CN101663732A

CN101663732A - Mems package having at least one port and manufacturing method thereof

Info

Publication number: CN101663732A
Application number: CN200880012503A
Authority: CN
Inventors: A·D·米内尔维尼; G·P·马辛吉
Original assignee: Knowles Electronics LLC
Current assignee: Knowles Electronics LLC
Priority date: 2007-03-07
Filing date: 2008-02-29
Publication date: 2010-03-03

Abstract

A plurality of individual MEMS packages are formed as a contiguous unit and each of the plurality of individual MEMS packages include at least one acoustic port. One or more separation boundaries fromwhere to separate adjacent ones of the plurality of individual MEMS packages are determined. Each of the plurality of individual MEMS packages are subsequently separated from the others according tothe one or more separation boundaries to provide separate and distinct individual MEMS packages. Each acoustic port disposed within each separate and distinct individual MEMS package is exposed due tothe separating so as to allow sound energy to enter each separate and distinct individual MEMS package.

Description

MEMS encapsulation and manufacture method thereof with at least one port

The cross reference of related application

The application is the U.S. Patent application No.12/034 that submitted on February 21st, 2008,764 continuity, and this application requires the U.S. Provisional Patent Application No.60/893 of submission on March 7th, 2007, and 500 priority applies for that more than integral body is incorporated into this by reference.

Background

The mobile communication technology progress makes progress rapidly in recent years.The consumer uses mobile communication equipment or any other similar devices such as cell phone, the cell phone that network function is arranged, PDA(Personal Digital Assistant), handheld computer, laptop computer, flat computer more and more.Generally speaking, cell phone comprises the printed circuit board (PCB) (PCB) in shell and the shell.Sonic transducer can have the surface that is used for this transducer is electrically coupled to PCB, and is fixed in the shell.At least one acoustic path is coupled to the acoustical ports of this transducer the outer surface of shell.This shell can have at least one sound openings, is used for transmitting acoustic signal via this acoustical ports and acoustic path between transducer and user.Because the position of the sound openings in the cell phone depends primarily on the position of the transducer acoustical ports in the cell phone, so in the cell phone of some type, transducer is installed in the enclosure can have problems.In addition, the acoustical ports of transducer is to form by passing transducer enclosure boring or acoustical ports being molded in the transducer enclosure, thereby causes the efficient during the manufacture process significantly lower.

The accompanying drawing summary

For understanding present disclosure better, should be with reference to following the detailed description and the accompanying drawings, wherein:

Fig. 1 is the stereogram according to the MEMS that uses in the polytype equipment encapsulation of various different execution modes of the present invention;

Fig. 2 is the stereogram that illustrates according to the MEMS encapsulation of various different execution modes of the present invention;

Fig. 3-the 11st is according to the sectional view of the MEMS of various different execution modes of the present invention encapsulation;

Figure 12-the 20th is according to the sectional view of the exemplary MEMS encapsulation of another of various different execution modes of the present invention;

Figure 21-the 29th is according to the sectional view of another exemplary couple of MEMS encapsulation of various different execution modes of the present invention;

Figure 30-the 36th is according to the sectional view of the exemplary MEMS encapsulation of another of various different execution modes of the present invention;

Figure 37-the 42nd is according to the sectional view of the exemplary MEMS encapsulation of another of various different execution modes of the present invention;

Figure 43-the 48th is according to the sectional view of the exemplary MEMS encapsulation of another of various different execution modes of the present invention;

Figure 49 is the plane graph according to the panel of a plurality of MEMS encapsulation of various different execution modes of the present invention;

Figure 50 is the sectional view according to the communication equipment that comprises the MEMS encapsulation of various different execution modes of the present invention;

Figure 51 is the sectional view according to another described example of the communication equipment that comprises the MEMS encapsulation of various different execution modes of the present invention;

Figure 52 is the sectional view according to another described example of the communication equipment that comprises the MEMS encapsulation of various different execution modes of the present invention;

Figure 53-the 59th is according to the sectional view of the folding MEMS encapsulation of various different execution modes of the present invention;

Figure 60-the 62nd is according to the sectional view of the exemplary folding MEMS encapsulation of various different execution modes of the present invention; And

Figure 63 is the sectional view according to the communication equipment that comprises the MEMS encapsulation of various different execution modes of the present invention.

Those skilled in the art will understand for simple and clear for the purpose of show element in the accompanying drawing.It is to be further understood that and may describe or describe specific action and/or step in proper order, but those skilled in the art can understand with specific appearance, actual need be about these definitions of order.It is to be further understood that term used herein and expression have its ordinary meaning, just as giving the implication of these terms and expression, unless state specific meanings in this article in addition about their corresponding the research and learning fields.

Describe in detail

Though the disclosure is allowed many kinds modifications and alternative form, its specific implementations will illustrate by the example in the accompanying drawing and these execution modes will be described in detail in this article.Yet, should be understood that, present disclosure is not intended to limit the invention to particular forms disclosed, otherwise the present invention is intended to cover all modifications, substitute and the equivalent that drops in the spirit and scope of the present invention as defined by the appended claims.

In many these execution modes, a plurality of individual MEMS package are formed adjacent unit, and in these a plurality of individual MEMS package each comprises at least one acoustical ports.Be identified for separating one or more separate confinements of the adjacent encapsulation in a plurality of individual MEMS package.Subsequently, according to these one or more separate confinements in a plurality of individual MEMS package each is separated with other, so that independent and discrete individual MEMS package to be provided.Owing to separating each acoustical ports that is arranged in each independent and discrete individual MEMS package is exposed, enter each independent and discrete individual MEMS package to allow acoustic energy.

In one example, this adjacent unit can be installed on the mounting strap.In another example, can fix this adjacent unit by vacuum.Other means that are used for fixing this adjacent unit also are possible.In case fixing, can by such as sawing, laser cutting, draw to carve and fracture and realize separating.Other separating technology also is possible.

In other example, protective finish to small part is coated in a plurality of individual MEMS package each.At after separating, handle each independent and discrete individual MEMS package to remove coating.

Can multitude of different ways construct and form this MEMS encapsulation.In one example, individual MEMS package can be formed second structure that has first structure and be attached to this first structure.In addition, in the individual MEMS package each can be formed and comprise a chamber.Electronic device and MEMS tube core can be set in this chamber.In addition, the MEMS encapsulation can be formed single MEMS encapsulation or two MEMS encapsulation.

In other embodiments, form the MEMS encapsulation, it comprises elongated pedestal.One or more MEMS devices can be arranged on this elongated bases.The first of this pedestal to small part is surrounded these one or more MEMS devices, and forms permission acoustic energy in received at least one acoustical ports in one or more MEMS devices place.

Can be in many ways, the first of shape or folding this pedestal of structure.In one approach, thus the first of collapsible this pedestal provides sidewall for the MEMS device.In another example, thus the first of collapsible this pedestal provides lid for the MEMS device.In another example, the first of collapsible this pedestal so that its be positioned under the remaining part of this pedestal to small part.Also can use the combination of these examples.In addition, other folding arrangement and structure are possible.

This MEMS device itself can be MEMS tube core and electronic device.In one example, electronic device is an integrated circuit, and the MEMS tube core is a microphone.

In other execution mode of these execution modes, provide MEMS (micro electro mechanical system) (MEMS) encapsulation.This MEMS encapsulation comprises pedestal and first structure that is arranged on this pedestal.Second structure is set on first structure, and this second structure is configured to form first chamber, and has at least one sidewall that is attached to first structure.At least one MEMS tube core is set in this chamber, and forms first acoustical ports and penetrate this sidewall.First acoustical ports provides permission acoustic energy to enter MEMS encapsulation and at the received passage in MEMS tube core place.

In other example, the MEMS encapsulation also comprises electronic device.In one example, this electronic device is an integrated circuit.In some examples, this MEMS tube core is a microphone.

In other example, this MEMS encapsulation is set in the chamber of electronic installation, this electronic installation comprises that the rising tone learns port, this second acoustical ports be used for providing permission from the acoustic energy of portable electron device outside at the received second channel in second chamber of this electronic installation.In one example, this electronic installation is a cell phone.Other example of portable electron device is possible.

In other execution mode of these execution modes, a kind of MEMS (micro electro mechanical system) (MEMS) encapsulation comprises the MEMS structure, and this MEMS structure comprises elongated pedestal.At least one MEMS device is set on this elongated bases, and first folded part of this elongated bases is arranged to become collapsed relationship with the remaining part of this elongated bases, surrounding at least one MEMS device at least in part, and form and allow acoustic energy in received at least one acoustical ports in MEMS device place.

Can or dispose first folded part of the elongated bases of this MEMS encapsulation according to the multitude of different ways arrangement.In one example, first folded part provides sidewall for the MEMS encapsulation.In one example, first folded part provides lid for the MEMS encapsulation.In another example, first folded part to small part is positioned under the remaining part of this pedestal.Can use the combination of these arrangements, and other example also is possible.

Forward accompanying drawing now to, Fig. 1 shows flexibility and the availability according to the encapsulation 10 of one or more execution modes described herein.MEMS (micro electro mechanical system) (MEMS) assembly is provided and has been used to make the method for these encapsulation.The encapsulation that is provided has small size, therefore is suitable for being included in the little and/or thin electronic equipment.Just in this point, these encapsulation can be included in such as computer (desktop computer for example, laptop computer, notebook computer, flat computer, handheld computer, PDA(Personal Digital Assistant), global positioning system (GPS), security system), communication equipment (cell phone for example, the cell phone that network function is arranged, radio telephone, beep-pager), the peripheral hardware that computer is relevant (printer for example, scanner, monitor), amusement equipment (TV for example, broadcasting, satellite broadcasting, stereo system, tape and computer cd player, digital camera, video camera, video cassette recorder, Motion Picture Experts Group, audio layer 3 (MP3) player, video-game), listening equipment (hearing aids for example, earphone, headphone, the blue teeth wireless headphone, In-Ear Headphones, the UWB wireless head-band earphone) or the like in and so on various types of equipment.The miscellaneous equipment example also is possible.In addition, these encapsulation alleviate or have eliminated the influence of electromagnetic interference (EMI) significantly.Because these encapsulate little and easy manufacturing, so reduced manufacturing cost and strengthened reliability.

In many these execution modes, encapsulation 10 comprises tube core and electronic device.Depend on the application of expectation, this tube core can be the microphone and the receiver of loud speaker, receiver, the silicon receiver based on MEMS, dual collector, electret microphone, dynamically microphone, the silicon microphone based on MEMS, two microphone, combination.Depend on the expectation application, this electronic device can be integrated circuit (IC), capacitor, resistor, inductor or other passive devices.Should be understood that, can comprise one or more tube cores and electronic building brick.This tube core and IC can be integrated in the single chip.Alternatively, this tube core can directly be engaged to IC by lead-in wire.

With reference to figure 2, encapsulation 10 can comprise shell 11, and it has pedestal 12, separator 14 and the lid 16 adhered together by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).The chamber (not shown) forms in shell 11.This chamber can be back volume (back volumn), front volume (front volumn) or mixed volume.Pedestal 12 and lid 16 are shown to have one deck at least.Yet pedestal 12 and lid 16 can use multilayer, and have discussed such example in this article in more detail.Separator 14 is shown to have multilayer 14a, 14b and 14c, yet this separator 14 can use individual layer, and has discussed such example in this article in more detail.Though described pedestal 12, separator 14 and lid 16, might remove one of structure 12,14,16 or add additional structure.For example, separator 14 can be integrated into single structure has four sidewalls with formation lid with pedestal 12 or lid 16.Alternatively, in some cases, can add second shell and be coupled to form stacked encapsulation with the mode and first shell 11 according to back-to-back alignment.Tube core and electronic building brick are set in the shell 11.Shell 11 protection tube cores and electronic building brick are not subjected to illumination, electromagnetic interference (EMI) and physical damage.Depend on the expectation application, encapsulation 10 can comprise single port or a plurality of port.As shown in the figure, use cutting technique on the sidewall of shell 11, to form port one 8, be used for providing the voice path that leads to the tube core that is arranged on shell 11.Port one 8 can adopt different shape (for example circular, square or rectangle), and has multiple different size.The second port (not shown) can be formed on the shell 11 so that directional characteristic to be provided, i.e. omnidirectional, two-way or unidirectional sensitivity.The more details of the formation of relevant side ports have been described in the disclosure.

Fig. 3-11 is illustrated in a kind of technology that forms acoustical ports 118 during the separating technology.Fig. 3-11 structurally is similar to the encapsulation 10 among Fig. 1-2, and wherein is accustomed to indicating similar elements with identical mark, and for example element 12 is corresponding to element 112.As shown in Figure 3, provide the pedestal of first structure 112 as encapsulation 100.Pedestal 112 can be made up of printed circuit board (PCB) (PCB), flexible circuit, collapsible circuit, ceramic substrate, film multi-chip module substrate, pre-folded substrate and their combination or similar baseplate material.Pedestal 112 can be the rigidity or the flexible support thing of embedded electronic building brick.Pedestal 112 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction alternately and electrically non-conductive material layer utilize bonding or not too bonding lamination techniques and join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.

Refer now to Fig. 4, second structure 114 is attached to first structure 112 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).Second structure 114 is provided, makes it as separator with the chamber 115 that is surrounded by sidewall 117.The separator 114 identical with the material of first structure 112 can use one or more layers.For example, can construct separator 114, and these layers are to use bonding or not too bonding lamination techniques and join to together by the alternating layer that forms conduction and electrically non-conductive material.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.

As shown in Figure 5; depend on the expectation application; use evaporation, condense, spin coating, spraying, brushing, flow coat or silk screen printing fill or cover the part in chamber 115 by protective finish 120, exempts from impact, stress and cracked with protection tube core and electronic device during cutting.Also can use other technology.Protective finish 120 can be a water-soluble coating, whether adopts water spray though depend on cutting method and it, can use water-soluble coating.Can from soft solid-state, steam pressure height or decomposition temperature near 150 ℃, remove the back do not have remaining, be not inclined to and select protective finish 120 the one group of material that produces friction.In one embodiment, this protective finish 120 can be generally can from Promerus LLC (Promerus, LLC) obtain according to the unified polynorbornene of trade title (PNB) material or any similar material.Generally speaking, can utilize heat that this material is applied and be treated to solid as liquid.Decompose and under the temperature range of the rising between 200 ℃ and 425 ℃, take place usually.Alternatively, but can from evaporation or from water distillation so that select protective finish 120 materials in one group of material removing.One group of material comprises the linear carbon chain molecule that contains 12-18 carbon atom.For example, protective finish 120 can be dodecanol, heptadecanol or such as 2,6-two chloro-2, the chlorinatable material of 6-dimethyl heptane and so on.In a preferred implementation, protective finish 120 is hexadecanol CH ₃(CH ₂) ₁₅OH is also referred to as the 1-hexadecanol, and its fusing point is higher than 24 ℃ and preferably be lower than 50 ℃, and its boiling point is higher than 100 ℃ and preferably be lower than 150 ℃.

Now, as shown in Figure 6, MEMS tube core 122 and electronic device 124 are arranged in the chamber 115 of encapsulation 100.Utilize the adhesive (not shown) that MEMS tube core 122 is attached to first structure 112.For example, electronic device 124 can be to utilize the adhesive (not shown) to be attached to the IC of first structure 112.Alternatively, electronic device 124 can be the passive block that is attached to first structure 112 by surface mounting technology (SMT).In one embodiment, electronic device 124 is IC, and MEMS tube core 122 is microphones.Then the wire 126 by being connected to microphone 122 with IC tube core 124 wire-bonded to the microphone 122 the pad (not shown) and the pad (not shown) on first structure 112.IC 124 and microphone 122 can be integrated in the single chip, use adhesive with this chip attach to the first structure 112 in die attach process.

Refer now to Fig. 7, the 3rd structure 116 is attached to second structure 114 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).The lid of the 3rd structure 116 as encapsulation 100 is provided.The 3rd structure 116 is similar to first structure 112, and can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 116.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.As mentioned before, the 3rd structure 116 can be integrated into single structure with second structure 114 and have the lid of four sidewalls with formation, and is attached to this lid as first structure 112 of pedestal, thereby limits shell 111.Can add optional second shell is coupled to form stacked encapsulation with the mode and first shell 111 according to back-to-back alignment.Shell 111 protection microphones 122 and IC 124 avoid illumination, EMI and physical damage.

Refer now to Fig. 8, will encapsulate 100 then and be installed on the optional cutting belt 128, then along the tangent cut locus road 130 the cutting to produce a plurality of encapsulation.Alternatively, can then its monolithic be turned to a plurality of encapsulation by the fixing encapsulation 100 of vacuum.The layer of cutting belt 128 can have the releasable adhesive of UV.Other example of band also is possible.Cut, pass shell 111 and pass the protective layer 120 that is provided with in the shell 111, be not with 128 to produce otch or saw kerf 132, as shown in Figure 9 but do not cut off.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.

Now, as shown in figure 10,, will encapsulate 100 and be transferred in the process chamber (not shown), and under a temperature, handle certain hour, up to protective finish 120 removal from the chamber 115 of shell 111 fully when encapsulation 100 still is retained in when being with on 128.Port one 18 is formed on the sidewall of the connecting wall 134,136 that adjoins shell 111, thereby allows acoustic signal to enter chamber 115 to interact with the shell 111 interior microphones of installing 122.An encapsulation advantage of 100 is, and is different with the encapsulation of routine, and the port one 18 of encapsulation 100 is not by mechanically punching or boring form in structure 112,114 or 116.Cutting shell 111 is handled protective finish 120 then, and to be formed for providing the port one 18 that leads to the voice path that is arranged on the tube core 122,124 in the shell 111, this has simplified manufacturing process.In addition, reduced manufacturing cost and strengthened reliability.

As shown in Figure 11, will encapsulate 100 with being with 128 to be exposed to UV irradiation (not shown).Be exposed to this irradiation, be enough to destroy with 128 with encapsulation 100 between engaging.Alternatively, can use combination or other release tech of injection syringe needle or UV, heat, injection syringe needle, will encapsulate 100 from being with release 128.Then tube core sorting arrangement (not shown) be ready to check, test or actual situation about using under, each encapsulation 100 is peeled off from being with 128.

Figure 12-20 is illustrated in a kind of technology that forms acoustical ports 218 during the separating technology.Figure 12-20 structurally is similar to the encapsulation 100 among Fig. 3-11, and wherein with identical mark custom indication similar elements, for example element 112 is corresponding to element 212.As shown in figure 12, provide the pedestal of first structure 212 as encapsulation 200.Pedestal 212 can be made up of printed circuit board (PCB) (PCB), flexible circuit, collapsible circuit, ceramic substrate, film multi-chip module substrate or similar baseplate material.Pedestal 212 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 212 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.

Refer now to Figure 13, second structure 214 is attached to first structure 212 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).Provide second structure 214 as separator with the chamber 215 that is surrounded by sidewall 217.The separator 214 identical with the material of first structure 212 can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct separator 214.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.

Now, as shown in figure 14, MEMS tube core 222 and electronic device 224 are arranged in the chamber 215 of encapsulation 200.Utilize the adhesive (not shown) that MEMS tube core 222 is attached to first structure 212.For example, electronic device 224 can be to utilize the adhesive (not shown) to be attached to the IC of first structure 212.Alternatively, electronic device 224 can be the passive block that is attached to first structure 212 by surface mounting technology (SMT).In one embodiment, electronic device 224 is IC, and MEMS tube core 222 is microphones.Then the wire 226 by being connected to microphone 222 with IC tube core 224 wire-bonded to the microphone 222 the pad (not shown) and the pad (not shown) on first structure 212.IC 224 and microphone 222 can be integrated in the single chip, use adhesive with this chip attach to the first structure 212 in die attach process.

Refer now to Figure 15, depend on the application of expectation, use evaporation, condense, spin coating, spraying, brushing, flow coat or screen printing technique be coated to chamber 215 with protective layer, exempts from impact, stress and cracked with protection tube core 222,224 during cutting technique.Also can use other technology.Can after tube core 222,224 is mounted to first structure 212, use protective finish 220 partially filled chambeies 215, but tube core 222 wants not necessarily complete protected coating 220 to cover.Protective finish 220 can be a water-soluble coating, whether adopts water spray though depend on cutting method and it, can use water-soluble coating.Can from soft solid-state, steam pressure height or decomposition temperature near 150 ℃, remove the back do not have remaining, be not inclined to and select protective finish 220 the one group of material that produces friction.In one embodiment, this protective finish 220 can be generally can from Promerus LLC (Promerus, LLC) obtain according to the unified polynorbornene of trade title (PNB) material or any similar material.Generally speaking, can utilize heat that this material is applied and be treated to solid as liquid.Decompose and under the temperature range of the rising between 200 ℃ and 425 ℃, take place usually.Alternatively, but can from evaporation or from water distillation so that select protective finish 220 materials in one group of material removing.One group of material comprises the linear carbon chain molecule that contains 12-18 carbon atom.For example, protective finish 220 can be dodecanol, heptadecanol or such as 2,6-two chloro-2, the chlorinatable material of 6-dimethyl heptane and so on.In a preferred implementation, protective finish 120 is hexadecanol CH ₃(CH ₂) ₁₅OH is also referred to as the 1-hexadecanol, and its fusing point is higher than 24 ℃ and preferably be lower than 50 ℃, and its boiling point is higher than 100 ℃ and preferably be lower than 150 ℃.

Refer now to Figure 16, the 3rd structure 216 is attached to second structure 214 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).The lid of the 3rd structure 216 as encapsulation 200 is provided.The 3rd structure 216 is similar to first structure 212, and can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 216.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.As mentioned before, the 3rd structure 216 can be integrated into single structure with second structure 214 and have the lid of four sidewalls with formation, and is attached to this lid as first structure 212 of pedestal, thereby limits shell 211.Can add second shell is coupled to form stacked encapsulation with the mode and first shell 211 according to back-to-back alignment.Shell 211 protection microphones 222 and IC 224 avoid illumination, EMI and physical injury.

Refer now to Figure 17, will encapsulate 200 then and be installed on the optional cutting belt 228, then along the tangent cut locus road 230 the cutting to produce a plurality of encapsulation.Alternatively, can then its monolithic be turned to a plurality of encapsulation by the fixing encapsulation 200 of vacuum.The layer of cutting belt 228 can have the releasable adhesive of UV.Other example of band also is possible.Cutting is passed shell 211 and is passed the protective layer 220 that is provided with in the shell 211 and carry out, and is not with 228 to produce otch or saw kerf 232, as shown in figure 18 but do not cut off.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.

Now, as shown in figure 19,, will encapsulate 200 and be transferred in the process chamber (not shown), and under a temperature, handle certain hour, up to protective finish 220 removal from the chamber 215 of shell 211 fully when encapsulation 200 still is retained in when being with on 228.Port 218 is formed on the sidewall of the connecting wall 234,236 that adjoins shell 211, thereby allows acoustic signal to enter chamber 215 to interact with the shell 211 interior microphones of installing 222.An encapsulation advantage of 200 is, and is different with the encapsulation of routine, and the port 218 of encapsulation 200 is not by mechanically punching or boring form in structure 212,214 or 216.Cutting shell 211 is handled protective finish 220 then, has simplified manufacturing process to be formed for providing the port 218 that leads to the voice path that is arranged on the tube core 222,224 in the shell 211.In addition, reduced manufacturing cost and strengthened reliability.

As shown in Figure 20, will encapsulate 200 with being with 228 to be exposed to UV irradiation (not shown).Be exposed to this irradiation be enough to destroy with 228 with encapsulation 200 between engaging.Alternatively, can use the combination of injection syringe needle or UV, heat, injection syringe needle or other release tech will encapsulate 200 from being with 228 to discharge.Then tube core sorting arrangement (not shown) be ready to check, test or actual situation about using under, each encapsulation 200 is peeled off from being with 228.

Figure 21-29 is illustrated in a kind of technology that forms acoustical ports 318 during the separating technology.Figure 21-29 structurally is similar to the encapsulation 200 among Figure 12-20, and wherein with identical mark custom indication similar elements, for example element 212 is corresponding to element 312.As shown in figure 21, provide the pedestal of first structure 312 as encapsulation 300.Pedestal 312 can be made up of printed circuit board (PCB) (PCB), flexible circuit, collapsible circuit, ceramic substrate, film multi-chip module substrate or similar baseplate material.Pedestal 312 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 312 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.

Refer now to Figure 22, second structure 314 is attached to first structure 312 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).Provide second structure 314 as separator with the chamber 315 that is surrounded by sidewall 317.The separator 314 identical with the material of first structure 312 can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct separator 314.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.

As shown in figure 23; depend on the expectation application; use evaporation, condense, spin coating, spraying, brushing, flow coat or silk screen printing fill or cover the part in chamber 315 by protective finish 320, exempts from impact, stress and cracked with protection tube core and electronic device during cutting.Also can use other technology.Protective finish 320 can be a water-soluble coating, whether adopts water spray though depend on cutting method and it, can use water-soluble coating.Can from soft solid-state, steam pressure height or decomposition temperature near 150 ℃, remove the back do not have remaining, be not inclined to and select protective finish 320 the one group of material that produces friction.In one embodiment, this protective finish 320 can be generally can from Promerus LLC (Promerus, LLC) obtain according to the unified polynorbornene of trade title (PNB) material or any similar material.Generally speaking, can utilize heat that this material is applied and be treated to solid as liquid.Decompose and under the temperature range of the rising between 200 ℃ and 425 ℃, take place usually.Alternatively, but can from evaporation or from water distillation so that select protective finish 320 materials in one group of material removing.One group of material comprises the linear carbon chain molecule that contains 12-18 carbon atom.For example, protective finish 320 can be dodecanol, heptadecanol or such as 2,6-two chloro-2, the chlorinatable material of 6-dimethyl heptane and so on.In a preferred implementation, protective finish 320 is hexadecanol CH ₃(CH ₂) ₁₅OH is also referred to as the 1-hexadecanol, and its fusing point is higher than 24 ℃ and preferably be lower than 50 ℃, and its boiling point is higher than 100 ℃ and preferably be lower than 150 ℃.

Now, as shown in figure 24, MEMS tube core 322 and electronic device 324 are arranged in the chamber 315 of encapsulation 300.Utilize the adhesive (not shown) that MEMS tube core 322 is attached to first structure 312.For example, electronic device 324 can be to utilize the adhesive (not shown) to be attached to the IC of first structure 312.Alternatively, electronic device 324 can be the passive block that is attached to first structure 312 by surface mounting technology (SMT).In one embodiment, electronic device 324 is IC, and MEMS tube core 322 is microphones.Then the wire 326 by being connected to microphone 322 with IC tube core 324 wire-bonded to the microphone 322 the pad (not shown) and the pad (not shown) on first structure 312.IC 324 and microphone 322 can be integrated in the single chip, use adhesive with this chip attach to the first structure 312 in die attach process.

Refer now to Figure 25, the 3rd structure 316 is attached to second structure 314 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).The lid of the 3rd structure 316 as encapsulation 300 is provided.The 3rd structure 316 is similar to first structure 312, and can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 316.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.As mentioned before, the 3rd structure 316 can be integrated into single structure with second structure 314 and have the lid of four sidewalls with formation, and is attached to this lid as first structure 312 of pedestal, thereby limits shell 311.Can add second shell is coupled to form stacked encapsulation with the mode and first shell 311 according to back-to-back alignment.Shell 311 protection microphones 322 and IC 324 avoid illumination, EMI and physical injury.

Refer now to Figure 26, will encapsulate 300 then and be installed on the optional cutting belt 328,330 cuttings encapsulate to produce a plurality of pairs along the tangent cut locus road then.Alternatively, can then its monolithic be turned to a plurality of encapsulation by the fixing encapsulation 300 of vacuum.The layer of cutting belt 328 can have the releasable adhesive of UV.Other example of band also is possible.As shown in figure 27, cutting is passed shell 311 and is passed the protective layer 320 that is arranged in the shell 311 and carry out, and is not with 328 with generation otch or saw kerf 332 but do not cut off, thereby forms two encapsulation 300.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.

Now, as shown in figure 28,, will encapsulate 300 and be transferred in the process chamber (not shown), and under a temperature, handle certain hour, up to protective finish 320 removal from shell 311 fully when encapsulation 300 still is retained in when being with on 328.Port 318 is formed on the sidewall of the connecting wall 334,336 that adjoins shell 311, thereby allows acoustic signal to enter chamber 315 to interact with the shell 311 interior microphones of installing 322.An advantage of two encapsulation 300 is, and is different with the encapsulation of routine, and the port 318 of encapsulation 300 is not by mechanically punching or boring form in shell 311.Cutting shell 311 is handled protective finish 320 then, has simplified manufacturing process to be formed for providing the port 318 that leads to the voice path that is arranged on the tube core 322,324 in the shell 311.In addition, reduced manufacturing cost and strengthened reliability.

Finally, as shown in Figure 29, will encapsulate 300 with being with 328 to be exposed to UV irradiation (not shown).Be exposed to this irradiation be enough to destroy with 328 with encapsulation 300 between engaging.Alternatively, can use the combination of injection syringe needle or UV, heat, injection syringe needle or other release tech will encapsulate 300 from being with 328 to discharge.Then tube core sorting arrangement (not shown) be ready to check, test or actual situation about using under, each encapsulation 300 is peeled off from being with 328.

Figure 30-36 is illustrated in a kind of technology that forms acoustical ports 418 during the separating technology.Figure 30-36 structurally is similar to the encapsulation 300 among Figure 21-29, and wherein with identical mark custom indication similar elements, for example element 312 is corresponding to element 412.As shown in figure 30, provide the pedestal of first structure 412 as encapsulation 400.Pedestal 412 can be made up of printed circuit board (PCB) (PCB), flexible circuit, collapsible circuit, ceramic substrate, film multi-chip module substrate or similar baseplate material.Pedestal 412 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 412 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.

Refer now to Figure 31, second structure 414 is attached to first structure 412 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).Provide second structure 414 as separator with the chamber 415 that is surrounded by sidewall 417.The separator 414 identical with the material of first structure 412 can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct separator 414.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Second structure 414 can be integrated into single structure has four sidewalls with formation base shell with first structure 412.

Shown in figure 32, the bottom surface with first structure 412 is installed on the cutting belt 428 then, subsequently along the tangent cut locus road 430 cuttings to produce a plurality of base shell 411a as shown in figure 33.The layer of cutting belt 428 can have the releasable adhesive of UV.Other example of band also is possible.As shown in figure 33, cutting is passed base shell 411a and is carried out, when incomplete cut-off band 428, to produce otch or saw kerf 432.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.

Now, as shown in figure 34, MEMS tube core 422 and electronic device 424 are arranged in the chamber 415 of base shell 411a.Utilize the adhesive (not shown) that MEMS tube core 422 is attached to first structure 412.For example, electronic device 424 can be to utilize the adhesive (not shown) to be attached to the IC of first structure 412.Alternatively, electronic device 424 can be the passive block that is attached to first structure 412 by surface mounting technology (SMT).In one embodiment, electronic device 424 is IC, and MEMS tube core 422 is microphones.Then the wire 426 by being connected to microphone 422 with IC tube core 424 wire-bonded to the microphone 422 the pad (not shown) and the pad (not shown) on first structure 412.IC 424 and microphone 422 can be integrated in the single chip, use adhesive with this chip attach to the first structure 412 in die attach process.

When base shell 411a still is retained in when being with on 428, use the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown) that a plurality of lids 416 are attached to base shell 411a, thereby limit package casing 411 as shown in figure 35.Lid 416 is similar to pedestal 412, and can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 416.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Shell 411 protection tube cores 422,424 are avoided illumination, EMI and physical injury.Port 418 is formed on the sidewall of shell 411, thereby allows acoustic signal to enter chamber 415 to interact with the shell 411 interior microphones of installing 422.An encapsulation advantage of 400 is, and is different with the encapsulation of routine, and the port 418 of encapsulation 400 is not by mechanically punching or boring form in shell 411.Cutting shell 411 has been simplified manufacturing process to form port 418.In addition, reduced manufacturing cost and strengthened reliability.

Now, as shown in figure 36, will encapsulate 400 with being with 428 to be exposed to UV irradiation (not shown).Be exposed to this irradiation, be enough to destroy with 428 with encapsulation 400 between engaging.Alternatively, can use the combination of injection syringe needle or UV, heat, injection syringe needle or other release tech will encapsulate 400 from being with 428 to discharge.Then tube core sorting arrangement (not shown) be ready to check, test or actual situation about using under, each encapsulation 400 is peeled off from being with 428.

Figure 37-42 is illustrated in a kind of technology that forms acoustical ports 518 during the separating technology.Figure 37-42 structurally is similar to the encapsulation 400 among Figure 30-36, and wherein with identical mark custom indication similar elements, for example element 412 is corresponding to element 512.As shown in figure 37, provide the pedestal of first structure 512 as encapsulation 500.Pedestal 512 can be made up of printed circuit board (PCB) (PCB), flexible circuit, collapsible circuit, ceramic substrate, film multi-chip module substrate or similar baseplate material.Pedestal 512 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 512 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.

Refer now to Figure 38, second structure 514 is attached to first structure 512 by the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown).Provide second structure 514 as separator with the chamber 515 that is surrounded by sidewall 517.The separator 514 identical with the material of first structure 512 can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct separator 514.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Second structure 514 can be integrated into the base shell 511a that has four sidewalls 517 in the single structure with formation with first structure 512.On base shell 511a, form a plurality of tangent cut locuses road 530 so that the part cutting.

Refer now to Figure 39,530 cutting base shell 511a are to produce a plurality of base shell 511a along the tangent cut locus road.Cutting is passed second structure 514 and is carried out, but incomplete cut-off first structure 512 is to produce otch or saw kerf 532.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.Because do not cut off first structure 512 fully, support to leave thin bar (web) in the fixed position of supporting thin bar so that each base shell 511a is remained on so formed.

Now, as shown in figure 40, MEMS tube core 522 and electronic device 524 are arranged in the chamber 515 of base shell 511a.Utilize the adhesive (not shown) that MEMS tube core 522 is attached to first structure 512.For example, electronic device 524 can be to utilize the adhesive (not shown) to be attached to the IC of first structure 512.Alternatively, electronic device 524 can be the passive block that is attached to first structure 512 by surface mounting technology (SMT).In one embodiment, electronic device 524 is IC, and MEMS tube core 522 is microphones.Then the wire 526 by being connected to microphone 522 with IC tube core 524 wire-bonded to the microphone 522 the pad (not shown) and the pad (not shown) on first structure 512.IC 524 and microphone 522 can be integrated in the single chip, use adhesive with this chip attach to the first structure 512 in die attach process.

As shown in figure 41, use the combination of electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown) that a plurality of lids 516 are attached to pedestal 512, thereby limit package casing 511.Lid 516 is similar to pedestal 512, and can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 516.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Shell 511 protection tube cores 522,524 are avoided illumination, EMI and physical injury.Introduce more than second tangent cut locus road 533 (referring to Figure 41) along shell 511, shell 511 is separated into fully single encapsulation 500.

Now, as shown in figure 42, port 518 is formed on the sidewall of shell 511, thereby allows acoustic signal to enter chamber 515 to interact with the shell 511 interior microphones of installing 522.An encapsulation advantage of 500 is, and is different with the encapsulation of routine, and the port 518 of encapsulation 500 is not by mechanically punching or boring form in shell 511.Cutting shell 511 has been simplified manufacturing process to form port 518.In addition, reduced manufacturing cost and strengthened reliability.Finally, inspection, test or actual the use are ready in each encapsulation 500.

Figure 43-48 is illustrated in a kind of technology that forms acoustical ports 618 during the separating technology.Figure 43-48 structurally is similar to the encapsulation 400 among Figure 37-42, and wherein with identical mark custom indication similar elements, for example element 612 is corresponding to element 512.As shown in figure 43, provide the pedestal of first structure 612 as encapsulation 600.Pedestal 612 can be made up of printed circuit board (PCB) (PCB), flexible circuit, ceramic substrate, film multi-chip module substrate or similar baseplate material.Pedestal 612 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 612 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.As shown in figure 44, pedestal 612 comprises the first chamber 615a and the second chamber 615b opposite with the first chamber 615a.Pedestal 612 also comprises the first side wall 617a and the second sidewall 617b opposite with the first side wall 617a.Partly cut pedestal 612 to form a plurality of base shells as shown in figure 45 along tangent cut locus road 630a, 630b.

Refer now to Figure 45, partly cut pedestal 612 along tangent cut locus road 630a, 630b.Carry out the cutting first time by the first surface that partly cuts off pedestal 612 along tangent cut locus road 630a to produce otch or saw kerf 632a.Carry out the cutting second time by the second surface that partly cuts off pedestal 612 along tangent cut locus road 630b to produce otch or saw kerf 632b.Alternatively, can only once cut on any in first or second surface of pedestal 612, support thin bar 632a ' or 632b ' as long as on a surface of pedestal, formed at least one, leave the fixed position of supporting thin bar 632a ' or 632b ' so that each base shell 611 is remained on.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.

Now, as shown in figure 46, MEMS tube core 622 and electronic device 624 are arranged among chamber 615a, the 615b of pedestal 612.Utilize the adhesive (not shown) MEMS tube core 622 to be attached to first and second surfaces of pedestal 612.For example, electronic device 624 can be to utilize the adhesive (not shown) to be attached to the IC on first and second surfaces of pedestal 612.Alternatively, electronic device 624 can be the passive block that is attached to first and second surfaces of pedestal 612 by surface mounting technology (SMT).In one embodiment, electronic device 624 is IC, and MEMS tube core 622 is microphones.Then the wire 626 by being connected to microphone 622 with IC tube core 624 wire-bonded to the microphone 622 the pad (not shown) and the first and second lip-deep pad (not shown) of pedestal 612.IC 624 and microphone 622 can be integrated in the single chip, use adhesive with this chip attach to the first structure 612 in die attach process.

As shown in figure 47, the combination of use electroconductive binder, scolder or electroconductive binder or scolder and non-conductive adhesive (not shown) is attached to the second structure 616a sidewall 617a of pedestal 612, and the 3rd structure 616b is attached to the sidewall 617b of pedestal 612, thereby limits package casing 611.Provide the second and the 3rd structure 616a, 616b as lid.Different with first structure 612, the second and the 3rd structure 616a, 616b can use one or more layers.For example, can pass through to form the alternating layer of conduction and electrically non-conductive material, and use bonding or not too bonding lamination techniques that these layers are joined to and come together to construct lid 616a, 616b.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Package casing 611 protection tube cores 622,624 are avoided illumination, EMI and physical injury.Introducing is along more than the 3rd the tangent cut locus road 633 (referring to Figure 41) of shell 611, shell 611 is separated into fully single stacked encapsulation 600.

Now, as shown in figure 48, port 618 is formed on the sidewall of shell 611, thereby allows acoustic signal to enter

chamber

615a, 615b to interact with the shell 611 interior microphones of installing 622.An advantage of laminate packaging 600 is, and is different with the encapsulation of routine, and the port 618 of encapsulation 600 is not by mechanically punching or boring form in shell 611.Cutting shell 611 has been simplified manufacturing process to form port 618.In addition, reduced manufacturing cost and strengthened reliability.Finally, each laminate packaging 600 is ready for inspection, test or actual the use.

Figure 49 is the plane graph that panel 752 is shown.This panel 752 comprises a plurality of alignment aperture 754, with when an above panel sets being installed to together correct placement and the alignment of guaranteeing panel 752 when forming a plurality of encapsulation 700.Panel 752 can be the combination of base shell, last shell, pedestal and sidewall or the combination of going up shell and sidewall.

Figure 50-52 and 63 illustrates the electronic equipment 760 that contains transducer encapsulation 732.This electronic equipment 760 can be phone that network function is arranged, cell phone, PDA(Personal Digital Assistant) equipment, laptop computer, beep-pager, digital camera, listening equipment, hearing-aid device etc.In these execution modes, this electronic equipment 760 is cell phones.Equipment 760 comprises shell, and this shell has last shell 762 and lower casing 764, and wherein lower casing 764 is engaged to shell 762 by comprising mechanical fasteners, crimping, welding or bonding and so on any suitable attachment method.Introducing at least one sound openings 774 on the surface of shell enters or leaves to allow sound wave.Comprise printed circuit board (PCB) (PCB) 776 in equipment 760, it is included in electric assembly and other assembly that equipment 760 duration of works use.At least one that introduce encapsulation 732 connects surface (four surfaces are illustrated as 766,768,770,772) and is used for and being connected of the inwall of upper and lower shell 762,764, PCB 776 or they.As shown in figure 50, connect surface 766 is electrically connected to PCB 776 by welding procedure first surface; Yet those skilled in the art with accessible are, comprise that any type of electrical connection of electroconductive binder, contact, spring loaded contact, plug etc. all can be satisfied the demand.PCB 776 is coupled to the inwall of shell 762 with the first surface opposed second surface.The connection surface 768 of encapsulation 732 is coupled to the inwall of lower casing 764.In equipment 760, form chamber 778, encapsulate 732 acoustical ports 734 the sound openings 774 acoustics ground of equipment 760 is coupled to by chamber 778.Chamber 778 can be back volume, front volume, mixed volume or recess.In this execution mode, this chamber 778 is front volume.The chamber of other type also is possible.

Shown in Figure 51, provide acoustic seal 784 to be sealed to PCB 776 will go up shell 762.Introducing second sound openings 780 on the surface of shell 762 enters or leaves to allow sound wave.In PCB776, form aperture 786, with second chamber 788 by formation between last shell 762 and PCB 726 with second sound openings, 780 acoustics be coupled to aperture 786.In encapsulation 732, form the second optional sound port (not shown) so that directional characteristic to be provided.

With reference now to Figure 52,, will encapsulate the inwall that 732 connecting wall 770 is attached to shell 762 by any known technology.The connecting wall 772 of the encapsulation 732 that port 734 is located therein is attached to the upper surface of PCB 776.In PCB 776, form chamber 778 by any known technology, be coupled to the port 734 of encapsulation 732 these chamber 778 acoustics.The sound openings 774 of introducing equipment 760 is to allow sound wave to enter chamber 778 and to interact with the tube core that is formed in the encapsulation 732.

Refer now to Figure 63, in equipment 760, be provided with pad 792 to play acoustic seal.Encapsulation 732 is attached to the surface of PCB 776 and pad 792.Pad 792 can be formed the part of device housings, it comprises that opening 774 is to allow acoustic signal and enter and to interact with the tube core that is arranged in the encapsulation 732.Alternatively, pad 792 can be formed the part of encapsulation 732.

Figure 53-59 is illustrated in a kind of technology that forms acoustical ports 818 during the separating technology.Figure 53-59 structurally is similar to the encapsulation 500 among Figure 37-42, and wherein indicates similar elements with identical with reference to custom, and for example element 512 is corresponding to element 812.Shown in Figure 53, structure 812 comprises base part 813, sidewall 817 and elongated portion 819.Structure 812 can be made up of printed circuit board (PCB) (PCB), flexible circuit, ceramic substrate, film multi-chip module substrate or rigid substrates, collapsible substrate and their combination or similar baseplate material.Structure 812 can be the rigidity or the flexible supporter of embedded electronic building brick.Pedestal 812 can be made up of electric conducting material, electrically non-conductive material or their combination.Electric conducting material can be copper, copper alloy, aluminium alloy, conducting polymer adhesive (PCA) or alloy and their combination.Electrically non-conductive material can be epoxy resin (FR-4), rubber, polyimides, polyethylene polyimides (PEI), polytetrafluoroethylene (PTFE), liquid crystal polymer (LCP) or the plastics that the fire retardant nonwoven glass strengthens.Conduction and electrically non-conductive material layer alternately utilizes bonding or not too bonding lamination techniques to join to together.Other suitable attachment method such as gas deposition, sputter, evaporation, coating, electro-deposition or plating also can be satisfied the demand.On structure 812, form a plurality of tangent cut locuses road 830 so that the part cutting.

During cutting, form a plurality of otch or saw kerf 832, but because do not cut off structure 812 fully, so a plurality of supports that formed shown in Figure 54 approach bar 832a.Can use saw, laser, draw to carve or fracture and realize cutting.Other example of cutting technique also is possible.On structure 812, form at least one fold line 842 (referring to Figure 57) and be used for folding technology to form shell 811.Below be the more details that relevant shell forms.

Now, shown in Figure 55, MEMS tube core 822 and electronic device 824 are installed on the upper surface of base part 813.Utilize the adhesive (not shown) that MEMS tube core 822 is attached to base part 813.For example, electronic device 824 can be to utilize the adhesive (not shown) to be attached to the IC of base part 813.Alternatively, electronic device 824 can be the passive block that is attached to base part 813 by surface mounting technology (SMT).In one embodiment, electronic device 824 is IC, and MEMS tube core 822 is microphones.Then the wire 826 by being connected to microphone 822 with IC tube core 824 wire-bonded to the microphone 822 the pad (not shown) and the pad (not shown) on the base part 813.IC 824 and microphone 822 can be integrated in the single chip, in die attach process, use adhesive with this chip attach to base part 813.

Refer now to Figure 56, introduce more than second tangent cut locus road 833 along thin bar 832a, structure 812 monolithics are changed into the single encapsulation 800 shown in Figure 57.Shown in Figure 58, fold elongated portions 819 to form shell 811 along fold line 842.The first of folding elongated portion 819 is so that the bottom surface of first is attached to the bottom surface of base part 813.Fold the second portion of elongated portion, be attached to the outer surface of sidewall 817 with bottom surface second portion.The remaining part of folding elongated portion 819 is with formation lid 816, thus a part of opening of reservation shell 811.On a side of shell 811, form port 818 then, thereby the permission sound wave enters shell 811 and interacts with tube core 822,824.Shell 811 protection tube cores 822,824 are avoided illumination, EMI and physical injury.Alternatively, the remaining part of elongated portion 819 stops in the position of the location, top of sidewall 817, to form opening 818.At least once form multilayer base part 813 by folding elongated portion 819.Folding elongated portion 819 is attached to the lower surface of base part 813.Formed the opening as Figure 59 shown in 818 of size, thereby allowed sound wave to enter shell 811 greater than the part shown in Figure 58 818.An advantage of encapsulation 800 is that different with the encapsulation of routine, the opening that does not need the pre-punched hole on the structure 812 is to align with opening 818.Finally, inspection, test or actual the use are ready in each encapsulation 800.

Figure 60-62 illustrates the folded package 900 that is included in the side ports 918 that forms during the cutting technique.Figure 60-62 structurally is similar to above-mentioned encapsulation, and identifies similar elements with identical mark custom.Only show an encapsulation 900 for the sake of simplicity.Shown in Figure 60, after first and second structures 912,816 are cut into single encapsulation 900, form port 918.Alternatively, after with first structure, 912 singualtion, second structure 916 is attached to first structure 912.First structure 912 comprises at least one tube core 922 on pedestal with sidewall 917 and the pedestal that is installed in first structure 912.The sidewall 917 that second structure 916 is attached to first structure 912 is to form shell 911.Second structure 916 comprises the lid part opposite with the base part of first structure 916 and is attached to the elongated portion 919 of lid part.On elongated portion 919, form at least one fold line (not shown), to fold elongated portion 919 according to any desired shape.At least a portion of first structure 912 is folded elongated portion 919 and covers, and keeps side ports 918 and be uncovered, thereby allows sound wave to enter shell 911 to interact with the tube core of wherein installing 922.Shown in Figure 61-62, the first that elongated portion 919 is adjoined lid 916 is folding downwards, so that the outer surface of a sidewall 917 is covered and be attached to this first by this first.The second portion of folding elongated portion 919 is so that the lower surface of the base part of its attached first structure 812.The end of the second portion of elongated portion 919 stops in the position of side ports 912 location.

Should be understood that the various variations of said method are possible.For example, the variation to said method can comprise with different order execution above-mentioned steps.In addition, encapsulation more than can be installed in the equipment.For example, stacked encapsulation, two encapsulation or folded package can be set in electronic equipment.Also can will use encapsulation of the present invention as the encapsulation of electret build transducer, optical package, sensor package etc.The purposes of other type and encapsulated type also are possible.In another example, can the combination of first structure, second structure, the 3rd structure or above at least two kinds of structures will be used for the optional terminal pads that encapsulation is coupled to the PCB of any audio frequency or communicator is formed on.In another example, in the final step of this process, use laser cutting technique with this structure singualtion and form port, do not need the part cutting step then.

Described the preferred implementation of this invention in this article, comprised being used for realization known for inventor optimal mode of the present invention.Should be understood that illustrated embodiment only is exemplary, and not should be understood to limit the scope of the invention.

Claims

1. one kind forms the method that a plurality of independent and discrete individual MEMS (micro electro mechanical system) (MEMS) encapsulate, and comprising:

A plurality of individual MEMS package are formed adjacent unit, and in described a plurality of individual MEMS package each comprises at least one acoustical ports;

Determine to be used for separating one or more separate confinements of the adjacent encapsulation in described a plurality of individual MEMS package; And

According to described one or more separate confinements in described a plurality of individual MEMS package each is separated with other MEMS encapsulation subsequently, so that independent and discrete individual MEMS package to be provided, wherein be arranged on each acoustical ports in each independent with discrete individual MEMS package owing to expose described the separation, enter each independent and discrete individual MEMS package to allow acoustic energy.

2. the method for claim 1 is characterized in that, also comprises described adjacent unit is installed on the mounting strap.

3. the method for claim 1 is characterized in that, described separation comprises that utilization is from being separated by the technology of selecting sawing, laser cutting, stroke quarter and the group of forming that fractures.

4. the method for claim 1; it is characterized in that; also comprise protective finish is coated in described a plurality of individual MEMS package each at least in part, and at described after separating, handle in the described independent and discrete individual MEMS package each to remove described coating.

5. the method for claim 1 is characterized in that, forms a plurality of individual MEMS package and comprises first structure that forms pedestal and be attached to described pedestal.

6. method as claimed in claim 5, it is characterized in that, in described a plurality of individual MEMS package each comprises the chamber, and wherein form a plurality of individual MEMS package and comprise further electronic device and MEMS tube core are arranged in each the described chamber in described a plurality of individual MEMS package, and wherein said MEMS encapsulation is the encapsulation of selecting from the group of being made up of single MEMS encapsulation and two MEMS encapsulation.

7. one kind forms the method that MEMS (micro electro mechanical system) (MEMS) encapsulates, and comprising:

Form the MEMS encapsulation, described MEMS encapsulation comprises elongated bases;

At least one MEMS device is set on the described pedestal;

The first of folding described pedestal so that it surrounds described at least one MEMS device at least in part, and forms permission acoustic energy in described at least one received at least one acoustical ports in MEMS device place.

8. method as claimed in claim 7 is characterized in that, the first of folding described pedestal comprises that the described first of folding described pedestal is to provide the sidewall that adjoins described MEMS device.

9. method as claimed in claim 7 is characterized in that, provides lid thereby the first of folding described pedestal comprises the described first of folding described pedestal for described MEMS device.

10. method as claimed in claim 7 is characterized in that, the first of folding described pedestal comprise folding described pedestal described first so that its be positioned at least in part under the remaining part of described pedestal.

11. method as claimed in claim 7 is characterized in that, described MEMS device comprises MEMS tube core and electronic device.

12. method as claimed in claim 11 is characterized in that, described electronic device comprises integrated circuit, and described MEMS tube core comprises microphone.

13. a MEMS (micro electro mechanical system) (MEMS) encapsulation comprises:

First structure;

Second structure, it is set on described first structure and forms first chamber, and described second structure has at least one sidewall that is attached to described first structure;

Be arranged at least one the MEMS tube core in the described chamber;

Pass first acoustical ports that described sidewall forms, described first acoustical ports provides and allows acoustic energy to enter described MEMS encapsulation and at described at least one received passage in MEMS tube core place.

14. MEMS encapsulation as claimed in claim 13 is characterized in that, also comprises the electronic device that is arranged in the described chamber.

15. MEMS as claimed in claim 14 encapsulation is characterized in that, described electronic device comprises a kind of in integrated circuit, capacitor, resistor and the inductor.

16. MEMS as claimed in claim 13 encapsulation is characterized in that, described MEMS tube core comprises a kind of in the microphone of microphone, loud speaker, receiver and associating and the receiver.

17. MEMS encapsulation as claimed in claim 13, it is characterized in that, described MEMS encapsulation is set in the chamber of electronic installation, described electronic installation comprises that the rising tone learns port, described second acoustical ports be used for providing permission from the acoustic energy of described portable electron device outside at the received second channel in described second chamber of described electronic installation.

18. MEMS as claimed in claim 17 encapsulation is characterized in that, described electronic installation comprises a kind of in cell phone, laptop computer, flat computer, personal digital assistant, camera, listening equipment and the hearing aids.

19. MEMS encapsulation as claimed in claim 17 is characterized in that described second chamber comprises in back volume and the front volume.

20. a MEMS (micro electro mechanical system) (MEMS) encapsulation comprises:

The MEMS structure, described MEMS structure comprises elongated bases;

Be arranged at least one the MEMS device on the described elongated bases; And

First folded part of described elongated bases is configured to become collapsed relationship with the remaining part of described elongated bases, and surround described at least one MEMS device at least in part, described first folded part forms at least one acoustical ports at least in part, is received at described MEMS device place to allow acoustic energy.

21. MEMS encapsulation as claimed in claim 20 is characterized in that, described first folded part provides sidewall for described MEMS encapsulation.

22. MEMS encapsulation as claimed in claim 20 is characterized in that, described first folded part provides lid for described MEMS encapsulation.

23. MEMS encapsulation as claimed in claim 20 is characterized in that described first folded part is folded under the described remaining part of described pedestal at least in part.