CN101982281A - Tin ball feeding device of ball planting bonding machine - Google Patents
Tin ball feeding device of ball planting bonding machine Download PDFInfo
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- CN101982281A CN101982281A CN 201010511370 CN201010511370A CN101982281A CN 101982281 A CN101982281 A CN 101982281A CN 201010511370 CN201010511370 CN 201010511370 CN 201010511370 A CN201010511370 A CN 201010511370A CN 101982281 A CN101982281 A CN 101982281A
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Abstract
The invention relates to a tin ball feeding device of a ball planting bonding machine, relating to a tin ball feeding device. The invention solves the problem that the existing tin ball feeding device is only suitable for vertical feeding and not suitable for stereo packaging feeding. A reverse round table-shaped cavity and a first cylindrical cavity are processed in the middle of a feeding cavity from top to bottom, and mutually and correspondingly communicated; a filter core is arranged in the first cylindrical cavity; a feeding passageway is processed on the feeding cavity; the feeding passageway is mutually communicated with the reverse round table-shaped cavity; a cap is covered on the feeding passageway of the feeding cavity; a reverse conical cavity and a second cylindrical cavity are processed in the middle of a feeding cover and mutually and correspondingly communicated; the second cylindrical cavity is correspondingly communicated with the reverse round table-shaped cavity; a discharge hole is processed on the upper end surface of the feeding cover; and a gas passageway is processed on a base. The feeding device of the invention is applicable to the stereo packaging feeding and can carrying out drying and anti-oxidation protection on tin balls.
Description
Technical field
The present invention relates to a kind of tin ball feeding device, belong to the Electronic Packaging field.
Background technology
Along with the development of electronic product to microminiaturized and multifunction direction, its integrated, modular trend is more and more obvious.Device size is littler, and is lighter, and more complex functions certainly will significantly increase the pin number of device, so the encapsulation technology of high density, high reliability is subjected to extensively paying attention to and developing rapidly.Some are applicable to the face encapsulation technology of high-density packages form, and for example Flip-Chip Using (Flip Chip-FC), BGA Package (Ball Grid Array-BGA), wafer-level package technology such as (Chip Scale Package-CSP) occur in succession.And one of key technology in these method for packing is the accurate location and the making of solder ball bump.
United States Patent (USP) " Solder Ball Supply Device ", the patent No.: US 5,467,913, the tin ball feeding device of this patent is to match by tin ball hopper with tin ball location hole array and tin ball suction nozzle with vacuum slot array, by suction nozzle with the sucking-off and be placed on the chip bonding pad position from hopper of tin ball.Though this device once can take out the tin ball of whole solder ball array and be placed on assigned address, can't change array type, and be not suitable for picking up and discharging of single tin ball, can not be used for the making of single salient point and reprocess.American National patent " Solder Ball Delivery and Reflow Apparatus and Method ", the patent No.: US 6,386,433 B1, the tin ball feeding device of this patent can carry out feeding operation to single tin ball.The tin ball that is about in the hopper imports in the elongated charging line by flexible conduit, but the tin ball guide of move left and right is arranged at the pipeline bottom, by the move left and right of the bullport on the guide, realizes the switch of charging line.Because the self gravitation of tin ball can fall into bullport and finish feeding.This device utilizes the self gravitation of tin ball to finish feeding, is only applicable to vertical feeding situation, is not suitable for the tin ball feeding when carrying out three-dimensional the encapsulation.Obviously, along with the development of MEMS (MEMS) technology, the 3 D stereo encapsulation has become the trend of following encapsulation technology development.
Summary of the invention
The present invention is only applicable to vertical feeding in order to solve existing tin ball feeding device, is not suitable for the problem of three-dimensional encapsulation feeding, and then a tin ball feeding device of planting ball bonding machine is provided.
The present invention solves the problems of the technologies described above the technical scheme of taking to be: tin ball feeding device of planting ball bonding machine of the present invention comprises the feed lid, the feed cavity, capping, base, tracheae, pole bracket and filter core, described base is packed on the upper surface of pole bracket, described feed cavity is packed on the upper surface of base, described feed covers on the upper surface of feed cavity, the middle part of described feed cavity is processed with the rounding bench-type chamber and the first cylinder die cavity from top to bottom, and the rounding bench-type chamber and the first cylinder die cavity are corresponding mutually to be communicated with, described filter core is installed in the first cylinder die cavity, be processed with feeding-passage on the described feed cavity, described feeding-passage and rounding bench-type chamber are interconnected, and described capping is covered on the feeding-passage of feed cavity; The middle part of described feed lid is processed with the inverted cone die cavity and the second cylinder die cavity from top to bottom, and the inverted cone die cavity and the second cylinder die cavity are corresponding mutually to be communicated with, described second cylinder die cavity and the corresponding connection in rounding bench-type chamber, be processed with discharging opening on the upper surface of described feed lid, and discharging opening and inverted cone die cavity are interconnected, and described discharging opening is circular discharging opening; Be processed with gas passage on the described base, and an end of described gas passage is communicated with the first cylinder die cavity, the other end of described gas passage is communicated with the sidewall of base, and described tracheae is installed on the sidewall of base, and tracheae and gas passage are interconnected.
The invention has the beneficial effects as follows: feeding device of the present invention adopts the feed cavity, is blown into nitrogen by tracheae in the feed cavity, and nitrogen blows afloat the tin ball, is applicable to three-dimensional encapsulation feeding, and can carries out drying and protection against oxidation to the tin ball; The each feed of feeding device of the present invention only provides a tin ball, has guaranteed that chip repairing and micro element single-point plant the yield rate of ball bonding; Applied range of the present invention is particularly suitable for the feed of planting ball bonding machine that BGA (Ball Grid Array-BGA) is reprocessed and the MEMS solid encapsulates.
Description of drawings
Fig. 1 is the stereogram of feeding device of the present invention, and Fig. 2 is the sectional view of Fig. 1.
The specific embodiment
The specific embodiment one: shown in Fig. 1～2, the described tin ball feeding device of planting ball bonding machine of present embodiment comprises feed lid 1, feed cavity 2, capping 3, base 4, tracheae 5, pole bracket 6 and filter core 9, described base 4 is packed on the upper surface of pole bracket 6, described feed cavity 2 is packed on the upper surface of base 4, described feed lid 1 covers on the upper surface of feed cavity 2, the middle part of described feed cavity 2 is processed with the rounding bench-type chamber 2-1 and the first cylinder die cavity 2-2 from top to bottom, and the rounding bench-type chamber 2-1 and the first cylinder die cavity 2-2 are corresponding mutually to be communicated with, described filter core 9 is installed in the first cylinder die cavity 2-2, be processed with feeding-passage 2-3 on the described feed cavity 2, described feeding-passage 2-3 and rounding bench-type chamber 2-1 are interconnected, and described capping 3 is covered on the feeding-passage 2-3 of feed cavity 2; The middle part of described feed lid 1 is processed with the inverted cone die cavity 1-1 and the second cylinder die cavity 1-2 from top to bottom, and the inverted cone die cavity 1-1 and the second cylinder die cavity 1-2 are corresponding mutually to be communicated with, described second cylinder die cavity 1-2 and the corresponding connection of rounding bench-type chamber 2-1, be processed with discharging opening 1-3 on the upper surface of described feed lid 1, and discharging opening 1-3 and inverted cone die cavity 1-1 are interconnected, and described discharging opening 1-3 is circular discharging opening; Be processed with gas passage 4-1 on the described base 4, and the end of described gas passage 4-1 is communicated with the first cylinder die cavity 2-2, the other end of described gas passage 4-1 is communicated with the sidewall of base 4, and described tracheae 5 is installed on the sidewall of base 4, and tracheae 5 is interconnected with gas passage 4-1.
Described filter core 9 can guarantee that the tin ball in the feed cavity 2 does not fall into the gas passage 4-1 of supply base 4, can guarantee simultaneously gas can be smoothly by and enter into feed cavity 2.
The specific embodiment two: shown in Fig. 1～2, the internal diameter of the described discharging opening 1-3 of present embodiment is 50～400 μ m.So design is promptly particularly used arbitrary dimension tin ball feed always in the MEMS field applicable to the Electronic Packaging field by changing feed lid 1.Other composition and annexation are identical with the specific embodiment one.
The specific embodiment three: shown in Fig. 1～2, the described feeding device of present embodiment also comprises electromagnetic shaker 7, and described electromagnetic shaker 7 is packed in the middle part of pole bracket 6.So design, the phenomenon of having avoided the tin ball of diameter below 300 μ m to adhere to the cavity inner wall generation separates it by vibration, has improved the success rate of feed.Other composition and annexation are identical with the specific embodiment one or two.
The course of work:
Shown in Fig. 1～2, open charging aperture capping 3, a certain amount of tin ball 10 is inserted in the feed cavity 2 by feeding-passage 2-3, then capping 3 is covered at feeding-passage 2-3 place;
During discharging opening 1-3 above the ball attachment machine suction nozzle moves to feed lid 1, open tracheae 5, nitrogen is entered in the feed cavity 2 via the gas passage 4-1 of base 4, tin ball 10 is blown afloat to " boiling " shape;
Cooperate the absorption of the vacuum slot 8 of planting ball bonding machine, finish absorption single tin ball 10;
Close the air inlet of tracheae 5 and discharge cavity pressure, open electromagnetic shaker 7 and continue to close after 0.2 second.
Claims (3)
1. tin ball feeding device of planting ball bonding machine, described feeding device comprises feed lid (1), feed cavity (2), capping (3), base (4), tracheae (5), pole bracket (6) and filter core (9), described base (4) is packed on the upper surface of pole bracket (6), described feed cavity (2) is packed on the upper surface of base (4), described feed lid (1) covers on the upper surface of feed cavity (2), it is characterized in that: the middle part of described feed cavity (2) is processed with the rounding bench-type chamber (2-1) and the first cylinder die cavity (2-2) from top to bottom, and the rounding bench-type chamber (2-1) and the first cylinder die cavity (2-2) are corresponding mutually to be communicated with, described filter core (9) is installed in the first cylinder die cavity (2-2), be processed with feeding-passage (2-3) on the described feed cavity (2), described feeding-passage (2-3) is interconnected with rounding bench-type chamber (2-1), and described capping (3) is covered on the feeding-passage (2-3) of feed cavity (2); The middle part of described feed lid (1) is processed with the inverted cone die cavity (1-1) and the second cylinder die cavity (1-2) from top to bottom, and the inverted cone die cavity (1-1) and the second cylinder die cavity (1-2) are corresponding mutually to be communicated with, described second cylinder die cavity (1-2) and the corresponding connection in rounding bench-type chamber (2-1), be processed with discharging opening (1-3) on the upper surface of described feed lid (1), and discharging opening (1-3) is interconnected with inverted cone die cavity (1-1), and described discharging opening (1-3) is circular discharging opening; Be processed with gas passage (4-1) on the described base (4), and an end of described gas passage (4-1) is communicated with the first cylinder die cavity (2-2), the other end of described gas passage (4-1) is communicated with the sidewall of base (4), described tracheae (5) is installed on the sidewall of base (4), and tracheae (5) is interconnected with gas passage (4-1).
2. tin ball feeding device of planting ball bonding machine according to claim 1 is characterized in that: the internal diameter of described discharging opening (1-3) is 50～400 μ m.
3. tin ball feeding device of planting ball bonding machine according to claim 1 and 2, it is characterized in that: described feeding device also comprises electromagnetic shaker (7), described electromagnetic shaker (7) is packed in the middle part of pole bracket (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105113703A CN101982281B (en) | 2010-10-19 | 2010-10-19 | Tin ball feeding device of ball planting bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105113703A CN101982281B (en) | 2010-10-19 | 2010-10-19 | Tin ball feeding device of ball planting bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101982281A true CN101982281A (en) | 2011-03-02 |
| CN101982281B CN101982281B (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105113703A Expired - Fee Related CN101982281B (en) | 2010-10-19 | 2010-10-19 | Tin ball feeding device of ball planting bonding machine |
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| CN (1) | CN101982281B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109559994A (en) * | 2017-09-26 | 2019-04-02 | 常州高凯精密机械有限公司 | A kind of tin ball sequence separator |
| CN112259478A (en) * | 2020-10-23 | 2021-01-22 | 技感半导体设备(南通)有限公司 | Ball scraping and spreading device and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264930A (en) * | 1995-03-24 | 1996-10-11 | Shibuya Kogyo Co Ltd | Method for supplying solder ball |
| US6742694B2 (en) * | 2001-02-16 | 2004-06-01 | Hitachi Global Storage Technologies Netherlands B.V. | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| CN101151947A (en) * | 2005-03-30 | 2008-03-26 | 富士通株式会社 | Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
-
2010
- 2010-10-19 CN CN2010105113703A patent/CN101982281B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264930A (en) * | 1995-03-24 | 1996-10-11 | Shibuya Kogyo Co Ltd | Method for supplying solder ball |
| US6742694B2 (en) * | 2001-02-16 | 2004-06-01 | Hitachi Global Storage Technologies Netherlands B.V. | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| CN101151947A (en) * | 2005-03-30 | 2008-03-26 | 富士通株式会社 | Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109559994A (en) * | 2017-09-26 | 2019-04-02 | 常州高凯精密机械有限公司 | A kind of tin ball sequence separator |
| CN109559994B (en) * | 2017-09-26 | 2024-05-10 | 江苏高凯精密流体技术股份有限公司 | Tin ball sorting and separating device |
| CN112259478A (en) * | 2020-10-23 | 2021-01-22 | 技感半导体设备(南通)有限公司 | Ball scraping and spreading device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101982281B (en) | 2012-05-30 |
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