CN101924066B - Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device - Google Patents
Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device Download PDFInfo
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- CN101924066B CN101924066B CN 200910146997 CN200910146997A CN101924066B CN 101924066 B CN101924066 B CN 101924066B CN 200910146997 CN200910146997 CN 200910146997 CN 200910146997 A CN200910146997 A CN 200910146997A CN 101924066 B CN101924066 B CN 101924066B
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- flexible substrate
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Abstract
The invention provides a method for separating a flexible substrate from a support plate and a manufacturing method of a flexible electronic device. The method comprises the following steps: providing the flexible substrate which is provided with a lower surface; carrying out surface treatment on the lower surface of the flexible substrate to form a lower surface with an anti-adhesion characteristic; configuring the flexible substrate on the support plate by an adhesive layer, wherein, the lower surface with the anti-adhesion characteristic faces towards the support plate; and cutting and separating the flexible substrate configured on the support plate.
Description
[technical field]
The present invention is about a kind of method of separating flexible substrate from support plate, particularly about a kind of by after surface treatment with the method for separating flexible substrate from support plate.
[background technology]
Flat-panel screens is in the large tracts of land development, and the characteristic with lighter, thinner and deflection will become the target that following display is mainly pursued.Therefore, make with flexible substrate the development trend that two-d display panel will become following display.
The manufacture method of the thin-film transistor array base-plate of present bendable flat-panel screens, to make of existing glass substrate Preparation equipment, first plastic base is pasted on support plate by adhesive phase, carry out again the manufacturing step of the elements such as thin-film transistor (thin film transistor, TFT) on plastic base.Though this kind mode can reach sheet to the making flow process of sheet (Sheet to Sheet), also reach general preparation requirement, but after elements such as completing thin-film transistor was made, the problem that must face was that the plastic base that how successfully this to be had thin film transistor (TFT) array takes off from support plate.
[summary of the invention]
One of the present invention execution mode proposes a kind of method of separating flexible substrate from support plate, and comprising: flexible substrate is provided, and wherein this flexible substrate has lower surface; Lower surface to this flexible substrate carries out surface treatment, has the lower surface of anti-adhesion characteristic with formation; By adhesive phase, this flexible substrate is disposed on support plate, wherein this lower surface with anti-adhesion characteristic is towards this support plate; And, this flexible substrate that is disposed on this support plate is cut disengaging.
Another execution mode of the present invention also provides a kind of manufacture method of flexible electronic device, comprises: flexible substrate is provided, and wherein this flexible substrate has upper surface and lower surface; Lower surface to this flexible substrate carries out surface treatment, has the zone of anti-adhesion characteristic with formation, partly is not defined as the zone with tack and carry out surface-treated; By adhesive phase, this flexible substrate is disposed on support plate, wherein this adhesive phase cover this flexible substrate this have the zone of anti-adhesion characteristic and this has the zone of tack; Form electronic component in the upper surface of this flexible substrate; And, cut being positioned at this this flexible substrate with zone of anti-adhesion characteristic, obtain flexible electronic device.
Below by several embodiment and coordinate appended graphicly, illustrating further the present invention, but be not the scope that limits the present invention, scope of the present invention should be as the criterion with claims.
[description of drawings]
Fig. 1 a-1d is a series of profiles, shows the method for the described separating flexible substrate from support plate of an embodiment of the present invention.
Fig. 2 shows the described surface treatment that utilizes chemical reagent to carry out flexible substrate of an embodiment of the present invention.
Fig. 3 a-3e is a series of profiles, shows the method for the described separating flexible substrate from support plate of another execution mode of the present invention.
Fig. 4 is the upward view of structure shown in Fig. 3 c.
Fig. 5 shows the described surface treated flexible substrate of another execution mode of the present invention, and it comprises the zone that has anti-adhesion characteristic through patterned.
Fig. 6 is profile, shows the flexible substrate of cutting gained, and its size can have less than this size in the zone of anti-adhesion characteristic.
Fig. 7 a-7d is a series of profiles, and demonstration an embodiment of the present invention is described reacts chemical reagent and flexible substrate in the rotary coating mode, forms the manufacturing process in the zone with anti-adhesion characteristic.
Fig. 8 a-8d is a series of profiles, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the manufacturing process in the zone with anti-adhesion characteristic in the impression mode.
Fig. 9 a-9d is a series of profiles, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the manufacturing process in the zone with anti-adhesion characteristic with roll coating model.
Figure 10 is profile, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the zone that patterning has anti-adhesion characteristic with roll-type letterpress technology.
Figure 11 a-11b is a series of profiles, shows the manufacture method of the described flexible electronic device of an embodiment of the present invention.
[main element symbol description]
10～flexible substrate;
11～lower surface;
12～chemical reagent;
13～have a zone of tack;
14～adhesive phase;
The lower surface of 15～tool anti-adhesion characteristic;
16～support plate;
17～have a zone of anti-adhesion characteristic;
18～roller;
19～pressing direction;
21～line of cut;
Flexible substrate after 22～cutting;
24～photoresist layer;
25～upper surface;
26～template;
28～roller;
29～coating direction;
30～electronic component; And
40～flexible electronic device.
[execution mode]
Below, please coordinate graphicly, describe the method for the described separating flexible substrate from support plate of the embodiment of the present invention in detail:
At first, please refer to Fig. 1 a, flexible substrate 10 is provided, wherein this flexible substrate 10 has lower surface 11.this flexible substrate 10 can comprise polymeric substrate, or metal substrate, in this execution mode, can be polymeric substrate, polyimides (polyimide for example, PI), Merlon (polycarbonate, PC), polyether sulfone (polyethersulfone, PES), polynorbornene (polynorbornene, PNB), Polyetherimide (polyetherimide, PEI), PEN (polyethylenenaphthalate, PEN) or PETG (polyethylene terephthalate, PET).
Then, please refer to Fig. 1 b, the lower surface 11 of this flexible substrate 10 is carried out surface treatment, have the lower surface 15 of anti-adhesion characteristic with formation.At this, this surface treatment can comprise on the lower surface 11 that provides chemical reagent 12 to be formed at this flexible substrate 10 and with this flexible substrate 10 reacts (please refer to Fig. 2), obtains having the flexible substrate 10 (please refer to Fig. 1 b) of the lower surface 15 of anti-adhesion characteristic.In addition, another execution mode according to the present invention, the lower surface 11 of this flexible substrate 10 is carried out surface treatment can be plasma treatment, ion beam bombardment, electronics bombardment, etch processes, friction treatment or above-mentioned combination, mainly utilize plasma to come treatment surface, take argon gas as carrier gas, reaction atmosphere is CF
2, CF
3Or contain silica-based gas, create stable plasma under atmospheric environment.
It should be noted that, the lower surface 11 of this flexible substrate 10 is after this surface treatment, can be consumed, cover or replace with the functional group that follow-up formed adhesive phase produces bond on this lower surface 11, causing the lower surface with anti-adhesion characteristic 15 of gained and the tack between follow-up formed adhesive phase significantly to reduce.At this, the functional group of these flexible substrate 10 upper surfaces and the producible bond of adhesive phase comprise ionic bond, covalent bond or hydrogen bond, and wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
The chemical reagent 12 that one of the present invention execution mode uses has the structure that functional group with the lower surface 11 of flexible substrate 10 carries out addition reaction, sloughs reaction or substitution reaction, and for instance, this chemical reagent 12 can have following structure:
Wherein, W is C, Si or Ge; X is S or Se; Y is C or S;
R
1, R
2And R
3Independent separately, and be hydrogen, alkyl, alkyl ,-OR or its make up, wherein R is carbon number between 1～18 alkyl;
R
4Be F, Cl, Br, I, carboxyl, amido, amino, cyano group, amide groups, haloalkyl or its combination; And
R
5And R
6System is independent and be F, Cl, Br, I, alkyl, alkyl, carboxyl, amido, amide groups, haloalkyl or its combination separately.
In this application, R
1, R
2, R
3, R
4, R
5And R
6" alkyl " in definition can comprise that carbon number is 1～6 alkyl; " alkyl " can comprise that carbon number is 1～6 straight or branched alkyl, such as methyl, ethyl group, 2-methyl ethane base etc.; " haloalkyl " can comprise that carbon number is 1～5 haloalkyl.
For instance, this chemical reagent 12 can comprise: dimethylchlorosilane, trim,ethylchlorosilane, trimethyl chloromethanes, 1-chloromethyl-1-trimethyl silane, 2-N-Propyl Bromide, dimethyldichlorosilane, Trimethlyfluorosilane, bromotrimethylsilane, Iodotrimethylsilane, trimethylsilyl cyanide, thionyl chloride, chlorotriethyl silane or its mixing.The use form of this chemical reagent 12 is also unrestricted, can be liquid state, gaseous state or solid-state reagent, and better is liquid reagent, and its boiling point can be less than 200 ℃, and better for 100 ℃, better is just can dry liquid when normal temperature.
In one embodiment, process flexible substrate with chemical reagent (at this take thionyl chloride (thionyl chloride) as example).In one of the present invention execution mode, the temperature of reacting can be room temperature, and the time of reaction can be 1 minute.
Then, please refer to Fig. 1 c, by adhesive phase 14, this flexible substrate 10 is disposed on support plate 16, wherein this lower surface 15 with anti-adhesion characteristic contacts with this adhesive phase 14, and towards this support plate 16.Then, utilize roller 18 towards pressing direction 19, flexible substrate 10 closely is pasted to this adhesive phase 14.This support plate 16 is for generally to have the hard substrate of certain rigid, and it can be for example metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer, in this execution mode, can be glass substrate.In this execution mode, the functional group that can produce bonds with this adhesive phase 14 due to the lower surface with anti-adhesion characteristic 15 surfaces of this flexible substrate 10 by this chemical reagent 12 consume and convert to other can with the functional group of adhesive phase 14 generation bonds.Therefore, this adhesive phase 14 and surface treated flexible substrate 10 degree of adhering to (adherence) are compared with not surface treated flexible substrate 10, can decline to a great extent.At last, please refer to Fig. 1 d, this flexible substrate 10 is separated.
In addition, please refer to following preparation process, be another execution mode of method of separating flexible substrate from support plate of the present invention.
At first, please refer to Fig. 3 a, flexible substrate 10 is provided, wherein this flexible substrate 10 has lower surface 11.Then, please refer to Fig. 3 b and 3c, the part lower surface 11 of this flexible substrate 10 is carried out surface treatment, the zone 17 that has anti-adhesion characteristic with formation, do not carry out the surface-treated part and be defined as the zone 13 with tack, and please refer to Fig. 5, it is the upward view of Fig. 3 c.This surface treatment comprises to be provided on the part lower surface 11 that chemical reagent 12 is formed at this flexible substrate 10 and reacts (please refer to Fig. 3 b) with this flexible substrate 10, obtains comprising the flexible substrate 10 (please refer to Fig. 3 c) in the zone 17 with anti-adhesion characteristic.Formed zone 17 with anti-adhesion characteristic can be graphical form (for example rectangle, circle or other figures); In addition, this zone 17 with anti-adhesion characteristic also can comprise a plurality of blocks, as shown in Figure 4.
Then, please refer to Fig. 3 d, by adhesive phase 14, this flexible substrate 10 is disposed on support plate 16, wherein this lower surface 15 with anti-adhesion characteristic contacts with this adhesive phase 14, and towards this support plate 16.Then, utilize roller 18 towards pressing direction 19, flexible substrate 10 closely is pasted to this adhesive phase 14.It should be noted that this adhesive phase 14 is pasted on the lower surface 11 of this flexible substrate 10, and this adhesive phase 14 covers this zone with anti-adhesion characteristic 17 simultaneously and this has the zone 13 of tack.This adhesive phase 14 and this flexible substrate in this has the zone of anti-adhesion characteristic 17 degree of adhering to less than this adhesive phase 14 and this flexible substrate degree of adhering to of 13 in this has tack regional, and this zone 13 with tack provides the anchorage of these flexible substrate 10 integral body on adhesive phase 14, is conducive to the subsequent preparation process of this flexible substrate 10.For instance, when this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 13 of tack when maintaining 1B-5B, this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 17 of anti-adhesion characteristic is between 0B-1B; In another execution mode of the present invention, when this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 13 of tack when maintaining 2B-5B, this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 17 of anti-adhesion characteristic is between 0B-2B.
At last, please refer to Fig. 3 e, prolong flexible substrates 10 that 21 pairs of lines of cut are formed in this zone with anti-adhesion characteristic 17 and cut, the flexible substrate 22 after being cut.This line of cut 21 can drop on the edge of this zone with anti-adhesion characteristic 17 (flexible substrate 10 of namely processing through chemical reagent), and the size of the flexible substrate 22 after this cutting like this has zone 17 measure-alike of anti-adhesion characteristic with this.In addition, please refer to Fig. 6, this line of cut 21 also can drop on the inboard of this zone with anti-adhesion characteristic 17 (flexible substrate 10 of namely processing through chemical reagent), and so the size of the flexible substrate 22 after this cutting has the size in the zone 17 of anti-adhesion characteristic less than this.
Embodiment of the present invention is described carries out surface treatment to this flexible substrate, and its chemical reagent that uses can utilize immersion technology, rotary coating technology, stamping technique, scrape technology or roller coating technology is formed on this flexible substrate 10.
The execution mode one of according to the present invention, this chemical reagent 12 is formed on flexible substrate 10 with rotary coating.At first, please refer to Fig. 7 a, utilize little shadow technology, (be defined as lower surface 11) and form graphical photoresist layer 24 on this flexible substrate 10, and expose the lower surface 11 that wish forms this zone with anti-adhesion characteristic; Then, please refer to Fig. 7 b, utilize the rotary coating mode to form this chemical reagent 12 in this lower surface that exposes 11; Can form the zone 17 with anti-adhesion characteristic after chemical reagent 12 and flexible substrate 10 react, remove afterwards this photoresist layer 24, please refer to Fig. 7 c and 7d.
In addition, another execution mode according to the present invention, this chemical reagent 12 is formed on flexible substrate 10 with stamping technique.At first, please refer to Fig. 8 a, form chemical reagent 12 coatings on template 26, and this template 26 is aimed at (alignment) with this flexible substrate 10, make these chemical reagent 12 coatings aim at the lower surface 11 that wish forms this zone with anti-adhesion characteristic; Then, please refer to Fig. 8 b, this template 26 is impressed (imprint) to this flexible substrate 10; After the lower surface 11 reaction formation of chemical reagent 12 and flexible substrate 10 have the zone 17 of anti-adhesion characteristic, remove this template 26, please refer to Fig. 8 c and 8d.
Moreover, the another execution mode according to the present invention, this chemical reagent 12 with scrape or roller coating technology shape on flexible substrate 10.At first, please refer to Fig. 9 a and 9b, utilize roller 28 (or scraper) towards coating direction 29, chemical reagent 12 is coated the lower surface 11 that wish forms this zone with anti-adhesion characteristic, can obtain having the zone 17 of anti-adhesion characteristic, please refer to Fig. 9 c and 9d.
In addition, can also roll-type letterpress technology with the lower surface 11 of chemical reagent 12 patterned coated in this flexible substrate 10, in order to form the zone with anti-adhesion characteristic 17 of patterning, please refer to Figure 10.
One of the present invention execution mode also provides a kind of manufacture method of flexible electronic device, described according to an embodiment of the present invention, after completing the described preparation process that flexible substrate 10 is adhered on the support plate 16 with adhesive phase 14 of Fig. 3 d, please refer to Figure 11 a, electronic component 30 can be formed at the upper surface 25 (with these lower surface 11 object settings) of this flexible substrate 10, then again the flexible substrate 10 that is formed with electronic component 30 is cut, can obtain flexible electronic device 40, please refer to Figure 11 b.Wherein the kind of this electronic component 30 there is no special restriction, can be known any electronic component that is formed on the deflection base material, comprise: thin film transistor (TFT) array, memory cell, plane display element, solar cell, semiconductor circuit or its combination.
The method of the described separating flexible substrate from support plate of embodiment of the present invention and the manufacture method of flexible electronic device, can make flexible substrate after cutting complete by peeling off on support plate, the method utilize surface treatment make flexible substrate surface easily consume with the functional group that adhesive phase forms bond (or cover, replacement, make to lose activity) fall.The embodiment of the present invention can make flexible substrate surface-treated preparation process simple and cheap.
Although the present invention discloses as above with embodiment, so it is not to limit the present invention, any those skilled in the art, and without departing from the spirit and scope of the present invention, when can do a little change and retouching, so protection range of the present invention is as the criterion with claims.
Claims (25)
1. the method for a separating flexible substrate from support plate comprises:
Flexible substrate is provided, and wherein this flexible substrate has lower surface;
Part lower surface to this flexible substrate carries out surface treatment, has the lower surface of anti-adhesion characteristic with formation;
By adhesive phase, this flexible substrate is disposed on support plate, wherein this lower surface with anti-adhesion characteristic is towards this support plate; And
This flexible substrate that is disposed on this support plate is cut disengaging.
2. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this support plate comprises metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer.
3. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this flexible substrate comprises polymeric substrate or metal substrate.
4. the method for separating flexible substrate from support plate as claimed in claim 3, wherein this polymeric substrate comprises polyimides, Merlon, polyether sulfone, polynorbornene, Polyetherimide, PEN or PETG.
5. the method for separating flexible substrate from support plate as claimed in claim 1, wherein the part lower surface of this flexible substrate after this surface treatment, can be consumed, cover or replace with the functional group that this adhesive phase produces bond on the lower surface of this flexible substrate.
6. the method for separating flexible substrate from support plate as claimed in claim 5, wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
7. the method for separating flexible substrate from support plate as claimed in claim 5, the bond that the functional group of this flexible substrate lower surface and adhesive phase produce comprises ionic bond, covalent bond or hydrogen bond.
8. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this surface treatment comprises:
Provide the lower surface of chemical reagent and this flexible substrate to react.
9. the method for separating flexible substrate from support plate as claimed in claim 8, wherein this chemical reagent is with immersion technology, rotary coating technology, stamping technique, scrapes the lower surface that technology or roller coating technology are formed at this flexible substrate.
10. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this surface treatment comprises: plasma treatment, ion beam bombardment, electronics bombardment, etch processes, friction treatment or its combination.
11. the manufacture method of a flexible electronic device comprises:
Flexible substrate is provided, and wherein this flexible substrate has upper surface and lower surface;
Part lower surface to this flexible substrate carries out surface treatment, has the zone of anti-adhesion characteristic with formation, partly is not defined as the zone with tack and the lower surface of this flexible substrate carries out surface-treated;
By adhesive phase, this flexible substrate is disposed on support plate, wherein this adhesive phase cover this flexible substrate this have the zone of anti-adhesion characteristic and this has the zone of tack;
Form electronic component in the upper surface of this flexible substrate; And
Cut being positioned at this this flexible substrate with zone of anti-adhesion characteristic, obtain flexible electronic device.
12. the manufacture method of flexible electronic device as claimed in claim 11, wherein this support plate comprises metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer.
13. the manufacture method of flexible electronic device as claimed in claim 11, wherein this flexible substrate comprises polymeric substrate or metal substrate.
14. the manufacture method of flexible electronic device as claimed in claim 13, wherein this polymeric substrate comprises polyimides, Merlon, polyether sulfone, polynorbornene, Polyetherimide, PEN or PETG.
15. as the manufacture method of claim 11 described flexible electronic device, wherein the lower surface of this flexible substrate after this surface treatment, can be consumed, cover or replace with the functional group of this adhesive phase generation bond on the lower surface of this flexible substrate.
16. the manufacture method of flexible electronic device as claimed in claim 15, wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
17. the manufacture method of flexible electronic device as claimed in claim 15, the bond that the functional group of this flexible substrate lower surface and adhesive phase produce comprises ionic bond, covalent bond or hydrogen bond.
18. the manufacture method of flexible electronic device as claimed in claim 11, wherein this surface treatment comprises:
Provide the lower surface of chemical reagent and this flexible substrate to react.
19. the manufacture method of flexible electronic device as claimed in claim 18, wherein this chemical reagent is with immersion technology, rotary coating technology, stamping technique, scrapes the lower surface that technology or roller coating technology are formed at this flexible substrate.
20. the manufacture method of flexible electronic device as claimed in claim 11, wherein this surface treatment comprises: plasma treatment, ion beam bombardment, electronics bombardment, etch processes, friction treatment or its combination.
21. the manufacture method of flexible electronic device as claimed in claim 11, wherein, this flexible substrate and this adhesive phase degree of adhering in this has the zone of anti-adhesion characteristic is less than this flexible substrate and this adhesive phase degree of adhering in this has tack regional.
22. the manufacture method of flexible electronic device as claimed in claim 11, wherein the size of this flexible electronic device and this have zone measure-alike of anti-adhesion characteristic.
23. the manufacture method of flexible electronic device as claimed in claim 11, wherein the size of this flexible electronic device has the size in the zone of anti-adhesion characteristic less than this.
24. the manufacture method of flexible electronic device as claimed in claim 11, wherein this electronic component comprises: memory cell, plane display element, semiconductor circuit or its combination.
25. the manufacture method of flexible electronic device as claimed in claim 11, wherein this electronic component comprises: thin film transistor (TFT) array, solar cell or its combination.
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| CN 200910146997 CN101924066B (en) | 2009-06-09 | 2009-06-09 | Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device |
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| CN102637575B (en) * | 2011-02-09 | 2015-07-01 | 群康科技(深圳)有限公司 | Manufacturing method of component baseplate |
| CN103515313B (en) * | 2012-10-29 | 2015-10-28 | Tcl集团股份有限公司 | A kind of stripping means of display flexible base, board |
| CN105280841B (en) * | 2014-07-18 | 2017-06-06 | Tcl集团股份有限公司 | A kind of flexible displayer part and preparation method thereof |
| CN106450027B (en) * | 2016-10-31 | 2018-08-14 | 昆山维信诺科技有限公司 | Flexible organic light emitting display and preparation method thereof |
| CN108257913B (en) * | 2016-12-29 | 2020-10-16 | 上海和辉光电有限公司 | Preparation method of flexible display |
| CN109840031A (en) * | 2018-12-28 | 2019-06-04 | 深圳莱宝高科技股份有限公司 | A kind of flexible base plate processing and treating method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006313827A (en) * | 2005-05-09 | 2006-11-16 | Seiko Epson Corp | Method of manufacturing thin film device and electronic apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313827A (en) * | 2005-05-09 | 2006-11-16 | Seiko Epson Corp | Method of manufacturing thin film device and electronic apparatus |
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Effective date of registration: 20220420 Address after: 26, 1 song Chi Road, Xinyi District, Taipei, Taiwan, China Patentee after: HANNSTAR DISPLAY Corp. Address before: Hsinchu County, Taiwan, China Patentee before: Industrial Technology Research Institute |