CN101909408B - Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) - Google Patents
Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) Download PDFInfo
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- CN101909408B CN101909408B CN2010102170969A CN201010217096A CN101909408B CN 101909408 B CN101909408 B CN 101909408B CN 2010102170969 A CN2010102170969 A CN 2010102170969A CN 201010217096 A CN201010217096 A CN 201010217096A CN 101909408 B CN101909408 B CN 101909408B
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a method for implanting an RFID (radio frequency identification) signal into a PCB (printed circuit board), relates to the fields of manufacturing of the PCB and application of UHF RFID, and discloses a method for implanting the UHF RFID into the PCB to fulfill the aims of anti-counterfeiting and tracing. Different from a method for directly embedding or attaching a packaged RFID label on the surface, the method is basically characterized in that: an unpackaged RFID chip is directly embedded into the PCB, an antenna is made in the PCB, and the antenna and the chip are interconnected in the PCB by a Build-up technique. Through the method, one-time packaging of the RFID chip and the antenna is saved, the chip embedding and antenna making are compatible with the PCB processing technique, and the RFID labels can be simultaneously made in batches on the entire PCB so as to reduce the application cost of embedding the RFID labels.
Description
Technical field
The present invention relates to field of printed circuit board fabrication and ultrahigh frequency RFID application; It mainly is a kind of structure of heeling-in ultrahigh frequency RFID in printed circuit board (PCB); With the heeling-in and being produced in the printed circuit board (PCB) respectively of RFID chip and antenna; And accomplish interconnection, thereby can accomplish false proof and effect spike.
Background technology
According to the thought of hyundai electronics assembling, printed circuit board (PCB) is divided into different types in the different phase of electronics assembling process.Dissimilar printed circuit board (PCB)s (Printed Circuit Board, PCB), the function that it plays is slightly variant, and application direction is also different.Base plate for packaging is applied to the assembling of first order electronics.On this substrate, directly carry single-chip, constitute the basal disc of encapsulation; Conventional printed circuit board applications is in the assembling of second and third grade electronics, as the motherboard of construction system, carries out discrete device and the assembling of the integrated chip that encapsulated.
The structure of one printed circuit board plate generally is made up of individual layer or multiple layer of copper conductive pattern layer, supports with dielectric layer between the conductive pattern layer and insulate, and the intercommunicated Layer increasing method technology of crossing between each layer realizes that the element dress is attached to the surface of printed circuit board (PCB) plate.
Fig. 1 is the example of one 4 layer printed circuit board plate.4 layer printed circuit board plates are processed by 7 layer materials.101 and 107 is signals layer, and 103 is power plane, and 105 is ground plane, is central layer insulation by 104 between 103 and 105 and supports, and between 101 and 103, between 105 and 107, is insulated by dielectric material (102,106).
RFID is REID (Radio Frequency Identification), is a kind of automatic identification technology that begins to rise the nineties in 20th century.REID utilizes radiofrequency signal, realizes that through space coupling (alternating magnetic field or electromagnetic field) contactless information transmission and the information of passing through to be transmitted reach the technology of identifying purpose.Wherein, ultrahigh frequency RFID is the super high frequency radio frequency recognition technology, operating frequency be 860MHz between the 960MHz, the electric wave of this frequency range can not pass through many materials, particularly water, dust, suspended particulate matters such as mist.With respect to the RFID (operating frequency 13.56MHz) of high frequency, the electronic tag of hyper band does not need to separate with metal.Another advantage of ultrahigh frequency RFID is that message transmission rate is high, can read a large amount of electronic tags in the very short time.
In printed circuit board industry, need suitable manner that the printed circuit panel products of producing is carried out anti-fake mark and whereabouts affirmation.Initial mode is manual dress joint strip font code on the surface, puts the RFID of reading of data automatically to labeing on the surface.As shown in Figure 2, on a packaged printed circuit board (PCB) that posts 201, select suitable space dress joint strip font code or RFID label 202.But manually dress pastes and loses time, and the surface is labeled the form of putting and can not well be protected, to guarantee false proof and function spike.Because label be placed on the surface possibly suffer artificial or unexpected failure, carve or the like such as peeling off, drawing.Therefore people begin to consider the heeling-in of RFID label inner at substrate, because the RFID label has certain distance that reads, heeling-in can not influence its data reads in substrate inside, and has effectively protected the RFID label.As shown in Figure 3, for a kind of existing with the structure of RFID label heeling-in at the printed circuit intralamellar part.With the doubling plate is example, among the dielectric layer between signals layer 301 and 304 302, heeling-in RFID label 303.
The present invention is directed to the new heeling-in method of heeling-in ultrahigh frequency RFID proposition in printed circuit board (PCB).
Summary of the invention
The object of the present invention is to provide a kind of in printed circuit board (PCB) the method for heeling-in ultra-high frequency RFID label; Omit the encapsulation of RFID label; The ultrahigh frequency RFID chip that direct heeling-in does not encapsulate; Utilize printed circuit board (PCB) plate manufacture craft to accomplish the interconnection between antenna making and chip and the antenna, thereby reduce cost, and can accomplish the different antennas making according to specifically reading needs.
One of characteristic of the present invention is; For four layer printed circuit boards; Select top signal of telecommunication layer and these two centres of power plane that the electrically conductive signal layer of a dielectric layer is arranged; Do not have on said power plane that wiring and element dress paste, be positioned at wiring and paste the not ultrahigh frequency RFID chip of encapsulation of the peripheral design reserved area bonding in zone with the element dress, in the signal of telecommunication layer of said top vertically corresponding to the said ultrahigh frequency RFID chip area making antenna pattern that does not encapsulate; On the ultrahigh frequency RFID chip of said not encapsulation, utilize Layer increasing method technology to draw the interface of antenna, pass the interconnection of said dielectric layer and said antenna.Be not limited to the signal of telecommunication layer of above explanation, in printed circuit board (PCB) arbitrarily adjacent two signal of telecommunication layers and wherein between the RFID chip heeling-in that can not encapsulate of dielectric layer make and accomplish with antenna and interconnect.
Two of characteristic of the present invention is: described four layer printed circuit boards comprise base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Three of characteristic of the present invention is; For printed circuit board (PCB) more than four layers; Select second signal of telecommunication layer and the 3rd signal of telecommunication layer from the top down, there is a dielectric layer two-layer centre, and nothing wiring and element dress paste on said the 3rd signal of telecommunication layer; Be positioned at wiring and element dress and paste the not ultrahigh frequency RFID chip of encapsulation of the peripheral design reserved area bonding in zone; In said secondary signal layer, vertically make antenna pattern, on the ultrahigh frequency RFID chip of said not encapsulation, utilize Layer increasing method technology to draw the interface of antenna, pass the interconnection of said dielectric layer and said antenna corresponding to the ultrahigh frequency RFID chip area of said not encapsulation.Be not limited to the signal of telecommunication layer of above explanation, in printed circuit board (PCB) arbitrarily adjacent two signal of telecommunication layers and wherein between the RFID chip heeling-in that can not encapsulate of dielectric layer make and accomplish with antenna and interconnect.
Four of characteristic of the present invention is: described printed circuit board (PCB) more than four layers comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
The general mode that adopts the packaged RFID label of direct heeling-in of existing heeling-in RFID technology has comprised RFID control store chip and antenna in this encapsulation.Itself has increased cost encapsulation, and chip area is very little, and area is subject to Antenna Design in encapsulation, and Antenna Design is subject to packaging appearance, in promptly a certain proportion of rectangular profile.The present invention will be in printed circuit board (PCB) the RFID control store chip of heeling-in un-encapsulated, and in printed circuit board (PCB), accomplish the interconnection of antenna making and chip and antenna, thereby constitute complete RFID label.When reaching the purpose of heeling-in RFID with false proof spike; Reduced the packaging cost of RFID label; Can be on whole plate batch making simultaneously, and designing antenna does not more freely have wiring and the subsides of element dress with Antenna Design at printed circuit board (PCB); Be positioned at wiring and element dress and paste the peripheral design reserved area in zone, adapt to different RFID with the flexible antenna design and read demand.
Description of drawings
Fig. 1 is the signals of 4 layer printed circuit boards;
Fig. 2 is for printed circuit board surface mounts bar code or the signal of RFID label;
Fig. 3, for a kind of with the structure of RFID label heeling-in at the printed circuit intralamellar part;
Fig. 4 pastes the peripheral design reserved area explanation in zone for being positioned at wiring and element dress in the printed circuit board (PCB);
Fig. 5 is heeling-in structure explanation among the present invention;
Fig. 6 makes signal for antenna among the present invention, (a) is the broken line type antenna pattern, (b) is the linear pattern antenna pattern;
Fig. 7 is the RFID chip instance that four layer printed circuit board heeling-ins do not encapsulate;
Fig. 8, the RFID chip instance that does not encapsulate for the six-layer printed circuit board heeling-in.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the present invention, and can not be interpreted as limitation of the present invention.
In the present invention, that utilizes that printed circuit board (PCB) do not have that wiring and element dress paste is positioned at the design reserved area that wiring and element dress paste the periphery, zone, carries out the making of heeling-in of RFID chip and antenna.
1) on printed circuit board (PCB), select certain peripheral design reserved area of wiring and element dress subsides zone that is positioned on one side to carry out the chip heeling-in;
2) select two adjacent conductive signals layers of printed circuit intralamellar part;
3) in the print circuit plates making process, with the heeling-in of RFID chip between two signals layers;
4) utilize Layer increasing method technology to form being connected of chip and last layer signals layer;
5) accomplish the making of antenna pattern at the last layer signals layer.
The wiring of in such scheme, mentioning that is positioned at is pasted the peripheral design reserved area in zone with element dress, promptly around the plank apart from not have wiring or element to adorn the zone of subsides in the edge certain limit, see Fig. 4.In printed circuit board (PCB) 400,401 zones are wiring and element put area, and being positioned at of reserving during 402 zones are all around promptly designed connected up and peripheral zone, element dress subsides zone.403 are the zone of the predetermined completion chip heeling-in of selection.Because the RFID chip size is very little, in 0.5mm*0.5mm, the chip heeling-in can both be accomplished in the zone that is positioned at wiring and periphery, element dress subsides zone of general printed circuit board (PCB) reservation.
In selected zone 403, carry out the chip heeling-in, see Fig. 5.Bonding chip 502 on signals layer 501 is accomplished Layer increasing method technology 503 on 502, then according to the print circuit plates making flow process, add dielectric layer 504, compresses signals layer 505.The making of antenna pattern is accomplished in the corresponding region of signals layer 505.The antenna of making in the signals layer 505 is as shown in Figure 6, but the form that is not limited to provide among Fig. 6.
In fact; Because the signal of ultrahigh frequency RFID frequency range can be by copper shield; Therefore the heeling-in position of chip is not limited to be positioned at the peripheral design reserved area of wiring and element dress subsides zone; For example, can open up a zone at the power plane layer and carry out chip attach and carry out the antenna making in the suitable independent position of another layer, condition is the not boring in the chip attach zone.
With the four-layer circuit board is example, and 701,703,705,707 is signal of telecommunication layer, and 702,706 is dielectric layer, and 704 is central layer among the figure, and for no core plate structure circuit board, 704 is dielectric layer.Connect up and the peripheral design reserved area in element dress subsides zone in selected being positioned at; Two signals layers selecting top signal of telecommunication layer 701 and power plane 703 need use for the RFID heeling-in; Bonding ultrahigh frequency RFID chip 708 in definite zone of 703; Vertical correspondence position 701 is made antenna pattern 709, on chip 708, utilizes Layer increasing method technology to draw the port that connects antenna, passes dielectric layer 702 and accomplishes interconnection with antenna 709.Can cover green oils with protective circuit on signals layer 701 surfaces after accomplishing the lamination making, antenna pattern is also protected by green oil.
For printed circuit board (PCB) more than four layers; With the 6-layer circuit board is example; Connect up and the peripheral design reserved area in element dress subsides zone two signals layers selecting the second, the three layer signal layer need use from top to bottom as the RFID heeling-in in selected being positioned at; Bonding ultrahigh frequency RFID chip 808 in definite zone of 803; Vertical correspondence position 801 is made antenna pattern 809, on chip 808, utilizes Layer increasing method technology to draw the port that connects antenna, passes dielectric layer 802 and accomplishes interconnection with antenna 809.Because antenna is produced on the secondary signal layer, does not directly contact with the outside, has obtained good protection.
Claims (4)
1. method that is implanted into the RFID label of radio frequency identification at printed circuit board (PCB); It is characterized in that: for four layer printed circuit boards; Select top signal of telecommunication layer and these two centres of power plane that the electrically conductive signal layer of a dielectric layer is arranged; Nothing wiring and element dress paste on said power plane; Be positioned at wiring and element dress and paste the not ultrahigh frequency RFID chip of encapsulation of the peripheral design reserved area bonding in zone; In the signal of telecommunication layer of said top, vertically make antenna pattern, on the ultrahigh frequency RFID chip of said not encapsulation, utilize Layer increasing method technology to draw the interface of antenna, pass the interconnection of said dielectric layer and said antenna corresponding to the ultrahigh frequency RFID chip area of said not encapsulation.
2. according to claim 1, its essential characteristic also is: said four layer printed circuit boards comprise base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
3. method that is implanted into the RFID label of radio frequency identification at printed circuit board (PCB); It is characterized in that: for printed circuit board (PCB) more than four layers; Select second signal of telecommunication layer and the 3rd signal of telecommunication layer from the top down; There is a dielectric layer two-layer centre; Do not have on said the 3rd signal of telecommunication layer that wiring and element dress paste, be positioned at wiring and paste the not ultrahigh frequency RFID chip of encapsulation of the peripheral design reserved area bonding in zone with the element dress, in said secondary signal layer vertically corresponding to the said ultrahigh frequency RFID chip area making antenna pattern that does not encapsulate; On the ultrahigh frequency RFID chip of said not encapsulation, utilize Layer increasing method technology to draw the interface of antenna, pass the interconnection of said dielectric layer and said antenna.
4. according to claim 3, its essential characteristic also is: described printed circuit board (PCB) more than four layers comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102170969A CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102170969A CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
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| Publication Number | Publication Date |
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| CN101909408A CN101909408A (en) | 2010-12-08 |
| CN101909408B true CN101909408B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102170969A Active CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2016120254A1 (en) | 2015-01-27 | 2016-08-04 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna structure |
| WO2017186913A1 (en) | 2016-04-28 | 2017-11-02 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method |
| EP3349302B1 (en) | 2017-01-12 | 2019-11-13 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Ambient backscatter communication with devices having a circuit carrier with embedded communication equipment |
| IL256108B (en) | 2017-12-04 | 2021-02-28 | Elbit Systems Ltd | System and method for detecting usage condition and authentication of an article of manufacture |
| GB2621271A (en) * | 2021-06-10 | 2024-02-07 | Tridonic Gmbh & Co Kg | Antenna device, LED driver and LED device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100819196B1 (en) * | 2006-10-25 | 2008-04-04 | 광운대학교 산학협력단 | Uhf band rfid tag antenna mountable on metallic object |
| CN201117799Y (en) * | 2007-11-30 | 2008-09-17 | 华南理工大学 | UHF RFID electronic label antenna possessing broad band characteristic |
| CN101299486A (en) * | 2008-06-18 | 2008-11-05 | 北京邮电大学 | RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4026080B2 (en) * | 2006-02-24 | 2007-12-26 | オムロン株式会社 | Antenna and RFID tag |
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- 2010-06-23 CN CN2010102170969A patent/CN101909408B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100819196B1 (en) * | 2006-10-25 | 2008-04-04 | 광운대학교 산학협력단 | Uhf band rfid tag antenna mountable on metallic object |
| CN201117799Y (en) * | 2007-11-30 | 2008-09-17 | 华南理工大学 | UHF RFID electronic label antenna possessing broad band characteristic |
| CN101299486A (en) * | 2008-06-18 | 2008-11-05 | 北京邮电大学 | RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band |
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| CN101909408A (en) | 2010-12-08 |
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Effective date of registration: 20201026 Address after: Room 1303, No. 99, Songyu south 2nd Road, Xiamen City, Fujian Province Patentee after: Xiamen Qingxin Integrated Technology Co., Ltd Address before: 100084 Beijing 100084-82 mailbox Patentee before: TSINGHUA University |
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