CN101600319A - Heat abstractor - Google Patents

Heat abstractor Download PDF

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Publication number
CN101600319A
CN101600319A CNA2008100675783A CN200810067578A CN101600319A CN 101600319 A CN101600319 A CN 101600319A CN A2008100675783 A CNA2008100675783 A CN A2008100675783A CN 200810067578 A CN200810067578 A CN 200810067578A CN 101600319 A CN101600319 A CN 101600319A
Authority
CN
China
Prior art keywords
fan
fixture
heat abstractor
base
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100675783A
Other languages
Chinese (zh)
Inventor
李伟
吴宜强
陈俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CNA2008100675783A priority Critical patent/CN101600319A/en
Priority to US12/406,087 priority patent/US20090301690A1/en
Publication of CN101600319A publication Critical patent/CN101600319A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A kind of heat abstractor, be used to distribute the heat that an electronic component produces, this heat abstractor comprises the base that contacts with this electronic component, be positioned at the some radiating fins on this base and be installed on a fan on this base, this heat abstractor comprises that also one is fixed to the fan Fixture on the described base, and described fan is fixed to fixture on this fan Fixture, the part of described fixture is with the setting of being separated by of this fan Fixture and described fan.Compared with prior art, in the use of heat abstractor of the present invention, the air-flow that fan produces is except the space from the radiating fin group flows away, and also the manhole from the radiating fin flows away, and has increased the radiating efficiency of heat abstractor; The convex body of the fixture of above-mentioned heat abstractor is interposed between fan and the fan Fixture, and the vibration that produces when avoiding fan to rotate is passed on fan Fixture and the radiating fin group, thereby reduces the noise of this heat abstractor.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor with fan fixer.
Background technology
Along with the constantly development of electronic information industry, electronic component running frequency and speed are also in continuous lifting.The heat that high-frequency high-speed will make electronic component produce is more and more, temperature is also more and more higher, performance and stability when having a strong impact on the electronic component operation can normally be moved in order to ensure electronic component, must in time discharge a large amount of heats that the electronic component operation is produced.For this reason, industry is usually at these heat-generating electronic elements mounted on surface one heat abstractors, with auxiliary its heat radiation.
Wherein a kind of heat abstractor comprises that one is installed on the radiator on the electronic component.When electronic component is worked, the heat of its generation via heat sink radiates to ambient air, thereby guarantee its operate as normal.In order further to improve the radiating efficiency of radiator, this heat abstractor comprises that also one is installed on the fan at radiator top, promptly the heat that radiator absorbed is taken away by the high velocity air of fan generation.
As everyone knows, fan can produce vibration in the process of work, increase the noise or the different sound of fan running, because the fan of above-mentioned heat abstractor is the top that directly is fixed to radiator by a fixture, the vibration that fan produces when work can act on the radiator, strengthens the noise of heat abstractor combination.Therefore, above-mentioned heat abstractor requires further improvement.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor that has fan fixer and can reduce noise in fact.
A kind of heat abstractor, be used to distribute the heat that an electronic component produces, this heat abstractor comprises the base that contacts with this electronic component, be positioned at the some radiating fins on this base and be installed on a fan on this base, this heat abstractor comprises that also one is fixed to the fan Fixture on the described base, and described fan is fixed to fixture on this fan Fixture, the part of described fixture is with the setting of being separated by of this fan Fixture and described fan.
Compared with prior art, in the use of heat abstractor of the present invention, the air-flow that fan produces is except the space from the radiating fin group flows away, and also the manhole from the radiating fin flows away, and has increased the radiating efficiency of heat abstractor; The convex body of the fixture of above-mentioned heat abstractor is interposed between fan and the fan Fixture, and the vibration that produces when avoiding fan to rotate is passed on fan Fixture and the radiating fin group, thereby reduces the noise of this heat abstractor.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the part assembly drawing of heat abstractor of the present invention.
Fig. 3 is the stereogram of fixture of the fan fixer of heat abstractor of the present invention.
Fig. 4 is the three-dimensional assembly diagram of heat abstractor of the present invention.
Embodiment
See also Fig. 1, heat abstractor of the present invention is used for an electronic component (figure do not show) heat radiation, it comprise a base that contacts with this electronic component 10, place this base 10 fan 20, one with fan 20 be fixed to base 10 fan fixer 30, be installed on some first heat pipes 40 and one second heat pipe 50 on the base 10 and place on the base 10 and a radiating fin group 60 that confession first heat pipe 40 and second heat pipe 50 wear.
Please consult Fig. 2 simultaneously, above-mentioned base 10 comprises a body that roughly is square 12, protrudes out the clamp 14 that these body 12 formation one are cuboid under a side direction of body 12.Offer a rectangular aperture (not indicating) on the body 12 of base 10 in order to accommodate a substrate 122.This substrate 122 is near the side away from clamp 14 of body 12.These substrate 122 approximate centre positions offer a square opening (not indicating), accommodate a pedestal 124 in this square opening.The bottom surface of this pedestal 124 is to fit with electronic component and to absorb the heat that this electronic component produces.The top of this pedestal 124 offers some grooves 1240 of these pedestal 124 1 sides that are parallel in order to accommodate described first heat pipe 40.Described clamp 14 offers a fluting 142 that is parallel to the perforation of described groove 1240 at centre position place, the length of the length of this clamp 14 and body 12 1 sides is suitable, and this clamp 14 is provided with a block groove 146 that connects at the top away from an end of pedestal 124 grooves 1240.
Said fans 20 comprises a fan frame 22.Four corners of this fan frame 22 offer a location hole 24 respectively.
See also Fig. 1 and Fig. 2, said fans fixture 30 comprises that one roughly is the fan Fixture 32 of ㄇ type and plurality of fixed part 34 in order to fan Fixture 32 is fixed on the described fan 20.
Described fan Fixture 32 comprises a rectangular tabular top board 320 and two baffle plates 322 that extend vertically downward from these top board 320 two ends.The width of the width of this top board 320 and baffle plate 322 and the fan frame 22 of said fans 20 is suitable.A breach 3220 is offered in the lower right corner of each baffle plate 322.Each baffle plate 322 forms two attaching clamps 3222 from the inside vertical extent of opposite end away from breach 3,220 one sides, and each attaching clamp 3222 has through hole 3223 and wears buckle for fixture 34.Each attaching clamp 3222 that is positioned at baffle plate 322 bottoms extends to form a level first installation portion 3224 from the vertical outwards bending of its bottom margin.Each baffle plate 322 forms a support ledge 3226 from the inside vertical extent of an end near these baffle plate 322 breach 3220, and the outwards vertical bending of the top of this each support ledge 3226 extends to form a level second installation portion 3228 certainly.First installation portion 3224 and second installation portion, 3228 approximate centre positions offer the screwed hole 3229 for screw (figure does not show) screw lock respectively.
Please consult Fig. 3 simultaneously, described fixture 34 is one-body molded by elastic plastic material, has better elastic.This fixture 34 comprises that to left end a head 340, a column place bar 341, a convex body 342, a column connecting rod 343, one conical abutting part 344 and a column handle 345 by right-hand member successively.This head 340 is a disc.In the present embodiment, the parallel side 3420 of the cut formation in the relative both sides of convex body 342 circumference two.In other embodiments, this convex body 342 can be disc.In the present embodiment, to place the girth diameter of bar 341 little than the girth diameter of head 340 and convex body 342 for column.It is more smaller so that attaching clamp 3222 firmly is folded between this head 340 and the convex body 342 than the thickness of the attaching clamp 3222 of baffle plate 322 that column places the length of bar 341.In the present embodiment, the girth diameter of the girth diameter of convex body 342 and head 340 is suitable.In other embodiments, the girth diameter of convex body 342 can be different with the girth diameter of head 340.In the present embodiment, the length of column connecting rod 343 is more smaller than the degree of depth of the installing hole 24 of fan 20.The girth diameter of column connecting rod 343 is little than the girth diameter of convex body 342, and to place the girth diameter of bar 341 suitable with column.In other embodiments, the girth diameter of column connecting rod 343 can to place the girth diameter of bar 341 different with column.In the present embodiment, the girth diameter of the right-hand member of conical abutting part 344 is greater than the girth diameter of column connecting rod 343, and the girth diameter of abutting part 344 is reduced to its girth diameter gradually along column connecting rod 343 towards handle direction identical with the girth diameter of handle 345.Abutting part 344 is that taper shape is so that abutting part 344 passes the girth diameter location hole 24 little than abutting part 344 girth diameters.The girth diameter of handle 345 less than the girth diameter of column connecting rod 343 so that this handle 345 successfully passes the location hole 24 of fan 20.
See also Fig. 1 and Fig. 2, the quantity of above-mentioned first heat pipe 40 is three, and each heat pipe 40 roughly is the setting of " U " shape.Each heat pipe 40 has the endotherm section 42 of a level and two heat release section 44 of being extended straight up afterwards by the bending of endotherm section 42 two ends.These endotherm sections 42 mutually near and be arranged in parallel.These endotherm section 42 correspondences are housed in the groove 1240 of being located at said base 124 tops in order to absorb the heat from the electronic component absorption of this pedestal 124.44 of above-mentioned heat release section are spaced from each other and be arranged in parallel, to be arranged in the radiating fin group 60.In the present embodiment, the linkage section of each heat pipe 40 is on crooked shape and the no longer same plane.
Above-mentioned second heat pipe 50 is " U " shape and is provided with.This second heat pipe 50 has the endotherm section 52 of a level and two heat release section 54 of extending straight up after the bending of endotherm section 52 two ends.The endotherm section 42 of this endotherm section 52 and first heat pipe 40 is parallel to each other and is separated by setting.These endotherm section 52 correspondences are housed in the fluting 142 of base 10 to absorb the heat on the base 10.This heat release section 54 is parallel to the heat release section 44 of described first heat pipe.This heat release section 54 is arranged in the radiating fin group 60.
See also Fig. 1 and Fig. 2, above-mentioned radiating fin group 60 comprises one first radiating fin 62, some second radiating fins 64, some the 3rd radiating fins 66 and one hot fin 68 that scatters.The position relation of these radiating fins 62,64,66,68 is: first radiating fin 62 is in the superiors; Next is second radiating fin 64; Be the 3rd radiating fin 66 once more; Scatters hot fin 68 at orlop.
These radiating fins the 62,64,66, the 68th, roughly rectangular sheet metal all has the body 620,640,660,680 that a size is identical and be parallel to each other.Side perpendicular to the clamp 14 of described base 10 of these radiating fins 62,64,66,68 protrudes out this base 10.The body 620,640,660,680 of these radiating fins 62,64,66,68 all offers some manholes 61 so that said fans 20 air communication mistakes.The body 660,680 of each radiating fin 66,68 offers a containing hole 69 in the part that protrudes out described base 10, and these containing hole 69 common accommodation spaces 690 that form are to accommodate described fan 20 and fan fixer 30.All offering some through holes 63 on the body 640,660,680 of each radiating fin 64,66,68 wears for the heat release section 44 of above-mentioned first heat pipe 40.Second radiating fin, 64 bodies 640 offer the heat release section 54 of two perforation 642 to accommodate above-mentioned second heat pipe 50 in the side near the clamp 14 of described base 10.The body 660,680 of each radiating fin 66,68 perforation 642 places away from containing hole 69 in the perforation 642 of corresponding second radiating fin 64 offer an opening 602 for second heat pipe 50 wherein a heat release section 54 wear, second heat pipe, 50 another heat release section 54 are passed accommodation space 690.
The body 620,640,660 of above-mentioned each radiating fin 62,64,66 extends a short flanging 65 downwards from the two relative vertical one of longer edges difference.This short flanging 65 with these radiating fins 62,64,66 with same distance at interval.
Above-mentioned the scatter hot fin 68 body 680 from two relative longer edges respectively vertical one extend long flangings 67 downwards, the width of this long flanging 67 is wideer than above-mentioned short flanging 65.Wherein the bottom of a long flanging 67 is placed in the block groove 146 interior effects of moving and play support radiating fin group 60 with restriction radiating fin group 60 vertical downward direction of the clamp 14 of above-mentioned base 10.
Please consult Fig. 3 and Fig. 4 simultaneously, during assembling, at first the endotherm section 42 of above-mentioned first heat pipe 40 is welded in the groove 1240 of body 12 pedestals 124 of described base 10, heat release section 44 correspondences of first heat pipe 40 penetrate a wherein long flanging 67 that scatters hot fin 68 are embedded in the block groove 146 of clamp 14 of base 10; The endotherm section 52 of above-mentioned second heat pipe 50 is welded in the fluting 142 of body 12 of described base 10, the perforation 642 that a wherein heat release section 54 of second heat pipe 50 is passed the body 640 of the opening 602 of third and fourth radiating fin 66,68 and second radiating fin 64 is successively supported and is ended on the body 620 of first radiating fin 62, simultaneously, another heat release section 54 of second heat pipe 50 is passed the perforation 642 of the accommodation space 690 and second radiating fin 64 successively to ending on the body 620 of first radiating fin 62; Said fans 20 is by in the fan Fixture 32 that penetrates said fans fixture 30 down, and makes the location hole 24 of fan 20 aim at the through hole 3223 of the attaching clamp 3222 of fan Fixtures 32; The handle 345 of the fixture 34 of fan fixer 30 passes the through hole 3223 of fan Fixture 32 attaching clamps 3222 successively and the location hole 24 of fan 20 makes this handle protrude out the location hole 24 of fan 20, then handle 345 being applied pulling force makes fixture 34 be in the tensile deformation state, and the abutting part 344 that makes fixture 34 passes the through hole 3223 of fan Fixture 32 attaching clamps 3222 and the location hole 24 of fan 20, make convex body 342 pass the through hole 3223 of fan Fixture 32 attaching clamps 3222 simultaneously and be interposed between the fan frame 22 of this attaching clamp 3222 and fan 20, slowly discharge pulling force then handle 345.Because it is more smaller than the thickness of the attaching clamp 3222 of baffle plate 322 that column places the length of bar 341, the length of column connecting rod 343 is more smaller than the degree of depth of the installing hole 24 of fan 20, so fixture 34 still is in extended state, under the effect of the convergent force of fixture 34, head 340 is held in the outside of fan Fixture 32, convex body 342 is held between fan Fixture 32 and the fan 20, the right-hand member of abutting part 344 is held in the outside of the fan frame 22 of fan 20, thereby fan 20 is securely fixed on the fan Fixture 32; Then mounted fan 20 and fan Fixture 32 are made up by in the receiving space 690 of inserting radiating fin group 60 down, and make first installation portion 3224 of fan Fixture 32 support the bottom surface of ending at the body 12 of above-mentioned base 10, second installation portion 3228 supports and ends in the scatter bottom surface of hot fin 68 of the of above-mentioned radiating fin group 60, is fixed on the body 12 of base 10 by first installation portion 3224 of screw (figure does not show) with fan Fixture 32 then; By screw (figure do not show) second installation portion 3228 being installed in the scatters on the hot fins group 68.Like this, heat abstractor of the present invention assembling is finished.
Compared with prior art, in the use of heat abstractor of the present invention, the air-flow that fan 20 produces is except the space from radiating fin group 60 flows away, and also the manhole 61 from the radiating fin 62,64,66,68 flows away, and has increased the radiating efficiency of heat abstractor; The convex body 342 of the fixture 34 of above-mentioned heat abstractor is interposed between fan 20 and the fan Fixture 32, and the vibration that produces when avoiding fan 20 to rotate is passed on fan Fixture 32 and the radiating fin group 60, thereby reduces the noise of this heat abstractor.

Claims (15)

1. heat abstractor, be used to distribute the heat that an electronic component produces, this heat abstractor comprises the base that contacts with this electronic component, be positioned at the some radiating fins on this base and be installed on a fan on this base, it is characterized in that: this heat abstractor comprises that also one is fixed to the fan Fixture on the described base, and described fan is fixed to fixture on this fan Fixture, the part of described fixture is with the setting of being separated by of this fan Fixture and described fan.
2. heat abstractor as claimed in claim 1 is characterized in that: described fixture comprises a convex body, and this convex body is interposed between described fan and the described fan Fixture.
3. heat abstractor as claimed in claim 2 is characterized in that: described fixture also comprises head that is positioned at the one end and the operating handle that is positioned at its other end, and described fan Fixture has the attaching clamp that is folded between this head and the described convex body.
4. heat abstractor as claimed in claim 3 is characterized in that: be connected with a column between described convex body and the head and place bar, this places bar and is placed through in the described lug.
5. heat abstractor as claimed in claim 4, it is characterized in that: described fixture extends a column connecting rod in described convex body away from described bar one side that places, this connecting rod is placed through in the described fan, this fixture is formed with an abutting part in this fan away from described convex body one side, and this abutting part connects this connecting rod and described handle.
6. heat abstractor as claimed in claim 5 is characterized in that: described abutting part is tapered, and its girth diameter is reduced to handle direction gradually by described connecting rod.
7. heat abstractor as claimed in claim 1 is characterized in that: described fixture is one-body molded by elastic plastic material, and described fan Fixture is a framework, and it covers at the fan periphery and is the setting of ㄇ type.
8. heat abstractor as claimed in claim 5 is characterized in that: the girth diameter of described handle is little than the girth diameter of column connecting rod.
9. heat abstractor as claimed in claim 4 is characterized in that: the girth diameter of described handle is little than the girth diameter that column places bar.
10. heat abstractor as claimed in claim 1 is characterized in that: described fixture is in the elastic stretching state.
11. heat abstractor as claimed in claim 3, it is characterized in that: described fan Fixture comprises a top board and two baffle plates that extend vertically downward from these top board two ends, described attaching clamp is from the formation that extends internally of the opposite end of each baffle plate one side, extending internally from each baffle plate opposite side bottom forms a support ledge, and described fan is fixed on this attaching clamp.
12. heat abstractor as claimed in claim 11, it is characterized in that: each attaching clamp that is positioned at described baffle plate bottom outwards bends from the one edge and extends to form one first installation portion, outside bending extends to form one second installation portion from an edge of described each support ledge, this first installation portion is fixed on the described base, and this second installation portion is fixed on the described radiating fin.
13. heat abstractor as claimed in claim 1, it is characterized in that: described some fins protrude out described base to a side, these some fins are provided with the accommodation space of a ccontaining described fan and fan Fixture in its part that protrudes out base, the setting of being separated by of described fan and described radiating fin.
14. heat abstractor as claimed in claim 13 is characterized in that: a wherein fin of described some fins extends two flangings to described base direction, and described fan is between this two flanging.
15. heat abstractor as claimed in claim 14 is characterized in that: described base is provided with the block groove of a wherein flanging of chimeric described some fins.
CNA2008100675783A 2008-06-04 2008-06-04 Heat abstractor Pending CN101600319A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA2008100675783A CN101600319A (en) 2008-06-04 2008-06-04 Heat abstractor
US12/406,087 US20090301690A1 (en) 2008-06-04 2009-03-17 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2008100675783A CN101600319A (en) 2008-06-04 2008-06-04 Heat abstractor

Publications (1)

Publication Number Publication Date
CN101600319A true CN101600319A (en) 2009-12-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100675783A Pending CN101600319A (en) 2008-06-04 2008-06-04 Heat abstractor

Country Status (2)

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US (1) US20090301690A1 (en)
CN (1) CN101600319A (en)

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CN102213984A (en) * 2010-04-09 2011-10-12 鸿富锦精密工业(深圳)有限公司 Heat radiating system

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CN2664051Y (en) * 2003-10-30 2004-12-15 技嘉科技股份有限公司 A curvature radiator
CN2935724Y (en) * 2006-07-03 2007-08-15 欣瑞联科技股份有限公司 Heat sink with vibration-absorbing structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196707A (en) * 2010-03-08 2011-09-21 富准精密工业(深圳)有限公司 Heat radiating device
CN102213984A (en) * 2010-04-09 2011-10-12 鸿富锦精密工业(深圳)有限公司 Heat radiating system

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Application publication date: 20091209