of panel device and outer signal connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20160330 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |