CN101975791A - Method and device for detecting microwave curing condition of epoxy resin - Google Patents
Method and device for detecting microwave curing condition of epoxy resin Download PDFInfo
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- CN101975791A CN101975791A CN 201010277350 CN201010277350A CN101975791A CN 101975791 A CN101975791 A CN 101975791A CN 201010277350 CN201010277350 CN 201010277350 CN 201010277350 A CN201010277350 A CN 201010277350A CN 101975791 A CN101975791 A CN 101975791A
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- epoxy resin
- microwave
- infrared temperature
- infrared
- temperature sensor
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Abstract
The invention relates to method and device for detecting a microwave curing condition of epoxy resin. The device comprises a microwave generator and an infrared temperature sensor arranged above the epoxy resin, wherein an infrared window of the infrared temperature sensor just faces to an infrared temperature sensing hole. When the device works, the epoxy resin is not cured when the temperature of the epoxy resin, detected by the infrared sensor, in a microwave environment rises, the epoxy chain is completely broken and cured when the temperature of the epoxy resin in the microwave environment rises without changing or reducing, and microwave radiation is immediately stopped. Because microwaves can not penetrate through the infrared temperature sensing hole, the damage of the microwave to an electric circuit in the infrared temperature sensor is avoided.
Description
Technical field
The present invention relates to a kind of epoxy resin cure situation detection method and device, particularly a kind of epoxy resin microwave curing situation detection method and device.
Background technology
At present, the epoxy resin microwave curing is because the leakage of microwave radiation and to the harm of environment is to carry out in a confined space.So the curing situation to the epoxy resin in microwave environment is only estimated with microwave power and time, can not measure in real time.Finally cause solidification process out of hand.
Summary of the invention
The purpose of this invention is to provide a kind of epoxy resin microwave curing situation detection method and device.Utilize this system, can improve the work efficiency of epoxy resin microwave curing, reduce power consumption, reduce the electronics of microwave tube and fight back.
For achieving the above object, the technical scheme that epoxy microwave resin solidification situation detection method of the present invention and device adopt is: microwave generator and infrared temperature sensor are arranged on the top of epoxy resin.Infrared temperature sensor is arranged on the top of micro-wave screening cover, and the infrared window of infrared temperature sensor is over against infrared temperature sensing hole, and the girth in infrared temperature sensing hole is 1/4th a integral multiple of microwave wavelength.During work, microwave generator sends microwave and arrives epoxy resin by uncured epoxy resin absorption.When epoxy resin absorbed microwave, the temperature of epoxy resin constantly raise.This temperature rising meeting is detected by infrared temperature sensor.After the epoxy chain of epoxy resin is interrupted, just no longer absorb the energy of microwave, this moment, temperature was with regard to no longer rising or temperature begin to descend.So, the temperature of epoxy resin in microwave environment that detects by infrared sensor then is not cured for epoxy resin when rising, do not change after the temperature of epoxy resin rises in microwave environment or when descending then for the epoxy chain of epoxy resin is interrupted curing fully, should stop microwave radiation immediately.Because the girth in infrared temperature sensing hole is 1/4th a integral multiple of microwave wavelength, microwave can not pass infrared temperature sensing hole, so avoided the infringement of microwave to electronic circuit in the infrared temperature sensor.
Epoxy resin microwave curing situation detection method of the present invention and device reach the epoxy resin cure situation function in the real-time monitoring microwave environment, in time adjust microwave radiation according to the epoxy resin cure situation, thereby reach the purpose of quick curing and energy savings.
The invention has the beneficial effects as follows: improved the efficient of microwave curing, simple in structure, easy to maintenance, use cheap, with low cost.
Description of drawings
Fig. 1 is the schematic diagram of epoxy resin microwave curing situation detection method of the present invention and device.
Fig. 2 is the infrared temperature sensor micro-wave screening figure of epoxy resin microwave curing situation detection method of the present invention and device.
Fig. 3 is the structural drawing of epoxy resin microwave curing situation detection method of the present invention and device.
1. microwave generators among the figure, 2. epoxy resin, 3. infrared temperature sensor, 4. micro-wave screening cover, 5. infrared temperature sensing hole, 6. infrared temperature sensor support, 7. microwave radiation hole.
Embodiment
In Fig. 1, microwave generator 1 and infrared temperature sensor 3 are arranged on the top of epoxy resin 2.
In Fig. 2, infrared temperature sensor 3 is arranged on the top of micro-wave screening cover 4, an infrared temperature sensing hole 5 is set on the micro-wave screening cover 4, the infrared window of infrared temperature sensor 3 is over against infrared temperature sensing hole 5, and the girth in infrared temperature sensing hole 5 is 1/4th a integral multiple of microwave wavelength.
In Fig. 3, infrared temperature sensing hole 5 and microwave radiation hole 7 are set on the micro-wave screening cover 4, on the micro-wave screening cover 4 at 5 places, infrared temperature sensing hole, connect infrared temperature sensor support 6, infrared temperature sensor support 6 connects infrared temperature sensor 3, and the infrared window that makes infrared temperature sensor 3 is over against infrared temperature sensing hole 5.Microwave generator 1 passes microwave radiation hole 7 and is installed on the micro-wave screening cover 4.
Claims (2)
1. epoxy resin microwave curing situation detection method and device, comprise microwave generator, epoxy resin, infrared temperature sensor, micro-wave screening cover, infrared temperature sensing hole, infrared temperature sensor support, microwave radiation hole, it is characterized in that: the temperature of epoxy resin in microwave environment that detects by infrared sensor then is not cured for epoxy resin when rising, do not change after the temperature of epoxy resin rises in microwave environment or when descending then for the epoxy chain of epoxy resin is interrupted curing fully, should stop microwave radiation immediately.
2. by the described epoxy resin microwave curing of claim 1 situation detection method and device, it is characterized in that: infrared temperature sensor is arranged on the top of micro-wave screening cover, the infrared window of infrared temperature sensor is over against infrared temperature sensing hole, and the girth in infrared temperature sensing hole is 1/4th a integral multiple of microwave wavelength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010277350 CN101975791A (en) | 2010-09-10 | 2010-09-10 | Method and device for detecting microwave curing condition of epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010277350 CN101975791A (en) | 2010-09-10 | 2010-09-10 | Method and device for detecting microwave curing condition of epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101975791A true CN101975791A (en) | 2011-02-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010277350 Pending CN101975791A (en) | 2010-09-10 | 2010-09-10 | Method and device for detecting microwave curing condition of epoxy resin |
Country Status (1)
| Country | Link |
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| CN (1) | CN101975791A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108151089A (en) * | 2016-12-02 | 2018-06-12 | 沃西澳公司 | Overhead guard and measuring system |
| CN111764050A (en) * | 2020-06-19 | 2020-10-13 | 北京卫星制造厂有限公司 | Insulation board production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006044487A1 (en) * | 2006-09-21 | 2008-04-03 | Airbus Deutschland Gmbh | Sheet material for repairing fibre-reinforced components, e.g. cracked panels in airliners, comprises heat-curable resin containing glass fibres with a conductive coating which heats up in an alternating electromagnetic field |
| US7553670B2 (en) * | 2004-04-28 | 2009-06-30 | 3M Innovative Properties Company | Method for monitoring a polymerization in a three-dimensional sample |
| CN201342770Y (en) * | 2009-01-09 | 2009-11-11 | 麦克奥迪（厦门）电气有限公司 | Self-heating die for vacuum casting of epoxy resin insulating casting part |
-
2010
- 2010-09-10 CN CN 201010277350 patent/CN101975791A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7553670B2 (en) * | 2004-04-28 | 2009-06-30 | 3M Innovative Properties Company | Method for monitoring a polymerization in a three-dimensional sample |
| DE102006044487A1 (en) * | 2006-09-21 | 2008-04-03 | Airbus Deutschland Gmbh | Sheet material for repairing fibre-reinforced components, e.g. cracked panels in airliners, comprises heat-curable resin containing glass fibres with a conductive coating which heats up in an alternating electromagnetic field |
| CN201342770Y (en) * | 2009-01-09 | 2009-11-11 | 麦克奥迪（厦门）电气有限公司 | Self-heating die for vacuum casting of epoxy resin insulating casting part |
Non-Patent Citations (2)
| Title |
|---|
| 《材料科学与工程学报》 20050831 周文英等 环氧树脂及其复合材料微波固化研究 625-628 第23卷, 第4期 * |
| 《高分子材料科学与工程》 20040531 刘学清等 微波固化环氧树脂（E44/DDM）的热性能及膨胀性能 第20卷, 第3期 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108151089A (en) * | 2016-12-02 | 2018-06-12 | 沃西澳公司 | Overhead guard and measuring system |
| CN108151089B (en) * | 2016-12-02 | 2019-06-28 | 沃西澳公司 | Overhead guard and measuring system |
| CN111764050A (en) * | 2020-06-19 | 2020-10-13 | 北京卫星制造厂有限公司 | Insulation board production line |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110216 |