CN102164074A - Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module - Google Patents
Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module Download PDFInfo
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- CN102164074A CN102164074A CN2011100607472A CN201110060747A CN102164074A CN 102164074 A CN102164074 A CN 102164074A CN 2011100607472 A CN2011100607472 A CN 2011100607472A CN 201110060747 A CN201110060747 A CN 201110060747A CN 102164074 A CN102164074 A CN 102164074A
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Abstract
The invention provides a heat sink of an Ethernet SFP (Small Form-factor Pluggable) electric port module, comprising a first metal shell, a second metal shell and a printed circuit board positioned between the first metal shell and the second metal shell, wherein the printed circuit board is provided with a first heat source unit. The heat sink also comprises a first heat-conducting insulator, wherein the first heat-conducting insulator respectively contacts the first heat source unit and the first metal shell and is positioned between the first heat source unit and the first metal shell. The heat sink has the beneficial effect that the heat of the first heat source unit is conducted by the first metal shell and the first heat-conducting insulator to form a heat-conducting path, thereby ensuring that the SFP electric port module can normally operate under a high-temperature environment.
Description
Technical field
The present invention relates to heat abstractor, relate in particular to the heat abstractor of Ethernet SFP electricity mouthful module.
Background technology
Along with the arriving of information age, Gigabit Ethernet technology is used widely in local area network (LAN), metropolitan area network, Access Network, forms the new network as IP Ethernet, Metro Ethernet.Wherein used the gigabit Ethernet exchange, route and the transmission equipment that meet IEEE802.3 and Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA) standard in a large number, for the reliability requirement of its matching used gigabit Ethernet SFP electricity mouthful module also more and more higher.
Gigabit Ethernet SFP electricity mouthful module except profile and interface satisfy SFP MSA standard, also will must satisfy the related request of IEEE803.3 in any environment for use.
The gigabit Ethernet SFP of business level electricity mouthful module can only be used in temperature is not very high environment, ventilate not good at ethernet network device, dispel the heat bad or when being applied to the outdoor environment of heat, require the reliable and stable operation in the environment of high temperature of gigabit Ethernet SFP electricity mouthful module, but the SFP that existing market is generally used an electricity mouthful module situations such as deadlock, broken string, loss of data can occur under hot environment, for highly reliable Ethernet, had a strong impact on network security.
Summary of the invention
Under hot environment, move unstable problem in order to solve Ethernet SFP electricity mouthful module of the prior art, the invention provides a kind of heat abstractor of Ethernet SFP electricity mouthful module.
The invention provides a kind of heat abstractor of Ethernet SFP electricity mouthful module, it is characterized in that: comprise first metal shell, second metal shell and the printed substrate between described first metal shell and described second metal shell, described printed substrate is provided with first heat source unit; This heat abstractor also comprises first thermal conductive insulator, described first thermal conductive insulator contact with described first heat source unit and described first metal shell respectively and described first thermal conductive insulator between described first heat source unit and described first metal shell.
As a further improvement on the present invention, this heat abstractor also comprises second thermal conductive insulator, also be provided with second heat source unit on the described printed substrate, described second thermal conductive insulator contact with described second heat source unit and described second metal shell respectively and described second thermal conductive insulator between described second heat source unit and described second metal shell.
As a further improvement on the present invention, described first metal shell also comprises the metal boss, and described first thermal conductive insulator is positioned on the described metal boss and with described metal boss and contacts.
As a further improvement on the present invention, described first thermal conductive insulator and described second thermal conductive insulator are soft material and make.
As a further improvement on the present invention, described first heat source unit is provided with a plurality of electronic devices and components unit, and there is the gap in a plurality of described electronic devices and components between the unit; Described second heat source unit is provided with a plurality of electronic component modules, has the gap between a plurality of described electronic component modules; The part of described first thermal conductive insulator is squeezed in the gap between a plurality of described electronic devices and components unit, and the part of described second thermal conductive insulator is squeezed in the gap between a plurality of described electronic component modules.
As a further improvement on the present invention, described first thermal conductive insulator or described second thermal conductive insulator are of a size of: length be 20 millimeters, wide be that 10 millimeters, height are 1 millimeter.
The invention has the beneficial effects as follows: because this heat abstractor also comprises first thermal conductive insulator, described first thermal conductive insulator contact with described first heat source unit and described first metal shell respectively and described first thermal conductive insulator between described first heat source unit and described first metal shell, so just the heat of first heat source unit can be conducted by first metal shell and described first thermal conductive insulator, form passage of heat, guaranteed the normally operation under hot environment of SFP electricity mouthful module.The present invention just can conduct the heat of first heat source unit by first thermal conductive insulator, first metal shell, and is not only simple in structure, cost is lower, and under the relatively poor situation of ventilation condition, also can reach good heat-radiation effect.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is a decomposition texture schematic diagram of the present invention.
Embodiment
As depicted in figs. 1 and 2, the invention discloses a kind of heat abstractor 1 of Ethernet SFP electricity mouthful module, comprise first metal shell 11, second metal shell 12 and the printed substrate 3 between described first metal shell 11 and described second metal shell 12, described printed substrate 3 is provided with first heat source unit; This heat abstractor 1 also comprises first thermal conductive insulator 21, described first thermal conductive insulator 21 contact with described first heat source unit and described first metal shell 11 respectively and described first thermal conductive insulator 21 between described first heat source unit and described first metal shell 11.
This heat abstractor 1 also comprises second thermal conductive insulator 22, also be provided with second heat source unit on the described printed substrate 3, described second thermal conductive insulator 22 contact with described second heat source unit and described second metal shell 12 respectively and described second thermal conductive insulator 22 between described second heat source unit and described second metal shell 12.Conduct by second thermal conductive insulator 22 and second metal shell 12 heat second heat source unit.
Described first metal shell 11 also comprises metal boss 111, and described first heat conductive insulating, 21 bodies are positioned on the described metal boss 111 and with described metal boss 111 and contact.In order to reduce first thermal conductive insulator, 21 thickness as far as possible, increase the thickness of first metal shell, 11 metal materials, make full use of the high thermal conduction characteristic of metal material, reduce the passage of heat thermal resistance as far as possible, so on first metal shell 11, be provided with metal boss 111.
Described first thermal conductive insulator 21 and described second thermal conductive insulator 22 are soft material and make.
Described first heat source unit is provided with a plurality of electronic devices and components unit, and there is the gap in a plurality of described electronic devices and components between the unit; Described second heat source unit is provided with a plurality of electronic component modules, has the gap between a plurality of described electronic component modules.Under the extruding of first metal shell 11 and second metal shell 12, the part of described first thermal conductive insulator 21 is squeezed in the gap between a plurality of described electronic devices and components unit, and the part of described second thermal conductive insulator 22 is squeezed in the gap between a plurality of described electronic component modules.Because first thermal conductive insulator 21 and described second thermal conductive insulator 22 are soft material and make, so when the two is oppressed, the two can deform, and utilizes the fillable increase heat generating spot of soft thermal conductive insulator long-pending to the heat-conducting section of shell, more helps heat radiation.
As one embodiment of the present of invention, described first thermal conductive insulator 21 or described second thermal conductive insulator 22 are of a size of: length be 20 millimeters, wide be that 10 millimeters, height are 1 millimeter.Such size more helps distributing of heat.The SFP electricity mouthful module that heat abstractor of the present invention is installed is placed on the high/low-temperature impact platform, the temperature of high/low-temperature impact platform is set at-40 ℃, 0 ℃, 70 ℃, 85 ℃ successively, with the requirement of oscilloscope according to IEEE802.3 1000Base-T Compliance project, the ethernet signal index of test gigabit Ethernet SFP electricity mouthful module.Use network analyzer,, measure throughput, time delay, packet loss and the back-to-back index of gigabit Ethernet SFP electricity mouthful module respectively according to the regulation of RFC 2544.Experimental result shows, the heat dissipation design of SFP electricity mouthful module is after having adopted heat dissipation design of the present invention, in-40 ℃ ~ 85 ℃ environment, can both reach the gigabit ethernet signal index of IEEE803.3 regulation, throughput 100%, packet loss 0%, time delay, back-to-back index are normal value, otherwise SFP electricity mouthful module can only be operated in 0 ℃ ~ 70 ℃ the environment.
The chip, 10/100/1000 Base-T network transformer, twisted-pair feeder RJ45 interface, 1.2V DC/DC power supply changeover device, 2.5V DC/DC power supply changeover device, the 25MHz ± seven functional units in 15ppm clock source that comprise SFP MSA circuit interface, ethernet physical layer signaling interface on the printed substrate 3.
The chip of ethernet physical layer signaling interface is a very lagre scale integrated circuit (VLSIC), be the core parts of gigabit Ethernet SFP electricity mouthful module, it also is the main thermal source of gigabit Ethernet SFP electricity mouthful module, the DC/DC power supply changeover device also is made up of integrated circuit, equally also can produce certain heat, heat gathers the limiting temperature (125 ℃) that can allow the local temperature of its internal circuit surpass semiconductor work in integrated circuit (IC) chip, and employed inductance and network transformer are the ferrimagnetism element in the circuit, and hot environment can make its mis-behave.
So this first heat source unit is the chip of ethernet physical layer signaling interface, described second heat source unit is the DC/DC power supply changeover device.Described chip is a very lagre scale integrated circuit (VLSIC).
Described DC/DC power supply changeover device is 1.2V DC/DC power supply changeover device or 2.5V DC/DC power supply changeover device.
Owing to used this heat abstractor 1, guaranteed the normally operation under hot environment of SFP electricity mouthful module.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (6)
1. the heat abstractor of Ethernet SFP electricity mouthful module, it is characterized in that: comprise first metal shell, second metal shell and the printed substrate between described first metal shell and described second metal shell, described printed substrate is provided with first heat source unit; This heat abstractor also comprises first thermal conductive insulator, described first thermal conductive insulator contact with described first heat source unit and described first metal shell respectively and described first thermal conductive insulator between described first heat source unit and described first metal shell.
2. heat abstractor according to claim 1, it is characterized in that: this heat abstractor also comprises second thermal conductive insulator, also be provided with second heat source unit on the described printed substrate, described second thermal conductive insulator contact with described second heat source unit and described second metal shell respectively and described second thermal conductive insulator between described second heat source unit and described second metal shell.
3. heat abstractor according to claim 1 and 2 is characterized in that: described first metal shell also comprises the metal boss, and described first thermal conductive insulator is positioned on the described metal boss and with described metal boss and contacts.
4. heat abstractor according to claim 3 is characterized in that: described first thermal conductive insulator and described second thermal conductive insulator are soft material and make.
5. heat abstractor according to claim 4 is characterized in that: described first heat source unit is provided with a plurality of electronic devices and components unit, and there is the gap in a plurality of described electronic devices and components between the unit; Described second heat source unit is provided with a plurality of electronic component modules, has the gap between a plurality of described electronic component modules; The part of described first thermal conductive insulator is squeezed in the gap between a plurality of described electronic devices and components unit, and the part of described second thermal conductive insulator is squeezed in the gap between a plurality of described electronic component modules.
6. heat abstractor according to claim 5 is characterized in that: described first thermal conductive insulator or described second thermal conductive insulator are of a size of: length be 20 millimeters, wide be that 10 millimeters, height are 1 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100607472A CN102164074A (en) | 2011-03-15 | 2011-03-15 | Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100607472A CN102164074A (en) | 2011-03-15 | 2011-03-15 | Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module |
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| CN102164074A true CN102164074A (en) | 2011-08-24 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676027A (en) * | 2012-09-14 | 2014-03-26 | 泰科电子(上海)有限公司 | Connector |
| WO2014089935A1 (en) * | 2012-12-13 | 2014-06-19 | 武汉电信器件有限公司 | Electric-port sfp photoelectric module |
| CN106100674A (en) * | 2015-02-12 | 2016-11-09 | 义传科技股份有限公司 | VDSL2 and GFAST miniature pluggable module for any physical layer platform |
| US10219412B1 (en) | 2017-11-27 | 2019-02-26 | Nokia Solutions And Networks Oy | Connector assembly and associated heat sink housing for use in a radio unit |
| US11086081B2 (en) | 2019-03-21 | 2021-08-10 | Schweitzer Engineering Laboratories, Inc. | Conductive cooling for small form-factor pluggable (SFP) fiber optic transceivers |
| US11250253B2 (en) | 2018-06-19 | 2022-02-15 | Ricoh Company, Ltd. | Handwriting input display apparatus, handwriting input display method and recording medium storing program |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676027A (en) * | 2012-09-14 | 2014-03-26 | 泰科电子(上海)有限公司 | Connector |
| WO2014089935A1 (en) * | 2012-12-13 | 2014-06-19 | 武汉电信器件有限公司 | Electric-port sfp photoelectric module |
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| CN106100674A (en) * | 2015-02-12 | 2016-11-09 | 义传科技股份有限公司 | VDSL2 and GFAST miniature pluggable module for any physical layer platform |
| CN106100674B (en) * | 2015-02-12 | 2019-11-12 | 义传科技股份有限公司 | VDSL2 and GFAST miniature pluggable module for any physical layer platform |
| US10219412B1 (en) | 2017-11-27 | 2019-02-26 | Nokia Solutions And Networks Oy | Connector assembly and associated heat sink housing for use in a radio unit |
| US11250253B2 (en) | 2018-06-19 | 2022-02-15 | Ricoh Company, Ltd. | Handwriting input display apparatus, handwriting input display method and recording medium storing program |
| US11086081B2 (en) | 2019-03-21 | 2021-08-10 | Schweitzer Engineering Laboratories, Inc. | Conductive cooling for small form-factor pluggable (SFP) fiber optic transceivers |
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Address after: 518055 Guangdong city of Shenzhen province Nanshan District Longjing High Technology Park Building No. 2 Heng Po building Applicant after: SHENZHEN HI-OPTEL TECHNOLOGY CO., LTD. Address before: 518055 Guangdong city of Shenzhen province Nanshan District Longjing High Technology Park Building No. 2 Heng Po building Applicant before: Hengbaotong Photoelectronics Co., Ltd., Shenzhen City |
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Application publication date: 20110824 |