CN102192411B - The LED of enhance heat - Google Patents
The LED of enhance heat Download PDFInfo
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- CN102192411B CN102192411B CN201010121294.5A CN201010121294A CN102192411B CN 102192411 B CN102192411 B CN 102192411B CN 201010121294 A CN201010121294 A CN 201010121294A CN 102192411 B CN102192411 B CN 102192411B
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Abstract
The present invention discloses a kind of LED of enhance heat, comprise LED lamp, heat-conducting insulation material is filled in the chamber of lamp holder, mechanically contact an electrode of this wick and this lamp holder, thus heat energy is conducted to this electrode from this wick, and lampshade is sticked together on this lamp holder, thus heat energy is conducted to this lampshade from this electrode.Expand area of dissipation by this lampshade, help this wick to dispel the heat.
Description
Technical field
The present invention relates to a kind of electric light, particularly about a kind of light emitting diode (LED) lamp directly can replacing traditional tungsten filament, halogen or Electricity-saving lamp bulb.
Background technology
Use direct current LED matrix as the LED of wick, power supply changeover device must be used alternating current to be converted to direct current for should direct current LED matrix, therefore can increase the cost of LED.In addition, power supply changeover device is difficult to hide completely and is placed in the standard lamp head of conventional bulb, therefore needs mold developing separately to make the mechanism member being different from conventional bulb, not only more increases cost, also increase the volume of LED.Direct current LED matrix can produce heat energy when being energized, therefore must these heat energy of additional designs cooling mechanism process.If cannot efficiently radiates heat, high temperature can cause that the luminous efficiency of LED reduces, the life-span reduces and the unfavorable effect such as wavelength shift.Power supply changeover device, being converted to by alternating current in galvanic process, also can produce heat energy, particularly inductance wherein and integrated circuit, and high temperature also can damage this class component, causes product to operate.Particularly in high-power application, the light fixture of such as lighting use, the heat energy that direct current LED matrix produces is higher, therefore dispels the heat not enough and situation that is that cause is more serious.Some product adopts many lower powered bullet cut LED, and uses simple bridge rectifier, to adapt to traditional lamp holder of small size.But lower powered LED luminance is generally too low, and market acceptance is limited, and this series products is often because poor heat radiation, and light decay phenomenon is serious.
In recent years, use the technology of the LED matrix of alternating current day by day ripe, brightness also promotes day by day, has commercial exploitation.Alternating current LED matrix is produced on same epi-wafer by multiple LED of series and parallel, after the encapsulation of this epi-wafer, series connection has the resistor of certain resistance value, directly can bear civil power such as the high voltages such as 110 volts or 220 volts to use, therefore economize the power supply changeover device needed for removing DC LED matrix or rectification circuit, effectively reduce costs and reduce the quality problems that circuit causes.Although alternating current LED matrix is conveniently applied in the space of small size, the problem of heat radiation is still had to process.Especially in high-power application, the light fixture of such as lighting use, its heat energy produced is higher, if set up radiator, volume and the cost of LED can be strengthened, if do not help alternating current LED matrix to dispel the heat, can cause again that the luminous efficiency of LED reduces, the life-span reduces and wavelength shift, even burn LED epi-wafer.
Applicant in this case is once in China's patent application case number No. 098115441 a kind of LED of proposition, and it fills heat-conducting insulation material in lamp holder, so that heat energy is conducted to this lamp holder from LED lamp, thus helps this LED lamp to dispel the heat with the electrode of this lamp holder.Subject application is the further improvement to this front case.
Summary of the invention
An object of the present invention, is to propose a kind of LED strengthening LED lamp heat radiation.
According to the present invention, a kind of LED of enhance heat comprises the wick containing at least one alternating current LED matrix, there is the lamp holder of chamber, heat-conducting insulation material is filled in this chamber, mechanically contact an electrode of this wick and this lamp holder, to help heat energy to conduct to this electrode from this wick, and lampshade is sticked together on this lamp holder, to help heat energy to conduct to this lampshade from this electrode.This lampshade is used for expanding area of dissipation, improves radiating effect further.
Preferably, this heat-conducting insulation material some between this wick and this lampshade, help heat energy to conduct to this lampshade from this wick.Preferably, the heat-conducting insulation material of this part has the surface of white to improve light emission rate.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment of the present invention;
Fig. 2 is the schematic diagram of the equivalent circuit of the LED of Fig. 1;
Fig. 3 is the schematic diagram of several alternating current LED epi-wafer;
Fig. 4 is the schematic diagram of the second embodiment of the present invention;
Fig. 5 is the schematic diagram of many epi-wafers wick;
Fig. 6 is the schematic diagram of the third embodiment of the present invention;
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention;
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention;
Fig. 9 is the schematic diagram of the sixth embodiment of the present invention;
Figure 10 is the schematic diagram of the seventh embodiment of the present invention;
Figure 11 is the schematic diagram of the eighth embodiment of the present invention;
Figure 12 is structure alternating current LED epi-wafer and chip resister are packaged in same encapsulation;
Figure 13 is the schematic diagram of the equivalent circuit of the assembly of Figure 12; And
Figure 14 is the schematic diagram of the embodiment of the assembly using Figure 12.
Specific embodiment
Below in conjunction with Figure of description, the specific embodiment of the present invention is described in detail.
Fig. 1 is the schematic diagram of the first embodiment of the present invention.In order to highlight feature of the present invention, this embodiment uses the standard lamp head 10 of miniature bulb, and it has electrode 12 with 14 for being connected AC power.As those skilled in the art be familiar with, electrode 12 is the metal-backs with spiral lamination profile 16, has chamber 18 in it.This embodiment uses an alternating current LED matrix 20 as wick, and this wick is fixed on support 24 by alternating current LED epi-wafer 22, and covers sealing 26 thereon.LED is encapsulated as prior art, in order to simplicity of illustration, does not draw the detailed packaging structure of alternating current LED matrix 20 herein.One end of resistor 30 is soldered to electrode 14, and the other end is soldered to LED matrix 20 with wire 32, and the two ends of wire 34 are respectively welded to electrode 12 and alternating current LED matrix 20.As shown in Figure 2, to the equivalent circuit of this LED alternating current LED epi-wafer 22 and resistor 30 be connected between electrode 12 and 14.As those skilled in the art be familiar with, so-called alternating current LED epi-wafer, LED containing two contrary direction configurations is connected in parallel between two branch connecting pins, each the party upwards has at least one LED, and the LED of these two contrary direction configurations is lit in the positive and negative half period of AC power respectively.The size of the resistance value R of resistor 30 is selected according to the current value of design requirement.Resistor 30 also has the function of protection alternating current LED epi-wafer 22, and when being connected to the AC power generation surging of electrode 12 and 14, resistor 30 can absorb most surge voltage.Get back to Fig. 1, one of feature of the present invention, fill heat-conducting insulation material 36 in chamber 18, its Part I be positioned at below this wick mechanically contacts support 24 and electrode 12, provides first passage of heat by alternating current LED epi-wafer 22 because the thermal energy conduction that electrified light emitting produces is dispelled the heat to electrode 12.As those skilled in the art be familiar with, support 24 is usually containing the sheet metal of helpful alternating current LED epi-wafer 22 heat radiation, and therefore, support 24 is attached on heat-conducting insulation material 36, has good thermal conductance effect.Except helping alternating current LED epi-wafer 22 to dispel the heat, heat-conducting insulation material 36 also helps resistor 30 to dispel the heat, because resistor 30 is embedded in heat-conducting insulation material 36.As shown in the partial enlarged drawing on the right side of Fig. 1, lampshade 40 sticks together on lamp holder 10 by the Part II 78 of heat-conducting insulation material 36, thus provide second passage of heat that heat energy is conducted to lampshade 40 from lamp holder 10, the Part III 80 of heat-conducting insulation material 36, between wick and lampshade 40, thus provides the 3rd passage of heat that heat energy is conducted to lampshade 40 from wick.Because lampshade 40 expands area of dissipation, so better radiating effect can be provided.Preferably, the Part III 80 of heat-conducting insulation material 36 has the surface 82 of white, to reduce the absorption of light and to increase the reflection of light, therefore improves the light emission rate of LED.
Heat-conducting insulation material 36 can select epoxy resin, or heat conduction powder, such as aluminium oxide, aluminium nitride, boron nitride or other Heat Conduction Material, or the mixture of the two.Form the surface 82 of white, Chinese white can be coated with on the Part III 80 of heat-conducting insulation material 36, or titanium dioxide is mixed in heat-conducting insulation material 36.
Conventional bulb uses standard lamp head, and such as E12, E14, E17, E26 and E27 are the lamp holders of conventional tungsten bulb, MR16 and GU10 is the lamp holder of conventional halogen bulb.
As shown in Figure 1, the size of this LED is about identical with lamp holder 10, has again good heat-sinking capability, can reach the high power applications that prior art is not accomplished.In the lamp holder of conventional halogen bulb, an electrode is cylindrical metal shell, is opened by insulant and another electrode separation.Some standard lamp head is then use two needle electrode insulated from each other.No matter be conventional tungsten bulb, the lamp holder of conventional halogen bulb or other standard lamp head, there is chamber to fill heat-conducting insulation material, therefore have at least an electrode can with the wick heat radiation of helping LED.Because the electrode of lamp holder outwards exposes to the open air, so good radiating effect can be provided.
The alternating current LED epi-wafer 22 including more LED quantity can be selected to improve the brightness of LED.Fig. 3 is the schematic diagram of several alternating current LED epi-wafer 22, and the first is the LED that two string directions in parallel are contrary between two branch connecting pins, often a stringly comprises plural LED; The second between two branch connecting pins, connects two to above LED couple, and every a pair LED is connected in parallel to the LED contrary containing both direction; The third is that the LED of more than five is configured to bridge architecture.These have all had commercial product to select.
Lampshade 40, as over cap, prevents aqueous vapor, dust or external force to be applied on the intraware of LED.Lampshade 40 also has the function of optical module, and the modes such as atomization, geometry design that can pass through produce various required optical effect.The vaporific structure of lampshade 40 can utilize sandblasting, etching, electrostatic powder body coating, coating silica gel, spray paint or injection molding method making.
Fig. 4 is the schematic diagram of the second embodiment of the present invention.The wick of this embodiment comprise circuit board 28 and on alternating current LED matrix 20, alternating current LED matrix 20 is containing at least one alternating current LED epi-wafer 22.Resistors in series 38 changes into and being arranged on circuit board 28, and is connected between electrode 12 and 14 by circuit board 28 with wire 34 and 32.Circuit board 28 can select the assembly of tempered glass fiber (FR4) or metal substrate (IMS); Alternating current LED matrix 20 and resistors in series 38 can select surface installing type assembly (SMD), use surface mount technology (SMT) to be arranged on circuit board 28.Because resistor 38 is welded on circuit board 28, variable resistance therefore can be used to increase the elasticity of application, such as convenient adjustment is by the current value of alternating current LED matrix 20.The amount of heat-conducting insulation material 36 is filled to it and covers on circuit board 28, and therefore the Part III 80 of heat-conducting insulation material 36 is above circuit board 28, as shown in the partial enlarged drawing on right side.Further feature is identical with the embodiment of Fig. 1.
If improve the brightness of LED, more alternating current LED matrix 20 series, parallel or connection in series-parallel can be used.Many epi-wafers wick such as shown in Fig. 5, be three row's alternating current LED matrixs 20 in parallel between the weld pad 52 and 54 of circuit board 28, each row is containing three alternating current LED matrixs 20.If the power of each alternating current LED matrix 20 is 1 watt, then this wick can reach 9 watts.
The wick of Fig. 1, Fig. 4 and Fig. 5 is attached on circuit board 28 by alternating current LED matrix 20, also can change into and encapsulate alternating current epi-wafer 22 on circuit board 28, and it is directly attached on circuit board 28 by the naked crystalline substance of alternating current epi-wafer 22, covers sealing 26 again after routing.
Fig. 6 is the schematic diagram of the third embodiment of the present invention, alternating current LED matrix 20 is welded in the card of heat-conducting piece 50, the other end of heat-conducting piece 50 is imbedded in heat-conducting insulation material 36, utilizes it to imbed the depth in heat-conducting insulation material 36 to adjust the height of alternating current LED matrix 20.Further feature is identical with the embodiment of Fig. 1.
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention, use the circuit board 28 with perforation 60, one end of heat-conducting piece 50 is above circuit board 28, and the other end is imbedded in heat-conducting insulation material 36 through perforation 60, and alternating current LED matrix 20 is welded on one end that heat-conducting piece 50 exposes.The pin 66 of alternating current LED matrix 20 is soldered to circuit board 28, has scolding tin 70 to be soldered to electrode 12 in the perforation 64 of circuit board 28.Resistor 30 is welded between electrode 14 and circuit board 28, and therefore resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.Circuit board 28 can select the assembly of tempered glass fiber or metal substrate.Preferably, circuit board 28 also mechanically thermal contact conductance insulating materials 36.In various embodiments, also can change resistor 30 into be welded on circuit board 28 resistor, or on circuit board 28, increase resistor connect with resistor 30.Preferably, the upper surface coating Chinese white of circuit board 28, to improve the light emission rate of LED.Further feature is identical with the embodiment of Fig. 4.
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention, use the circuit board 28 with perforation 60, it welds alternating current LED matrix 20, the bottom of the Part I perforated 60 of heat-conducting insulation material 36 mechanically contact ac electricity LED matrix 20, the Part III 80 of heat-conducting insulation material 36 covers on circuit board 28, preferably, it covers the surface of full circuit board 28 as far as possible, except alternating current LED matrix 20.The Part III 80 of heat-conducting insulation material 36 has the surface of white to improve light emission rate.Further feature is identical with the embodiment of Fig. 7.
The LED of Fig. 8 uses half-mask lampshade 40 instead, and as shown in Figure 9, the inner surface of lampshade 40 can plated film or coating reflectorized material and form reflective surface 86.Further feature is identical with the embodiment of Fig. 8.
The embodiment of Figure 10 uses the circuit board 28 with metal substrate.This circuit board 28 has aluminium lamination, layers of copper and heat-conducting layer between therebetween, and heat-sinking capability is higher than tempered glass fibre base plate.Alternating current LED matrix 20 is welded on circuit board 28 with COB encapsulating structure, circuit board 28 is soldered to electrode 12 by scolding tin 70, resistor 30 is welded between electrode 14 and circuit board 28, and therefore resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.In various embodiments, also can change resistor 30 into be welded on circuit board 28 resistor, or on circuit board 28, increase resistor connect with resistor 30.Circuit board 28 has perforation 84 for filling heat-conducting insulation material 36 in chamber 18.Further feature is identical with the embodiment of Fig. 8.
As shown in figure 11, except resistor 30, a resistor 38 be arranged on circuit board 28 can be increased and be connected between resistor 30 and alternating current LED matrix 20.Resistor 38 can adopt variable resistance, adjusts its resistance value according to demand.Further feature is identical with the embodiment of Fig. 4.
Figure 12 is structure alternating current LED epi-wafer 22 and chip resister 90 are packaged in same encapsulation, alternating current LED epi-wafer 22 and two chip resisters 90 are attached on pad 88, closing line 92 connects alternating current LED epi-wafer 22 and chip resister 90, closing line 94 connecting leads 66 and chip resister 90, the coated all circuit structures of sealing 26, its equivalent circuit as shown in figure 13.The embodiment of Figure 14 is that the components welding of Figure 12 is formed loop between electrode 12 and 14, and further feature is identical with the embodiment of Fig. 1.
In the various embodiments described above, generally speaking, the cooling mechanism set up by Part II 78 and the Part III 80 of heat-conducting insulation material 36, can help the operating temperature of alternating current LED matrix 20 to reduce by 1 to 5 DEG C again.
According to the application of reality, the alternating current LED matrix 20 of employing, its power is between 0.3 to 5W, and preferably is 1 to 3W, selects the resistor 30 or 38 of 50 to 50000 nurses difficult to understand.The use voltage of alternating current LED matrix 20 is between 12 to 240 volts, if use single alternating current LED matrix 20, then it uses voltage to be chosen as 110 volts or 220 volts of persons according to AC power; Multiple alternating current LED matrix 20 if connected, then its voltage used can select junior, such as 12 volts.
Except the various encapsulating structures that the various embodiments described above are shown, assembly also applicable the present invention of other different kenel or encapsulation.
Above; be only preferred embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should define with claim is as the criterion.
Claims (9)
1. a LED for enhance heat, is characterized in that, comprising: wick, containing the alternating current LED matrix of at least one power between 0.3 to 5W; Have the lamp holder of first and second electrode, it has chamber, and this first electrode has spiral lamination, column or needles shape; The resistor of resistance value between 50 to 50000 nurses difficult to understand and this wick are connected between this first and second electrode; The heat-conducting insulation material of thermal conductivity factor between 0.25 to 30W/mK is filled in the chamber; And lampshade; Wherein, this heat-conducting insulation material has Part I and mechanically contacts this wick and this first electrode, thus first passage of heat is provided to help this wick to dispel the heat to this first electrode, this lampshade sticks together on this lamp holder by Part II, thus provide second passage of heat that heat energy is conducted to this lampshade from this first electrode, and Part III is between this wick and this lampshade, thus provide the 3rd passage of heat that heat energy is conducted to this lampshade from this wick.
2. the LED of enhance heat as claimed in claim 1, it is characterized in that, the Part I of this heat-conducting insulation material directly contacts the bottom of this alternating current LED matrix.
3. the LED of enhance heat as claimed in claim 1, it is characterized in that, this wick comprises this at least one alternating current LED matrix of circuit board bearing, and mechanically contacts the Part I of this heat-conducting insulation material.
4. the LED of enhance heat as claimed in claim 3, it is characterized in that, a part of upper surface of this circuit board is coated with Chinese white.
5. the LED of enhance heat as claimed in claim 3, is characterized in that, the Part III of this heat-conducting insulation material covers on the board, and mechanically contacts this lampshade, thus provides described 3rd passage of heat that heat energy is conducted to this lampshade from this wick.
6. the LED of enhance heat as claimed in claim 1, is characterized in that, the alternating current LED epi-wafer of this resistor and this alternating current LED matrix is packaged in same encapsulation.
7. the LED of enhance heat as claimed in claim 1, it is characterized in that, this heat-conducting insulation material comprises epoxy resin, or heat conduction powder, or its mixture.
8. the LED of the enhance heat as described in claim 1 or 5, is characterized in that, the Part III of this heat-conducting insulation material has the surface of white.
9. the LED of enhance heat as claimed in claim 8, it is characterized in that, this heat-conducting insulation material comprises titanium dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010121294.5A CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010121294.5A CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
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| Publication Number | Publication Date |
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| CN102192411A CN102192411A (en) | 2011-09-21 |
| CN102192411B true CN102192411B (en) | 2015-09-09 |
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| CN201010121294.5A Active CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883505A (en) * | 2012-09-21 | 2013-01-16 | 深圳Tcl新技术有限公司 | LED (light-emitting diode) driving circuit, method and LED lamp bar |
| WO2017024429A1 (en) * | 2015-08-07 | 2017-02-16 | 深圳市裕富照明有限公司 | Gas-filled led light bulb using smt |
| CN106468402A (en) * | 2015-08-07 | 2017-03-01 | 深圳市裕富照明有限公司 | The inflation LED bulb of SMT technique |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736938Y (en) * | 2004-09-21 | 2005-10-26 | 凌建春 | Energy-saving colored electric bulb |
| CN2753951Y (en) * | 2004-11-16 | 2006-01-25 | 谢岳桂 | Energy-saving small electric bulb |
| CN201314520Y (en) * | 2008-10-14 | 2009-09-23 | 曹金城 | Polygonal LED lamp bulb applicable to energy-saving modification of Chinese style lamps |
-
2010
- 2010-03-10 CN CN201010121294.5A patent/CN102192411B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736938Y (en) * | 2004-09-21 | 2005-10-26 | 凌建春 | Energy-saving colored electric bulb |
| CN2753951Y (en) * | 2004-11-16 | 2006-01-25 | 谢岳桂 | Energy-saving small electric bulb |
| CN201314520Y (en) * | 2008-10-14 | 2009-09-23 | 曹金城 | Polygonal LED lamp bulb applicable to energy-saving modification of Chinese style lamps |
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| CN102192411A (en) | 2011-09-21 |
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