CN101801646A - Bonding substrate manufacturing apparatus and bonding substrate manufacturing method - Google Patents
Bonding substrate manufacturing apparatus and bonding substrate manufacturing method Download PDFInfo
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- CN101801646A CN101801646A CN200880108048A CN200880108048A CN101801646A CN 101801646 A CN101801646 A CN 101801646A CN 200880108048 A CN200880108048 A CN 200880108048A CN 200880108048 A CN200880108048 A CN 200880108048A CN 101801646 A CN101801646 A CN 101801646A
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- China
- Prior art keywords
- infrabasal plate
- pressure
- upper substrate
- basal part
- adhesive base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Liquid Crystal (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Disclosed is a bonding substrate manufacturing apparatus for manufacturing a bonding substrate by bonding an upper substrate and a lower substrate while aligning the upper and the lower substrates with each other. The apparatus is provided with a base section for placing the lower substrate, a supporting bar arranged upright on the base section, and an upper pressurizing member which can vertically move along the supporting bar and hold the upper substrate. The upper substrate held by the upper pressurizing member and the lower substrate placed on the base section are bonded to each other by bringing down the upper pressurizing member.
Description
Technical field
The present invention relates to adhesive base plate manufacturing installation and adhesive base plate manufacture method.
The application is based on advocating priority in patent application 2007-290912 number of Japanese publication on November 8th, 2007, and quotes its content.
Background technology
Flat-panel monitor such as LCD and plasma scope (FPD) has the structure that two base plate bondings are formed.For example, LCD by array base palte (TFT substrate) that will be formed with a plurality of TFT (thin film transistor (TFT)) and the colored filter substrate (CF substrate) that is formed with colored filter and photomask etc. rectangularly to count relative configuration the in interval of μ m degree, between two substrates, enclose liquid crystal, and come the seal member (bonding agent) that the two substrates utilization contains light-cured resin bonding mutually and make.In addition, in order to prevent sneaking into of foreign gas etc., under vacuum environment, carry out the bonding of these two substrates.
As the device of this bonding two substrates, the base plate bonding device of present known for example patent documentation 1.The base plate bonding device of patent documentation 1 comprises: the vacuum chamber that is made of upper container and lower container, the upper substrate conveyance anchor clamps that are used to upper substrate is moved, be used to first support stick that upper container is moved up and down, second support stick that supports the base of this support stick and be used to make upper substrate conveyance anchor clamps to move up and down.
In the aforesaid substrate bonder, the first support stick downward direction is moved, and upper container and lower container butt to be constituting vacuum chamber, and the second support stick downward direction is moved, so that upper substrate conveyance anchor clamps descend, make upper substrate dispose so that predetermined distance is relative with infrabasal plate.Then, carry out the position alignment of upper substrate and infrabasal plate and bonding.
Patent documentation 1: Japan Patent Publication Laid-Open 2007-212572 communique
The adhesive base plate manufacturing installation of above-mentioned patent documentation 1 after vacuumizing, makes upper substrate and infrabasal plate position alignment in process chamber, with these two base plate bondings.But after making upper substrate and infrabasal plate position alignment, so that upper substrate conveyance anchor clamps when moving, the position of upper substrate and infrabasal plate may relativity shift by second support stick that is provided on the base is moved.This be because, have a plurality of parts between from the base to the infrabasal plate, therefore dispose the lower container of infrabasal plate and carry out different motions with the base that is equipped with second support stick.So, the relative position that has because of upper substrate and infrabasal plate produces skew, and causes the problem of decrease in yield.
Summary of the invention
The present invention produces in view of the above problems, and purpose is to provide a kind of position alignment precision of two substrates that can make to improve, and improves the adhesive base plate manufacturing installation and the adhesive base plate manufacture method of yield rate.
According to adhesive base plate manufacturing installation of the present invention, by upper substrate and infrabasal plate are carried out position alignment and the bonding adhesive base plate of making, it is characterized in that, comprising: the basal part of the described infrabasal plate of mounting; Setting is arranged on the support stick on this basal part; With the last pressure-producing part that can move up and down and can keep described upper substrate along this support stick; By the described pressure-producing part of going up is descended, the described described upper substrate of going up on the pressure-producing part is bonding with the described infrabasal plate that is positioned on the described basal part with remaining on.
According to above-mentioned adhesive base plate manufacturing installation, the support stick guiding that is arranged on mounting and is had by setting owing to the last pressure-producing part that maintains upper substrate on the basal part of infrabasal plate moves up and down, and therefore the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the relative position of upper substrate and infrabasal plate produces skew to bonding.Consequently have the position alignment precision that makes two substrates and improve, and improve the effect of yield rate.
Also can be on described be provided with seal member in mode on any one at least in pressure-producing part and the described basal part around the zone that disposes described upper substrate or described infrabasal plate, by the described pressure-producing part of going up is descended, described seal member, described on formation adhesion process chamber between pressure-producing part and the described basal part.
In the case, the adhesion process chamber can be made of last pressure-producing part, basal part and seal member, therefore can reduce the part number.Miniaturization and lightweight that consequently can implement device.
Also may further include the pressure regulating equipment that is reduced pressure in the inside of described adhesion process chamber, when utilizing this pressure regulating equipment to be reduced pressure in described adhesion process chamber, described adhesion process chamber is sealed by described seal member.
In the case, owing between last pressure-producing part and basal part, seal member is installed, therefore when reduced pressure in the adhesion process chamber, can make this adhesion process chamber sealing reliably.So, can reduce pressure to the adhesion process chamber reliably, thereby can make desired adhesive base plate.
Described basal part can also comprise: the infrabasal plate adsorbent equipment that adsorbs the part of described infrabasal plate and this infrabasal plate is moved; With when utilizing this infrabasal plate adsorbent equipment to move described infrabasal plate, this infrabasal plate is floated, and when bonding described upper substrate and described infrabasal plate, can adsorb in the described infrabasal plate and do not floated adsorbent equipment by the infrabasal plate of the part of described infrabasal plate adsorbent equipment absorption.
In the case, when bonding upper substrate and infrabasal plate, can utilize infrabasal plate to float adsorbent equipment infrabasal plate is adsorbed on the basal part.So, can prevent the position skew of infrabasal plate.Consequently can bonding well upper substrate of precision and infrabasal plate.In addition, owing to need be used for the platform of mounting infrabasal plate no longer in addition, therefore can reduce the component count that is present between basal part and the infrabasal plate.Further, when making infrabasal plate be adsorbed on the basal part, because infrabasal plate adsorbent equipment and infrabasal plate float adsorbent equipment and be not exposed in the adhesion process chamber, it is indoor to prevent that therefore particle that each device produces etc. from flowing into adhesion process.So, can guarantee the cleanliness factor that adhesion process is indoor.
Described seal member can also comprise: move up and down with respect to described basal part and described of going up in the pressure-producing part, constitute the junction surface of the wall portion of described adhesion process chamber; Be arranged on the described junction surface and offset and fetch the bubble-tight seal of guaranteeing described adhesion process chamber with described basal part or the described pressure-producing part of going up.
In the case, because the junction surface is with respect to basal part or go up the wall portion that pressure-producing part moved up and down and constituted the adhesion process chamber, rises and also the adhesion process chamber can be remained sealing state even therefore go up pressure-producing part.Thus, even also can reduce pressure under the state with increase conductance (コ Application ダ Network タ Application ス), consequently can shorten decompression time to the adhesion process chamber at configured separate infrabasal plate and upper substrate.
In addition, adhesive base plate manufacture method of the present invention, by infrabasal plate is positioned on the basal part, by being arranged on the last pressure-producing part maintenance upper substrate that the support stick on the described basal part moves up and down along setting, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, it is characterized in that, this adhesive base plate manufacture method comprises: utilize the infrabasal plate adsorbent equipment be arranged on the described basal part the part of the described infrabasal plate of absorption make simultaneously this infrabasal plate from described base part from, and utilize the infrabasal plate that is arranged on the described basal part to float the first infrabasal plate mobile process that adsorbent equipment floats described infrabasal plate; The described pressure-producing part of going up is descended, dispose the upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively; Utilize described infrabasal plate adsorbent equipment that described infrabasal plate is moved, with the substrate position alignment process of the position alignment of carrying out described infrabasal plate and described upper substrate; The described pressure-producing part of going up is risen, with the last pressure-producing part rising operation of described infrabasal plate of predetermined distance configured separate and described upper substrate; By seal member described going up between pressure-producing part and the described basal part sealed, the process chamber that forms the adhesion process chamber that accommodates described upper substrate and described infrabasal plate forms operation; Utilize described infrabasal plate adsorbent equipment in the part of the described infrabasal plate of absorption, this infrabasal plate and described basal part to be connected, and utilize described infrabasal plate to float the second infrabasal plate mobile process that adsorbent equipment adsorbs in the described infrabasal plate not the part of being adsorbed by described infrabasal plate adsorbent equipment; To the indoor decompression operation that reduces pressure of described adhesion process; With make under the state of the indoor sealing of described adhesion process described on pressure-producing part descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
According to above-mentioned adhesive base plate manufacture method, the support stick guiding that is arranged on mounting and is had by setting owing to the last pressure-producing part that maintains upper substrate on the basal part of infrabasal plate moves up and down, and therefore the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the position relation of upper substrate and infrabasal plate produces skew to bonding.So, the position alignment precision of two substrates is improved, thereby improve yield rate.
In addition, pressure-producing part is risen and, reduced pressure in the adhesion process chamber, so can under the bigger state of conductance, reduce pressure with after predetermined distance configured separate infrabasal plate and the upper substrate.Thus, can shorten decompression time.
Further, when bonding upper substrate and infrabasal plate, float adsorbent equipment by infrabasal plate infrabasal plate is adsorbed on the basal part.So, can prevent the position skew of infrabasal plate, thus can bonding well upper substrate of precision and infrabasal plate.In addition, owing to need be used for the platform of mounting infrabasal plate no longer in addition, therefore can reduce the component count that is present between basal part and the infrabasal plate.Further, when making infrabasal plate be adsorbed on the basal part, because infrabasal plate adsorbent equipment and infrabasal plate float adsorbent equipment and be not exposed in the adhesion process chamber, it is indoor to prevent that therefore particle that each device produces etc. from flowing into adhesion process.So, can be under the state of guaranteeing the cleanliness factor that adhesion process is indoor, bonding upper substrate and infrabasal plate.
The invention effect
The support stick guiding that is arranged on mounting and is had by setting owing to the last pressure-producing part that maintains upper substrate on the basal part of infrabasal plate moves up and down, and therefore the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..
Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the position relation of upper substrate and infrabasal plate produces skew to bonding.So, have the aligning accuracy that can make two substrates and improve, thus the effect of raising yield rate.
Description of drawings
Fig. 1 is the front skeleton diagram of the adhesive base plate manufacturing installation of first embodiment of the invention;
Fig. 2 is the cutaway view along the A-A line of Fig. 1;
Fig. 3 is the B portion enlarged drawing of Fig. 1;
Fig. 4 is that the key diagram (1) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 5 is that the key diagram (2) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 6 is that the key diagram (3) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 7 is that the key diagram (4) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 8 is that the key diagram (5) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 9 is that the key diagram (6) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Figure 10 is that the key diagram (7) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Figure 11 is the flow chart of expression manufacturing according to the process of the adhesive base plate of first embodiment;
Figure 12 is the structure chart of expression according to other forms of the seal member of first embodiment;
Figure 13 is the structure chart of seal member second embodiment of the invention.
Symbol description
10 adhesive base plate manufacturing installations
11 basal parts
13 support sticks
Pressure-producing part on 15
Room 17 (adhesion process chamber)
25 drive platform (infrabasal plate adsorbent equipment)
35 air cushions (infrabasal plate floats adsorbent equipment)
49 vavuum pumps (pressure regulating equipment)
52 seals
55 seal members
56 pipes (scalable parts)
57 junction surfaces
The W1 infrabasal plate
The W2 upper substrate
The W3 adhesive base plate
The specific embodiment
(first embodiment) (adhesive base plate manufacturing installation)
According to Fig. 1～Figure 12 the adhesive base plate manufacturing installation in first embodiment of the present invention is described.
Fig. 1 is the front skeleton diagram of adhesive base plate manufacturing installation, and Fig. 2 is the cutaway view along the A-A line of Fig. 1.As shown in Figure 1 and Figure 2, adhesive base plate manufacturing installation 10 comprises: the basal part 11 of mounting infrabasal plate W1, erect support stick 13 that is provided with and the last pressure-producing part 15 that is supported and can be moved up and down and can keep along support stick 13 upper substrate W2 by support stick 13 from basal part 11.
Driving platform 25 is configured in the recess 24 on the upper surface 23 that is formed at basal part 11.Driving platform 25 forms and be circular in overlooking, and is formed with cavity 28 in the inside that drives platform 25.Be formed with a plurality of passages 27 on the end face in cavity 28, cavity 28 links with the blast pipe 29 that is provided with thereunder in addition.Blast pipe 29 connects basal part 11 and extends from lower surface 21, and links with unshowned exhaust pump.Just, be positioned under the state that drives on the platform 25, when starting exhaust pump, by passage 27 infrabasal plate W1 be adsorbed on and drive on the platform 25 at infrabasal plate W1.In addition, blast pipe 29 be provided with valve 30 midway, can adjust capacity.In addition, the surface 26 that drives platform 25 is configured to that the upper surface 23 of (during non-driving) and basal part 11 is same plane usually the time.
In addition, drive platform 25 below be provided with to be used to make and drive first mobile device 31 that platform 25 moves along direction in the horizontal plane.Below first mobile device 31, be provided with to be used to make and drive second mobile device 32 that platform 25 moves along the vertical direction.The driving method of first mobile device 31 and second mobile device 32 is not particularly limited.First mobile device 31 utilizes actuator mechanism to move along direction in the horizontal plane in the present embodiment, thereby second mobile device 32 moves driving platform 25 by wedge-shaped member is moved along the vertical direction.
Next, the position corresponding to the planar dimension of infrabasal plate W1 on the upper surface 23 of basal part 11 is provided with a plurality of air cushions 35 (present embodiment is 14).Air cushion 35 is configured in the recess 36 on the upper surface 23 that is formed at basal part 11.Air cushion 35 forms and be circular in overlooking, and is formed with cavity 39 in the inside of air cushion 35.Be formed with a plurality of passages 38 on the end face in cavity 39, cavity 39 links with the air inlet-outlet pipe 40 that is provided with thereunder in addition.Air inlet-outlet pipe 40 connects basal part 11 and extends from lower surface 21, and links with unshowned intake and exhaust pump.Just, under the state that is positioned at infrabasal plate W1 on the basal part 11, when air cushion 35 carries out air inlet, spray air from passage 38 to infrabasal plate W1, thereby infrabasal plate W1 is floated.On the other hand, when under the state that is positioned at infrabasal plate W1 on the basal part 11 when air cushion 35 carries out exhaust, can infrabasal plate W1 be adsorbed on the basal part 11 by passage 38.In addition, air inlet-outlet pipe 40 be provided with valve 41 midway, can adjust the intake and exhaust amount.The surface 37 of air cushion 35 is configured to be same plane with the upper surface 23 of basal part 11.
In addition, in the upper surface 23 of basal part 11, be provided with a plurality of push rods 45 that hoist (present embodiment is 24) at the position of configuration driven platform 25 and air cushion 35 not.The push rod 45 that hoists is configured in the below of the upper surface 23 of basal part 11 usually.In addition, hoist push rod 45 risings to receive infrabasal plate W1 when installing when adhesive base plate manufacturing installation 10 transmits infrabasal plate W1 from unshowned other, can making from unshowned mechanical arm.And, after receiving infrabasal plate W1, descend by making the push rod 45 that hoists, infrabasal plate W1 can be positioned on the upper surface 23 of basal part 11.In addition, after the adhesion process of substrate is finished, when substrate being sent to other whens device, by the push rod 45 that hoists is risen so that adhesive base plate W3 separate from the upper surface 23 of basal part 11, and betwixt the crack insert mechanical arm can conveyance adhesive base plate W3.
In addition, on the upper surface 23 of basal part 11, be formed with exhaust outlet 47.Exhaust outlet 47 links with the blast pipe 48 that connects basal part 11.Blast pipe 48 links with vavuum pump 49 on the lower surface 21 that is installed in basal part 11.
In addition, on the upper surface 23 of basal part 11 with surround above-mentioned driving platform 25, air cushion 35, the mode of hoist push rod 45 and exhaust outlet 47 is formed with recess 51.Recess 51 is rectangular in forming and overlooking.In overlooking, be formed with wall portion 53 on whole full week along the inward flange of recess 51.The height of wall portion 53 is less than the thickness sum of infrabasal plate W1 and upper substrate W2.
Fig. 3 is the B portion enlarged drawing of Fig. 1.As shown in Figure 3, in recess 51, be provided with seal member 55.Seal member 55 comprise the below that is configured in recess 51 for example rubber system pipe 56 and be configured in the junction surface 57 of the top of pipe 56.Press by the air that changes pipe 56 to make it scalable, junction surface 57 can move up and down along the side 60 of recess 51 and follow moving of pressure-producing part 15.The upper surface 58 at junction surface 57 is positioned at the more top of the upper surface 23 of basal part 11.In addition, the upper surface 58 at junction surface 57 is provided with the seal 52 between sealing and the last pressure-producing part 15.Further, between the side 60 of the recess 51 of the side 59 at junction surface 57 and basal part 11, be provided with the seal 61 of sealing between the two.Thus, constitute chamber 17 by basal part 11, last pressure-producing part 15 and seal member 55.Outside wall portions 53 support engages portions 57 in addition are not so that chamber 17 sides can be swung in junction surface 57 when vacuumizing in chamber 17.
Return Fig. 2,, on the upper surface 23 of basal part 11, erect and be provided with support stick 13 in the outside of recess 51.Support stick 13 is erect and is arranged on four angles of basal part 11.In addition, the short side direction in the upper surface 23 of basal part 11 is roughly erect between the support stick 13 of pars intermedia and is provided with driving shaft 65.
Driving shaft 65 comprises by being installed in drive source 66 that motor on the basal part 11 etc. forms and one-sided two axial regions 67 that move up and down according to the indication from drive source 66.Just, setting is provided with four support sticks 13 and four driving shafts 65 on basal part 11.In addition, for convenience of explanation, the right side illustrates support stick 13 among Fig. 1, and the left side illustrates driving shaft 65.
For example, driving shaft 65 is constituted as the driving force that is used to self-driven source 66 and makes axial region 67 rotations.On axial region 67, be formed with external screw thread 85.This external screw thread 85 by axial region 67 rotation with internal thread 86 threaded engagement that are formed on the basal part 11, make axial region 67 rising/declines thus.
Be provided with pressure-producing part 15 above the support stick 13.Last pressure-producing part 15 forms in overlooking the rectangle with basal part 11 same size.In overlooking, on the corresponding position of four angles of last pressure-producing part 15 and support stick 13, be formed with the through hole 71 that to insert logical support stick 13.Below through hole 71, dispose guiding guide 83, make that going up pressure-producing part 15 moves up and down in vertical direction along support stick 13.In addition, the position corresponding to driving shaft 65 of the lower surface of last pressure-producing part 15 is provided with force cell 69.The compression face of force cell 69 (lower surface) is configured to join each other with the leading section 68 of axial region 67.
Between the position corresponding to support stick 13 (both sides 72 of short side direction) of the lower surface of last pressure-producing part 15 and position in addition, be formed with stage portion 73.In addition, both sides 72 are formed with respect to basal part 11 and are positioned at the position more farther than stage portion 73.On position, be formed with the maintenance face 75 that keeps upper substrate W2 than both sides 72 more close basal parts 11.During being formed in and overlooking, the edge part 76 of maintenance face 75 is positioned at the outside of the recess 51 of basal part 11.
In addition, the position of the maintenance upper substrate W2 in the maintenance face 75 is provided with a plurality of electrostatic chuck portion 77.The surface of electrostatic chuck portion 77 is configured to be same plane with maintenance face 75.In addition, the position that does not dispose electrostatic chuck portion 77 in the maintenance face 75 is provided with a plurality of maintenance bars 79.Keep bar 79 to be provided with air suction inlet at its front end, adsorbable maintenance upper substrate W2.Keep bar 79 usually the time, be configured in maintenance face 75 above.Keep bar 79 to descend when installing when adhesive base plate manufacturing installation 10 transmits upper substrate W2 from unshowned other, can making to receive upper substrate W2 from unshowned mechanical arm.After receiving upper substrate W2,, upper substrate W2 can be remained on the maintenance face 75 by when maintenance bar 79 is risen, carrying out the function of electrostatic chuck portion 77.
Further, in maintenance face 75, maintain the shoot part 81 that is formed with employed camera 80 when the position alignment of carrying out with infrabasal plate W1 near the optional position (being preferably the edge part of upper substrate W2) of upper substrate W2.In the camera configuration portion 82 that is formed with on the shoot part 81 as the through hole of pressure-producing part 15 on connecting.Just, camera 80 is installed in camera configuration portion 82, is utilized alignment mark M1, the M2 of camera 80 by 81 couples of infrabasal plate W1 of shoot part and upper substrate W2 to take, can detect the skew of alignment mark M1, M2.
In addition, be provided with the control part (not shown), be used for coming first mobile device 31 is indicated the amount of movement of direction in the horizontal planes according to the result that camera 80 is taken.
(effect)
Next, according to Fig. 4～Figure 11 the order of using adhesive base plate manufacturing installation 10 to make adhesive base plate is described.In addition, Fig. 4～Figure 10 is that expression uses the adhesive base plate manufacturing installation to make the key diagram of the process of adhesive base plate, and Figure 11 is the flow chart that the process of adhesive base plate is made in expression.In addition, each number of steps of aftermentioned is corresponding with the number of steps of Figure 11.
At first, as shown in Figure 4, the last pressure-producing part 15 of adhesive base plate manufacturing installation 10 is retained as the state that is positioned at its uppermost position.
Among the step S1, under this state, move into infrabasal plate W1 by mechanical arm.The method of specifically moving into of infrabasal plate illustrates after step S2.
Among the step S2, will be configured in the top of basal part 11 by the infrabasal plate W1 that unshowned mechanical arm conveyance comes.At this, the push rod 45 that hoists is risen so that infrabasal plate W1 floats from mechanical arm.
Among the step S3, mechanical arm is withdrawed from chamber 17.
Among the step S4, the push rod 45 that hoists is descended so that infrabasal plate W1 is positioned on the upper surface 23 of basal part 11.
Among the step S5,,, infrabasal plate W1 drives on the platform 25 thereby being adsorbed on by carrying out exhaust from blast pipe 29.
Among the step S6, drive second travel mechanism 32 that is arranged on basal part 11, driving platform 25 is moved upward.
Among the step S7, with step S6 roughly simultaneously to air cushion 35 air inlets, from passage 38 to infrabasal plate W1 ejection air.Like this, the substantial middle portion of infrabasal plate W1 is driven platform 25 and lifts, and further, the effect by air cushion 35 is floated the edge part of infrabasal plate W1.So, infrabasal plate W1 is remained level (the first infrabasal plate mobile process).At this moment, infrabasal plate W1 floats the degree of tens of μ m from the upper surface 23 of basal part 11.
Among the step S8, will be configured in the below of the maintenance face 75 of pressure-producing part 15 by the upper substrate W2 that unshowned mechanical arm conveyance comes.
Among the step S9, make to keep bar 79 to descend and absorption upper substrate W2.
Among the step S10, mechanical arm is withdrawed from chamber 17.
Among the step S11, make to keep bar 79 to rise.
Among the step S12, the function of carrying out electrostatic chuck portion 77 is to be adsorbed on upper substrate W2 on the maintenance face 75.Fig. 5 is the key diagram when finishing to above-mentioned step S12.
In addition, the operation of moving into upper substrate W2 of the operation of moving into infrabasal plate W1 of step S1～S5 and step S8～S12 which formerly carry out all can.But,,, can prevent to impact and feed through to infrabasal plate WI because of the institute that falls of upper substrate W2 therefore by formerly carrying out moving into of upper substrate W2 because upper substrate W2 has from the danger that falls of absorption bar 57.Particularly, when making liquid crystal panel,, therefore preferably formerly carry out moving into of upper substrate W2 owing to be coated with liquid crystal at the upper surface of infrabasal plate W1.
Next, among the step S13, as shown in Figure 6, be retained as under the horizontal state, driving shaft 65 driven, so that go up 15 basad 11 (infrabasal plate W1) declines of pressure-producing part (upper substrate mobile process) at infrabasal plate W1.At this moment, make axial region 67 rotations, thereby axial region 67 is descended according to indication from drive source 66.Because last pressure-producing part 15 is supported by axial region 67, therefore go up pressure-producing part 15 and descend simultaneously.In addition, be connected with support stick 13 owing on the guiding guide 83 at four angles of last pressure-producing part 15, insert, therefore on pressure-producing part 15 descend remaining under the situation of level.So it is the interval of regulation that pressure-producing part 15 is descended between infrabasal plate W1 and upper substrate W2.
Among the step S14, as shown in Figure 7, after between infrabasal plate W1 and the upper substrate W2 being predetermined distance (hundreds of μ m degree), start camera 80, alignment mark M1, the M2 of infrabasal plate W1 and upper substrate W2 focused successively and take.Then, move infrabasal plate W1, feasible alignment mark unanimity (substrate position alignment process) separately along direction in the horizontal plane.At this moment, according to the side-play amount of alignment mark, first mobile device 31 is driven so that driving platform 25 moves along direction in the horizontal plane, thereby make infrabasal plate W1 move to the appropriate location.
In addition, when carrying out the position alignment of this infrabasal plate W1 and upper substrate W2, maintenance face 75 connects with the junction surface 57 of seal member 55.Just, constitute the chamber 17 (process chamber forms operation) of close encapsulation by basal part 11, last pressure-producing part 15 and seal member 55.Particularly, when last pressure-producing part 15 was pushed junction surface 57, junction surface 57 was by pressure pipe 56.Because pipe 56 links with unshowned pressure-reducing valve (リ リ one Off man's cap used in ancient times), therefore manage 56 and under the state that interior pressure is maintained fixed, shrink.Thus, can prevent to manage 56 damaged and keep the sealing state at pressure-producing part 15 and junction surface 57.
Among the step S15, as shown in Figure 8, after the position alignment of infrabasal plate W1 and upper substrate W2 is finished, the driving platform 25 of infrabasal plate W1 is descended and stop air inlet, thereby infrabasal plate W1 is dropped on the upper surface 23 of basal part 11 air cushion 35.So, carry out exhaust from air cushion 35, so that infrabasal plate W1 is adsorbed on the upper surface 23, make its do not misplace (second infrabasal plate mobile process).Then, make pressure-producing part 15 be moved upward some (going up pressure-producing part rising operation).Compare elongated when so, the distance that makes infrabasal plate W1 and upper substrate W2 is with position alignment.This be for after when carrying out vacuumizing in the chamber 17, increase conductance, shorten the pumpdown time, and discharge the air between substrate W1, W2 reliably.So, be moved upward pressure-producing part 15 when some, also adjust so that maintenance face 75 and junction surface 57 butt reliably.
Particularly, with above-mentioned opposite, pipe 56 expands under the state that interior pressure is maintained fixed, and can keep the sealing state at pressure-producing part 15 and junction surface 57.Just, the air pressure of the pipe 56 by adjusting seal member 55 is adjusted the position of the upper surface 58 at junction surface 57.In addition, even if junction surface 57 is moved up and down, by seal 61 also can holding chamber air-tightness in 17.In addition, also can on making after pressure-producing part 15 risings, infrabasal plate W1 be dropped on the upper surface 23 of basal part 11.In addition, also can after last pressure-producing part rising operation, implement process chamber and form operation.
Among the step S16, start vavuum pump 49, carry out exhaust (decompression operation) by 17 inside, 47 pairs of chambers of steam vent.So, will remain vacuum state (about 0.4Pa is following) in the chamber 17.
Among the step S17, after vacuumizing in chamber 17 finished, pressure-producing part 15 is descended.
Among the step S18, as shown in Figure 9, bonding infrabasal plate W1 and upper substrate W2 (base plate bonding operation).At this moment, the part of the deadweight of pressure-producing part 15 is pressurizeed to two substrates W1, W2 in the utilization.At this, the force cell 69 between the leading section 68 by being arranged on axial region 67 and the both sides 72 of last pressure-producing part 15 comes the load of detection effect on two substrates W1, W2, comes adhesive base plate thereby adjust with suitable load.
Among the step S19, as shown in figure 10, after bonding the finishing of infrabasal plate W1 and upper substrate W2, pressure-producing part 15 is risen.At this moment, adhesive base plate W3 is configured on the basal part 11.Just, the function of the electrostatic chuck portion 77 of pressure-producing part 15 in the releasing is so that upper substrate W2 separates from last pressure-producing part 15.
Among the step S20, the push rod 45 that hoists of basal part 11 is risen, so that adhesive base plate W3 rises from upper surface 23.
Among the step S21, in the gap of the upper surface 23 of adhesive base plate W3 and basal part 11, insert mechanical arm, and send adhesive base plate W3 to mechanical arm from the push rod 45 that hoists.So mechanical arm arrives unshowned other devices with adhesive base plate W3 conveyance, thereby finishes dealing with.
According to present embodiment, comprise by upper substrate W2 and infrabasal plate W1 being carried out position alignment and the bonding adhesive base plate manufacturing installation 10 of making adhesive base plate W3: the basal part 11 of mounting infrabasal plate W1, erect support stick 13 that is arranged on the basal part 11 and the last pressure-producing part 15 that can move up and down and can keep upper substrate W2 along support stick 13, by pressure-producing part 15 is descended, so that upper substrate W2 and infrabasal plate W1 is bonding.
Therefore, the last pressure-producing part 15 that maintains upper substrate W2 is arranged on mounting and is had support stick 13 guiding on the basal part 11 of infrabasal plate W1 and moves up and down by setting.Just, the component count that is present between upper substrate W2 and the infrabasal plate W1 is suppressed to Min..Thus, can prevent that from the position alignment of upper substrate W2 and infrabasal plate W1 the relative position of upper substrate W2 and infrabasal plate W1 produces skew to bonding.So, can improve the position alignment precision of two substrate W1, W2, thereby improve yield rate.
In addition, in adhesive base plate manufacturing installation 10 according to present embodiment, basal part 11 is provided with the seal member 55 around the configuring area of infrabasal plate W1, descend by making pressure-producing part 15, thereby seal member 55, on formation chamber 17 between pressure-producing part 15 and the basal part 11.
Therefore, chamber 17 can be made of last pressure-producing part 15, basal part 11 and seal member 55, thereby can reduce the part number.So, miniaturization and lightweight that can implement device.
In addition, the adhesive base plate manufacturing installation 10 in the present embodiment further comprises the vavuum pump 49 that reduces pressure the inside of chamber 17, and when utilizing 49 pairs of chambers 17 of vavuum pump to reduce pressure, chamber 17 is sealed by seal member.
So, by being installed in the seal member 55 between pressure-producing part 15 and the basal part 11, when reduced pressure in chamber 17, can make chamber 17 sealings reliably.So, can make chamber 17 decompressions reliably, thereby can make desired adhesive base plate W3.
Further, the part of absorption infrabasal plate W1 and the driving platform 25 that infrabasal plate W1 is moved are set on basal part 11; When platform 25 moves infrabasal plate W1 infrabasal plate W1 is floated with driving, and when bonding upper substrate W2 and infrabasal plate W1, can adsorb the air cushion 35 of infrabasal plate W1 in utilization.
Therefore, when bonding upper substrate W2 and infrabasal plate W1, can infrabasal plate W1 be adsorbed on the basal part 11 by air cushion 35.So, have the position skew that can prevent infrabasal plate W1, thus can the bonding well upper substrate W2 of precision and the effect of infrabasal plate W1.In addition, owing to need be used for the platform of mounting infrabasal plate W1 no longer in addition, therefore can reduce the part number that is present between basal part 11 and the infrabasal plate W1.Further, when making infrabasal plate W1 be adsorbed on the basal part 11, owing to drive platform 25 and air cushion 35 is not exposed in the chamber 17, can prevent that therefore particle that each device produces etc. from flowing in the chamber 17.So, can guarantee the cleanliness factor in the chamber 17.
And seal member 55 comprises: relatively basal part 11 moves up and down and the junction surface 57 and being arranged on that constitutes the wall portion of chamber 17 is used on the butt pressure-producing part 15 to guarantee the bubble-tight seal 52 of chamber 17 on the junction surface 57.
Therefore, junction surface 57 moves up and down and constitutes the wall portion of chamber 17 with respect to basal part 11, also can construct the chamber 17 of sealing even go up pressure-producing part 15 risings.Thus, can reduce pressure in to chamber 17 under with the state that increases conductance at configured separate infrabasal plate W1 and upper substrate W2, thereby can shorten decompression time.
In addition, Figure 12 illustrates other forms of the seal member 55 in the present embodiment.As shown in figure 12, seal member 255 comprises the gas supply part 256 and the junction surface 57 that is configured in the top of gas supply part 256 that is arranged in the recess 51 and is formed on the below of recess 51.By changing the air pressure of gas supply part 256, junction surface 57 can move up and down along the side 60 of recess 51 and follow moving of pressure-producing part 15.The upper surface 58 at junction surface 57 is positioned at the more top of the upper surface 23 of basal part 11.
In addition, the upper surface 58 at junction surface 57 be provided with and last pressure-producing part 15 between the sealing seal 52.Further, between the side 60 of the recess 51 of the side 59 at junction surface 57 and basal part 11, be provided with sealing seal 61 between the two at Liang Chu.On the spatial portion 263 between the sealing part 61,61, be connected with the unshowned communicating pipe that is communicated with outside (atmosphere).Can alleviate the pressure load of seal 61 thus.In addition, be provided with the seal 262 that cuts off between gas supply part 256 and outside (atmosphere) at the opposition side that is provided with seal 61.
Thus, seal member 255 can obtain the action effect roughly the same with above-mentioned seal member 55.
(second embodiment)
Next, according to Figure 13 the adhesive base plate manufacturing installation in second embodiment of the present invention is described.In addition since present embodiment only the structure with the seal member of first embodiment is different, other structures are roughly the same, therefore to same area mark same-sign and detailed.
Figure 13 is the structure chart of seal member.As shown in figure 13, seal member 155 is arranged on pressure-producing part 15 sides.Particularly, on the maintenance face 75 of last pressure-producing part 15, be formed with recess 151.Recess 151 is formed on the position roughly relative with the recess 51 of first embodiment.
In recess 151, be provided with seal member 155.Seal member 155 comprises the spring 156 of the bottom that is configured in recess 151 and is configured in the junction surface 157 of the top of spring 156.Junction surface 157 is shunk by spring 156 and is moved up and down.In addition, the front end face 162 at junction surface 157 is provided with seal 164.Further, between the side 160 of the side 159 at junction surface 157 and recess 151, be provided with side seal 161.In order to prevent that junction surface 157 from falling from recess 151, erect to the side 159 at junction surface 157 from the side 160 of recess 151 and to be provided with limit stops 165.Thus, constitute chamber 17 by basal part 11, last pressure-producing part 15 and seal member 155.
(effect)
Before adhesive base plate (original state of device), junction surface 157 is because the biasing force of spring 156 and deadweight and sagging downwards, and limited backstop 17 cards end.When pressure-producing part 15 was descended, upper substrate W2 descended simultaneously.Like this, the seal 164 at junction surface 157 connects with the upper surface 23 of basal part 11, constitutes chamber 17 by basal part 11, last pressure-producing part 15 and seal member 155.Then, when pressure-producing part 15 was further descended, spring 156 shrank, and junction surface 157 is accommodated in the recess 151.After this, even if pressure-producing part 15 is moved up and down with some amounts, under the effect of the biasing force of spring 156, seal 164 also can keep the butt state with the upper surface 23 of basal part 11.
So, at substrate W1, when W2 is bonding, can constitute chamber 17 reliably, thereby can make the adhesive base plate W3 of expectation.
In addition, owing to make upper substrate W2 and adhesive base plate W3 17 take out and put into from the chamber by mechanical arm, so seal member 155 is configured to not hinder upper substrate W2 and adhesive base plate W3 to go out to enter the room 17.In addition, if junction surface 157 only utilizes deadweight just can move, then also spring 156 can be set on seal member 155 downwards.In the case,, can reduce the part number, consequently not expense and producing device owing to do not need the mechanism up and down at junction surface 157.In addition, because when substrate took out and puts into, mechanical arm was was also together come in and gone out, therefore go up pressure-producing part 15 and rise to the degree that junction surface 157 can not counteract.
In addition, technical scope of the present invention is not limited to above-mentioned embodiment, in the scope that does not break away from purport of the present invention, comprises above-mentioned embodiment is applied various changes.That is, concrete shape of being enumerated in the embodiment and structure etc. only are an example, the change that can suit.
For example, in the present embodiment, the situation that adopts pipe or spring for the junction surface is moved up and down is illustrated, yet also can uses actuator etc.
In addition, in the present embodiment, the situation that camera is arranged on the pressure-producing part is illustrated, yet also can be arranged on the basal part.
Utilize possibility on the industry
The present invention can provide a kind of position alignment precision of two substrates that makes to improve, and improves adhesive base plate manufacturing installation and the adhesive base plate manufacture method of yield rate.
Claims (6)
1. an adhesive base plate manufacturing installation by upper substrate and infrabasal plate are carried out position alignment and the bonding adhesive base plate of making, is characterized in that, comprising:
The basal part of the described infrabasal plate of mounting;
Setting is arranged on the support stick on this basal part; With
Can move up and down and can keep the last pressure-producing part of described upper substrate along this support stick,
By the described pressure-producing part of going up is descended, the described described upper substrate of going up on the pressure-producing part is bonding with the described infrabasal plate that is positioned on the described basal part with remaining on.
2. adhesive base plate manufacturing installation according to claim 1 is characterized in that,
On described pressure-producing part and described basal part be provided with seal member in mode on any one at least around the zone that disposes described upper substrate or described infrabasal plate,
By the described pressure-producing part of going up is descended, described seal member, described on formation adhesion process chamber between pressure-producing part and the described basal part.
3. adhesive base plate manufacturing installation according to claim 2 is characterized in that,
Further comprise the pressure regulating equipment that is reduced pressure in the inside of described adhesion process chamber,
When utilizing this pressure regulating equipment to be reduced pressure in described adhesion process chamber, described adhesion process chamber is sealed by described seal member.
4. according to each the described adhesive base plate manufacturing installation in the claim 1～3, it is characterized in that,
Described basal part comprises:
The infrabasal plate adsorbent equipment that adsorbs the part of described infrabasal plate and this infrabasal plate is moved; With
When utilizing this infrabasal plate adsorbent equipment to move described infrabasal plate, this infrabasal plate is floated, and when bonding described upper substrate and described infrabasal plate, can adsorb in the described infrabasal plate and do not floated adsorbent equipment by the infrabasal plate of the part of described infrabasal plate adsorbent equipment absorption.
5. according to claim 2 or 3 described adhesive base plate manufacturing installations, it is characterized in that,
Described seal member comprises:
Move up and down with respect to described basal part and described of going up in the pressure-producing part, constitute the junction surface of the wall portion of described adhesion process chamber; With
Be arranged on the described junction surface and offset and fetch the bubble-tight seal of guaranteeing described adhesion process chamber with described basal part or the described pressure-producing part of going up.
6. adhesive base plate manufacture method, by infrabasal plate is positioned on the basal part, by being arranged on the last pressure-producing part maintenance upper substrate that the support stick on the described basal part moves up and down along setting, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, it is characterized in that this adhesive base plate manufacture method comprises:
Utilization be arranged on the described basal part the infrabasal plate adsorbent equipment the part of the described infrabasal plate of absorption make simultaneously this infrabasal plate from described base part from, and utilize the infrabasal plate be arranged on the described basal part to float the first infrabasal plate mobile process that adsorbent equipment floats described infrabasal plate;
The described pressure-producing part of going up is descended, dispose the upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively;
Utilize described infrabasal plate adsorbent equipment that described infrabasal plate is moved, with the substrate position alignment process of the position alignment of carrying out described infrabasal plate and described upper substrate;
The described pressure-producing part of going up is risen, with the last pressure-producing part rising operation of described infrabasal plate of predetermined distance configured separate and described upper substrate;
By seal member described going up between pressure-producing part and the described basal part sealed, the process chamber that forms the adhesion process chamber that accommodates described upper substrate and described infrabasal plate forms operation;
Utilize described infrabasal plate adsorbent equipment in the part of the described infrabasal plate of absorption, this infrabasal plate and described basal part to be connected, and utilize described infrabasal plate to float the second infrabasal plate mobile process that adsorbent equipment adsorbs in the described infrabasal plate not the part of being adsorbed by described infrabasal plate adsorbent equipment;
To the indoor decompression operation that reduces pressure of described adhesion process; With
Make under the state of the indoor sealing of described adhesion process described on pressure-producing part descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-290912 | 2007-11-08 | ||
| JP2007290912 | 2007-11-08 | ||
| PCT/JP2008/070114 WO2009060855A1 (en) | 2007-11-08 | 2008-11-05 | Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101801646A true CN101801646A (en) | 2010-08-11 |
| CN101801646B CN101801646B (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880108048.7A Active CN101801646B (en) | 2007-11-08 | 2008-11-05 | Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4839407B2 (en) |
| KR (1) | KR101195085B1 (en) |
| CN (1) | CN101801646B (en) |
| TW (1) | TW200941614A (en) |
| WO (1) | WO2009060855A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730389A (en) * | 2012-10-16 | 2014-04-16 | 全球标准技术有限公司 | Substrate bonding apparatus and substrate bonding method |
| CN103915365A (en) * | 2012-12-28 | 2014-07-09 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding process method |
| CN104701220A (en) * | 2013-12-09 | 2015-06-10 | 贝思瑞士股份公司 | Downholder for holding down the substrate places of a substrate |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6100571B2 (en) * | 2013-03-22 | 2017-03-22 | 株式会社東芝 | Display device manufacturing apparatus and display device manufacturing method |
| JP6128337B2 (en) * | 2014-10-23 | 2017-05-17 | パナソニックＩｐマネジメント株式会社 | Semiconductor device manufacturing method and manufacturing apparatus |
| JP6049820B1 (en) * | 2015-07-24 | 2016-12-21 | 信越エンジニアリング株式会社 | Bonding device manufacturing apparatus and manufacturing method |
| JP6622254B2 (en) * | 2017-06-21 | 2019-12-18 | 芝浦メカトロニクス株式会社 | Bonding device and bonding processing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631500A (en) * | 1992-07-20 | 1994-02-08 | Hitachi Ltd | Hot press |
| JP3542956B2 (en) * | 2000-10-30 | 2004-07-14 | 信越エンジニアリング株式会社 | LCD panel substrate bonding equipment |
| JP2005238456A (en) * | 2004-02-24 | 2005-09-08 | Sumitomo Chemical Co Ltd | Method for manufacturing thickness irregular large-sized waveguide |
| JP4078487B2 (en) * | 2005-05-25 | 2008-04-23 | 株式会社日立プラントテクノロジー | Substrate assembly apparatus and method |
-
2008
- 2008-11-05 KR KR1020107006124A patent/KR101195085B1/en active IP Right Grant
- 2008-11-05 JP JP2009540055A patent/JP4839407B2/en not_active Expired - Fee Related
- 2008-11-05 CN CN200880108048.7A patent/CN101801646B/en active Active
- 2008-11-05 WO PCT/JP2008/070114 patent/WO2009060855A1/en active Application Filing
- 2008-11-06 TW TW97142875A patent/TW200941614A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730389A (en) * | 2012-10-16 | 2014-04-16 | 全球标准技术有限公司 | Substrate bonding apparatus and substrate bonding method |
| CN103915365A (en) * | 2012-12-28 | 2014-07-09 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding process method |
| CN103915365B (en) * | 2012-12-28 | 2017-01-18 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding process method |
| US9741596B2 (en) | 2012-12-28 | 2017-08-22 | Shibaura Mechatronics Corporation | Bonding apparatus and bonding process method |
| CN104701220A (en) * | 2013-12-09 | 2015-06-10 | 贝思瑞士股份公司 | Downholder for holding down the substrate places of a substrate |
| CN104701220B (en) * | 2013-12-09 | 2019-07-23 | 贝思瑞士股份公司 | Compactor for compressing the substrate position of substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009060855A1 (en) | 2009-05-14 |
| CN101801646B (en) | 2013-04-17 |
| JPWO2009060855A1 (en) | 2011-03-24 |
| JP4839407B2 (en) | 2011-12-21 |
| KR20100057653A (en) | 2010-05-31 |
| KR101195085B1 (en) | 2012-10-29 |
| TW200941614A (en) | 2009-10-01 |
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