CN101582094A - Through hole arrangement system and through hole arrangement method - Google Patents
Through hole arrangement system and through hole arrangement method Download PDFInfo
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- CN101582094A CN101582094A CNA2008101078154A CN200810107815A CN101582094A CN 101582094 A CN101582094 A CN 101582094A CN A2008101078154 A CNA2008101078154 A CN A2008101078154A CN 200810107815 A CN200810107815 A CN 200810107815A CN 101582094 A CN101582094 A CN 101582094A
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- weld pad
- hole
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- hole weld
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Abstract
The invention relates to a through hole arrangement system and a through hole arrangement method, which are applied to wiring software of a printed circuit board and are used for designing a wiring diagram of the printed circuit board. The wiring software is provided with a part library. The method comprises the following steps: forming a restricted area of an outer frame is superposed with an outer frame of the uncovered area of a wave soldering carrier in the wiring diagram of the printed circuit board according to uncovered area data of the wave soldering carrier which is stored in the part library in advance and corresponds to wave soldering parts, and setting interval rules of through hole weld pads inside the restricted area and interval rules of through hole weld pads outside the restricted area respectively; and when the through hole weld pads are arranged in the wiring diagram of the printed circuit board, judging whether coordinates of the though hole weld pads are inside or outside the restricted area, judging whether the though hole weld pads inside the restricted area or outside the restricted area accord with the interval rules of the through hole weld pads or not, and otherwise, adjusting the coordinates of the through hole weld pads.
Description
Technical field
The present invention relates to a kind of through hole arranging system and method, particularly relate to through hole arranging system and method in the wiring software that is applied to a printed circuit board (PCB).
Background technology
Along with the development of integrated circuit densification, with electric design automation (ElectronicDesign Automation; EDA) demand that connects up of software also gets over lifting.Comparatively general wiring method is the method that adopts self routing to combine with manual wiring at present.Because have characteristics such as speed is fast, accuracy height than simple manual wiring and self routing, so more can deal with market fast to the requirement in the product design, wherein craft wiring then can be made adjustment to the cabling mode that the part does not meet design, to reach the purpose of optimization wiring.
Printed circuit board (PCB) (Printed Circuit Board general technology (lead is arranged); PCB) in the design, the spacing between the through hole weld pad (via pad) is required need have the gap each other for each through hole weld pad.And along with the rise of lead-free process, in lead-free process, because the factor of scolding tin component, compare splicer's easier tin bridge phenomenon that causes between the through hole weld pad of planting, therefore in order to satisfy the requirement of lead-free process, prevent that tin bridge phenomenon from producing, in the design process of printed circuit board (PCB), promptly the spacing between the through hole weld pad on the printed circuit board (PCB) is made corresponding standard, especially at the through hole weld pad that is exposed in the wave-soldering in the scolder zone (being wave-soldering carrier uncovered area), its spacing requires to be different from other zones on the circuit board.This spacing requires to comprise the spacing between the through hole weld pad and the electrical weld pad of through hole weld pad and other types, for example the spacing (spacing) between THMT weld pad, SMT weld pad and the golden finger (gold figure) need satisfy certain safe distance regulation.
But at present in the design software of printed circuit board (PCB), this function of Shang Weiyou, way is when laying the through hole weld pad at present, adopt artificial mode judge around this through hole weld pad and its spacing between other conductors (being above-mentioned through hole weld pad, THMT weld pad, SMT weld pad and golden finger) whether satisfy safe distance requirement, and through hole weld pad of every laying all needs to carry out above-mentioned artificial judgment.
But, flourish along with electronic industry, that electronic product also tends to is multi-functional, the high-performance direction develops to satisfy the demands of consumers.For catering to this development trend, electronic product manufacturer also proposes quite high requirement to the printed circuit board (PCB) of product, the through hole weld pad quantity of printed circuit board (PCB) flaggy number is increased, wiring is more and more intensive, being laid on the printed circuit board (PCB) is also more and more, if adopting above-mentioned manual type judges, not only can lose time significantly and human resources because of complex operation, therefore cause inefficiency, and also may prolong the PCB design cycle and bring unnecessary loss to enterprise.In addition, follow-uply also must repeat above-mentioned steps to judge, make troubles for designing program of printed circuit board (PCB) far and away if need carry out the through hole bond pad locations when adjusting.
Therefore, how a kind of through hole arranging system and method are proposed, with avoid existing when laying the through hole weld pad because the waste of the time that complex operation was caused, manpower and then influence defective such as its efficient, become the technical matters that present industry is demanded urgently overcoming in fact.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of through hole arranging system and method, lays the time to shorten the through hole weld pad, makes the laying of through hole weld pad simple to operate, and then promote the efficient that the through hole weld pad is laid.
For reaching above-mentioned and other purpose, the invention provides a kind of through hole arranging system, being applied to one carries in the wiring software of the printed circuit board (PCB) to the electronic installation, in order to the designing printed circuit board wiring diagram, this wiring software has a parts library, it is characterized in that, this through hole arranging system comprises: part is provided with module, in order to the wave-soldering carrier uncovered area of corresponding wave-soldering part to be set, for will be to this parts library to this wave-soldering carrier uncovered area data storage that should the wave-soldering part; The zone is provided with module, when being used in this parts library, call this wave-soldering part, the data to wave-soldering carrier uncovered area that should the wave-soldering part according to being stored in this parts library forms the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area in printed circuit board wiring figure; Rule is provided with module, in order to provide a through hole weld pad (via pad) to lay rule the interface is set, so that through hole weld pad spacing rule in the restricted area and the through hole weld pad spacing rule outside the restricted area to be set; Processing module, when being used in this printed circuit board wiring figure, to lay the through hole weld pad by this wiring software, judge that this through hole weld pad coordinate is whether in this restricted area, if this through hole weld pad coordinate drops in this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule in this restricted area, if do not meet, in this restricted area, adjust the coordinate of this through hole weld pad, if this through hole weld pad coordinate drops on outside this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area, if do not meet, outside this restricted area, adjust the coordinate of this through hole weld pad.
The present invention also proposes a kind of through hole distribution method, being applied to one carries in the wiring software of the printed circuit board (PCB) to the electronic installation, in order to design this printed circuit board wiring figure, this wiring software has a parts library, it is characterized in that, this through hole weld pad distribution method may further comprise the steps: in this parts library, set up and store the wave-soldering carrier uncovered area data of corresponding wave-soldering part in advance; Carrying out by this wiring software in the printed circuit board wiring figure design process, during this wave-soldering part in calling this parts library, according to stored to wave-soldering carrier uncovered area data that should the wave-soldering part, in printed circuit board wiring figure, form the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area; Provide a through hole weld pad (viapad) to lay rule the interface is set, so that through hole weld pad spacing rule in the restricted area and the through hole weld pad spacing rule outside the restricted area to be set; When in this printed circuit board wiring figure, laying the through hole weld pad by this wiring software, judge that this through hole weld pad coordinate is whether in this restricted area, if, judge whether this through hole weld pad meets the through hole weld pad spacing rule in this restricted area, if do not meet, in this restricted area, adjust the coordinate of this through hole weld pad, if this through hole weld pad coordinate drops on outside this restricted area, judge then whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area, if do not meet, outside this restricted area, adjust the coordinate of this through hole weld pad.
In through hole arranging system of the present invention and method, the through hole weld pad spacing rule in this restricted area comprises that this through hole weld pad that is laid in this restricted area and the distance between the conductor are more than or equal to a safe distance.Through hole weld pad spacing rule outside this restricted area comprises that this through hole weld pad that is laid in outside this restricted area and the distance between the conductor are more than or equal to a safe distance.This conductor is to be laid in this restricted area and one of them person of outer through hole weld pad, THMT weld pad, SMT weld pad and golden finger (gold figure); This electronic installation is a computer.
Compared with prior art, through hole arranging system of the present invention and method, mainly be earlier according to the wave-soldering carrier uncovered area data that is stored in corresponding wave-soldering part in the parts library in advance, in circuit board wiring figure, form the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area, and be provided with respectively be laid in the restricted area in and outer through hole weld pad be laid in identical lay safe distance between the regional conductor of zone and different layings through hole weld pad spacing rule, so that when laying the through hole weld pad, judge that this through hole weld pad coordinate is whether in this restricted area, if, judge that whether this through hole weld pad coordinate is in this restricted area, if do not meet, in this restricted area, adjust the coordinate of this through hole weld pad, if this through hole weld pad coordinate drops on outside this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area, if do not meet, outside this restricted area, adjust the coordinate of this through hole weld pad, thus, need not to spend great amount of manpower, time can reach the purpose that the through hole weld pad is rationally laid fast, correspondingly promote the efficient that the through hole weld pad is laid, and detect and judge the troublesome operation of the spacing of through hole weld pad and other conductors when avoiding carrying out the through hole weld pad and laying by manual type.
Description of drawings
Fig. 1 is the basic framework block schematic diagram of through hole arranging system of the present invention; And
Fig. 2 is the flow chart of steps of through hole distribution method of the present invention.
The simple declaration of element numbers:
10 through hole arranging systems
100 parts are provided with module
102 distances are provided with module
104 rules are provided with module
106 processing modules
12 parts libraries
S20～S28 step
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this instructions disclosed.The present invention also can be implemented or be used by other different instantiations, and the every details in this instructions also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
As shown in Figure 1, it is in order to illustrate the basic framework block schematic diagram of through hole arranging system of the present invention.Through hole arranging system of the present invention is applied to a printed circuit board (PCB) (Printed CircuitBoard; PCB) in the wiring software, and this wiring software is equipped in the electronic installation, in order to design this printed circuit board wiring figure, this wiring software has a parts library 12, this parts library 12 is to use for all required information parts of this PCB design of storage, therefrom calls corresponding part when designing for follow-up execution printed circuit board wiring figure; This electronic installation is a computer.As shown in Figure 1, through hole arranging system 10 of the present invention comprises that part is provided with that module 100, zone are provided with module 102, rule is provided with module 104 and processing module 106, below promptly through hole arranging system 10 of the present invention is elaborated.
It is in order to the wave-soldering carrier uncovered area (wave pallet) of corresponding wave-soldering part to be set that this part is provided with module 100, for will be to this wave-soldering carrier uncovered area data storage that should the wave-soldering part to this parts library 12.In actual design process, this wave-soldering carrier uncovered area is the scolder zone in the wave-soldering.And this wave-soldering carrier uncovered area data comprises the size of this wave-soldering carrier uncovered area and housing shape etc.
It is when being used to call this wave-soldering part in this parts library 12 that this zone is provided with module 102, according to the data to wave-soldering carrier uncovered area that should the wave-soldering part of being stored in this parts library 12, in printed circuit board wiring figure, form the restricted area that its housing overlaps with frame outside this wave-soldering carrier uncovered area, that is, the housing shape of the housing shape of this restricted area and this wave-soldering carrier uncovered area is coincide, so the size of the size of this restricted area and this wave-soldering carrier uncovered area is equal to.
It is in order to provide a through hole weld pad (via pad) to lay rule the interface to be set that this rule is provided with module 104, so that through hole weld pad spacing rule in the restricted area and the through hole weld pad spacing rule outside the restricted area to be set.Wherein, the through hole weld pad spacing rule in this restricted area comprises that this through hole weld pad that is laid in this restricted area and the distance between the conductor are more than or equal to a safe distance.Through hole weld pad spacing rule outside this restricted area comprises that this through hole weld pad that is laid in outside this restricted area and the distance between the conductor are more than or equal to a safe distance.
In the present invention, this conductor be for example for the through hole weld pad of this through hole weld pad same type, also can be with this through hole weld pad be dissimilar THMT weld pad, SMT weld pad and golden fingers (gold figure) etc.For satisfying the requirement of printed circuit board (PCB) lead-free process, no matter the through hole weld pad is laid in the restricted area still is outside the restricted area, the through hole weld pad is wanted 16mil at least to the distance of THMT weld pad, can module 104 be set at being laid in the restricted area or outer THMT weld pad by rule, be provided with in this restricted area and safe distance that outer through hole weld pad spacing rule is between through hole weld pad and the THMT weld pad is 16mil.No matter the through hole weld pad is laid in the restricted area still is outside the restricted area, the through hole weld pad is wanted 6mil at least to the distance of SMT weld pad, can module 104 be set at being laid in the restricted area or outer SMT weld pad by rule, be provided with in this restricted area and safe distance that outer through hole weld pad spacing rule is between through hole weld pad and the SMT weld pad is 6mil.No matter the through hole weld pad is laid in the restricted area still is outside the restricted area, the through hole weld pad is at least 30mil to the distance of golden finger, can module 104 be set at being laid in the restricted area or outer golden finger by rule, be provided with in this restricted area and safe distance that outer through hole weld pad spacing rule is between through hole weld pad and the golden finger is 30mil.For the requirement of the spacing of through hole weld pad and other through hole weld pads more complicated then, when the through hole weld pad is laid in outside the restricted area (being wave-soldering carrier overlay area), its be laid in the restricted area or the spacing of other outer through hole weld pads is at least 5mil, in the time of in the through hole weld pad is laid in restricted area (being wave-soldering carrier uncovered area), it is at least 8mil with the spacing that is laid in other through hole weld pads in the restricted area, and the distance of its other through hole weld pads outside being laid in the restricted area is at least 5mil.Therefore, can module 104 being set by rule, through hole weld pad spacing rule in the restricted area (this moment, the through hole weld pad for being laid in the restricted area in) is set is through hole weld pad and to be laid in safe distance between other through hole weld pads in the restricted area be 5mil, safe distance between other through hole weld pads outside the restricted area is 8mil; And through hole weld pad spacing rule outside the restricted area (this moment, the through hole weld pad for being laid in the restricted area outside) is set is the through hole weld pad and be laid in the restricted area or the safe distance between other outer through hole weld pads is 5mil by rule module 104 to be set.
The flow process of the through hole distribution method of corresponding through hole arranging system of the present invention is as shown in Figure 2, and it comprises following detailed implementation step:
In step S20, in this parts library 12, set up and store the wave-soldering carrier uncovered area data of corresponding wave-soldering part in advance.Then proceed to step S21.
In step S21, carrying out by this wiring software in the printed circuit board wiring figure design process, during this wave-soldering part in calling this parts library 21, according to stored to wave-soldering carrier uncovered area data that should the wave-soldering part, in printed circuit board wiring figure, form the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area.Then proceed to step S22.
In step S22, provide a through hole weld pad to lay rule the interface is set, for the through hole weld pad spacing rule and the outer through hole weld pad spacing rule of restricted area that are provided with in the restricted area.Wherein, the through hole weld pad spacing rule in this restricted area comprises that this through hole weld pad that is laid in this restricted area and the distance between the conductor are more than or equal to a safe distance.Through hole weld pad spacing rule outside this restricted area comprises that this through hole weld pad that is laid in outside this restricted area and the distance between the conductor are more than or equal to a safe distance.Then proceed to step S23.
In step S23, when in this printed circuit board wiring figure, laying the through hole weld pad, capture this through hole weld pad coordinate by this wiring software by this wiring software.Then proceed to step S24.
In step S24, judge that this through hole weld pad coordinate whether in this restricted area, if this through hole weld pad coordinate drops in this restricted area, then proceeds to step S25, if this through hole weld pad coordinate drops on outside this restricted area, then proceed to step S27.
In step S25, judge whether this through hole weld pad meets the through hole weld pad spacing rule in this set restricted area of step S22, lay process if then finish this through hole, otherwise proceed to step S26.
In step S26, in this restricted area, adjust the coordinate of this through hole weld pad by this wiring software, then be back to step S25.
In step S27, judge whether this through hole weld pad meets the through hole weld pad spacing rule outside this set restricted area of step S22, lay process if then finish this through hole, otherwise proceed to step S28.
In step S28, outside this restricted area, adjust the coordinate of this through hole weld pad by this wiring software, then be back to step S27.Make thus spacing between through hole weld pad on the printed circuit board wiring figure and the conductor elements such as through hole weld pad, THMT weld pad, SMT weld pad and golden finger around it satisfy safe distance requirement.
Compared with prior art, through hole arranging system of the present invention and method, mainly be earlier according to the wave-soldering carrier uncovered area data that is stored in corresponding wave-soldering part in the parts library in advance, in circuit board wiring figure, form the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area, and be provided with respectively be laid in the restricted area in and outer through hole weld pad be laid in identical lay safe distance between the regional conductor of zone and different layings through hole weld pad spacing rule, so that when laying the through hole weld pad, judge that this through hole weld pad coordinate is whether in this restricted area, if, judge that whether this through hole weld pad coordinate is in this restricted area, if do not meet, in this restricted area, adjust the coordinate of this through hole weld pad, if this through hole weld pad coordinate drops on outside this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area, if do not meet, outside this restricted area, adjust the coordinate of this through hole weld pad, thus, need not to spend great amount of manpower, time can reach the purpose that the through hole weld pad is rationally laid fast, correspondingly promote the efficient that the through hole weld pad is laid, and detect and judge the troublesome operation of the spacing of through hole weld pad and other conductors when avoiding carrying out the through hole weld pad and laying by manual type.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (10)
1, a kind of through hole arranging system is applied to one and carries in the wiring software of the printed circuit board (PCB) to the electronic installation, and in order to the designing printed circuit board wiring diagram, this wiring software has a parts library, it is characterized in that, this through hole arranging system comprises:
Part is provided with module, in order to the wave-soldering carrier uncovered area of corresponding wave-soldering part to be set, for will be to this wave-soldering carrier uncovered area data storage that should the wave-soldering part to this parts library;
The zone is provided with module, when being used in this parts library, call this wave-soldering part, the data to wave-soldering carrier uncovered area that should the wave-soldering part according to being stored in this parts library forms the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area in printed circuit board wiring figure;
Rule is provided with module, in order to provide a through hole weld pad to lay rule the interface is set, so that through hole weld pad spacing rule in the restricted area and the through hole weld pad spacing rule outside the restricted area to be set; And
Processing module, when being used in this printed circuit board wiring figure, to lay the through hole weld pad by this wiring software, judge that this through hole weld pad coordinate is whether in this restricted area, if this through hole weld pad coordinate drops in this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule in this restricted area, if do not meet, in this restricted area, adjust the coordinate of this through hole weld pad, if this through hole weld pad coordinate drops on outside this restricted area, judge whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area, if do not meet, outside this restricted area, adjust the coordinate of this through hole weld pad.
2, through hole arranging system according to claim 1 is characterized in that, the through hole weld pad spacing rule in this restricted area comprises that this through hole weld pad that is laid in this restricted area and the distance between the conductor are more than or equal to a safe distance.
3, through hole arranging system according to claim 1 is characterized in that, the through hole weld pad spacing rule outside this restricted area comprises that this through hole weld pad that is laid in outside this restricted area and the distance between the conductor are more than or equal to a safe distance.
According to claim 2 or 3 described through hole arranging systems, it is characterized in that 4, this conductor is to be laid in this restricted area and one of them person of outer through hole weld pad, THMT weld pad, SMT weld pad and golden finger.
5, through hole arranging system according to claim 1 is characterized in that, this electronic installation is a computer.
6, a kind of through hole distribution method is applied to one and carries in the wiring software of the printed circuit board (PCB) to the electronic installation, and in order to the designing printed circuit board wiring diagram, this wiring software has a parts library, it is characterized in that, this through hole distribution method may further comprise the steps:
In this parts library, set up and store the wave-soldering carrier uncovered area data of corresponding wave-soldering part in advance;
Carrying out by this wiring software in the printed circuit board wiring figure design process, during this wave-soldering part in calling this parts library, according to stored to wave-soldering carrier uncovered area data that should the wave-soldering part, in printed circuit board wiring figure, form the restricted area that its housing overlaps with the housing of this wave-soldering carrier uncovered area;
Provide a through hole weld pad to lay rule the interface is set, so that through hole weld pad spacing rule in the restricted area and the through hole weld pad spacing rule outside the restricted area to be set; And
When in printed circuit board wiring figure, laying the through hole weld pad, judge that this through hole weld pad coordinate is whether in this restricted area, if, judge whether this through hole weld pad meets the through hole weld pad spacing rule in this restricted area,, in this restricted area, adjust the coordinate of this through hole weld pad if do not meet, if this through hole weld pad coordinate drops on outside this restricted area, judge then whether this through hole weld pad meets the through hole weld pad spacing rule outside this restricted area,, outside this restricted area, adjust the coordinate of this through hole weld pad if do not meet.
7, through hole distribution method according to claim 6 is characterized in that, the through hole weld pad spacing rule in this restricted area comprises that this through hole weld pad that is laid in this restricted area and the distance between the conductor are more than or equal to a safe distance.
8, through hole distribution method according to claim 6 is characterized in that, the through hole weld pad spacing rule outside this restricted area comprises that this through hole weld pad that is laid in outside this restricted area and the distance between the conductor are more than or equal to a safe distance.
According to claim 7 or 8 described through hole distribution methods, it is characterized in that 9, this conductor is to be laid in this restricted area and one of them person of outer through hole weld pad, THMT weld pad, SMT weld pad and golden finger.
10, through hole distribution method according to claim 6 is characterized in that, this electronic installation is a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101078154A CN101582094A (en) | 2008-05-14 | 2008-05-14 | Through hole arrangement system and through hole arrangement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101078154A CN101582094A (en) | 2008-05-14 | 2008-05-14 | Through hole arrangement system and through hole arrangement method |
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| Publication Number | Publication Date |
|---|---|
| CN101582094A true CN101582094A (en) | 2009-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101078154A Pending CN101582094A (en) | 2008-05-14 | 2008-05-14 | Through hole arrangement system and through hole arrangement method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172816A (en) * | 2017-06-20 | 2017-09-15 | 郑州云海信息技术有限公司 | A kind of method and system of establishment DIP types part encapsulation |
| CN109933832A (en) * | 2017-12-18 | 2019-06-25 | 瞻博网络公司 | It is generated using the printed circuit board gap information of the rule set based on parameter |
| CN113113322A (en) * | 2021-03-31 | 2021-07-13 | 上海华虹宏力半导体制造有限公司 | CUP through hole overlap correction method |
-
2008
- 2008-05-14 CN CNA2008101078154A patent/CN101582094A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172816A (en) * | 2017-06-20 | 2017-09-15 | 郑州云海信息技术有限公司 | A kind of method and system of establishment DIP types part encapsulation |
| CN107172816B (en) * | 2017-06-20 | 2020-03-06 | 郑州云海信息技术有限公司 | Method and system for creating DIP type part package |
| CN109933832A (en) * | 2017-12-18 | 2019-06-25 | 瞻博网络公司 | It is generated using the printed circuit board gap information of the rule set based on parameter |
| CN109933832B (en) * | 2017-12-18 | 2021-02-02 | 瞻博网络公司 | Printed circuit board void information generation using parameter-based rule sets |
| CN113113322A (en) * | 2021-03-31 | 2021-07-13 | 上海华虹宏力半导体制造有限公司 | CUP through hole overlap correction method |
| CN113113322B (en) * | 2021-03-31 | 2024-03-15 | 上海华虹宏力半导体制造有限公司 | CUP through hole overlapping correction method |
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Open date: 20091118 |