CN101972876B - MBS bridge type rectifier welding process - Google Patents
MBS bridge type rectifier welding process Download PDFInfo
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- CN101972876B CN101972876B CN201010509038A CN201010509038A CN101972876B CN 101972876 B CN101972876 B CN 101972876B CN 201010509038 A CN201010509038 A CN 201010509038A CN 201010509038 A CN201010509038 A CN 201010509038A CN 101972876 B CN101972876 B CN 101972876B
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- tin cream
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Abstract
The invention discloses an MBS bridge type rectifier welding procedure, including the following steps: a, chip P face prewelding is carried out, namely a soldering flake with uniform soldering tin amount is used for carrying out chip P face prewelding, so as to ensure N face of chip to be even; b, a solder paste wetting pen is used for wetting solder paste, namely the solder paste wetting pen is used for wetting quantitative solder paste on a tablet; c, a prewelding chip is positioned, namely the even N face of chip is positioned on the tablet by virtue of solder paste with higher viscosity after the step b; d, the tablets are combined; e, tunnel furnace welding is carried out. The invention has the beneficial effects that: soldering flake with uniform soldering tin amount is used for carrying out P face prewelding, so that solder paste amount of P face of chip can be fully ensured to certain extent; solder paste with higher viscosity is used for positioning the chip, thus overcoming the defect of welding deviation as viscosity of soldering flux is not high enough; the method has extremely less investment and operation convenience; time for manually adjusting deviated chip is greatly reduced, and efficiency is improved by more than 2.5 times; and the original welding deviation reject ratio is reduced to 0% from 15%.
Description
Technical field
The present invention relates to the electronic product processing technique field, particularly a kind of welding procedure of MBS bridge rectification device.
Background technology
The electricity-saving lamp industry is used semiconductor rectifier device at present; Mainly with " the chip prewelding; after assembly welding again " mode weld, its shortcoming is: this chip area of rectifying device that is used for electricity-saving lamp is very little, similar square of its profile or sphere behind prewelding; And occur when causing assembly welding the prewelding chip be difficult for dividing to, prewelding chip with scaling powder be difficult for the location, the chip off normal appears in welding product, and inefficiency etc.
Along with the development of production technology, people's manipulator that begins one's study is used for the feasibility that the welding of this product is produced, and through the evidence of most producers, this method can be improved the situation of product chips off normal, but this method is mainly introduced import equipment, and price is high, and cost is big; And the tin cream amount for chip P face is wayward, causes reliability of products can still have the problem of inefficacy.
Summary of the invention
To the problems referred to above, the invention provides a kind of welding procedure that combines tin cream to weld with the chip prewelding, this welding procedure input cost is low, efficient is high, weld no off normal etc.
In order to reach above-mentioned technique effect, the technical scheme that the present invention adopts is following: a kind of MBS bridge rectification device welding procedure, this technology comprises the steps:
A. chip P face prewelding: carry out chip P face prewelding with soldering tin amount weld tabs of the same size, and guarantee that the N face of chip is smooth;
B. tin cream is stained with a tin sticky cream: be stained with pen with tin cream and be stained with quantitative tin cream on tablet;
C. the prewelding chip is located: after the b step, be positioned on the tablet through the bigger viscosity of the tin cream N face that chip is smooth;
D. tablet combination;
E. advance the continuous tunnel furnace welding.
The present invention comprises that also to the cover plate design of tablet location, tablet location cover plate is slim aluminum alloy frame, is used for tablet is positioned the tablet dish.
The present invention also comprises the design to the tin cream box, and the tin cream box is the aluminium alloy grooved, and tin cream is stained with pen can just put into groove.
The present invention comprises also welding is designed with sucker that the hole depth of sucker is 0.3mm～0.4mm, and sets up the lead angle of 0.1mm around it.
In addition, used tin cream is stained with pen and is stained with pen for aluminium alloy among the present invention, and carries out positive electricity plating really up to the mark and handle.
The invention has the beneficial effects as follows: carry out chip P face prewelding with soldering tin amount weld tabs of the same size, make how much being fully guaranteed of soldering tin amount of chip P face; The solder(ing) paste bigger with ratio of viscosities positions chip, causes the bad of welding off normal inadequately thereby improved scaling powder viscosity; This method input cost is few, easy to operate first; Second significantly reduced artificial adjustment and deflected away from the time of chip, raised the efficiency more than 2.5 times; Three are reduced to 0% with former welding off normal fraction defective 15%.
The specific embodiment
For the present invention is understood more easily, the present invention is done more detailed description below in conjunction with the specific embodiment.
At first, the chip branch is stained with a frock to sucker, tablet location cover plate, tin cream box and tin cream and designs concrete the design as follows:
. chip divides and design to sucker: the hole depth of present sucker is designed to 0.35mm by 0.5mm, and increases the lead angle of 0.1mm all around, so that 100% anti-(turning over) of chip is to function;
The cover plate design of tablet location: be designed to slim aluminum alloy frame, purpose is that tablet is positioned on the tablet dish, when tin cream is stained with operation, can tablet is not taken up and causes tin sticky cream uneven phenomenon;
Tin cream box design: be designed to small-sized aluminium alloy grooved, and make tin cream be stained with pen just to put into this groove; Purpose is the each point that makes tin cream the be stained with pen very uniformly tin cream point that can in this tin cream box, share equally;
Tin cream is stained with a frock design: combine the position of each point on the tablet drawing, the design aluminium alloy is stained with pen, and is anti-oxidation distortion, it is carried out hard positive electricity plating handle; Actual purpose is to be stained with pen through this tin cream can tin cream be stained with the position on the corresponding tablet uniformly.
Then, carry out chip P face and connect (weldering) in advance: similar producer product prewelding is that P, the N face of chip all carries out prewelding, and the chip behind the prewelding is because the parcel of scolding tin makes the P of chip, N face all heave similar sphere; The present invention then is a P face with soldering tin amount weld tabs prewelding of the same size chip, and the N face of chip is then very smooth.
Then; Carry out tin cream and be stained with a tin sticky cream and prewelding chip location: product does not in the market use this technology, but is positioned on the tablet being coated with the chip of one deck scaling powder after with prewelding on the tablet, and such one is that scaling powder viscosity is lower; The 2nd, the chip P behind the prewelding, the equal ovalize of N face; Less with the contact area of tablet, cause chip and be easy to occur off normal, run out of tablet position phenomenon, so just need the artificial chip of adjusting deflection.The present invention is stained with pen with tin cream to be stained with quantitative tin cream on tablet; The back is positioned at the fixed position of tablet firmly through the bigger viscosity of the tin cream N face that chip is smooth; This technology has just been saved the time of artificial adjustment chip, has reduced cost, has improved efficient.
Tablet combination: for the same tablet of size design; The tablet combination meeting of present similar producer product off normal occurs owing to the height increase of prewelding chip causes the extruding that chip more is subject to two tablets, therefore before product advances continuous tunnel furnace, also needs artificial chip to the extruding deflection to adjust; And the height of prewelding chip of the present invention is lower, and the bigger tin cream location of viscosity is arranged, and can not occur being extruded the situation of off normal fully, also with regard to not needing manual work that chip is adjusted, has saved the time, has reduced cost of labor, has promoted efficient.
Advance continuous tunnel furnace welding: at present producer's product advance continuous tunnel furnace welding procedure and this invention to advance the process that continuous tunnel furnace welds the same.
Through the site operation personnel is carried out training on operation; And through practical operation rehearsal evaluation personnel technical ability; Form training program; Carry out the action of periodic Ongoing Training, so that operator's hints on operation and reach the level that new design frock is handled very skillfully on top of, then to the effect comparison of two kinds of welding methods:
Same operating personnel in the same workaday working time, produce product to two kinds of methods and compare monitoring; The result is following:
The product performance index test:
Claims (5)
1. MBS bridge rectification device welding procedure, it is characterized in that: this technology comprises the steps:
A. chip P face prewelding: carry out chip P face prewelding with soldering tin amount weld tabs of the same size, and guarantee that the N face of chip is smooth;
B. tin cream is stained with a tin sticky cream: be stained with pen with tin cream and be stained with quantitative tin cream on tablet;
C. the prewelding chip is located: after the b step, be positioned on the tablet through the bigger viscosity of the tin cream N face that chip is smooth;
D. tablet combination;
E. advance the continuous tunnel furnace welding.
2. according to the said a kind of MBS bridge rectification device welding procedure of claim 1, it is characterized in that: this technology comprises that also to the cover plate design of tablet location, tablet location cover plate is slim aluminum alloy frame, is used for tablet is positioned the tablet dish.
3. according to the said a kind of MBS bridge rectification device welding procedure of claim 1, it is characterized in that: this technology also comprises the design to the tin cream box, and the tin cream box is the aluminium alloy grooved, and tin cream is stained with pen can just put into groove.
4. according to claim 2 or 3 said a kind of MBS bridge rectification device welding procedures, it is characterized in that: said tin cream is stained with pen and is stained with pen for aluminium alloy, and it is carried out hard positive electricity plating handle.
5. according to the said a kind of MBS bridge rectification device welding procedure of claim 1, it is characterized in that: this technology comprises also welding is designed with sucker that the hole depth of sucker is 0.3mm～0.4mm, and sets up the lead angle of 0.1mm around it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010509038A CN101972876B (en) | 2010-10-18 | 2010-10-18 | MBS bridge type rectifier welding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010509038A CN101972876B (en) | 2010-10-18 | 2010-10-18 | MBS bridge type rectifier welding process |
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| Publication Number | Publication Date |
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| CN101972876A CN101972876A (en) | 2011-02-16 |
| CN101972876B true CN101972876B (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010509038A Active CN101972876B (en) | 2010-10-18 | 2010-10-18 | MBS bridge type rectifier welding process |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513633A (en) * | 2011-11-30 | 2012-06-27 | 常州星海电子有限公司 | Soldering method of ABS (Acrylonitrile Butadiene Styrene) rectifier bridge |
| CN103117230B (en) * | 2012-10-25 | 2015-11-04 | 南通康比电子有限公司 | A kind of technique of DIP rectifier bridge of high response |
| CN104465410A (en) * | 2013-09-16 | 2015-03-25 | 瑞安市固特威汽车配件有限公司 | Rectifier bridge preparation process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0307319A2 (en) * | 1987-09-11 | 1989-03-15 | Senju Metal Industry Co., Ltd. | Reflow furnace |
| CN1267910A (en) * | 1999-03-19 | 2000-09-27 | 国际商业机器公司 | Ball grid array package capable of relieving stress |
| CN1339174A (en) * | 1999-01-29 | 2002-03-06 | 松下电器产业株式会社 | Electronic parts mounting method and device therefor |
| JP4082462B1 (en) * | 2007-09-27 | 2008-04-30 | 株式会社ヤスカワ | Reflow furnace |
| CN101835350A (en) * | 2010-04-26 | 2010-09-15 | 迈普通信技术股份有限公司 | PCB connector strengthening method and device |
-
2010
- 2010-10-18 CN CN201010509038A patent/CN101972876B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0307319A2 (en) * | 1987-09-11 | 1989-03-15 | Senju Metal Industry Co., Ltd. | Reflow furnace |
| CN1339174A (en) * | 1999-01-29 | 2002-03-06 | 松下电器产业株式会社 | Electronic parts mounting method and device therefor |
| CN1267910A (en) * | 1999-03-19 | 2000-09-27 | 国际商业机器公司 | Ball grid array package capable of relieving stress |
| JP4082462B1 (en) * | 2007-09-27 | 2008-04-30 | 株式会社ヤスカワ | Reflow furnace |
| CN101835350A (en) * | 2010-04-26 | 2010-09-15 | 迈普通信技术股份有限公司 | PCB connector strengthening method and device |
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| CN101972876A (en) | 2011-02-16 |
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