CN101663125B

CN101663125B - Laser machining method, laser cutting method, and method for dividing structure having multilayer board

Info

Publication number: CN101663125B
Application number: CN2008800109736A
Authority: CN
Inventors: 镰田将尚; 住吉哲实; 辻川晋; 关田仁志
Original assignee: Cyber Laser Inc
Current assignee: Cyber Laser Inc
Priority date: 2007-04-05
Filing date: 2008-04-02
Publication date: 2012-11-28
Anticipated expiration: 2028-04-02
Also published as: JPWO2008126742A1; JP2013223886A; JP5822873B2; CN101663125A; TWI445586B; WO2008126742A4; WO2008126742A1; TW200848190A; JP5784273B2; KR20100015948A; KR101333518B1

Abstract

The present invention provides a method for efficiently machining a work with a very short pulse. A method is used for machining a work such as a board with a laser beam. The method is characterized in that a very short pulse laser beam having a wavelength to which the work is transparent is directed to the front surface of the work toward the back surface and focused, the beam waist of the focused laser beam is located away from the back surface of the work, a beam focus channel long in the light beam traveling direction from the beam waist formed by the auto-focusing action due to the laserbeam propagation in the work is thus formed in the work, a substance in the channel is decomposed by the laser beam, the decomposed substance can be discharged from the back surface, and a cavity is formed in the channel. While forming the cavity, the laser beam is scanned, a machined surface is formed, and thereafter the work can be cut with a weak bending stress. The invention can be applied todivide two substrates opposed to each other, and can be used for dividing a glass substrate of a liquid crystal panel.

Description

Laser processing and cutting method and dividing method with structure of multilager base plate

Technical field

The present invention relates to the processing object object particularly as substrate flat object use with respect to this object and efficiently and in high quality carry out method for processing as the ultra-short pulse laser of transparent wavelength.

The invention still further relates to the dividing method that adopts laser that the structure with multilager base plate is cut apart, multilager base plate wherein have at least two substrate configured in parallel and between inserted the structure of partition.The present invention is applicable to cuts apart the panel display board that display panels, Plasmia indicating panel etc. have adopted glass substrate.

Background technology

In electronics industry, the microminiaturization of semiconductor equipments such as CPU, DRAM, SRAM is progressive year by year, meanwhile, has realized the highly integrated of internal circuit.The structure of these equipment is on semiconductor substrates such as silicon wafer, to form with the integrated circuit pattern of height.In order to obtain a plurality of chips, must make chip cut apart required area and minimize from semiconductor wafer.Therefore it is few to hope in line (ス Network ラィ PVC Application グ) operation, to process dispersing of removal thing.Hope can be cut apart with given size in the cutting action of the glass substrate of LCD etc. exactly.In these segmentation process, need under not to the condition that causes fire damage and mechanical damage around the processing portion, remove processing, therefore use the burst pulse below the nanosecond pulse.In the processing of using ultra-short pulse laser, though can reduce the hot-working metamorphic layer generation technology and be that material transparent also can absorb the technology of processing and belong to known technology through the nonlinear optical that is absorbed as representative with multi-photon for this wavelength.

According to patent documentation 2, it is known adopting the transparent body processing method of the laser of ultrashort pulse vibration, and in patent documentation 3, has put down in writing the method that optically focused carries out Laser Processing to object to be processed at the back side of substrate.

During with the big UV laser radiation of surperficial absorptivity; Produce plasma from irradiating surface; Therefore laser is absorbed; So the utilization ratio of laser energy is low, simultaneously, thereby also exist on every side because of also having because from the illuminated situation that the characteristic of equipment is on every side exerted an influence of the SE secondary emission of plasma.Therefore as the crossed process that semiconductor substrate, the effective glass substrate of film crystal is divided into prescribed level, in patent documentation 3, record from joint-cutting get into the opposite face of face (machined surface) in focus the machined surface irradiating laser come method to machined surface processing joint-cutting.In the method, owing to make laser focusing on the face opposite, carry out laser ablation processing with the laser light incident side, thereby have the not enough shortcoming of the working groove degree of depth.When groove depth was dark inadequately, in order to separate along this groove, it is big that the bending force that not only ruptures required becomes, and can not cut apart along line sometimes.If working groove is enough dark, just can cut apart with less stress so along line.

On the other hand, in the manufacturing of liquid crystal indicator, comprise the operation that the large-size glass substrate that constitutes panel is cut.At least two glass plates of panel surface configured in parallel of liquid crystal indicator are provided with the wiring of the required chromatic filter of display unit, liquid crystal, thin film transistor (TFT) (TFT), control electrode etc. therebetween.These glass plates side by side make the multi-disc display unit through in manufacturing process, adopting the glass bigger than final display unit, thereby carry out the manufacturing of polylith display floater simultaneously, to raise the efficiency.Therefore, for final consistent with the panel size of product, need be from cutting respectively on the large-size glass substrate that forms bigger polylith panel.The cutting method of existing glass plate has: utilize the cutter etc. of diamond cutter, superhard cutter and so on along desirable line of cut incision glass surface line to be set; Stress application on perpendicular to the direction of this line afterwards, the method that it is separated along this line fracture; And, make laser along the scanning of desirable line of cut, heating, on glass substrate, produce thermal stress, make substrate from this part method of cutting apart etc. that ruptures.In this case, adopt the big optical maser wavelength of absorptivity that glass plate is shone, make its local heat, force cooling afterwards, to cut apart from irradiation position.

Between two glass plates, insert display unit and after sealing around the glass, be divided under the situation of each display floater, implement to face the method that each side is rule and cut then from two of two overlapping glass plates with sealant.For this reason, owing to cut, thereby become after one side having been carried out line processing and reversed its lap is rule, cut apart together then the method for two overlapping glass plates in the surface of double glazing unit and the back side with diamond cutter.Because the trend that in recent years market exists the size of display floater to maximize, thereby the size that is used for the glass of panel also presents increasing trend.Therefore, the Handling device that is used to make the large glass plate is complicated, and reversing device becomes in large scale and becomes high price equipment.Therefore, under nonreversible situation, become practicality and effective manufacturing approach from the one-sided method that glass plate is rule.In patent documentation 4, disclose each glass surface irradiation Ultra-Violet Laser of an a kind of side direction from two blocks of overlapping glass, implemented the scheme of line on the surface of two glass plates of overlay structure.In the method, laser is had the transparency at glassy phase, under the situation of top glass side irradiating laser, Ultra-Violet Laser arrives the bottom glass surface condition that necessitates through top glass.Therefore, if be useful on the metal film of the metal line etc. at the top of bottom glass or the upper glass plate back side, so owing to laser radiation makes metal film damaged, perhaps because the laser beam that blocks of metal film is difficult to arrive lower glass plate.Like this, having between two blocks of glass under the situation of inserting, to be difficult to the glass plate of bottom rule through the glass plate on top from one-sided irradiating laser light beam.

Patent documentation 1: the U.S. re-issues No. 37585 specification of patent

Patent documentation 2: the spy opens the 2002-205179 communique

Patent documentation 3: the spy opens the 2004-351466 communique

Patent documentation 4: the spy opens the 2005-132694 communique

Patent documentation 5: the spy opens flat 8-64556 communique

Summary of the invention

The problem that invention will solve

The problem that solves is; Adopt with respect to processing object be the ultra-short pulse laser of transparent wavelength when the face (back side) opposite with light incident side implemented high-precision processing to processing object, in processing object inside the light beam of minor diameter is skimmed over the scope longer than the depth of focus of focal point and is arranged on the direct of travel of laser.

In addition, further problem is that a kind of method that only just can cut apart this structure to the structure with multilager base plate from a substrate surface side irradiating laser is provided.In addition, between two substrates, have in the structure of metallic film, the dividing method that metallic film is exposed is provided.In addition, providing a kind of has sealing and under the situation of the inboard formation of sealing electronic unit, can export to the dividing method of the structure in the sealing outside with connecting up from this electronic unit between two substrates.

Solve the scheme of problem

Processing object is inner to be produced from the pack effect through making, and the working width of laser is diminished, thereby it is big especially that the processing distance of the direct of travel of laser is compared with common ablation processing, solves above-mentioned problem thus.

For solving above-mentioned problem; The present invention provides a kind of laser processing; Wherein, Is that the ultra-short pulse laser of transparent wavelength carries out optically focused through beam condensing unit to the object to be processed that has with respect to comprise first and second, shines said laser so that the beam waist position of the said laser behind the optically focused is formed between first and second of said object to be processed from first side, through the inner ultrashort pulse peak value laser propagation of said object to be processed from the pack effect; On the direct of travel of said laser, form the optically focused passage, form the cavity that arrives second at said optically focused channel part thus and perhaps arrive near the cavity second.The processing distance that thus, can make the laser direct of travel is greater than common ablation processing.

Near said laser direct of travel and intersection point second, be formed with than the protrusion structure a little less than the higher mechanical strength of circumferential surface protrusion.In addition, make said cavity be formed up to second through making said optically focused passage be formed up to second.In addition, make said cavity be formed up to second through making said optically focused passage be formed up to second from first face from first face.In addition, being formed up to said processing object inside through said optically focused passage from first face makes said cavity be formed up to said processing object inside from first face.By above-mentioned these modes, the processing distance of laser direct of travel is processed greater than common ablation (ァ Block レ one ショ Application).

In addition, said object to be processed is the sandwich construction of tabular overlapped object of the same race or not same material more than two.Thus, can process the object more than two simultaneously.

In addition, through being that other transparent objects change the length by the said optically focused passage that forms from the pack effect of said object to be processed with respect to said optical maser wavelength in first side setting of said object to be processed.Thus, can adjust the processing distance of laser direct of travel.

In addition, be other transparent objects through first side setting with respect to said optical maser wavelength at said object to be processed, make the said optically focused passage that forms from the pack effect arrive first by said object to be processed.Thus, can be machined to the surface of substrate.

In addition, through making with the coincidence of said beam condensing unit the said ultra-short pulse laser of the inner optically focused of said object to be processed relatively moves the space that said cavity is set with speed arbitrarily along cut direction on.In addition, relatively move with speed arbitrarily along cut direction at the said ultra-short pulse laser of the inner optically focused of said object to be processed, said cavity spatially is set discretely through making by said beam condensing unit.By above-mentioned these modes, can on object to be processed, form line of cut, and, because the processing of laser direct of travel distance is big, thereby can cut with less bending stress.

In addition; Said object to be processed is plane object; Make first the angled oblique incidence of normal direction of the light-concentrating laser and the said object to be processed of said ultra-short pulse laser; Make said light-concentrating laser have the inclination of said angle and it is rotated and carry out circular scanning, obliquely machined surface is processed.Thus, can process circular line of cut.

In addition, be included in the operation of carrying out repeatedly changing between said respectively the relatively moving of relatively moving said laser beam waist height.Thus, can form the cavity, thereby can implement to cut to the processing of whole cuttings from part in the deep of object to be processed.

【0013】

On the other hand, the present invention provides a kind of cutting method of object to be processed, has wherein carried out cutting said object to be processed along the processing part with little stress after the Laser Processing at the object to be processed to above record.Thus, can correctly cut apart object to be processed along line of cut.

In addition; The present invention provides a kind of cutting method of display panels substrate; Wherein, display panels has the laminated structure of first substrate and second substrate, and said cutting method may further comprise the steps; On the parts that carry on second substrate surface place first substrate-side, smearing or gluing together or be close to respect to said optical maser wavelength is opaque material and from the first substrate-side irradiating laser; In first substrate, to form laser beam waist, when irradiating laser, the laser through first substrate can not cause damage to said parts.

In addition, in the present invention, provide a kind of first substrate and the second substrate configured in parallel and between partly to clip the dividing method of the structure of partition.

This method comprises that line forms step and substrate cut step; Form in the step in line; Through beam condensing unit to being that transparent wavelength, the ultra-short pulse laser of pulse width below 100ps carries out optically focused with respect to first substrate and second substrate; Shine so that beam waist position is in the surperficial or inner of arbitrary substrate from the outside of first substrate; On pack acts on the direct of travel of this ultra-short pulse laser, form the optically focused passage through what this ultra-short pulse laser was propagated, form the cavity at this optically focused channel part thus, form line through relatively moving this ultra-short pulse laser; In the substrate cut step,, line the substrate that has formed said line is cut after forming step along this line.Since can be only from have multilager base plate particularly a side-irradiation laser of the structure of bilevel substrate process, thereby can realize the simplification of equipment.

In addition, the present invention, this line form step and comprise the following A step, and this substrate cut step comprises following C step.

In addition, said line forms step and comprises following A and B step, implements with the order of said A step, this B step or this B step, said A step, and said substrate cut step comprises following C and D step, implements with the order of said C step, this D step.Thus, can form the part of the second not relative substrate with first substrate, thus can be on the medial surface of second substrate or its surperficial top form control circuit, realize the lightening of display floater such as liquid crystal panel.

A step: this ultra-short pulse laser is carried out optically focused so that should with a tight waistly be on second substrate through first substrate; On second substrate, to form first line; Carry out optically focused again so that with a tight waist placing on first substrate; With relatively moving this ultra-short pulse laser, rule thereby on first substrate, form second with the same plan-position of first line.

The B step: said ultra-short pulse laser is carried out optically focused so that said position with a tight waist is positioned at first substrate, through with distance abreast the relatively move said ultra-short pulse laser of second line at a distance of regulation, on first substrate, form the 3rd line.

C step: through cutting apart this structure along first line cutting second substrate and along the second line cutting, first substrate.

D step:, remove the part of second line to the 3rd line of first substrate through along the 3rd line cutting first substrate.

And said structure has metal film on first substrate, relative with second substrate-side face.And said partition is an encapsulant; Have the sealing material of formation by first substrate and second substrate and sealing material encirclement space; Be formed with electronic unit in this space, said metallic film is crossed in the inboard and the outside in this space, and said metal film is electrically connected with this electronic unit.Because metallic film is across seal, this metallic film is electrically connected with this electronic unit that forms in seal inside, thereby can this metallic film be used as wiring, can connect up to this electronic unit in the outside of sealing.

And the present invention provides a kind of laser processing device, and it comprises: the ultra-short pulse laser generating means; Revolving mirror makes the pulse laser that produces from said ultra-short pulse laser generating means be partial at a certain angle and rotate; Collector lens, rotation is so that optical axis overlaps with the light path of the said laser beam of deflection synchronously with said revolving mirror, and through optically-active, the focus of collector lens is described circular trace; The device that the said optical axis direction in edge moves said collector lens; With the processing object mounting apparatus.Constitute through this, can on object to be processed, form circular line of cut, and can cut circularly along line of cut.

The effect of invention

Through generation from the pack effect; The optically focused passage forms through long distance than with a tight waist on the laser direct of travel; Form the cavity at the optically focused channel part; Arrive second cavity in the formation of optically focused channel part, perhaps arrive second cavity nearby, so the comparable common ablation processing of the processing of laser direct of travel distance greatly.

Description of drawings

Fig. 1 adopts relevant with the present invention pie graph from the object to be processed processing method of pack effect that is caused by Kerr effect for explanation.

Fig. 2 makes laser scanning carry out the pie graph of substrate processing.

Fig. 3 is the figure that the spot position of change laser focusing point carries out once more method for processing after being illustrated in scanning and processing object to be processed.

The pie graph that Fig. 4 processes for the sandwich construction that two substrates are processed.

Fig. 5 cuts the figure of situation at diverse location to liquid crystal panel structure and two glass substrates for explanation.

Fig. 6 is the schematic sectional view that is used to explain the dividing method of the structure of being processed by two substrates.

Fig. 7 illustrates an example of the general shape of the glass structure body of being processed by two substrates.

Fig. 8 is the key diagram when the large glass structure is divided into each display panels.

Fig. 9 illustrates the figure that processing method of the present invention is applied to the embodiment of inclined plane processing.

Figure 10 is the figure that the result of first embodiment is shown, and it is the microphotograph of object to be processed near surface.

Figure 11 is the figure that the result of first embodiment is shown, and it is near the microphotograph the object to be processed back side.

Figure 12 is the figure that the result of second embodiment is shown, and it is the key diagram and its microphotograph of the cut surface of empty passage.

Figure 13 is the figure that the result of second embodiment is shown, and it is the scan microscope photo of the section in shooting cavity 61.

Figure 14 is near the scan microscope photo to amplifying especially the substrate back among Figure 13.

Figure 15 is the figure that the result of the 3rd embodiment is shown, and it is the microphotograph of cut surface.

Figure 16 is the figure that the result of the 4th embodiment is shown, and it is the microphotograph of cut surface.

Figure 17 is the figure that the result of the 5th embodiment is shown, and it is that two microphotographs after the substrate processing are shown.

The specific embodiment

Embodiment of the present invention below is described.Fig. 1 is the figure that the embodiment of processing method of the present invention is shown.As from laser (light beam) 2 of the ultrashort pulse 15 of ultra-short pulse laser generating means 1 output through collimater (not shown) row that flattens, incide collector lens 3 beam condensing units such as grade, as surface 45 incidents of pack laser beam 5 from object to be processed 4.The laser of so-called ultrashort pulse be meant pulse width at 100ps with interior laser.As the example of said object to be processed 4, for example can be insulating materials such as glass, sapphire or diamond, perhaps semi-conducting material such as silicon or gallium nitride.In addition, object to be processed 4 is suitably flat objects such as substrate.Therefore, below, also object to be processed 4 is called substrate.It is the laser of transparent wavelength that laser is chosen as with respect to object to be processed.Here said transparent, be not limited to must 100% printing opacity the meaning.Also comprise laser and can see through situation to a certain degree.For example, if object to be processed is a silicon substrate, wavelength is that the region of ultra-red of 1 μ m to 2 μ m gets final product so.As the example of laser medium, for example can also the fiber that add erbium, fiber, Nd:YAG crystal, the Nd:YVO that adds yttrium except titanium sapphire crystal (centre wavelength 780nm) ₄Crystal, Nd:YLF crystal etc.In addition, with glass substrate during as object to be processed, preferably with titanium sapphire crystal (centre wavelength 780nm) as laser medium.

In addition, so-called surface is meant the face of laser light incident side, is called the back side with the face of its opposition side.Pack laser beam 5 forms as with a tight waist 6 of focal point in the inside of object to be processed 4.To object to be processed 4 irradiation pack laser beams 5, make its with a tight waist 6 aim at from the surface 45 to the back side 44 the inner appropriate location of object to be processed come illumination beam.

When energy, wavelength and the pulse width of adjustment pack laser beam 5 and the focal length and the spot position of said collector lens 3; Thereby when ultrashort pulse optically focused being become high-energy-density in the inside of object to be processed 4; From with a tight waist 6 towards direct of travel produce based on Kerr effect from the pack effect, form the propagation ducts 8 of light pencil with 6 such diameters with a tight waist.In Fig. 1; When according in the inside of the thickness 7 of object to be processed 4 from the back side 44 when surface direction forms that laser beam waist 6 is such sets illuminate conditions; The pack laser beam 5 of incident is from a tight waist 6; Can not produce a little less than because of energy density based on Kerr effect in the zone of pack effect, in case behind 6 optically focused with a tight waist just with light beam 10 propagation of diversity.But; If the energy density of Kerr effect very high focal point form with a tight waistly, then form the passage 8 of filament through distance 13, the pack laser beam is propagated along the inner passage 8 of object to be processed; Advance to the back side 44 while consuming laser beam energy; If 44 also keep the energy that can keep the Kerr effect degree overleaf, then there is part compression towards periphery owing to shock wave of passage 8 in object to be processed, and the result forms thin cavity; Remaining be discharged to outside from the back side or under the situation of not discharging overleaf 44 form protruding, along passage 8 through associate with a tight waist 6 to the back side 44 the elongated cavity of distance 14 formation.Under not by the state of machined object bulk absorption, arrive the light beam at the back side 44, thereby penetrate as diversity light beam 11 owing to no longer receive to limit from the pack effect.

As the beam condenser effect that in object to be processed, the causes significant condition that becomes, with good grounds document J.H.Marburger, Prog.Quantum Electron. (quantum electronics), Vol.4, p.35 (1975) from the pack effect.In the threshold limit value power P that is called from pack _CrFormula 1 shown in index.

[formula 1]

P_{cr} = \frac{3.77 λ^{2}}{8 π n_{0} n_{2}}

In formula 1, λ is an optical maser wavelength, n ₀Be the refractive index of object, n ₂Nonlinear refractive index for object.

According to formula 1; For example the threshold limit value power from pack of quartz glass is 2.3MW; If it is bigger than this value to incide the peak value output (pulsed laser energy is divided by the value of laser pulse width) of laser pulse of object to be processed, then will produce significantly from the pack effect.

The focal length of energy, wavelength, pulse width and collector lens through realizing ultra-short pulse laser, the adjustment of spot position can change the generation situation from the pack effect.Thus, form the cavity that arrives the back side and perhaps arrive near cavity, the back side.Here near said, be meant to comprise from this towards internal direction the scope that arrives as the distance of the thickness about 1/10 of the object of processed objects such as substrate.Formation state in cavity can be set as follows.

(1) cavity does not arrive the back side, thereby the back side forms than circumferential surface height and the projective structure of bad mechanical strength.

(2) said optically focused passage is formed until the back side, and the cavity is formed until the back side thus.

(3) from the surface to the back side, form said optically focused passage, from the surface to the back side, form the cavity thus.

(4) only to be formed from the surface processing object inner for the optically focused passage, and the cavity is formed from the surface only inner to processing object thus.

According to the present invention; To have with respect to object to be processed be that the ultra-short pulse laser of transparent wavelength utilizes light-gathering optics optically focused in substrate on the very little laser sectional area through making; Realize the focal point of high-energy-density at the focal point place; And make the laser in substrate, propagated in case by optically focused thus, then produce Kerr effect from the pack effect, produce the blooming effect that causes by plasma at focal point on the other hand; Through the balance of these two effects, the propagation of laser pulse light forms the filament from trap from the pack effect.The scope of this trap can form than the laser propagation passage from the pack effect near the big several times distance of the depth of focus with a tight waist that does not occur the focus under the common power level condition of pack effect, forming.The length of passage changes according to parameters such as the power density of material behavior, laser beam, energy.Because the end of the laser propagation direction of passage arrives the back side; Afterwards; Owing to the energy of channel interior savings forms local high temperature, high pressure conditions and applies power by inside to the outside, thus above-mentioned optically focused passage from the pack effect pass through form also residual cavity in the vestige.

As shown in Figure 2, form based on cavity along scan line 48 from the oval column type passage of pack effect.Should the optically focused of the laser of ultra-short pulse laser 2 from object to be processed 4 in be lighted be expert at into formation more longways on the direction 16 from the pack effect.And; Forming the back, cavity is applying scan line 48 on the right angle orientation under the situation that bending stress 49 fractures; Owing to be formed with big many holes, depth ratio aperture, thereby play the effect of the starting point that fractures, can cut with smaller stress along ruling along the line (line) of this groove.Owing to be formed with continuous shallow slot or the bulge-structure a little less than the structure at the back side of substrate, thus fracture direction really only along scan line 48 promptly along line.Though near overleaf sometimes surface has the hole and channel outlet portion becomes the structure than the bad mechanical strength of circumferential surface protrusion; But in either event, through making laser all can promptly form machining shape along scan line 48 from the substrate deep inside to the back side along line along the scanning direction of wanting cutting substrate.Because the degree of depth of working groove is enough, thereby can use less bending stress 49 along scan line 48 cutting substrates afterwards.Line can not form through moving of object to be processed 4 through moving of laser yet.These two kinds mobile any one are called relative scanning.In addition, carrying out on the direction of wanting to fracture under the situation of laser scanning, through the adjustment sweep speed; Can line be set continuously to plane of rupture; In addition, also can vacate line is set at interval discretely, no matter can use less bending stress along the cutting substrate of ruling under which kind of situation.

In Fig. 3, illustrated on one side with laser focusing to certain height of object to be processed on one side to object to be processed carry out single pass processing, the spot position that changes laser focusing point then carries out method for processing once more.At first, shown in (a), make the aligning with a tight waist of laser be the empty position that forms distance 57 (about 135 μ m) apart to the inner back side 44 with object to be processed 4, formation is from the passage 8 of pack effect, and 47 carry out a linear scanning along the scanning direction.Thus, form the cavity row of orthoscopic.Secondly, shown in (b), move collector lens 3 along optical axis direction, only move the empty distance 58 that forms with forming the height of girdling the waist to face side, formation passage 8 also scans once more.At this moment, owing to be the processing line 35 enterprising line scannings in first scanning, thereby the mode that the cavity row are roughly arranged according to the cavity row that form with first scanning continuously forms.And, necessary, shown in (c), be used for the scanning that forms with the cavity row of highly moving with a tight waist.Highly move and scan and only carry out necessary number of times repeatedly.Through carrying out the linearity cavity wall that this inside that operates in object to be processed 4 is integrally formed repeatedly.At last, object to be processed 4 being applied bending stress cuts along empty wall.First scanning may not make the cavity arrive the back side.In addition, with a tight waist can carrying out repeatedly highly moves and scans until arriving the surface.Through such method, because object to be processed is arrived its deep repeatedly and forms the cavity, thereby can implement to cut to the processing of whole cuttings from part.

Substrate as the processing object object is not limited in one.Even of the same race or two sandwich constructions that above substrate is overlapping of same material not also can be processed all substrates.Under the situation of sandwich construction, substrate can be adjacent to also and can separate, and under the situation of separation, the space also can be organic material or transparent electrode layer except air.Substrate is under two the situation, as Fig. 4, by the upper substrate that places the laser beam incident side 81 with place the lower basal plate 82 of opposition side to constitute, the situation that leaves space 83 is also arranged.If this method, even for the glass that is made up of multilayer, method of the present invention is also applicable.

As Fig. 4, under the situation of two substrates, lower basal plate 82 is carried out longer processing in the laser propagation direction.This is because increase according to the propagation distance in the object to be processed from the pack effect.In addition, in order to form the optically focused passage of self-optically focused effect, laser needs to propagate the distance of 10 to 200 μ m in object to be processed.This distance is long more, can form long more cavity with same energy.Utilize this specific character,, the cavity is formed apart from elongated, and can carry out darker processing through placing of the same race with it in the face side of substrate or, can strengthening effectively from the pack effect by other substrates of processing with respect to the not same material of laser-light transparent.Particularly, can also make object to be processed from the surface to the back side, form the optically focused passage, extend through the back side from the surface and form the cavity.In other substrates that are not object to be processed, both can not form the cavity and also can form the cavity.

This method goes for cutting the glass substrate of display panels.The glass substrate of display panels is made up of upper substrate that places the laser beam incident side and the lower basal plate that places opposition side and between leaves the space.

If the top glass substrate is shone ultra-short pulse laser according to the mode that is in the surperficial or inner appropriate location of this substrate with a tight waist of laser beam from upper surface side, then in the top glass substrate, forms the cavity.Through relatively moving laser, on the top glass substrate, form cut surface (line).

Lower glass substrate also can form cut surface through the upper surface side irradiation ultra-short pulse laser from the top glass substrate.Shine according to making the laser beam mode that is in the surperficial or inner appropriate location of this substrate with a tight waist.Ultra-short pulse laser can see through under the situation of not damaging the top glass substrate, and in lower glass substrate, forms the cavity.Through the scanning ultra-short pulse laser, on lower glass substrate, form cut surface (line).

The sectional view of display panels has been shown among Fig. 5 (a).Display panels 90 is formed by the lamination of two glass substrates.Inner surface at top glass substrate 91 is formed with parts 95 such as transparency electrode, chromatic filter, thin film transistor (TFT), is formed with parts 96 such as electrode at the inner surface of lower glass substrate 92.In addition, between two glass substrates, be filled with liquid crystal 93.Sealing liquid crystal is in gas-tight seal material 94.In cutting action, situation that the identical line of cut of top glass substrate and second glass substrate edge is cut or the operation of cutting with other lines of cut that depart from are a little arranged.Under the situation of cutting along identical line of cut, also go for overlapping substrate and the occasion that all substrates are processed more than two of above-mentioned that kind as shown in Figure 4.

Fig. 5 (a) further shows the operation of cutting with other lines of cut that depart from.In this operation, carry out the cutting 97 of top glass substrate and the cutting 98 of lower glass substrate.In case the surface irradiation pack laser beam 5 that is in the mode of the inner appropriate location of this substrate from top glass substrate 91 with a tight waist according to laser beam just forms cavity 61 near the back side of top glass substrate 91.Through 5 scannings of pack laser beam, form cut surface at top glass substrate 91.At this moment; Owing to the laser beam that in the processing of top glass substrate 91, does not have to consume shines the parts such as electrode 96 that form on the lower glass substrate 92 through top glass substrate 91, thereby might cause damage also finally the work of liquid crystal indicator to be brought harmful effect to parts such as electrode 96.In order to prevent this harmful effect, shown in Fig. 5 (b), on the laser beam irradiation position of parts such as electrode 96, form protective finish 99 in advance through smearing, glue together or fitting.Protective finish 99 is opaque with respect to the wavelength of pack laser beam.Here said opaque, not only comprise the situation that laser does not see through fully, and be included in not the parts such as electrode 96 under the protective finish 99 are caused the situation that sees through some light under the situation of damage.

Beyond top glass substrate 91 processed, lower glass substrate 92 is processed.Likewise, from the surface irradiation pack laser beam 5 of top glass substrate 91, shine according to the mode that is in the appropriate location of lower glass substrate 92 inside with a tight waist that makes laser beam.Pack laser beam 5 forms cavity 91 through top glass substrate 91 near the back side of lower glass substrate 92.Through 5 scannings of pack laser beam, on lower glass substrate 92, form cut surface.After the glass substrate stress application is cut glass substrate,, process liquid crystal indicator through the assembling procedure of display panels and miscellaneous part.Therefore, this method can be used for the manufacturing of display panels and liquid crystal indicator.

Other embodiments of a plurality of substrate situation are described.In this embodiment, show the dividing method of the structure of two substrates formations.Fig. 6 is the schematic sectional view that is used to explain this embodiment.

Structure 70 has the structure that top glass substrate 91 constitutes with lower glass substrate 92 configured in parallel.Under situation about using, between two glass substrates of structure 70, partly insert partition as display panels.In order between two glass substrates, the space to be set, need partition.For example, in display panels, dispose a plurality of objects such as spherical silicon dioxide or polystyrene, columned photoresist material.In the example of this embodiment; Between two glass substrates, be inserted with gas-tight seal material 94; Basic goal is to constitute enclosure space with this glass substrate and this gas-tight seal material 94, but in the situation of not inserting other objects, partition also can be realized this effect.Under the situation of not inserting gas-tight seal material 94, can insert other partition 94.Upper surface in lower glass substrate 92 is provided with metallic film wiring 89 within the specific limits.Have under the situation of said gas-tight seal material, on the lower glass substrate 92 of said enclosure space, dispose electronic unit (not shown), in addition, preferably metallic film wiring 89 is configured to be connected with this electronic unit electrical equipment and stride across gas-tight seal material 94.The if structure body is a display panels, in this enclosure space, is formed with the display unit element so.

Here, in order to connect up 89 from the outside near the metallic film on the lower glass substrate 92, isolating construction body 70.At first; Carry out optically focused from the upper surface side of top glass substrate 91 through 3 pairs of ultra-short pulsed laser beams of collector lens 2; The upper surface (surface of laser light incident side) that is in lower glass plate 92 with laser beam with a tight waist is gone up or the mode of inner appropriate location shines that (laser beam girdles the waist on upper surface among the figure; But be not limited in this, below identical).But, be the position that does not have metallic film wiring 89 in the lower glass plate.Laser beam 2 forms the cavity 64 from the pack effect through top glass substrate 91 in lower glass substrate 92.Through relatively moving laser beam 2, form continuous or discrete cavity, on lower glass substrate 92, form first line 88.

Secondly, move collector lens 3, make that laser beam is with a tight waist to be in that upper glass plate 91 upper surfaces (surface of laser light incident side) are gone up or the mode of inner appropriate location is shone to the top.In upper glass plate 91, form cavity 63 from the pack effect is produced.Through relatively moving laser beam 50, form continuously or discrete cavity, form second line 87 at top glass substrate 91.Second the line 87 be formed at first the line 88 directly over.Once more, perhaps before forming first and

second line

88 and 87,, make the 3rd line 86 in upper glass plate 91 with the method same with second line 87.In this process, form cavity 62.The 3rd line 86 positions that preferably are arranged near gas-tight seal material between top glass substrate 91 and the lower glass substrate 92 or partition 94, and be formed the metallic film wiring 89 of common leap lower glass substrate 92 upper surfaces.In addition, the 3rd line 86 and second is rule 87 apart 77 (Δ Y) and is formed abreast.

Have the gas-tight seal material and having under the situation of electronic unit in the internal configurations of the enclosure space that is made up of gas-tight seal material and two substrates, the 3rd line preferably is arranged on the position of the outside of this enclosure space near this gas-tight seal material 94.

At this moment, owing to make the laser beam 2 process top glass substrates 91 that do not consume in 86, shine metallic film wiring 89, thereby might cause damage it in the 3rd line of top glass substrate 91.But the intensity that sees through the laser beam 2 of top glass substrate 91 is not enough to it is caused damage usually.In addition, in order to prevent to damage, also can on the laser beam irradiation position of metallic film wiring 89, form protective finish in advance through smear, glue together or applying etc.Protective finish as following along the 3rd line cutting, become from the outside can near after removal.And protective finish is opaque with respect to the wavelength of laser beam, and the so-called opaque situation that comprises that not only laser does not see through fully is also included within not these parts are caused the situation that sees through some light under the situation of damage.

So form after first to the 3rd line; If apply bending stress along first line 88 and the 87 pairs of structures 70 of second line directly over it; The position that is respectively arranged with first and second line of bottom and top glass substrate fractures so, thus along first and second line segmenting structure body 70.Secondly, if top glass substrate 91 is applied bending stress along the 3rd line, second and the 3rd distance of ruling is that the part of Δ Y is separated in the top glass substrate 91 so.Come cutting structure body 70 through above order.

The two-layer structure body of cutting like this has been shown in Fig. 7.Lower glass substrate 92 only enlarges the Δ Y suitable with the interval 11 of the second and the 3rd line, has the ledge structure that does not have top glass substrate 91 on top.Thereby the part that can enlarge near lower basal plate 92 from the outside.Therefore, can form the wiring of electronic unit such as new control loop and metallic film.In addition, under the situation that has the metallic film wiring that exports to the outside from gas-tight seal portion inside on the lower glass substrate, can connect that part of wiring that exports to the outside.

In Fig. 7, the section separately 66 and 65 of lower glass substrate 92 and top glass substrate 91 is sections of cutting apart as starting point with first line the 88 and the 3rd line 86 respectively.The

side

68,67 of glass plate is identical with the formation method of first line, 88 and second line 87, can carry out optically focused and after forming line respectively on the glass substrate on bottom and top, cut apart forming from top to ultrashort laser pulse.

Through this embodiment, owing to can only process from the single face side irradiating laser light beam of glass structure body, thereby can realize the simplification of equipment.In addition, owing to can be formed on the lower basal plate part that top does not have upper substrate, thereby can be approaching from the outside, electronic unit or metallic film wirings such as control circuit can be set from the lower basal plate upper surface or at this substrate.Therefore, can realize the lightening of display floater.In addition, can the metallic film wiring portion that export to the outside from gas-tight seal portion inside be connected with other elements.

Fig. 8 illustrates the exemplary plot that this embodiment is applied to the situation of liquid crystal panel manufacturing., the large structure 70 with two large-size glass substrates 91 up and down of being formed with a plurality of liquid crystal panels and 92 implements this embodiment from cutting into the operation of each panel 80 after making liquid crystal panel.By this

glass substrate

91,92 and be inserted in the space that the gas-tight seal material 94 between them surrounds and be built-in with (other elements are not shown except that liquid crystal) such as the required chromatic filter of display panels, liquid crystal, driving transistors, wiring, partitions.(a) being vertical view and sectional view, (b) is the amplification sectional view that dissects along the Y direction.The Z direction is the direction perpendicular to paper.

Line 74-1～74-m along directions X forms as follows.On lower glass plate, there is not the part of metallic film wiring 89 to form first line 88 in the above to lower glass substrate 92.In addition, in top glass substrate 91, on first line 88, form second line 87.In addition, the top glass substrate is provided with the 3rd line, preferably the 3rd line is arranged on the position near gas-tight seal material 94.The 3rd line 86 and second is rule 87 apart 77 (Δ Y) and is provided with abreast.The 3rd line 86 is formed common leap metallic film wiring 89.

Can be simply every line be set seriatim along the line 73-1～73-n of Y direction with the interval of panel width 76.Likewise be provided with the method that forms said first and second line.

After line forms, cut apart along the line that forms on this upper and lower glass substrate, so, owing to can on X, Y direction, cut apart, thereby can make polylith display panels 80 by large-scale two-layer structure body 70.Particularly; In at least one side of display panels 80, on lower glass substrate 92, extracting out to the outside from the inside of gas-tight seal material 94 has metallic film wiring 89; Because can be approaching from the outside at an easy rate, thereby can realize the various structures that are electrically connected.

Cutting apart respectively under the situation of a plurality of display floaters from large-scale two-layer structure body according to this embodiment with polylith display floater; Owing to can line be set through only processing at two glass substrates, thereby not need the upset Handling device of large glass from one-sided irradiating laser light beam.And, do not damage at laser beam under the situation of metal film etc. of the electric wiring that reveals the outside from the internal structure of display floater etc., form on the substrate that one of can be therein be easy to approaching from the outside, two glass plates have the ledge structure of Δ Y width up and down.For the line near the surface of lower glass substrate be arranged on top glass substrate facing surfaces on metal film and electronic unit because an end of top glass substrate is removed as the part between the second and the 3rd line, thereby approaching from the outside easily.In addition, the metallic film wiring can surpass sealing from the inner derivation of display floater on lower glass substrate.Therefore, can connect up from the sealing outside.

This method is not only applicable to display panels, is applicable to the cutting of other panel display boards such as Plasmia indicating panel yet.In addition, this method can be used for the manufacturing process of these panel display boards.

Process by glass though constitute the substrate of structure, be not limited in this as the material of object of the present invention.In addition, though substrate is two layers, obviously the present invention also is applicable to the substrate more than three layers.

Fig. 9 shows the embodiment of oblique angle (inclined plane) processing method.Will be from the ultra-short pulsed laser beam of ultra-short pulse laser generating means 1 with revolving mirror 51 deflection certain angle θ and rotate 52 around rotating shaft 55.If adopt laser beam 53 and 54 light path coincidence and the collector lens 3 that with revolving mirror 51 rotate of optical axis with rotation, the focus of collector lens 3 is described circular trace so.Go up the object to be processed 4 of placement substrate shape at processing object mounting apparatus (not shown) such as platforms.When the object to be processed 4 that carries mode placement substrate shapes such as the face of putting is parallel through making this circular trace and processing object mounting apparatus so that its normal to a surface is parallel with rotating shaft 55, so just can make laser irradiating position rotation sweep and carry out the irradiation of circular trace on object to be processed 4.At this moment, can with the mode of 55 one-tenth tilt angle theta of rotating shaft to object to be processed 44 processing of tilting.At first, the aligning with a tight waist that makes light beam reaches the position that the cavity forms distance 57 (about 135 μ m) from the back side 56 of object to be processed 4 to inside, through circular scan, forms the cavity row on the circular filament in the direction from normal deviation angle θ.And through collector lens 3 is moved on the direction of revolving mirror 51 along optical axis direction, move the cavity successively and form distance 58,59, form the cavity row when moving and scan repeatedly, form from the surface of object to be processed 4 to the circular empty wall at the back side.Afterwards, separate, apply inclined plane processing on every side, and be cut into circle through bending.So, the present invention not only can nearby be concatenated to form the cavity on the surface of object to be processed, and can be concatenated to form the cavity that arrives inside, can implement to cut to from part the processing of whole cuttings.

In above Laser Processing, below the preferred 1mJ of pulse energy, more preferably below the 10 μ J.Under the situation below the 10 μ J, can obtain neat level and smooth cut surface, the crack produces few, and breakdown strength is high.If there is crack etc., because object to be processed weakened such as glass, thereby produce undesirable condition sometimes.Under the big situation of pulse energy; If near surface is processed; Because the pulse leading section makes pulse center portion to rearward end produce reflection, scattering, absorption at the free electron plasma that near surface generates, thereby be difficult to sometimes in the inner cavity that forms of glass.Under the little situation of pulse energy, owing to the density of the free electron plasma that produces near surface is low, the transmission of paired pulses does not have very big obstruction, thereby can be at an easy rate at the empty passage of the inner formation of glass.

In addition, the laser of so-called ultrashort pulse be pulse width at 100ps with interior laser, in addition, pulse width is preferably 500fs to 10ps, more preferably is about 2ps.This be because, after forming plane of rupture continuously, stress required when cutting off glass substrate is low, the quality of section is good.

In addition, under with the situation of glass substrate as object to be processed, pulse width is that 150 femtoseconds, output energy are to suit more than the 1 μ J.

Shown in above, the present invention provides a kind of new processing method, and this method adopts little with a tight waist of the depth of focus of optically focused light beam of ultrashort pulse, use form in the inside of object to be processed from the pack effect, can increase the depth of focus of processing substantively.The precision machining method that this method did not see, utilizes first the interaction of laser beam and machining object to realize in existing processing method.

Embodiment 1

Laser medium is titanium sapphire crystal (centre wavelength 780nm), and pulse width 150 femtoseconds are more than the output energy 1 μ J.In addition, processing object is the Corning Eagle2000 as glass substrate, thickness 700 μ m.Under the situation that does not have different therewith records, these parameters are common in all embodiment among each embodiment.

Present embodiment is the formation shown in Fig. 1, is that the spot position when object to be processed is carried out laser radiation moves to the variation of observing object to be processed under the inner situation and producing, the experimental example that confirms the principle of this processing method from the surface.

At the microphotograph of observing the sectional view of the variation that produces in the object to be processed shown in Figure 10 and Figure 11.Figure 10 illustrates the surface 45 as the substrate of object to be processed, Figure 11 illustrate the back side 44 near.For the formation of Fig. 1, used diameter to be about the aberration compensation non-spherical lens of 3.1mm as the lens incident beam of 6mm, the focal distance f of collector lens 3.If the transverse mode of laser beam is set to the light beam of Gaussian distribution, the beam diameter that can calculate the focal point place is about 1 μ m, and the depth of focus that comprises the scope of energy 90% with a tight waist is below the 1 μ m.So; Shining object to be processed with the little ultra-short pulsed laser beam of the depth of focus; Making position with a tight waist be positioned at surface 45 carries out under the situation of pack and illumination beam; Be removed with the shallow part 21 shown in the degree of depth 23 to inside from surface 45 among Figure 10, if also move with a tight waistly to inside, then the surface removal amount reduces; If move position with a tight waist to inside again, then produce zone 24,25 that optical distortion takes place etc. at its peripheral part corresponding to the position of residing depth direction with a tight waist in the inside of object to be processed 4.If the inside that places with a tight waist, the removal processing on surface reduces, and replaces, and the internal optics distortion occurs, zone 24,25 occurs.

Figure 11 is the cross-section photo when further making with a tight waist moving in substrate inside.Observe the

position

31,32 that optical change has taken place 45 parts with a tight waist that under constant condition, produce on the surface.And, along with the back side 44 to object to be processed is approaching, in hundreds of microns the scope at the back side, observed the position 33 that produces optical change in inside.And, if with a tight waist, form filamentous empty 34 so internally point-blank to the back side near the back side 44 about 135 μ m.And, if laser beam waist is aimed at the back side 44, have only so the back side near be removed.According to such processing result; Though the depth of focus 37 of laser beam is about 1 μ m as aforementioned; But, form by cavity formation distance (about 135 μ m) towards the direct of travel of light beam as the filament shape cavity 34 of beam waist diameter size, do not occurring under the situation of pack effect; Compare with only processing, carry out thread cavity processing in the method in the length range about 2 one magnitude in the scope of the depth of focus (about 1 μ m) of light beam.

Embodiment 2

Present embodiment carries out the situation of laser scanning with the cut surface that forms empty passage on one side for forming on one side empty passage near overleaf.

Under the situation in the thread cavity of pack effect, shown in the figure in Figure 12, can be formed with funnel shaped part 43 in the lump overleaf sometimes in formation.This funnel shaped part 43 has overlapped adjacency section; Thread cavity and passage 8 form respectively at same position; Ultrashort laser pulse is relatively scanned at the back side 44 through along object to be processed, on the envelope 46 of working depth, has formed a plurality of thread cavity arranged side by side along the scanning direction.In Figure 12, contrast the microphotograph of the cut surface in the thread cavity that shows formation like this.In this example, carry out the scanning of laser pulse with the sweep speed of 3mm/s after, observe section through bending along scan line to cut apart.In the figure, show in the processing of the thickness 41 of object to be processed, along the envelope in 42 scopes 46 forms a plurality of thread empty passages and cuts apart the processing section of object to be processed with this as the starting point from the back side 44 to the degree of depth.Figure 13 is the scan microscope photo of the section in shooting cavity 61, and in addition, Figure 14 is by the scan microscope photo of special amplification near the back side.Show the projective structure 71 position, that surface ratio is protruded and mechanical strength is weak that forms cavity 61 on every side.

Embodiment 3

With the formation shown in Fig. 3, change height with a tight waist, repeatedly scan, to processing near the back side.It is 4 times that Figure 15 shows scanning times, and pulse energy is 10 μ J, and pulse width is the section under the 2ps situation.Through reducing pulse energy, optimize pulse width, can neighbouringly overleaf form high-quality machining area 36.

Embodiment 4

In this embodiment also to be formation as shown in Figure 3.Change height with a tight waist, repeatedly scan and process.In this embodiment, form with a tight waist according to the mode of setting machining area at the near surface of glass substrate.At scanning times shown in Figure 16 is that 10 times, pulse energy are that 1 μ J, pulse width are the section under the 2ps situation.Through optimizing pulse energy and pulse width, can obtain to lead to the good machining area 36 on surface.

Embodiment 5

Present embodiment is that object to be processed is the situation that two glass substrate laminations constitute.As the formation shown in Fig. 4, the spot position that makes laser moves to the back side from the surface of the upper substrate 81 of glass and processes.Microphotograph after two glass substrates are processed shown in Figure 17.Not only top glass 81 but also the bottom glass 82 that is opposite to its rear side are also processed.Top glass 81 is processed up 150 μ m, bottom glass 82 is processed up 250 μ m.As previously mentioned, the substrate of bottom placement has carried out longer processing in the laser propagation direction.

Embodiments of the invention more than have been described.Obviously, under the situation that does not break away from the technological thought of putting down in writing in claims of the present invention, can implement change to it.

The possibility of utilizing on the industry

As application examples of the present invention; In the processing of the object to be processed of the display device that adopts semiconductor equipment, liquid crystal etc., for the substrate of silicon chip, thin film transistor (TFT) and display device cut apart, high Breakdown Voltage Power semiconductor chip processing and carry out from the surface for the sandwich construction electronic component that the inner removal of layer adds the trickle of man-hour and processing that heat affecting is little is effective.In high density integrated circuit having is made, owing to the microminiaturization of working width, the minimizing that thing is removed in processing etc., finished product rate improve, thereby can reduce the manufacturing cost of electronic unit.And, also be effective to hole processing of the substrate of semiconductor equipments such as quartz, sapphire etc.Processing to the filter that is provided with a plurality of fine holes also is effective.And the present invention can be used for the manufacturing that display panels, Plasmia indicating panel etc. adopt the electronic installation of multilayer glass structures.

Claims

1. laser processing; It is characterized in that; Make ultra-short pulse laser carry out optically focused through beam condensing unit; It is transparent wavelength that said ultra-short pulse laser has for the object to be processed that comprises first and second, shines said laser so that the said laser behind the optically focused with a tight waist is formed between first and second of said object to be processed from first side, through the inner ultrashort pulse peak value of said object to be processed laser propagation from the pack effect; On the direct of travel of said laser, form the optically focused passage, be formed with the Laser Processing zone that comprises the cavity at said optically focused channel part thus.

2. laser processing according to claim 1, wherein, the pulse width of said pulse laser is below the 100ps.

3. laser processing according to claim 2, wherein, the pulse width of said pulse laser is 500fs to 10ps.

4. according to any described laser processing of claim 1 to 3, it is characterized in that, near said laser direct of travel and second intersection point, be formed with the little protrusion structure of the mechanical strength higher than the circumferential surface protrusion.

5. according to any described laser processing of claim 1 to 3, it is characterized in that, be formed up to second, make said cavity be formed up to second through making said optically focused passage.

6. according to any described laser processing of claim 1 to 3, it is characterized in that, be formed up to second from first face, make said cavity be formed up to second from first face through making said optically focused passage.

7. according to any described laser processing of claim 1 to 3, it is characterized in that inner through making said optically focused passage be formed up to said processing object from first face, it is inner to make that said cavity is formed up to said processing object from first face.

8. according to any described laser processing of claim 1 to 3; It is characterized in that said object to be processed is insulating material or semi-conducting material, wherein; Said insulating material is selected from glass, sapphire and diamond, and said semi-conducting material is selected from silicon and gallium nitride.

9. according to any described laser processing of claim 1 to 3, it is characterized in that said ultra-short pulse laser is the output pulse below the pulse energy 1mJ.

10. according to any described laser processing of claim 1 to 3, it is characterized in that said ultra-short pulse laser is the output pulse below the pulse energy 10 μ J.

11., it is characterized in that said object to be processed is flat object according to any described laser processing of claim 1 to 3.

12. according to any described laser processing of claim 1 to 3, it is characterized in that said object to be processed is a silicon substrate, said wavelength is 1 μ m to 2 μ m.

13., it is characterized in that said object to be processed is the sandwich construction of tabular overlapped object of the same race or not same material more than two according to any described laser processing of claim 1 to 3.

14. laser processing according to claim 13 is characterized in that, the said object to be processed fluid-tight engagement that is sandwich construction exists air gap, organic material or transparent electrode layer between perhaps.

15. according to any described laser processing of claim 1 to 3; It is characterized in that, through being that other transparent objects change the length by the said optically focused passage that forms from the pack effect of said object to be processed with respect to said optical maser wavelength in first side setting of said object to be processed.

16. according to any described laser processing of claim 1 to 3; It is characterized in that; First side setting through at said object to be processed is other transparent objects with respect to said optical maser wavelength, makes the said optically focused passage that forms from the pack effect by said object to be processed arrive first.

17. according to any described laser processing of claim 1 to 3; It is characterized in that, through making by the coincidence of said beam condensing unit the said ultra-short pulse laser of the inner optically focused of said object to be processed relatively moves the space that said cavity is set with speed arbitrarily along cut direction on.

18. according to any described laser processing of claim 1 to 3; It is characterized in that; Relatively move with speed arbitrarily along cut direction at the said ultra-short pulse laser of the inner optically focused of said object to be processed through making, said cavity spatially is set discretely by said beam condensing unit.

19. laser processing according to claim 17; It is characterized in that; Said object to be processed is plane object; Make first angled ground of normal direction oblique incidence of the light-concentrating laser and the said object to be processed of said ultra-short pulse laser, make said light-concentrating laser have the inclination of said angle and it is rotated and carry out circular scanning, obliquely machined surface is processed.

20. laser processing according to claim 17 is characterized in that, is included in the operation of carrying out repeatedly changing between said respectively the relatively moving of relatively moving said laser beam waist height.

21. the cutting method of object to be processed is characterized in that, with the described method of claim 17 object to be processed is being carried out after the Laser Processing, under the situation of few stress, cuts said object to be processed along the processing part.

22. the cutting method of display panels substrate, it is the cutting method of the described object to be processed of claim 21, and wherein, said object to be processed is the substrate of display panels.

23. the cutting method of display panels substrate; It is the cutting method of the described object to be processed of claim 22, and wherein, said display panels has the laminated structure of first substrate and second substrate; Said cutting method may further comprise the steps; On the parts that are positioned on second substrate surface of first substrate-side, smearing or glue together or be close to respect to said optical maser wavelength is opaque material, from the first substrate-side irradiating laser, in first substrate, to form laser beam waist; When irradiating laser, the laser through first substrate can not cause damage to said parts.

24. the manufacturing approach of display panels is characterized in that, comprises the cutting method of the display panels substrate of claim 22 or 23.

25. the dividing method of structure, first substrate of said structure and the second substrate configured in parallel and between partly clip partition, it is characterized in that the dividing method of this structure comprises:

Line forms step; Is that transparent wavelength and the ultra-short pulse laser of pulse width below 100ps carries out optically focused through beam condensing unit to having with respect to first substrate and second substrate; Shine so that beam waist position is in the surperficial or inner of arbitrary substrate from the outside of first substrate;, pack forms the optically focused passage through what this ultra-short pulse laser was propagated on acting on the direct of travel of this ultra-short pulse laser; Form the cavity at this optically focused channel part thus, form line through relatively moving this ultra-short pulse laser; And

The substrate cut step is cut the substrate that has formed said line along this line after line forms step,

This line forms step and comprises the following A step, and this substrate cut step comprises following C step,

A step: this ultra-short pulse laser is carried out optically focused so that should with a tight waistly be positioned on second substrate on second substrate, to form first line through first substrate; Thereby carry out optically focused again so that with a tight waist being positioned on first substrate on first substrate, to form second line with relatively mobile this ultra-short pulse laser in the conplane position of first line

26. method according to claim 25; It is characterized in that; Said line forms step and also comprises following B step, implements with the order of said A step, this B step or this B step, said A step, and said substrate cut step also comprises following D step; Order with said C step, this D step is implemented

The B step: said ultra-short pulse laser is carried out optically focused so that said first substrate that is positioned at a tight waist, through with second line at a distance of the distance of the regulation said ultra-short pulse laser that relatively moves abreast, on first substrate, form the 3rd line,

27. method according to claim 26 is characterized in that, said structure has metal film on the face relative with second substrate-side of first substrate.

28. method according to claim 27 is characterized in that, said metal film is spatially crossed in the 3rd line that on second substrate, forms.

29. according to claim 25 or 26 described methods, it is characterized in that said partition is an encapsulant, have space by first substrate and second substrate and the encirclement of sealing material.

30. according to claim 27 or 28 described methods; It is characterized in that; Said partition is an encapsulant, has the space by first substrate and second substrate and the encirclement of sealing material, is formed with electronic unit in this space; Said metal film is crossed in the inboard and the outside in this space, and said metal film and this electronic unit are electrically connected.

31., it is characterized in that first substrate and second substrate all are glass substrates according to any described method of claim 25 to 28.

32. according to any described method of claim 25 to 28, said structure is display panels or Plasmia indicating panel.

33. laser processing device is characterized in that, comprising:

The processing object mounting apparatus is used for carrying and puts the object to be processed with first and second;

The ultra-short pulse laser generating means is used to produce ultra-short pulse laser, and it is transparent wavelength that said ultra-short pulse laser has for the object to be processed that comprises first and second; And

Collector lens carries out optically focused to the ultra-short pulse laser that is produced by said ultra-short pulse laser generating means;

Through the ultra-short pulse laser of collector lens optically focused, from said first side irradiation, so that the said ultra-short pulse laser behind the optically focused with a tight waist be formed between first and second of said object to be processed,

Through propagate at the inner ultra-short pulse laser of said object to be processed from the pack effect; On the direct of travel of said laser, form the optically focused passage, form said second cavity of arrival or arrive near the cavity said second at said optically focused passage thus.