CN101609054A - The Integrated Check out System of flexible PCB and method thereof - Google Patents

The Integrated Check out System of flexible PCB and method thereof Download PDF

Info

Publication number
CN101609054A
CN101609054A CNA2009101472494A CN200910147249A CN101609054A CN 101609054 A CN101609054 A CN 101609054A CN A2009101472494 A CNA2009101472494 A CN A2009101472494A CN 200910147249 A CN200910147249 A CN 200910147249A CN 101609054 A CN101609054 A CN 101609054A
Authority
CN
China
Prior art keywords
aforementioned
inspection object
flexible pcb
inspection
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2009101472494A
Other languages
Chinese (zh)
Inventor
崔铉镐
金敏秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AJU HIGH TECH CORP
Original Assignee
AJU HIGH TECH CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AJU HIGH TECH CORP filed Critical AJU HIGH TECH CORP
Publication of CN101609054A publication Critical patent/CN101609054A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/33Transforming infrared radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Quality & Reliability (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Multimedia (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention provides a kind of can the Integrated Checkout flexible PCB circuit pattern and the Integrated Check out System and the method thereof of the flexible PCB of outward appearance.The present invention relates to a kind of can the Integrated Checkout flexible PCB circuit pattern and the Integrated Check out System and the method thereof of the flexible PCB of outward appearance.According to Integrated Check out System of the present invention, comprising: feeder, it provides the inspection object; Coiled strip portion, the aforementioned inspection object of inspection is finished in its unloading; And inspection portion, it is configured between aforementioned feeder and the aforementioned coiled strip portion, the aforementioned inspection object that inspection is moved to aforementioned coiled strip portion from aforementioned feeder, aforementioned inspection portion comprises pattern inspection portion that checks aforementioned inspection object pattern and the visual examination portion that checks aforementioned inspection object outward appearance.

Description

The Integrated Check out System of flexible PCB and method thereof
Technical field
The present invention relates to a kind of Integrated Check out System and method thereof of flexible PCB, in more detail, relate to a kind of can the Integrated Checkout flexible PCB circuit pattern and the Integrated Check out System and the method thereof of the flexible PCB of outward appearance.
Background technology
The tellite of one of employed main material in the manufacturing of various semiconductor equipments such as the drive integrated circult of liquid crystal indicator, storer uses flexible PCBs (Flexible Printed CircuitBoard) such as film (film), tape (tape) type mostly according to the miniaturization of semiconductor equipment, lightweight tendency.TAB (Tape Automatic Boading), COF (Chip On Film) substrate etc. are for example arranged in the tellite of soft mode, wait by exposure, development, etching work procedure on substrate, to form the fine circuits pattern.
In the production of this flexible PCB, actual conditions are to implement to have utilized pattern detector (AOI) that is used for check pattern and the inspection operation of checking the visual examination device (AVI) of overall appearance through gold-plated, welding resistance (solder resist) operation after the pattern inspection before finally dispatching from the factory at twice separately.
Thereby in the production of flexible PCB, requirement can be more effectively and the checkout facility that carries out pattern inspection and visual examination apace.
Summary of the invention
The present invention puts in view of the above problems and makes, and its purpose is to provide a kind of Integrated Check out System and the method thereof that can be carried out the flexible PCB of pattern inspection and visual examination by an equipment.
The invention provides a kind of Integrated Check out System and the method thereof that can carry out the flexible PCB of pattern inspection to the flexible PCB of having smeared solder resist.
The invention provides a kind of Integrated Check out System and method thereof that can prevent the flexible PCB that flase drop is surveyed.
The problem to be solved in the present invention is not limited thereto, this area practitioner can from following record, understand clearly not mentioned to other problem.
In order to reach above-mentioned purpose, the invention provides the Integrated Check out System of the inspection object of a kind of continuous formation flexible PCB unit.According to an embodiment of the present invention, Integrated Check out System of the present invention possesses: feeder (loader), and it provides aforementioned inspection object; Coiled strip portion (unloader), the aforementioned inspection object of inspection is finished in its unloading; And inspection portion, it is configured between aforementioned feeder and the aforementioned coiled strip portion, the aforementioned inspection object that inspection is moved to aforementioned coiled strip portion from aforementioned feeder, aforementioned inspection portion comprises pattern inspection portion that checks aforementioned inspection object pattern and the visual examination portion that checks aforementioned inspection object outward appearance.
According to the embodiment of the present invention, aforementioned pattern inspection portion comprises shoot part, this shoot part has camera and to the Lighting Division of aforementioned inspection object irradiates light, and aforementioned Lighting Division comprises to aforementioned inspection object irradiates light and generates the transillumination of the transmitted light that sees through this inspections object and to aforementioned inspection object irradiates light and generate in the catoptrical indirect illumination that this inspection object reflects at least one.
According to the embodiment of the present invention, aforementioned transillumination or aforementioned indirect illumination are the illuminations of irradiation green light.
According to the embodiment of the present invention, aforementioned transillumination or aforementioned indirect illumination are the illuminations that irradiation has the light of 500~570nm wavelength.
According to the embodiment of the present invention, aforementioned transillumination or aforementioned indirect illumination are the LED illuminations.
According to the embodiment of the present invention, the aforementioned Lighting Division of aforementioned pattern inspection portion is the light to aforementioned inspection object irradiation infrared band.
According to the embodiment of the present invention, the aforementioned camera of aforementioned pattern inspection portion is an infrared camera.
According to the embodiment of the present invention, aforementioned visual examination portion comprises shoot part, this shoot part has camera and to the Lighting Division of aforementioned inspection object irradiates light, and aforementioned Lighting Division comprises to aforementioned inspection object irradiates light and generates the transillumination of the transmitted light that sees through this inspections object and to aforementioned inspection object irradiates light and generate in the catoptrical indirect illumination that this inspection object reflects at least one.
According to the embodiment of the present invention, the Integrated Check out System of aforementioned flexible PCB also possesses not good image confirmation unit, it is coloured image in order to take through the detected not good part of aforementioned pattern inspection portion and aforementioned visual examination portion, makes the operator judge that this detected not good part is really not good or flase drop is surveyed and offered display.
According to the embodiment of the present invention, aforementioned not good image confirmation unit comprises: indirect illumination, and it generates the reflected light of checking the object reflection through this to aforementioned inspection object irradiates light; And color camera, its mutual different zone of dividing aforementioned inspection object is taken.
According to the embodiment of the present invention, aforementioned not good image confirmation unit comprises: indirect illumination, and it generates the reflected light of checking the object reflection through this to aforementioned inspection object irradiates light; Face battle array camera, the not good part that it takes aforementioned inspection object in planar array scanning (area scan) mode; And moving-member, it is used for the not good part of aforementioned battle array camera movement to aforementioned inspection object.
According to the embodiment of the present invention, aforementioned inspection portion also comprises the bending handover portion that transfers aforementioned inspection object along crooked route, and aforementioned pattern inspection portion, aforementioned visual examination portion and aforementioned not good image confirmation unit are configured on the mobile route of the aforementioned inspection object that aforementioned crooked handover portion transfers along crooked route.
According to the embodiment of the present invention, aforementioned inspection portion also comprises aforementioned inspection object along bending handover portion that crooked route is transferred and the straight line handover portion that aforementioned inspection object level is transferred, aforementioned pattern inspection portion and aforementioned visual examination portion are configured on the mobile route of the aforementioned inspection object that aforementioned crooked handover portion transfers along crooked route, and aforementioned not good image confirmation unit is configured on the mobile route of the aforementioned inspection object that aforementioned straight line handover portion linearity is transferred.
The Integrated Check out System of the inspection object of continuous formation flexible PCB of the present invention unit possesses: Lighting Division, and it is to aforementioned inspection object irradiation green light; And shoot part, it has the camera of taking aforementioned inspection object image.
According to the embodiment of the present invention, aforementioned shoot part comprises that the pattern inspection of checking aforementioned inspection object pattern is with shoot part with check the visual examination shoot part of aforementioned inspection object outward appearance.
According to the embodiment of the present invention, aforementioned illumination is the LED illumination of the light of irradiation with 500~570nm wavelength.
The Integrated Checkout method of the inspection object of continuous formation flexible PCB of the present invention unit comprises: the stage that aforementioned inspection object is provided; Come the not good pattern examination phase of check pattern to aforementioned inspection object irradiates light; Check the visual examination stage that outward appearance is not good to aforementioned inspection object irradiates light; And the stage of reclaiming the aforementioned inspection object of finishing inspection, in the aforementioned pattern examination phase, use the illumination of irradiation green light.
According to the embodiment of the present invention, the illumination irradiation of shining aforementioned green light has the light of 500~570nm wavelength.
According to the embodiment of the present invention, aforementioned inspection object is the solder resist of smearing on the surface of pattern composition as insulation composition.
According to the embodiment of the present invention, the aforementioned pattern examination phase comprises: the 1st photographing phase, and it generates and sees through the transmitted light that this checks object to aforementioned inspection object irradiates light, the broken string of check pattern, doubling, outstanding, depression; And the 2nd photographing phase, it generates the reflected light of checking object reflection through this to aforementioned inspection object irradiates light, checks the stringiness foreign matter, does not have guiding perforation, surface imperfection.
According to the embodiment of the present invention, the aforementioned visual examination stage comprises: the 3rd photographing phase, it is to aforementioned inspection object irradiates light, generates to see through the transmitted light that this checks object, check solder resist pin hole, solidify, damage; And the 4th photographing phase, it generates the reflected light of checking object reflection through this to aforementioned inspection object irradiates light, checks sputter, pollution, scratch, foreign matter, the surface imperfection of solder resist.
According to the embodiment of the present invention, this method also comprises not good image the stage of recognition, it is coloured image in order to take through detected not good part of aforementioned pattern examination phase and aforementioned visual examination stage, makes the operator judge that this detected not good part is really not good or flase drop is surveyed and offered display.
According to the embodiment of the present invention, the illumination in the aforementioned pattern examination phase is the light to aforementioned inspection object irradiation infrared band.
According to the embodiment of the present invention, in the aforementioned pattern examination phase, by the infrared camera photographic images.
Beneficial effect of the present invention is as follows:
At first, according to above-mentioned the present invention, can implement pattern inspection and visual examination by an equipment.
In addition, according to the present invention, can carry out the pattern inspection to the flexible PCB of having smeared solder resist.
In addition, according to the present invention, can access the clean image of the pattern that is positioned at solder resist inside, thereby can improve checking efficiency.
In addition, the present invention can detect foreign conducting matter and non-conductive foreign matter, detects the certified products of non-conductive foreign matter in the pattern inspection, can suppress flase drop and survey.
Description of drawings
Fig. 1 is the figure of primary structure that the Integrated Check out System of the present invention's the 1st embodiment is shown.
Fig. 2 is the figure that inspection portion primary structure is shown.
Fig. 3 illustrates the different inspection items of each shoot part of the 1st embodiment and the form of standard thereof.
Fig. 4 is the figure of primary structure that the Integrated Check out System of the present invention's the 2nd embodiment is shown.
Fig. 5 illustrates in the inspection portion the not figure of the structure of good merchantable brand image confirmation unit.
Fig. 6 illustrates the different inspection items of each shoot part and the form of standard thereof.
Embodiment
With reference to the accompanying drawings 1 so that Fig. 6 embodiments of the present invention are described in more detail.Embodiments of the present invention can be deformed into multiple mode, should not be construed as the scope of the invention and are defined in the following embodiment.Present embodiment is more completely the present invention to be described and to provide for the technician who possesses average knowledge in this technical field.Thereby the shape of key element is exaggerated in order to emphasize more particularly bright in the accompanying drawing.For the textural element of carrying out identical function in the aforementioned figures, mark same reference numeral.
Fig. 1 is the figure of primary structure that the Integrated Check out System of the present invention's the 1st embodiment is shown.Fig. 2 is the figure that inspection portion primary structure is shown.Fig. 3 illustrates the different inspection items of each shoot part and the form of standard thereof.
When reference Fig. 1 and even Fig. 3, the Integrated Check out System 10 of the present invention's the 1st embodiment be can to inspection objects 20 such as the film (film) of continuous formation flexible PCB unit, tape (tape) type utilize the automatic pattern Processing inspection of a plurality of shoot parts and visual examination and also not the good merchantable brand image confirm the system that reexamines of (Verify).
Integrated Check out System 10 comprises feeder 100 (feed roller, loader), inspection portion 300, coiled strip portion 200 (winding roller, unloader) and the control part 900 of controlling the many actions of these textural elements.
Have the object 20 of inspection to be wound on the spool 110 in the feeder 100, the inspection object of sending from feeder 100 20 passes through the bending handover portion 310 that offers inspection portion 300 to deflector roll 120.Check that object 20 is wound on the spool 210 of coiled strip portion 200 through inspection portion 300.
Control part 900 possesses typical computer (so-called microcomputer), controls, handles the many actions according to optical check.And control part 900 is accepted reflected image and transmission image from the 1st and even the 4th shoot part of inspection portion 300, and it is good and outward appearance is not good to differentiate the pattern of checking object by the program of having imported.
When reference Fig. 2 and Fig. 3, inspection portion 300 comprises crooked handover portion 310, pattern inspection portion 320, visual examination portion 330 and not good image confirmation unit 340.
Bending handover portion 310 has the support sector 312 that supports to check object 20, and this support sector 312 makes to transfer along the circumference configuration with certain radius circular-arcly and checks object 20.Support sector 312 comprises 1 group of support roller 314 that mutual isolation is provided with.In inspection portion 300, check the path handover of object 20 by making along bending, compare with the handover length that linearity is transferred under the situation of checking object 20, will relatively prolong handover length, therefore the shoot part of a plurality of quantity can be set with not interfering mutually.Usually in the camera of shoot part, the adjustment component b that fixed support (bracket) a and being used to adjusts position of camera is set to 1 group, therefore requires the installing space greater than the camera size.
Pattern inspection portion 320 has the 3rd, the 4th shoot part 332,336 of the 1st, the 2nd shoot part 322,326, visual examination portion 330 and the 5th shoot part 342 of not good image confirmation unit 340, and they are configured in crooked handover portion 310 peripheries.These shoot parts 322,326,332,336,342 all comprise camera 302 and separately to the Lighting Division 304 of checking the object irradiates light.Lighting Division 304 is by constituting to the transillumination 306 of checking object 20 irradiates lights with to the indirect illumination 308 of checking object 20 irradiates lights, can select to use some in indirect illumination and the transillumination according to the project characteristic of wanting to check.Transillumination 306 is arranged on the holding components 312, by the slit between 1 group of support roller 314 to checking object 20 irradiates lights.Indirect illumination 308 is configured in camera 302 and checks between the object 20, to checking object 20 irradiates lights.For example, can use line scan camera or infrared camera as camera 302.
When being described more specifically pattern inspection portion 320, pattern inspection portion 320 comprises two the 1st shoot parts 322 and two the 3rd shoot parts 326.For the broken string of the circuit pattern of checking out inspection object 20, doubling, outstanding, depression etc., the camera 302 of the 1st shoot part 322 is taken area of the pattern.In the 1st shoot part 322, use from transillumination 306 irradiations and see through the transmitted light of checking object 20 and take.In order to check out inspection object stringiness foreign matter, not have guiding perforation (pre-punch), surface imperfection etc., the camera 302 of the 2nd shoot part 326 is taken area of the pattern.In the 2nd shoot part 326, use from the reflected light of indirect illumination 308 irradiations and object 20 reflections on inspection and take.
Visual examination portion 330 comprises one the 3rd shoot part 332 and two the 4th shoot parts 336.For the pin hole (pinhole) of the solder resist of checking out inspection object 20, solidify, damage, the camera 302 of the 3rd shoot part 332 is taken the solder resist zones.From the shooting area irradiates light of transillumination 306 to inspection object 20.For the solder resist sputter of checking out inspection object 20, pollution, scratch (scratch), foreign matter, surface imperfection etc., the camera 302 of the 4th shoot part 336 is taken the solder resist zones.From the shooting area irradiates light of indirect illumination 308 to inspection object 20.
The Lighting Division 304 of pattern inspection portion 320 and visual examination portion 330 wishes to use the high-brightness LED illumination of the green light of shining 500~570nm wavelength.Using the reason of green light LED illumination is to obtain more accurate, distinct pattern image in the pattern inspection.For example in checking object 20, the green solder resist SR that the pattern composition is used as insulation composition covers.If when using the illumination of normally used form and aspect (white and red), can't shoot pattern brightly owing to solder resist.But as the present invention, when green LED illumination identical with the solder resist form and aspect when irradiation or similar wavelength is taken, the LED illumination of identical wavelength will be shone the pattern plane of inboard bright by solder mask layer.Certainly in checking, the transmission of pattern inspection portion 320 also is suitable for same principle.Promptly when using the green LED illumination,, (do not have SR ground) too neatly and shoot the pattern that is positioned at solder resist inside even use the inspection of transmitted light.In addition, the green LED illumination is to checking in the outward appearance inspection item that the solder resist foreign matter is also very useful.
So in the present invention, when the illumination used with the similar wavelength of solder resist, the clean image till the pattern that is positioned at solder resist inside can be accessed, therefore after smearing solder resist, the pattern inspection can be carried out.
For example in pattern inspection of the present invention portion 320, can use the Lighting Division of the light of irradiation infrared band.Being pattern inspection portion 320 to have the zone of circuit pattern and forms pattern composition and space composition in inside in order to check to be not only by gold-plated, the above-mentioned electric circuit pattern of smearing the solder resist zone of solder resist, when using the Lighting Division of the light signal that shines infrared band, the reaction that can reduce according to foreign matter improves checking efficiency.For example for the Lighting Division that uses infrared band obtains imaged image, so and use infrared lenses or because of the focal length of infrared frequency than under the long situation of using general lens of luminous ray frequency band, get the lens focus distance setting longer.Certainly infrared lenses is to make the focal length of luminous ray frequency band and infrared frequency identical, therefore need not to adjust focal length.
In the pattern inspection portion 320 of Integrated Check out System 10 of the present invention, except the method for the illumination of using infrared band, can also use infrared camera to obtain same effect.
The inspection object that Integrated Check out System 10 of the present invention will be finished the finished product state of pattern operation, gold-plated process and welding resistance operation is that object is implemented to check.The inner foreign matter that exists of solder resist is coated with the welding resistance composition, therefore is difficult to distinguish qualified foreign matter or not good foreign matter at present.But in the present invention,, can distinguish qualification foreign matter and not good property foreign matter by using the light of the long infrared band of ripple.
340 of not good image confirmation units will optionally be taken from pattern inspection portion 320 and visual examination portion 330 detected not good parts and will be coloured image, and the image that will take shows by monitor, judges that by the operator really not good still is that flase drop is surveyed.Not good image confirmation unit 340 comprises three the 5th shoot parts 342, but the 5th shoot part 342 comprises to the indirect illumination 308 of checking object 20 irradiates lights, takes and check the not color camera 303 of good part of object.The image of taking in stage (pattern inspection and visual examination) before the 5th shoot part inspection will distinguish that taking for not good part is coloured image.The coloured image of Pai Sheing offers control part 900 like this, in control part 900 with coloured image and before distinguish that the image for not good part is presented on the monitor (not shown) in the stage (pattern inspection and visual examination).The operator relatively is presented at two images on the monitor, and by the final qualified or not good identification of input media input.
On the other hand, the inspection portion 300 of Integrated Check out System of the present invention implements visual examination after the pattern inspection, even but the order that changes visual examination and pattern inspection also has no relations, the pattern inspection is relatively to check the inspection object that moves with identical speed with visual examination, therefore needs the identical supervision time.
As Fig. 3, pattern check and visual examination in the identical camera of use, overlap the 1st shoot part the 322, the 2nd shoot part 326 and the 4th shoot part 336 that cameras constitute by two, use has the lens of same field of view 24mm and resolution, had a wide sphere of vision by 1 lens that overlap the 3rd shoot part 332 of camera, resolution is also variant.On the other hand, the 5th shoot part 342 is made of 3 cover cameras, so the visual field of lens is slightly little, and resolution also is 3.57 μ m.Lens are not shown in the accompanying drawings, and this point is a technique known for this area practitioner but lens are arranged on camera the place ahead (on the path that light enters), therefore omits for facility.
Fig. 4 is the figure of primary structure that the Integrated Check out System of the present invention's the 2nd embodiment is shown.Fig. 5 is the figure that the structure of not good image confirmation unit in the inspection portion is shown.Fig. 6 illustrates the different inspection items of each shoot part and the form of standard thereof.
When reference Fig. 4 and even Fig. 6, the Integrated Check out System 10a of the present invention's the 2nd embodiment comprises having and system's same structure of the 1st embodiment shown in Figure 1 and the feeder 100 of function (feed roller, loader), the 300a of inspection portion, coiled strip portion 200 (winding roller, unloader) and the control part 900 of controlling the many actions of these textural elements.Explanation to them describes in detail in the 1st embodiment, therefore omits in the present embodiment.But in the 1st embodiment, not good image confirmation unit 340 is to take not good part by three color lines smear cameras 303, but is to take not good part by two colour plane battle array cameras 354 in the present embodiment.Have and to come not good image confirmation unit 350 these points of photographic images to the camera movement of the mobile robotization of X-axis-Y-axis to not good part, have its structural attitude.
As Fig. 4 and shown in Figure 5, not good image confirmation unit is configured in the linearity handover portion of inspection portion.Straight line handover portion 380 comprises that 1 group of conveying roller 382 of isolating at certain intervals makes inspection object 20 horizontal linears transfer.Not good image confirmation unit 350 comprises: indirect illumination 308, and it is to checking object 20 irradiates lights; Two group of the 5th shoot part 352, it comprise with planar array scanning (area scan) mode take check object not good part face battle array camera 354 and face battle array camera 354 is moved to check the not X-Y shaft moving part 360 of good part of object.X-Y shaft moving part 360 comprises X-axis moving part 362 and Y-axis moving part 364.Face battle array camera 354 is to move to not good part by these moving parts to take the not image of good part.As the camera 354 and the indirect illumination 308 of the 5th shoot part, be to move to the X-Y direction of principal axis of checking object 20 by X-Y shaft moving part 360.Here, as X-Y shaft moving part 360, can use hydraulic cylinder (cylinder) mode or motor, the ball-screw that utilizes oil pressure and utilize the multiple mode of transferring nut.
As Fig. 6, pattern check and visual examination in identical camera and the illumination of use, overlap the 1st shoot part the 322, the 2nd shoot part 326 and the 4th shoot part 336 that cameras constitute by 2, use has the lens of same field of view 24mm and resolution, lens by 1 the 3rd shoot part 332 that constitutes of cover camera are had a wide sphere of vision, and resolution is also variant.On the other hand, the 5th shoot part 352 is to be made of 2 cover face battle array cameras (3CCD colour plane battle array smear camera) 354, therefore has the visual field of 1.2mm * 1.6mm.Particularly the shooting area of face battle array camera 354 is little, therefore after moving by X-Y shaft moving part 360, will take its not good part.
As above-mentioned, inspection of the present invention portion is by using the green illumination identical with solder resist, can access the clean image till the pattern that is covered by solder resist.Thereby, finish in the terminal stage of finished product of welding resistance operation, be not only visual examination and can also implement the pattern inspection, therefore can omit the pattern inspection of implementing before the welding resistance operation.
On the other hand, the present invention can diversely be out of shape in the comprehensive automatic inspection system that is made of said structure, can implement multiple mode.But the present invention is unqualified on the above-mentioned ad hoc base of mentioning, should be understood to the inventive concept and the whole deformations, equipollent and the sub that are in the scope that comprise by the claims scope definition.

Claims (24)

1. the Integrated Check out System of a flexible PCB is the Integrated Check out System that forms the inspection object of flexible PCB unit continuously, it is characterized in that this system possesses:
Feeder, it provides aforementioned inspection object;
Coiled strip portion, the aforementioned inspection object of inspection is finished in its unloading; And
Inspection portion, it is configured between aforementioned feeder and the aforementioned coiled strip portion, checks the aforementioned inspection object that moves to aforementioned coiled strip portion from aforementioned feeder;
Aforementioned inspection portion comprises pattern inspection portion that checks aforementioned inspection object pattern and the visual examination portion that checks aforementioned inspection object outward appearance.
2. the Integrated Check out System of flexible PCB according to claim 1 is characterized in that, aforementioned pattern inspection portion comprises shoot part, and this shoot part has camera and to the Lighting Division of aforementioned inspection object irradiates light;
Aforementioned Lighting Division comprises to aforementioned inspection object irradiates light and generates the transillumination of the transmitted light that sees through this inspection object and at least one in the catoptrical indirect illumination of this inspection object reflection to aforementioned inspection object irradiates light and generation.
3. the Integrated Check out System of flexible PCB according to claim 2 is characterized in that, aforementioned transillumination or aforementioned indirect illumination are the illuminations of irradiation green light.
4. the Integrated Check out System of flexible PCB according to claim 2 is characterized in that, aforementioned transillumination or aforementioned indirect illumination are the illuminations that irradiation has the light of 500~570nm wavelength.
5. according to the Integrated Check out System of claim 3 or 4 described flexible PCBs, it is characterized in that aforementioned transillumination or aforementioned indirect illumination are the LED illuminations.
6. the Integrated Check out System of flexible PCB according to claim 2 is characterized in that, the aforementioned Lighting Division of aforementioned pattern inspection portion is the light to aforementioned inspection object irradiation infrared band.
7. according to the Integrated Check out System of claim 2 or 6 described flexible PCBs, it is characterized in that the aforementioned camera of aforementioned pattern inspection portion is an infrared camera.
8. the Integrated Check out System of flexible PCB according to claim 1 is characterized in that, aforementioned visual examination portion comprises shoot part, and this shoot part has camera and to the Lighting Division of aforementioned inspection object irradiates light;
Aforementioned Lighting Division comprises to aforementioned inspection object irradiates light and generates the transillumination of the transmitted light that sees through this inspection object and at least one in the catoptrical indirect illumination of this inspection object reflection to aforementioned inspection object irradiates light and generation.
9. the Integrated Check out System of flexible PCB according to claim 1, it is characterized in that, this system also possesses not good image confirmation unit, it is coloured image in order to take through the detected not good part of aforementioned pattern inspection portion and aforementioned visual examination portion, makes the operator judge that this detected not good part is really not good or display is surveyed and offered to flase drop.
10. the Integrated Check out System of flexible PCB according to claim 9 is characterized in that, aforementioned not good image confirmation unit comprises: indirect illumination, and it generates the reflected light of checking the object reflection through this to aforementioned inspection object irradiates light; And color camera, its division is also taken the mutual different zone of aforementioned inspection object.
11. the Integrated Check out System of flexible PCB according to claim 9 is characterized in that, aforementioned not good image confirmation unit comprises: indirect illumination, and it generates the reflected light of checking the object reflection through this to aforementioned inspection object irradiates light; Face battle array camera, it takes the not good part of aforementioned inspection object in the planar array scanning mode; And moving-member, it is used for the not good part of aforementioned battle array camera movement to aforementioned inspection object.
12. the Integrated Check out System of flexible PCB according to claim 9 is characterized in that, aforementioned inspection portion also comprises the bending handover portion that transfers aforementioned inspection object along crooked route;
Aforementioned pattern inspection portion, aforementioned visual examination portion and aforementioned not good image confirmation unit are configured on the mobile route of the aforementioned inspection object that aforementioned crooked handover portion transfers along crooked route.
13. the Integrated Check out System of flexible PCB according to claim 9, it is characterized in that aforementioned inspection portion also comprises aforementioned inspection object along bending handover portion that crooked route is transferred and the straight line handover portion that aforementioned inspection object level is transferred;
Aforementioned pattern inspection portion and aforementioned visual examination portion are configured on the mobile route of the aforementioned inspection object that aforementioned crooked handover portion transfers along crooked route;
Aforementioned not good image confirmation unit is configured on the mobile route of the aforementioned inspection object that aforementioned straight line handover portion linearity is transferred.
14. the Integrated Check out System of a flexible PCB is the Integrated Check out System that forms the inspection object of flexible PCB unit continuously, it is characterized in that this system possesses:
Lighting Division, it is to aforementioned inspection object irradiation green light; And
Shoot part, it has the camera of taking aforementioned inspection object image.
15. the Integrated Check out System of flexible PCB according to claim 14, it is characterized in that aforementioned shoot part comprises that the pattern inspection of checking aforementioned inspection object pattern is with shoot part with check the visual examination shoot part of aforementioned inspection object outward appearance.
16. the Integrated Check out System of flexible PCB according to claim 15 is characterized in that, aforementioned illumination is to shine the LED of the light with 500~570nm wavelength illumination.
17. the Integrated Checkout method of a flexible PCB is the Integrated Checkout method that forms the inspection object of flexible PCB unit continuously, it is characterized in that this method comprises:
The stage of aforementioned inspection object is provided;
Come the not good pattern examination phase of check pattern to aforementioned inspection object irradiates light;
Check the visual examination stage that outward appearance is not good to aforementioned inspection object irradiates light; And
The stage of the aforementioned inspection object of inspection is finished in recovery;
In the aforementioned pattern examination phase, use the illumination of irradiation green light.
18. the method for comprehensive detection of flexible PCB according to claim 17 is characterized in that, the illumination irradiation of shining aforementioned green light has the light of 500~570nm wavelength.
19. the method for comprehensive detection of flexible PCB according to claim 18 is characterized in that, aforementioned inspection object is the solder resist of smearing on the surface of pattern composition as insulation composition.
20. the method for comprehensive detection of flexible PCB according to claim 19, it is characterized in that, the aforementioned pattern examination phase comprises: the 1st photographing phase, it is to aforementioned inspection object irradiates light, generate and see through the transmitted light that this checks object, the broken string of check pattern, doubling, outstanding, depression; And the 2nd photographing phase, it generates the reflected light of checking object reflection through this to aforementioned inspection object irradiates light, checks the stringiness foreign matter, does not have guiding perforation, surface imperfection.
21. the method for comprehensive detection of flexible PCB according to claim 20, it is characterized in that, the aforementioned visual examination stage comprises: the 3rd photographing phase, it is to aforementioned inspection object irradiates light, generate to see through the transmitted light that this checks object, check solder resist pin hole, solidify, damage; And the 4th photographing phase, it generates the reflected light of checking object reflection through this to aforementioned inspection object irradiates light, checks sputter, pollution, scratch, foreign matter, the surface imperfection of solder resist.
22. the method for comprehensive detection of flexible PCB according to claim 19, it is characterized in that, this method also comprises not good image the stage of recognition, it makes the operator judge that this detected not good part is really not good or display is surveyed and offered to flase drop in order to be coloured image through aforementioned pattern examination phase and the detected not good part shooting of aforementioned visual examination stage.
23. the method for comprehensive detection of flexible PCB according to claim 17 is characterized in that, the illumination in the aforementioned pattern examination phase is the light to aforementioned inspection object irradiation infrared band.
24. the method for comprehensive detection of flexible PCB according to claim 23 is characterized in that, in the aforementioned pattern examination phase, by the infrared camera photographic images.
CNA2009101472494A 2008-06-17 2009-06-12 The Integrated Check out System of flexible PCB and method thereof Pending CN101609054A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080056749 2008-06-17
KR1020080056749A KR20090131000A (en) 2008-06-17 2008-06-17 Union inspection ?system of flexible printed circuit board and method of the same

Publications (1)

Publication Number Publication Date
CN101609054A true CN101609054A (en) 2009-12-23

Family

ID=41482883

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2009101472494A Pending CN101609054A (en) 2008-06-17 2009-06-12 The Integrated Check out System of flexible PCB and method thereof

Country Status (3)

Country Link
JP (1) JP2009300438A (en)
KR (1) KR20090131000A (en)
CN (1) CN101609054A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102147375A (en) * 2010-12-23 2011-08-10 东莞市升力智能科技有限公司 Dual-working-platform surface fault automatic detector for flexible printed circuit
CN103832873A (en) * 2012-11-23 2014-06-04 三星泰科威株式会社 Reel-to-reel inspection apparatus and inspection method using the same
CN104820299A (en) * 2014-01-31 2015-08-05 有限会社共同设计企画 Electronic part detection device
CN109085174A (en) * 2018-07-02 2018-12-25 北京百度网讯科技有限公司 Display screen peripheral circuit detection method, device, electronic equipment and storage medium
CN109557053A (en) * 2018-11-27 2019-04-02 江门市利诺达电路科技有限公司 A kind of detection method of the circuit board via quality based on infrared external reflection principle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102147375A (en) * 2010-12-23 2011-08-10 东莞市升力智能科技有限公司 Dual-working-platform surface fault automatic detector for flexible printed circuit
CN102147375B (en) * 2010-12-23 2012-10-03 东莞市升力智能科技有限公司 Dual-working-platform surface fault automatic detector for flexible printed circuit
CN103832873A (en) * 2012-11-23 2014-06-04 三星泰科威株式会社 Reel-to-reel inspection apparatus and inspection method using the same
US9671352B2 (en) 2012-11-23 2017-06-06 Haesung Ds Co., Ltd Reel-to-reel inspection apparatus and inspection method using the same
CN104820299A (en) * 2014-01-31 2015-08-05 有限会社共同设计企画 Electronic part detection device
CN109085174A (en) * 2018-07-02 2018-12-25 北京百度网讯科技有限公司 Display screen peripheral circuit detection method, device, electronic equipment and storage medium
CN109557053A (en) * 2018-11-27 2019-04-02 江门市利诺达电路科技有限公司 A kind of detection method of the circuit board via quality based on infrared external reflection principle

Also Published As

Publication number Publication date
JP2009300438A (en) 2009-12-24
KR20090131000A (en) 2009-12-28

Similar Documents

Publication Publication Date Title
CN1828217B (en) Automatic optical detection system and method
CN101832948A (en) The appearance inspecting system of printed circuit board (PCB) and method thereof
KR20150018122A (en) Automatic optical inspector for the flexible printed circuit board
KR100796113B1 (en) Method and apparatus for measuring shape of bumps
CN107664645B (en) Illumination unit, defect inspection device, and illumination method
CN105979706B (en) The manufacturing method and inspection method of wired circuit board
CN101609054A (en) The Integrated Check out System of flexible PCB and method thereof
US6529624B1 (en) Apparatus for inspecting cream solder on PCB and method thereof
JP2014038045A (en) Inspection device, illumination, inspection method, program and substrate producing method
KR102393237B1 (en) Conductive ball inspection and repair device
CN106018415A (en) System for detecting quality of small parts based on micro-vision
CN100567885C (en) Automatic optical detecting system
JP2006105816A (en) Article inspecting device and article inspection method
JP2005140663A (en) Inspection device for wiring pattern, and wiring pattern inspecting method
JP2010190668A (en) Method of optical inspection and optical inspection device
EP1595138A1 (en) Image recognition apparatus and image recognition method
JP3150203B2 (en) Pattern detection method and device
KR20080112948A (en) Inspection apparatus
JP5043605B2 (en) Optical inspection system and optical inspection method
JP2006250930A (en) Automatic optical inspection system
KR20130035827A (en) Apparatus for automated optical inspection
JP2018179789A (en) Inspection device, inspection method, and item manufacturing method
JP2775411B2 (en) Lighting equipment for printed wiring board inspection equipment
CN201218722Y (en) Optical detector for printed circuit board
KR20170012911A (en) PCB Inspection device with AOI

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20091223