CN102042518A - 照明装置 - Google Patents

照明装置 Download PDF

Info

Publication number
CN102042518A
CN102042518A CN2009103083556A CN200910308355A CN102042518A CN 102042518 A CN102042518 A CN 102042518A CN 2009103083556 A CN2009103083556 A CN 2009103083556A CN 200910308355 A CN200910308355 A CN 200910308355A CN 102042518 A CN102042518 A CN 102042518A
Authority
CN
China
Prior art keywords
light emitting
solid
emitting element
state light
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009103083556A
Other languages
English (en)
Inventor
谌秉佑
吕英杰
黄正杰
卢建廷
江国丰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Shanghai Inc
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Shanghai Inc
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Technology Shanghai Inc, Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Shanghai Inc
Priority to CN2009103083556A priority Critical patent/CN102042518A/zh
Priority to KR1020100090098A priority patent/KR101167415B1/ko
Priority to JP2010206593A priority patent/JP2011086618A/ja
Priority to EP10186675A priority patent/EP2312918A1/en
Publication of CN102042518A publication Critical patent/CN102042518A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种照明装置,包括散热件、至少一固态发光元件以及基板。所述至少一固态发光元件连接于散热件的一端,所述基板上设有孔洞用以套置于固态发光元件上,并使基板的电路与固态发光元件的电极电性连接。所述的照明装置由于固态发光元件直接接触于散热件,使得固态发光元件所产生的热可以高效率的直接传导至散热件上进行热交换,而不会被基板所间隔阻挡,具有较佳的散热效果。长时间使用下,固态发光元件可有效散热而不会产生高温,固态发光元件不致发生亮度减弱或使用寿命缩短等问题,可提升照明装置的产品性能。

Description

照明装置
技术领域
本发明涉及一种照明装置,尤其涉及一种可提高散热效率的照明装置。
背景技术
发光二极管(LED,Light Emitting Diode)是一种可将电流转换成特定波长范围的光的半导体元件。发光二极管以其亮度高、工作电压低、功耗小、易与集成电路匹配、驱动简单、寿命长等优点,从而可作为光源而广泛应用于照明领域。
现有的发光二极管灯泡包括有散热件、电源接头、基板(印刷电路板)及多个发光二极管,电源接头连接于散热件的一端,基板连接于散热件的另一端,多个发光二极管设置于基板上。
由于基板多由玻璃纤维棉等材质制成的印刷电路板,具有耐高温的效果,使得基板的热传导效果不佳。因此,设置于基板上的多个发光二极管所产生的热,因受基板的间隔阻挡而无法高效率的将热传导至散热件上进行热交换,造成发光二极管无法有效散热而致高温。长时间使用下,将会造成发光二极管发生亮度减弱及使用寿命缩短等问题。
发明内容
有鉴于此,有必要提供一种可以提高散热效率的照明装置。
一种照明装置,包括散热件、至少一固态发光元件以及基板。所述至少一固态发光元件连接于散热件的一端,所述基板上设有孔洞用以套置于固态发光元件上,并使基板的电路与固态发光元件的电极电性连接。
所述的照明装置由于固态发光元件直接接触于散热件,使得固态发光元件所产生的热可以高效率的直接传导至散热件上进行热交换,而不会被基板所间隔阻挡,具有较佳的散热效果。长时间使用下,固态发光元件可有效散热而不会产生高温,固态发光元件不致发生亮度减弱或使用寿命缩短等问题,可提升照明装置的产品性能。
附图说明
图1是本发明第一实施例的照明装置的示意图。
图2是本发明第二实施例的照明装置的示意图。
图3是本发明第三实施例的照明装置的示意图。
具体实施方式
请参阅图1,本发明第一实施例提供的照明装置100包括散热件10、固态发光元件20、基板30、电源接头40及灯罩50。
所述散热件10包括有第一端及相对于第一端的第二端,散热件10的周缘环设有散热鳍片12,以提升散热件10的热交换效率。于第一实施例中散热件10是由铜、铝等散热效果较佳的材质制成,散热件10的第一端由单一平面所构成。
所述固态发光元件20包括有出光面及相对于出光面的底面,固态发光元件20的底面连接于散热件10的第一端,固态发光元件20设置的数量可依照明需求来增减。固态发光元件20的底面系藉由电性绝缘之导热胶来固定连接于散热件10第一端上。固态发光元件20于第一实施例中实施为发光二极管。
所述基板30上设有孔洞32,所述固态发光元件20可穿设于孔洞32中,从而与基板30结合,并使基板30的电路与固态发光元件20的电极电性连接。基板30于第一实施例中实施为软性电路板,孔洞32的数量及尺寸大小可依固态发光元件20的数量与尺寸大小相应设置。基板30的底面和散热件10第一端间形成有一空隙。
所述电源接头40连接于散热件10的第二端,电源接头40外部可设置常用的螺纹或卡扣结构用以与外部灯座(图未示)连接上并导通电源。电连接用的导线(图未示)可穿过散热件10并电性连接至电源接头40和基板30用来提供电力至基板30和固态发光元件20上。
所述灯罩50具有容置空间52,容置空间52由一开放端54开放,灯罩50的开放端54结合于散热件10的第一端,用以将固态发光元件20及基板30包覆于其容置空间52内。灯罩亦可做为固态发光元件20的光学组件,用以调整固态发光元件20光源的光场分布。光学元件可为透镜或反射罩,用以改变固态发光元件20光源的出射角度或配光曲线。
由于固态发光元件20直接接触于散热件10,使得固态发光元件20所产生的热可以高效率的直接传导至散热件10上进行热交换,而不会被基板30所间隔阻挡,具有较佳的散热效果。
长时间使用下,固态发光元件20可有效散热而不会产生高温,固态发光元件20不致发生亮度减弱或使用寿命缩短等问题,可提升照明装置100的产品性能。
当照明装置需要更高的照度时,可依需求增加固态发光元件设置的数量。请参阅图2,本发明第二实施例提供的照明装置100a包括散热件10、多个固态发光元件20a、基板30a、电源接头40及灯罩50。第二实施例与第一实施例大致相同,其差别在于多个固态发光元件20a的底面分别连接于散热件10的第一端,基板30a上设有多个相应于固态发光元件20a的孔洞32a,所述多个固态发光元件20a可穿设于多个孔洞32a中,从而与基板30a结合,并使基板30a的电路与多个固态发光元件20a的电极电性连接。
由于多个固态发光元件20a分别直接接触于散热件10第一端的不同位置,使得多个固态发光元件20a所产生的热可分别高效率的直接传导至散热件10的不同位置上进行热交换,具有良好的散热效果。
请参阅图3,本发明第三实施例提供的照明装置100b包括散热件10、多个固态发光元件20b、基板30b、电源接头40及灯罩50。第三实施例与第二实施例大致相同,其差别在于散热件10的第一端设有多个斜面14、16,多个固态发光元件20b的底面分别连接于散热件10第一端的多个斜面14、16,如此可使多个固态发光元件20b的出光面以不同角度来照射,可满足广照域的照明需求。
由于多个固态发光元件20b分别直接接触于散热件10第一端的多个斜面14、16,使得多个固态发光元件20b所产生的热可分别高效率的直接传导至散热件10的不同斜面14、16上进行热交换,而不会被基板30b所间隔阻挡,具有较佳的散热效果。
应该指出,上述实施方式仅为本发明的较佳实施方式,本领域技术人员还可在本发明精神内做其它变化。这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。

Claims (17)

1.一种照明装置,包括散热件、至少一固态发光元件以及基板,其特征在于:所述至少一固态发光元件连接于所述散热件的一端,所述基板上设有孔洞,所述固态发光元件可穿设于所述孔洞中,从而与所述基板结合,并使所述基板的电路与所述固态发光元件的电极电性连接。
2.如权利要求1所述的照明装置,其特征在于:所述散热件的周缘环设有散热鳍片,用以提升散热件的热交换效率。
3.如权利要求1所述的照明装置,其特征在于:所述散热件是由铜或铝制成。
4.如权利要求1所述的照明装置,其特征在于:所述散热件与固态发光元件相连接的一端是由单一平面构成。
5.如权利要求1所述的照明装置,其特征在于:所述散热件与固态发光元件相连接的一端是由多个斜面构成,所述固态发光元件分别设置于相应的斜面上。
6.如权利要求1所述的照明装置,其特征在于:所述固态发光元件设置的数量为多个,均匀分布于所述散热件的端面。
7.如权利要求6所述的照明装置,其特征在于:所述基板的孔洞的数量与所述固态发光元件的数量相应设置。
8.如权利要求1所述的照明装置,其特征在于:所述基板为软性电路板。
9.如权利要求1所述的照明装置,其特征在于:所述照明装置还包括电源接头,所述电源接头连接于散热件的另一端,所述电源接头和基板电性连接。
10.如权利要求1所述的照明装置,其特征在于:所述照明装置还包括灯罩,所述灯罩具有容置空间,所述容置空间由一开放端开放,所述灯罩的开放端结合于散热件的一端,用以将所述至少一固态发光元件及基板包覆于其容置空间内。
11.如权利要求1所述的照明装置,其特征在于:所述灯罩做为固态发光元件的光学元件,用以调整所述至少一固态发光元件光源的光场分布。
12.如权利要求1所述的照明装置,其特征在于:所述至少一固态发光元件通过电性绝缘的导热胶来连接于所述散热件的一端上。
13.如权利要求1所述的照明装置,其特征在于:所述基板的底面和所述散热件的所述一端间形成有一空隙。
14.如权利要求1所述的照明装置,其特征在于:所述至少一固态发光元件为发光二极管。
15.一种照明装置,包括散热件、至少一固态发光元件、基板以及电源接头,其特征在于:所述基板设置在所述散热件的一端上并与散热件相隔有一空隙,至少一固态发光元件穿过所述基板并连接于所述散热件的所述一端上,所述基板与所述固态发光元件的电极电性连接,所述电源接头和所述基板电性连接。
16.如权利要求15所述的照明装置,其特征在于:所述散热件的所述一端形成一斜面,所述至少一固态发光元件连接于所述斜面上。
17.如权利要求15所述的照明装置,其特征在于:所述至少一固态发光元件通过电性绝缘的导热胶来连接于所述散热件的所述一端上。
CN2009103083556A 2009-10-16 2009-10-16 照明装置 Pending CN102042518A (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2009103083556A CN102042518A (zh) 2009-10-16 2009-10-16 照明装置
KR1020100090098A KR101167415B1 (ko) 2009-10-16 2010-09-14 조명장치
JP2010206593A JP2011086618A (ja) 2009-10-16 2010-09-15 照明装置
EP10186675A EP2312918A1 (en) 2009-10-16 2010-10-06 Illumination Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103083556A CN102042518A (zh) 2009-10-16 2009-10-16 照明装置

Publications (1)

Publication Number Publication Date
CN102042518A true CN102042518A (zh) 2011-05-04

Family

ID=43003500

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009103083556A Pending CN102042518A (zh) 2009-10-16 2009-10-16 照明装置

Country Status (4)

Country Link
EP (1) EP2312918A1 (zh)
JP (1) JP2011086618A (zh)
KR (1) KR101167415B1 (zh)
CN (1) CN102042518A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208470A (zh) * 2012-03-30 2013-07-17 江苏汉莱科技有限公司 一种非介质嵌合导热方法及其应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101399750B1 (ko) 2012-05-15 2014-05-27 주식회사 포스코엘이디 광 반도체 기반 조명장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7044620B2 (en) * 2004-04-30 2006-05-16 Guide Corporation LED assembly with reverse circuit board
US20060193130A1 (en) * 2005-02-28 2006-08-31 Kazuo Ishibashi LED lighting system
US20070041190A1 (en) * 2005-08-17 2007-02-22 Au Optronics Corp. Bottom lighting module
US20080225533A1 (en) * 2007-03-15 2008-09-18 Industrial Technology Research Institute Light modules
WO2008148029A1 (en) * 2007-05-25 2008-12-04 Molex Incorporated Heat sink for a heat generator and a power source

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
JP2005100810A (ja) * 2003-09-25 2005-04-14 Seiko Epson Corp 光源装置及びプロジェクタ
TWI307799B (en) * 2005-05-25 2009-03-21 Coretronic Corp Backlight module
TWI256454B (en) * 2005-06-03 2006-06-11 Au Optronics Corp Light module
JP3998027B2 (ja) * 2005-07-25 2007-10-24 松下電工株式会社 Ledを用いた照明器具
DE202005012652U1 (de) * 2005-08-11 2005-11-10 Kotzolt, Michael Leistungs-LED-Modell
JP2006080095A (ja) * 2005-12-05 2006-03-23 Elna Co Ltd 発光ダイオード集合体ランプ
JP2008021505A (ja) * 2006-07-12 2008-01-31 Stanley Electric Co Ltd 照明装置
JP4980152B2 (ja) * 2007-06-19 2012-07-18 シャープ株式会社 照明装置
JPWO2009044716A1 (ja) * 2007-10-01 2011-02-10 株式会社光波 発光装置
JP4651701B2 (ja) * 2008-10-17 2011-03-16 三洋電機株式会社 照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7044620B2 (en) * 2004-04-30 2006-05-16 Guide Corporation LED assembly with reverse circuit board
US20060193130A1 (en) * 2005-02-28 2006-08-31 Kazuo Ishibashi LED lighting system
US20070041190A1 (en) * 2005-08-17 2007-02-22 Au Optronics Corp. Bottom lighting module
US20080225533A1 (en) * 2007-03-15 2008-09-18 Industrial Technology Research Institute Light modules
WO2008148029A1 (en) * 2007-05-25 2008-12-04 Molex Incorporated Heat sink for a heat generator and a power source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208470A (zh) * 2012-03-30 2013-07-17 江苏汉莱科技有限公司 一种非介质嵌合导热方法及其应用

Also Published As

Publication number Publication date
KR101167415B1 (ko) 2012-07-19
EP2312918A1 (en) 2011-04-20
KR20110041989A (ko) 2011-04-22
JP2011086618A (ja) 2011-04-28

Similar Documents

Publication Publication Date Title
JP5050250B2 (ja) 熱放散構造を有しかつ最適な光の分布を有するledモジュール
JP3174686U (ja) 照明装置
KR101253199B1 (ko) 조명 장치
US20110170288A1 (en) Led retrofit unit having adjustable heads for street lighting
TW200806920A (en) Illumination device
EP2149743A1 (en) High Efficiency LED lighting unit
KR101021722B1 (ko) 조명장치
US20130301275A1 (en) Led light with multiple heat sinks
RU76418U1 (ru) Источник света
TW201221830A (en) LED light device with improved thermal and optical characteristics
EP2184790A1 (en) Light emitting diode and llght source module having same
CN201697084U (zh) 发光二极管灯具及其具卷绕式热管的散热器
US8517569B2 (en) Illumination device
JP3158243U (ja) 発光ダイオード放熱モジュール
KR200457530Y1 (ko) 결합형 엘이디 조명기기
EP2325557A1 (en) Illumination device with heat dissipation structure
CN102042518A (zh) 照明装置
KR101241249B1 (ko) 조명 장치
US20100149799A1 (en) Led illuminating device and light engine thereof
KR101929256B1 (ko) 조명 장치
KR101742674B1 (ko) 조명 장치
US8333486B2 (en) Illumination device with heat dissipation structure
CN102042517A (zh) 照明装置
KR101860039B1 (ko) 조명 장치
KR101650539B1 (ko) 다각도로 발광하는 led패키지

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110504