CN102159058B - Liquid-cooled radiation structure - Google Patents
Liquid-cooled radiation structure Download PDFInfo
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- CN102159058B CN102159058B CN 201110065680 CN201110065680A CN102159058B CN 102159058 B CN102159058 B CN 102159058B CN 201110065680 CN201110065680 CN 201110065680 CN 201110065680 A CN201110065680 A CN 201110065680A CN 102159058 B CN102159058 B CN 102159058B
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Abstract
The invention discloses a liquid-cooled radiation structure, which comprises a substrate and at least one radiation fins, wherein the substrate is provided with at least one liquid input pipeline, at least one liquid output pipeline and at least one groove; the inner side of the groove is communicated with the liquid input pipeline and the liquid output pipeline to form an opening respectively; in addition, the radiation fin is provided with a plate body which can be embedded into and seal the groove; and the surface of the plate body is provided with a plurality of flow deflectors which can be embedded into the groove. The flow deflectors and the groove form a plurality of runners allowing the shunting of liquid, and the liquid flowing through the liquid input pipeline and the liquid output pipeline can flow among the plurality of runners by flowing in and out of the two openings of the groove, so that continuous cyclic radiation can be realized in the substrate.
Description
Technical field
The present invention is about a kind of liquid-cooling heat dissipation structure, and is especially a kind of by the moving mode of liquid circulation flow, the radiator structure that makes the carrying electronic component can cooling have fluid channel.
Background technology
Present high-power components (Power Device), because the characteristic of element, can produce big heat inevitably, with insulated gate bipolar electric crystal (Insulated Gate Bipolar Transistor, IGBT) illustrate, IGBT combines characteristic and the anti-high electric current of bipolar transistor and the low conducting voltage drooping characteristic that an effect electric crystal gate easily drives, and is generally used for middle high power capacity power occasion (as switched power supply, motor control, electromagnetic oven or be applied to the hundreds of amperes of field of power with six kilovolts); When if IGBT is used for switched power supply, with the high frequency switching mode, convert power supply to required DC power supply output by AC power supplies, in transfer process, power component generates heat because of energy loss, and the overheated performance of power component that will cause descends even damage.
Therefore take place for fear of superheating phenomenon, usually the solution of taking uses fin and forced air convection mode directly to dispel the heat, yet the cross-ventilation mode has noise and the not good shortcoming of thermal diffusivity, therefore thereby development in recent years goes out a kind of mode of taking away heat that circulates by liquid in the loop, mainly be close to thermal source by a cold drawing, and use liquid circulation flow that a motor drives after cold drawing absorbs heat, again heat is distributed and be delivered in the environment, so that electronic component is dispelled the heat.
Though yet above-mentioned liquid cooling mode has characteristics such as thermal resistance is low, transmission thermal capacity is big, transmission range is far away, but, because the limitation of cold drawing material and liquid endothermic temperature raise, therefore under certain liquid driven power, its thermal resistance value is certain, also make the thermal resistance of cold drawing can not obtain more effective reduction, thus can continue to accumulate the electronic component of high temperature for some, present employed liquid cooling structure the effect that can reach be extremely limited.
Therefore, if a kind of liquid-cooling heat dissipation structure can be provided, can make the liquid cooling heat radiation can have more uniform temperature and distribute by the radiator structure with fluid channel, and reach and have lower thermal resistance and better heat dispersion, should be a best solution.
Summary of the invention
The object of the present invention is to provide a kind of liquid-cooling heat dissipation structure, it has fluid channel, has more uniform temperature in the time of making liquid circulation heat radiation and distributes, and have lower thermal resistance and better heat dispersion.
For achieving the above object, the invention discloses a kind of liquid-cooling heat dissipation structure, it is characterized in that comprising:
One pedestal, have at least one liquid input tube road, at least one liquid output pipe road and at least one groove, and this groove inboard is communicated with this liquid input tube road and this liquid output pipe road respectively and respectively forms an opening, using can be by when this groove for the liquid that flows into this liquid input tube road, and is flowed out by this liquid output pipe road again; And
At least one radiating fin, this radiating fin have a plate body that can embed and seal this groove, and the surface of this plate body is provided with a plurality of flow deflectors that can embed this groove;
By this, make this flow deflector and this groove form a plurality of runners of allowing separating liquid, circulate in the liquid on this liquid input tube road and this liquid output pipe road, can be via two openings of this groove of turnover, with liquid flow between these a plurality of runners, so that the circulation that this base interior can continue heat radiation.
Wherein, can carry at least one electronic component on the plate body of this radiating fin.
Wherein, this electronic component is the insulated gate bipolar electric crystal.
Wherein, the plate body of this radiating fin can carry the printed circuit board (PCB) that at least one has electronic component.
Wherein, this pedestal is that to have the material of heat dissipation characteristics made.
Wherein, the plate body of this radiating fin is that to have the material of heat dissipation characteristics made.
Wherein, the flow deflector of this radiating fin is that to have the material of heat dissipation characteristics made.
Wherein, this liquid input tube road connects a pipeline open joint, in order to see through this pipeline open joint liquid is flowed into this inside, liquid input tube road.
Wherein, this liquid output pipe road connects a pipeline open joint, in order to see through this pipeline open joint liquid is flowed out by this liquid output pipe road is inner.
Wherein this liquid input tube Lu Weiyi is by the inside diminishing runner in this porch.
Wherein, the runner that enlarges gradually to this exit of this liquid output pipe Lu Weiyi.The more many
By said structure, liquid-cooling heat dissipation structure of the present invention possesses following technique effect:
1. the present invention, can shunt and constantly take away heat when radiator liquid is passed through by the radiator structure with fluid channel, so that the temperature of this plate body is distributed more evenly, and has lower thermal resistance and better radiating effect.
2. the present invention can be by its radiator liquid inflow of external control and the speed that flows out, to control the intensity of internal liquid heat radiation circulation.
Description of drawings
Fig. 1: be the three-dimensional decomposition chart of a kind of liquid-cooling heat dissipation structure of the present invention;
Fig. 2: be the three-dimensional integrated structure figure of this liquid-cooling heat dissipation structure;
Fig. 3 A: be the radiating fin three-dimensional structure diagram of this liquid-cooling heat dissipation structure;
Fig. 3 B: be the radiating fin top view of this liquid-cooling heat dissipation structure;
Fig. 4 A: be the liquid circulation heat radiation schematic diagram of this liquid-cooling heat dissipation structure;
Fig. 4 B: be the liquid circulation heat radiation schematic diagram of this liquid-cooling heat dissipation structure;
Fig. 4 C: be the liquid circulation heat radiation schematic diagram of this liquid-cooling heat dissipation structure;
Fig. 5 A: be the three-dimensional decomposition chart of the embodiment of this liquid-cooling heat dissipation structure;
Fig. 5 B: be the three-dimensional integrated structure figure of the embodiment of this liquid-cooling heat dissipation structure; And
Fig. 6: be the radiating effect testing jig composition of this liquid-cooling heat dissipation structure.
Embodiment
Relevant for aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly present.
See also Fig. 1, Fig. 2, Fig. 3 A, Fig. 3 B, Fig. 4 A, Fig. 4 B and Fig. 4 C, be the three-dimensional decomposition chart of liquid-cooling heat dissipation structure of the present invention, three-dimensional integrated structure figure, radiating fin three-dimensional structure diagram, radiating fin top view and liquid circulation heat radiation schematic diagram, by among the figure as can be known, this liquid-cooling heat dissipation structure comprises:
One pedestal 1, have at least one liquid input tube road 11, at least one liquid output pipe road 12 and at least one groove 13, and these groove 13 inboards are communicated with this liquid input tube road 11 and this liquid output pipe road 12 respectively and respectively form an opening (inlet opening 14 and flow out opening 15), use for the radiator liquid 2 that flows into this liquid input tube road 11 and can pass through in this groove 13, and flowed out by this liquid output pipe road 12 again;
At least one radiating fin 3, this radiating fin 3 has a plate body 31 that can embed and seal this groove 13, and the surface of this plate body 31 is provided with a plurality of flow deflectors 32 that can embed this groove 13, and this flow deflector 32 forms a plurality of runners 4 of allowing these radiator liquid 2 shuntings with this groove 13.
Therefore, as Fig. 4 A, shown in Fig. 4 B and Fig. 4 C, these 11 porch 111, liquid input tube road and 12 exits 121, this liquid output pipe road connect an oral siphon joint 51 and a titting water outlet 52 respectively, and by this oral siphon joint 51 radiator liquid 2 is flowed into these liquid input tube roads 11, and this inlet opening 14 can make this radiator liquid 2 enter this groove 13 (shown in Fig. 4 B), and again by a plurality of runners 4, make these radiator liquid 2 shuntings by behind these a plurality of runners 4, this radiator liquid 2 can contact the plate body 31 of this radiating fin 3, to absorb the heat that this plate body 31 distributes; At last, flow out opening 15 (shown in Fig. 4 C) by this again, make this radiator liquid that has absorbed heat 2 flow into this liquid output pipe road 12, and see through the radiator liquid 2 that this titting water outlet 52 will absorb heat and discharge, so carry out radiator liquid 2 and pass in and out constantly and flow between these a plurality of runners 4, the circulation heat radiation that this pedestal 1 inside can be continued.
What deserves to be mentioned is, can carry at least one electronic component on the plate body 31 of this radiating fin 3, and this electronic component is the insulated gate bipolar electric crystal.
What deserves to be mentioned is that the plate body 31 of this radiating fin 3 can carry the printed circuit board (PCB) that at least one has electronic component.
What deserves to be mentioned is that this pedestal 1 is made for the material with heat dissipation characteristics.
What deserves to be mentioned is that the plate body 31 of this radiating fin 3 is made for the material with heat dissipation characteristics.
What deserves to be mentioned is that the flow deflector 32 of this radiating fin 3 is made for the material with heat dissipation characteristics.
What deserves to be mentioned is that this liquid input tube road 11 can connect a pipeline open joint (oral siphon joint 51), in order to see through this pipeline open joint (oral siphon joint 51) radiator liquid 2 is flowed into these 11 inside, liquid input tube road.
What deserves to be mentioned is that this liquid output pipe road 12 can connect a pipeline open joint (titting water outlet 52), in order to see through this pipeline open joint (titting water outlet 52) radiator liquid 2 is flowed out by these 12 inside, liquid output pipe road.
What deserves to be mentioned is, this liquid input tube road 11 is one by these porch 111 inside diminishing runners, and this liquid output pipe road 12 is a runner that enlarges gradually to this exit 121, and the design of this runner convergent and runner flaring, can control break flow rate of fluid and pressure, make the fluid temperature that any one groove 13 flows into and flows out in this pedestal 1 can reach samming as far as possible, also can adjust simultaneously the temperature difference that makes between the groove 13 and reduce, for can reach groove 13 between can samming effect produce.
See also Fig. 5 A and Fig. 5 B, be the three-dimensional decomposition chart of the embodiment of liquid-cooling heat dissipation structure of the present invention and the three-dimensional integrated structure figure of embodiment, by among the figure as can be known, carried an insulated gate bipolar electric crystal 6 on the plate body 31 of this radiating fin 3, and on this insulated gate bipolar electric crystal 6 with printed circuit board (PCB) 71 combinations with electronic component 72; Therefore, when this insulated gate bipolar electric crystal 6 and this printed circuit board (PCB) 71 with electronic component 72 came into operation, this insulated gate bipolar electric crystal 6 can produce heat because of the loss of energy, and heat is passed on the plate body 31 of this radiating fin 3; And via circulating in the radiator liquid between these a plurality of runners, can be constantly with absorbing on the plate body 31, and the radiator liquid 2 that continues to absorb heat discharges, so that this pedestal 1 inside can be carried out the heat that this insulated gate bipolar electric crystal 6 the produces heat radiation that circulates.
See also Fig. 6, radiating effect testing jig composition for liquid-cooling heat dissipation structure of the present invention, by among the figure as can be known, in this experiment framework by a thermostat 91, one electric water pump 92, one inlet temperature meter 93, one head pressure gage 94, one outlet pressure meter 95, one outlet temperature meter 96 and a flowmeter 97, this liquid-cooling heat dissipation structure 8 is carried out the radiating and cooling measure of merit, and has a porch 81 in the liquid-cooling heat dissipation structure 8 in this test, one exit 85, first radiating module 82, second radiating module 83 and the 3rd radiating module 84, and in this first radiating module 82, place two heaters (six heaters altogether) on second radiating module 83 and the 3rd radiating module 84 separately, import this porch 81 by this electric water pump 92 liquid of this thermostat 91 is extracted out, and test temperature and the pressure of importing liquid through this inlet temperature meter 93 and head pressure gage 94; And should pass through this first radiating module 82, second radiating module 83 and the 3rd radiating module 84 by input liquid, can liquid be discharged by this exit 85, and by temperature, pressure and the fluid flow of this outlet temperature meter 95, outlet pressure meter 96 and the flowmeter 97 test liquid of discharging, can can understand the cooling-down effect that can reduce heat energy that this heater produces via this liquid-cooling heat dissipation structure 8 by the metrology data of testing at last; Therefore, the present invention is as follows by three groups of test data data checking radiating effects:
First group:
The thermal impedance of this liquid-cooling heat dissipation structure 8 be 0.0264 (℃/W), and via six heaters heat improve temperature after, wherein the temperature of this first radiating module 82 is that 45.76 ℃, the temperature of second radiating module 83 are that the temperature of 50.81 ℃ and the 3rd radiating module 84 is 55.39 ℃, the temperature that detects of this inlet temperature meter 93 is 25.29 ℃ in addition, and the temperature that this outlet temperature meter 95 detects is 27.36 ℃, hence one can see that, and the temperature of this first radiating module 82, second radiating module 83 and the 3rd radiating module 84 can be dispelled the heat by flowing liquid.
And the solution heat of first group of gained is as follows:
Mean temperature: (45.76+50.81+55.39)/3=50.6533 ℃
Average water temperature: (25.29+27.36)/2=26.325 ℃
Mean temperature difference: 50.6533-26.325=24.33 ℃
Separate heat: 24.33/0.0264=921.52W
Second group:
The thermal impedance of this liquid-cooling heat dissipation structure 8 be 0.0264 (℃/W), and via six heaters heat improve temperature after, wherein the temperature of this first radiating module 82 is that 61.15 ℃, the temperature of second radiating module 83 are that the temperature of 66.13 ℃ and the 3rd radiating module 84 is 67.61 ℃, the temperature that detects of this inlet temperature meter 93 is 39.77 ℃ in addition, and the temperature that this outlet temperature meter 95 detects is 41.74 ℃, hence one can see that, and the temperature of this first radiating module 82, second radiating module 83 and the 3rd radiating module 84 can be dispelled the heat by flowing liquid.
And the solution heat of second group of gained is as follows:
Mean temperature: (61.15+66.13+67.61)/3=64.963 ℃
Average water temperature: (39.77+41.74)/2=40.755 ℃
Mean temperature difference: 50.6533-26.325=24.208 ℃
Separate heat: 24.208/0.0264=916.96W
The 3rd group:
The thermal impedance of this liquid-cooling heat dissipation structure 8 be 0.0264 (℃/W), and via six heaters heat improve temperature after, wherein the temperature of this first radiating module 82 is that 85.74 ℃, the temperature of second radiating module 83 are that the temperature of 90.16 ℃ and the 3rd radiating module 84 is 92.57 ℃, the temperature that detects of this inlet temperature meter 93 is 64.28 ℃ in addition, and the temperature that this outlet temperature meter 95 detects is 66.05 ℃, hence one can see that, and the temperature of this first radiating module 82, second radiating module 83 and the 3rd radiating module 84 can be dispelled the heat by flowing liquid.
And the solution heat of the 3rd group of gained is as follows:
Mean temperature N:(85.74+90.16+92.57)/3=89.49 ℃
Average water temperature: (64.28+66.05)/2=65.165 ℃
Mean temperature difference: 89.49-65.165=24.325 ℃
Separate heat: 24.208/0.0264=921.4W
By above-mentioned three groups of experimental datas, provable radiator structure of the present invention has better heat radiating effect really.
A kind of liquid-cooling heat dissipation structure provided by the present invention when comparing mutually with other located by prior art, has more and gets the row advantage ready:
1. the present invention, can shunt and constantly take away heat when radiator liquid is passed through by the radiator structure with fluid channel, so that the temperature of this plate body is distributed more evenly, and has lower thermal resistance and better radiating effect.
2. the present invention can be by its radiator liquid inflow of external control and the speed that flows out, to control the intensity of internal liquid heat radiation circulation.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (9)
1. liquid-cooling heat dissipation structure is characterized in that comprising:
One pedestal, has at least one liquid input tube road, at least one liquid output pipe road and at least one groove, form an inflow opening and this groove is inboard with this liquid input tube road, be communicated with formation one with this liquid output pipe road and flow out opening, the porch on this liquid input tube road connects an oral siphon joint, the exit on this liquid output pipe road connects a titting water outlet, thereby by this oral siphon joint liquid is flowed into this liquid input tube road, the liquid that flows into this liquid input tube road can pass through when this groove, and discharges by this liquid output pipe road outflow and by this titting water outlet again; And
At least one radiating fin, this radiating fin have a plate body that can embed and seal this groove, and the surface of this plate body is provided with a plurality of flow deflectors that can embed this groove;
By this, make this flow deflector and this groove form a plurality of runners of allowing separating liquid, circulate in the liquid on this liquid input tube road and this liquid output pipe road, can be via two openings of this groove of turnover, with liquid flow between these a plurality of runners, so that the circulation that this base interior can continue heat radiation.
2. liquid-cooling heat dissipation structure according to claim 1 is characterized in that, can carry at least one electronic component on the plate body of this radiating fin.
3. as liquid-cooling heat dissipation structure as described in the claim 2, it is characterized in that this electronic component is the insulated gate bipolar electric crystal.
4. liquid-cooling heat dissipation structure according to claim 1 is characterized in that the plate body of this radiating fin can carry at least one printed circuit board (PCB) with electronic component.
5. liquid-cooling heat dissipation structure according to claim 1 is characterized in that, this pedestal is that to have the material of heat dissipation characteristics made.
6. liquid-cooling heat dissipation structure according to claim 1 is characterized in that, the plate body of this radiating fin is that to have the material of heat dissipation characteristics made.
7. liquid-cooling heat dissipation structure according to claim 1 is characterized in that, the flow deflector of this radiating fin is that to have the material of heat dissipation characteristics made.
8. liquid-cooling heat dissipation structure according to claim 1 is characterized in that this liquid input tube Lu Weiyi is by the inside diminishing runner in this porch.
9. liquid-cooling heat dissipation structure according to claim 1 is characterized in that the runner that this liquid output pipe Lu Weiyi enlarges gradually to this exit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110065680 CN102159058B (en) | 2011-03-18 | 2011-03-18 | Liquid-cooled radiation structure |
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| CN 201110065680 CN102159058B (en) | 2011-03-18 | 2011-03-18 | Liquid-cooled radiation structure |
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| CN102159058B true CN102159058B (en) | 2013-10-09 |
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| CN107275300B (en) * | 2017-07-06 | 2023-06-02 | 华南理工大学 | Modularized IGBT liquid cooling plate and manufacturing method thereof |
| CN109257903A (en) * | 2017-07-12 | 2019-01-22 | 深圳市蓝海华腾技术股份有限公司 | Flow tube radiator and its manufacturing method |
| CN110015003B (en) * | 2017-08-21 | 2022-11-25 | 徐煜 | Charging device |
| CN109429466B (en) * | 2017-08-21 | 2020-10-16 | 大石祖耀 | Heat dissipation device for charging device |
| WO2019119254A1 (en) * | 2017-12-19 | 2019-06-27 | 深圳市万景华科技有限公司 | Heat dissipation structure of charging pile power module |
| CN109526189B (en) * | 2018-11-29 | 2020-01-10 | 西安电子科技大学 | Annular micro-channel heat exchanger and fluid flow heat exchange experimental device thereof |
| CN110634823A (en) * | 2019-09-08 | 2019-12-31 | 南京金龙新能源汽车研究院有限公司 | Segmented flow blocking type heat dissipation structure of motor controller and heat dissipation method thereof |
| CN110494023A (en) * | 2019-09-16 | 2019-11-22 | 合肥天鹅制冷科技有限公司 | A kind of liquid cooling equipment suitable for multi-model |
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