CN101504951A - Flat panel display and manufacturing method thereof - Google Patents
Flat panel display and manufacturing method thereof Download PDFInfo
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- CN101504951A CN101504951A CNA2009101260931A CN200910126093A CN101504951A CN 101504951 A CN101504951 A CN 101504951A CN A2009101260931 A CNA2009101260931 A CN A2009101260931A CN 200910126093 A CN200910126093 A CN 200910126093A CN 101504951 A CN101504951 A CN 101504951A
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- frit
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention discloses a flat panel display which comprises the following components: an insulating substrate which is provided with a display element, a covering substrate which faces the insulating substrate and is connected with the insulating substrate, frit which is formed along the edge between the insulating substrate and the covering substrate, and filling material which is positioned between the insulating substrate and the covering substrate and connects the insulating substrate with the covering substrate. The filling material comprises a first part which is spaced from the frit and covers the display element, and a second part which is positioned between the frit and the insulation substrate. Therefore, the invention provides the flat panel display which can minimize the oxygen and moisture flowing from outside.
Description
The application divides an application, and the application number of its original bill application is 200610137821.5, and the applying date is on November 1st, 2006, and denomination of invention is flat-panel monitor and manufacture method thereof.
The application requires the priority of the korean patent application No.2006-0084737 that submits in Korea S Department of Intellectual Property in korean patent application No.2006-0032881 that the korean patent application No.2005-0103745 that submitted in Korea S Department of Intellectual Property on November 1st, 2005, on April 11st, 2006 submit in Korea S Department of Intellectual Property and on September 4th, 2006, and its full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of flat-panel monitor and manufacture method thereof, more particularly, the present invention relates to make oxygen and minimized flat-panel monitor of moisture and the manufacture method thereof that flows into from the outside.
Background technology
In flat-panel monitor, Organic Light Emitting Diode (" OLED ") since its with low voltage drive, thin light, have wide viewing angle, have former thereby have some advantages than short response time etc.OLED comprise have gate electrode, the thin-film transistor (" TFT ") of source electrode and drain electrode.OLED also comprises the pixel electrode that is connected to TFT, with the separated partition wall of pixel electrode, be formed on the organic luminous layer on the pixel electrode between the partition wall and be formed on common electrode on the organic luminous layer.
Here, organic luminous layer is to moisture and oxygen sensitive.Therefore, moisture and oxygen are easy to reduce the performance and the useful life of organic luminous layer.In order to prevent the organic light emission degraded layer, to carry out and seal processing to form isolated substrate, it has the organic light emission laminar surface, and combines with covered substrate, to stop moisture and oxygen.In addition, form organic encapsulant along the edge between two substrates, thereby these two substrates are linked together.
Yet organic encapsulant has higher moisture permeability (that is, approximately every day 10g/m2).Therefore, must provide hydroscopic substance to remove the moisture that infiltrates in the inside of flat-panel monitor.In this conventional method, hydroscopic substance has increased manufacturing cost, and the moisture that infiltrates is easy to make the organic light emission degraded layer, thereby reduces the useful life and the performance of flat-panel monitor.
Summary of the invention
Therefore, the invention provides a kind of oxygen and minimized flat-panel monitor of moisture that flows into from the outside that make.
Another aspect of the present invention provides to make and can make from the oxygen of outside inflow and a kind of method of the minimized flat-panel monitor of moisture.
To partly set forth other aspects of the present invention and/or advantage in the following description, and from described description, can partly understand other aspects of the present invention and/or advantage, perhaps can understand other aspects of the present invention and/or advantage by practice of the present invention.
By providing a kind of flat-panel monitor can realize aforementioned and/or other aspects of the present invention, described flat-panel monitor comprise have the insulated substrate of establishing display element thereon, in the face of insulated substrate and the covered substrate that is connected with insulated substrate and the frit that forms along the edge between insulated substrate and the covered substrate.
According to another aspect of the present invention, flat-panel monitor also can comprise the heat transfer piece that forms along frit, and heat transfer piece can be inserted in the frit.Perhaps, heat transfer piece can be arranged between in frit and insulated substrate and the covered substrate at least one.In another alternative embodiment, heat transfer piece is arranged at least one side of frit.
Heat transfer piece can comprise at least one distribution (wiring line).Heat transfer piece can be arranged or arrange as net by zigzag.Perhaps, heat transfer piece can be configured as plate, such as it is configured as film with preset width.
Frit can have 0.1 millimeter to 5 millimeters in the scope width and the thickness in 5 microns to 3 millimeters scopes.
Frit can solidify by heating.
Heat transfer piece can have 50 microns to 5 millimeters in the scope thickness and the width in 5 microns to 5 millimeters scopes.
Perhaps, heat transfer piece can have 5 microns in 50 micrometer ranges thickness and the width in 0.1 millimeter to 5 millimeters scope.
Heat transfer piece can comprise at least a in nickel, tungsten, Kan Saer material and the alloy thereof.Frit and heat transfer piece alternately pile up to have sandwich construction.Heat transfer piece can be formed with and be used for oxidation resistant passivation layer, and wherein passivation layer can comprise inorganic layer, and described inorganic layer comprises at least a in oxide layer, nitration case and the pyrocarbon.
Insulated substrate can be equipped with holding wire, and at least one in frit and the heat transfer piece can be at least in part overlaps with holding wire, and the width of the heat transfer piece in the overlapping region can be different from the width of the heat transfer piece in the overlapping region not.The width of the heat transfer piece in the comparable not overlapping region of the width of the heat transfer piece in the overlapping region is narrow.
According to another aspect of the present invention, flat-panel monitor also can comprise and is inserted between insulated substrate and the covered substrate and with these two inserts that substrate links together, described inserts can comprise the first that separates and cover display element with frit, and is inserted in the second portion between frit and the insulated substrate.
In this embodiment, frit can have 100 microns thickness in 600 micrometer ranges, and frit can have 1g/m every day
2To 10g/m every day
2Moisture permeability (permeability).
Flat-panel monitor also can comprise the hydroscopic substance in the space that is located between frit and the first.Hydroscopic substance can be under preset distance with frit and first at least one separate, and can comprise at least a among calcium Ca and the barium Ba.
Flat-panel monitor also can comprise first inoranic membrane that is inserted between display element and the inserts, and can comprise second inoranic membrane and the auxiliary inserts that is inserted between inserts and the insulated substrate, wherein second inoranic membrane is placed on first inserts, and auxiliary inserts is placed between second inoranic membrane and the covered substrate.
First and second inoranic membranes can have the thickness of 100 nanometers to 3000 nanometers, and can have sandwich construction.
But face the surface complanation of the frit of insulated substrate.
By providing a kind of method of making flat-panel monitor can realize aforementioned and/or other aspects of the present invention, described method comprises to be prepared covered substrate, forms first frit along the edge of covered substrate, form heat transfer piece, form second frit and insulated substrate (described insulated substrate has display element) alignd with covered substrate and by make the curing of first and second frits to the heat transfer piece power supply on heat transfer piece along first frit.
This method makes the frit semi-solid preparation of winning before also can being included in and forming heat transfer piece.The step that makes the frit semi-solid preparation of winning can be under 100 ℃ to 250 ℃ temperature, carried out, and at least a in baking oven, heating plate and the laser can be used.
Perhaps, this method makes the frit semi-solid preparation of winning after also can being included in and forming heat transfer piece, wherein can be by carrying out the step that makes the frit semi-solid preparation of winning to the heat transfer piece power supply.In this embodiment, described method also can be included in the step that makes the frit semi-solid preparation of winning and make the frit complanation of winning with between insulated substrate and the step that covered substrate aligns.
Can form first and second frits by distribution method or method for printing screen.Can under 300 ℃ or higher temperature, carry out program curing.Can be by at least a formation heat transfer piece in sputtering method and the chemical vapour deposition (CVD).Can in vacuum chamber, carry out the alignment program of covered substrate and insulated substrate and the program curing of first and second frit.Heat transfer piece can receive high frequency power from the RF power source in program curing.
This method also can be included in and be formed for oxidation resistant passivation layer on the heat transfer piece.
By providing a kind of method of making flat-panel monitor also can realize aforementioned and/or other aspects of the present invention, described method comprise prepare covered substrate, form frit, solidify this frit along the edge of covered substrate, at covered substrate be formed with and form inserts at least one of insulated substrate of display element and after covered substrate and insulated substrate are linked together, solidify inserts.
This method also can be included in solidifies the feasible afterwards surface planarization facing the frit of insulated substrate of described frit.
Inserts can comprise with insulated substrate or covered substrate in the corresponding first of display element on any one, an and lip-deep second portion that is formed on frit.
This method is inserted hydroscopic substance before or after also can being included in and forming inserts between frit and first.
This method also can be included in and form first inoranic membrane that forms at least a portion that covers display element before or after the inserts.
By providing a kind of method of making flat-panel monitor also can realize aforementioned and/or other aspects of the present invention, described method comprises along the edge of insulated substrate and forms first frit; Edge along covered substrate forms second frit; The heat transfer piece that will have a cutting groove partly is arranged between first frit and second frit, insulated substrate is connected with covered substrate; By making first and second frits solidify to the heat transfer piece power supply; And cut described cutting groove.
Heat transfer piece can comprise main body and stretch out and be formed with the cutting part of cutting groove from main body, and carry out the step that connects insulated substrate and covered substrate under the state that the heat transfer piece mode between first frit and second frit that is inserted in main body is arranged.
The step of solidifying first and second frits can comprise that power supply is to heat heat transfer piece in 300 ℃ to 700 ℃ temperature range.
Heat transfer piece can have rectangular plate shape.
Description of drawings
From below in conjunction with the description of accompanying drawing to embodiment, above-mentioned and/or others of the present invention and advantage will become apparent and be more readily understood.In the accompanying drawing:
Fig. 1 shows the perspective view of the structure of the representative flat panel display of first exemplary embodiments according to the present invention;
Fig. 2 is the cross sectional view along the representative flat panel display of the intercepting of the line II-II among Fig. 1;
Fig. 3 is the enlarged perspective of part " A " among Fig. 1;
Fig. 4 shows the perspective view of the structure of the representative flat panel display of second exemplary embodiments according to the present invention;
Fig. 5 shows the perspective view of the structure of the representative flat panel display of the 3rd exemplary embodiments according to the present invention;
Fig. 6 shows the perspective view of the structure of the representative flat panel display of the 4th exemplary embodiments according to the present invention;
Fig. 7 shows the perspective view of the structure of the representative flat panel display of the 5th exemplary embodiments according to the present invention;
Fig. 8 shows the cross sectional view of the representative flat panel display of the 6th exemplary embodiments according to the present invention;
Fig. 9 is the plan view of the representative flat panel display of the 7th exemplary embodiments according to the present invention;
Figure 10 A shows the perspective view of the structure of the representative flat panel display of the 8th exemplary embodiments according to the present invention, and Figure 10 B is the enlarged perspective of part B among Figure 10 A;
Figure 11 is the cross sectional view along the representative flat panel display of the intercepting of the line XI-XI among Figure 10;
Figure 12 shows the cross sectional view of the structure of the representative flat panel display of the 9th exemplary embodiments according to the present invention;
Figure 13 shows the cross sectional view of the structure of the representative flat panel display of the tenth exemplary embodiments according to the present invention;
Figure 14 shows the cross sectional view of the structure of the representative flat panel display of the 11 exemplary embodiments according to the present invention;
Figure 15 shows the perspective view of the structure of the representative flat panel display of the 12 exemplary embodiments according to the present invention;
Figure 16 is the cross sectional view along the representative flat panel display of the intercepting of the line XVI-XVI among Figure 15;
Figure 17 is the enlarged perspective of part " D " among Figure 15;
Figure 18 A shows the decomposition diagram of the representative flat panel display of the 12 exemplary embodiments according to the present invention; And Figure 18 B is the enlarged perspective of part E among Figure 18 A;
Figure 19 A to Figure 19 E shows the typical method of manufacturing representative flat panel display of first exemplary embodiments according to the present invention;
Figure 20 A to Figure 20 G shows the typical method of manufacturing representative flat panel display of the 8th exemplary embodiments according to the present invention;
Figure 21 A to Figure 21 F shows the typical method of manufacturing representative flat panel display of the 12 exemplary embodiments according to the present invention; And
Figure 22 A to Figure 22 C shows another typical method of the representative flat panel display of manufacturing the 13 exemplary embodiments according to the present invention.
Embodiment
Below, with reference to the accompanying drawing that example of the present invention is shown the present invention is described more fully.Yet the present invention can implement with different ways, and the embodiment that should not be limited to here to be set forth constructs.Certainly, provide these embodiment, be in order to make this announcement, and give full expression to scope of the present invention to those skilled in the art more comprehensively with complete.Same numeral is represented similar elements in the accompanying drawing.
Be appreciated that when point out an element another element " on " time, can perhaps can there be intermediary element in it between the two directly on another element.On the contrary, when pointing out that an element " directly " is on another element, just there is not intermediary element between the two.As used herein, term " and/or " comprise any or its all combinations in one or more relevant listed clauses and subclauses.
Although be appreciated that can use the term first, second, third, etc. to wait describes various elements, parts, zone, layer and/or part here, these elements, parts, zone, layer and/or part should not be limited to these terms.These terms only are used for an element, parts, zone, layer or part and another element, parts, zone, layer or part are made a distinction.Therefore, under the prerequisite that does not deviate from aim of the present invention, below first element, parts, zone, layer or the part discussed may also be referred to as second element, parts, zone, layer or part.
Here employed term only is used to describe the purpose of specific embodiment, and is not limited to the present invention.As used herein, if context does not clearly indicate, singulative " a " " an " and " the " also can comprise plural form.It is also understood that, when term " contains (comprises and/or comprising) " or " comprising (include and/or including) " when being used for this specification, show to have described feature, zone, integral body, step, operation, element and/or parts, do not exist or the additional group that one or more further features, zone, integral body, step, operation, element, parts and/or its formation are arranged but do not get rid of.
For convenience of description, here can the usage space relational terms, for example " ... under ", " below ", " following ", " in ... top ", " top " and similar term, to describe element shown in the accompanying drawing or feature relation for another (a plurality of) element or feature.Be appreciated that the spatial relationship term except the orientation shown in the accompanying drawing, can also comprise the different azimuth of device in use or the operation.For example, if with the device in accompanying drawing upset, so another element or feature " below " or the element of " below ", its orientation will become another element or feature " above ".Therefore, above exemplary term " below " can comprise and following two orientation.Device can be in other orientation (revolve turn 90 degrees or in other orientation), and employed here spatial relationship is described and can be done corresponding explanation.
Unless specialize, employed here all terms (comprising technical term and scientific and technical terminology) have the implication identical with one of ordinary skill in the art's of the present invention common sense.It is also understood that, term, for example those terms of common dictionary definition should be interpreted as having and they consistent implications of implication in correlation technique and context of the present disclosure, and should not be interpreted as Utopian or too formal implication, unless defined especially here.
With reference to cross-sectional view embodiments of the invention are described below as the schematic diagram of desirable embodiment of the present invention.Equally, can expect the diagrammatic sketch variation in shape that causes such as manufacturing technology and/or tolerance.Therefore, embodiments of the invention should not be configured to be confined to the given shape in the zone shown in this, but comprise for example owing to making the deviation in shape that causes.For example, be shown or be described as smooth zone, may have coarse and/or nonlinear characteristic usually.In addition, shown wedge angle may be fillet.Therefore, the zone that illustrates in the drawings is actually schematically, and its shape is not used for describing the accurate shape in zone, also is not used for limiting scope of the present invention.
Below, describe embodiments of the invention with reference to the accompanying drawings in detail.For example, will describe the Organic Light Emitting Diode (" OLED ") in the various flat-panel monitors below, but the invention is not restricted to this.Replacedly, the present invention can be applied to other flat-panel monitor, such as LCD (" LCD "), Plasmia indicating panel (" PDP ") etc.In the following embodiments, adopt a kind of as in the various sealants of frit (frit), but the invention is not restricted to this.Replacedly, can use any sealant, as long as it is by hot curing, and it has lower permeability for moisture or oxygen.
Fig. 1 shows the perspective view of the structure of the representative flat panel display of first exemplary embodiments according to the present invention, and Fig. 2 is the cross sectional view along the representative flat panel display of the intercepting of the line II-II among Fig. 1, and Fig. 3 is the enlarged perspective of part " A " among Fig. 1.
As shown in Figure 1 to Figure 3, the OLED 1 of first exemplary embodiments comprises according to the present invention: insulated substrate 100, and it is provided with the display element 110 of display image; Covered substrate 120, towards and combine with insulated substrate 100, and prevent that oxygen or moisture from entering in the display element 110; Frit 130, it forms along the edge between insulated substrate 100 and the covered substrate 120; And heat transfer piece 140, it forms along frit 130.
Frit 130 has the thickness d 2 of width d1 and the 5 μ m to 3mm of 0.1mm to 5mm.If the width d1 of frit 130 is less than 0.1mm, the bond strength between two substrates 100 and 120 will weaken and defectiveness so.If the width d1 of frit 130 less than 0.1mm, also is difficult to use distribution method or method for printing screen forms frit 130.On the other hand, if the width d1 of frit 130 greater than 5mm, the area of frit 130 is will be too big and can not pass through heat transfer piece 140 full solidification so.In this case, flat-panel monitor can not prevent the influence of heat and moisture fully.Simultaneously, if the thickness d 2 of frit 130, will be difficult to use distribution method so less than 5 μ m or method for printing screen forms frit 130, and defective combination may appear.On the other hand, if the thickness d 2 of frit 130 greater than 3mm, frit 130 can not pass through heat transfer piece 140 full solidification so, and also be difficult to do flat-panel monitor thinner.For example, frit 130 has the thickness d 2 of width d1 and 100 μ m to the 600 μ m of 1mm to 2mm.Here, the width d1 of frit 130 and thickness d 2 can increase with the size of flat-panel monitor or reduce pro rata.
Frit 130 can comprise cohesive powders glass, such as SiO
2, TiO
2, PbO, PbTiO
3, Al
2O
3Or the like.This type of frit 130 has low-down permeability for moisture and oxygen, thereby can prevent that the organic luminous layer in the display element 110 is destroyed, and does not need water absorbing agent.In addition, frit 130 has can stand enough durability (durability) that vacuum is installed, and makes OLED 1 to make in vacuum chamber, thereby will be from the near minimum of the performance of external penetration oxygen and moisture.Therefore, increase the operating period of flat-panel monitor, and improved its performance.Here, frit 130 is thermosettings, but the invention is not restricted to this.Replacedly, frit 130 can be thermoplastic.
Frit 130 can at high temperature solidify.Therefore, laser can act locally on frit 130, thus curing glass material 130.But, in the method for using laser, laser scanning needs higher technology, bubble occurs in frit 130, because the difference of thermal coefficient of expansion makes bonding difficult between the variety classes substrate, and laser may cause metal wiring (such as gate line and data wire) to have defective.Simultaneously, will can use with frit 130 by the organic encapsulant of light or hot curing.When organic encapsulant and frit 130 use together, compare with the situation of only using sealant, can obtain good effect.Yet, in this case, owing to the processing cost of using sealant to cause is higher relatively, and owing to the problems referred to above of using laser to cause still may occur.
For fear of the problems referred to above occurring, according to an exemplary embodiment of the present invention, be provided for applying the element of heat to frit 130 parts along frit 130, and to this element supplying energy, thereby make it produce heat.For example, as shown in Figure 1 to Figure 3, form heat transfer piece 140 along frit 130, and to these heat transfer piece 140 supplying energies, thereby curing glass material 130.Referring to figs. 1 through Fig. 3, heat transfer piece 140 is inserted into the inside of frit 130.Heat transfer piece 140 can comprise many distributions, such as being arranged to parallel to each other but unshowned heated filament (hotwire).In addition, heat transfer piece 140 has the relative end (will be discussed in more detail below) that is connected to power supply 150.When power supply 150 during to heat transfer piece 140 power supply, heat transfer piece 140 produces heats with curing glass material 130.That is to say that when to heat transfer piece 140 supply electric power, the internal resistance of heat transfer piece 140 produces heat, thus curing glass material 130.Here, heat transfer piece 140 comprise following one of at least: nickel, tungsten, its alloy of Kan Saer material (kanthal), and can form by sputtering method or chemical vapour deposition (CVD) (" CVD ") method.In addition, heat transfer piece 140 can be coated with passivation layer, and is oxidized to prevent heat transfer piece 140.Here, passivation layer can be an inorganic material, comprises at least a in oxide layer, nitration case and the pyrocarbon (pyrocarbon).And heat transfer piece 140 is heat conduction.Simultaneously, frit 130 and heat transfer piece 140 can alternately pile up, to have sandwich construction.In other words, heat transfer piece 140 can be formed on more than in one the layer, and frit 130 is formed between the layer of heat transfer piece 140.
In addition, heat transfer piece 140 can have the width d4 of 5 μ m to 5mm.If width d4 is less than 5 μ m, so from the angle of resistance, heat transfer piece 140 may short circuits, and it will be difficult to produce 300 ℃ or higher temperature, and will be difficult to local solidification frit 130, thereby cause defective bonding.On the other hand, if width d4 greater than 5mm, it will be difficult to make thin flat-panel monitor, and the interior metal distribution of display element 110 may be destroyed by the heat of excessive temperature.
For curing glass material 130 more effectively, preferably, the width d1 and the thickness d 2 of the thickness d 3 of heat transfer piece 140 and width d4 and frit 130 are formed in proportion to.
Two ends of heat transfer piece 140 all are connected to power supply 150.Power supply 150 is not included among the OLED 1, and power supply 150 disconnects with OLED 1 after the electric power that is used for curing glass material 130 to heat transfer piece 140 supplies.Usually, power supply 150 can be realized by well-known equipment.And radio frequency (" the RF ") power supply of supply High frequency power can be used as power supply 150.
Below, with reference to the flat-panel monitor of Fig. 4 to Fig. 8 description second to the 6th exemplary embodiments according to the present invention, in the accompanying drawing, second to the 6th embodiment shows the different shape of heat transfer piece 140.To the difference of comparing with first embodiment only be described.Therefore, components identical refers to identical label, and will save repeatability in case of necessity and describe.
Fig. 4 shows the perspective view of the structure of the representative flat panel display of second exemplary embodiments according to the present invention.As shown in FIG., heat transfer piece 140 is arranged to zigzag or sinuous shape.Here, the width of frit 130 and heat transfer piece 140 and thickness can with first exemplary embodiments in identical.Because heat transfer piece 140 forms with zigzag, so heat can put on frit 130 equably, thus full solidification frit 130.Therefore, make the bonding minimum of defective between two substrates 100 and 120.In addition, provide a kind of and can make oxygen and the minimum flat-panel monitor of moisture that flows into from the outside.
Fig. 5 shows the perspective view of the structure of the representative flat panel display of the 3rd exemplary embodiments according to the present invention.As shown in FIG., heat transfer piece 140 forms netted, has mesh portion intersected with each other.Here, the width of frit 130 and heat transfer piece 140 and thickness can be basically with first exemplary embodiments in identical.Because heat transfer piece 140 forms net-like pattern on frit 130, so heat can put on frit 130 equably, thus full solidification frit 130.Therefore, make the bonding minimum of defective between two substrates 100 and 120.In addition, provide a kind of and can make oxygen and the minimum flat-panel monitor of moisture that flows into from the outside.
Fig. 6 shows the perspective view of the structure of the representative flat panel display of the 4th exemplary embodiments according to the present invention.As shown in FIG., heat transfer piece 140 forms and has the tabular of preset width.Here, the width of heat transfer piece 140 can be less than or equal to the width of frit 130, and the thickness of frit 130 and heat transfer piece 140 can be basically with first exemplary embodiments in identical.Because it is tabular that heat transfer piece 140 forms on frit 130, so heat can put on frit 130 equably, thus full solidification frit 130.Therefore, make the bonding minimum of defective between two substrates 100 and 120.In addition, provide a kind of and can make oxygen and the minimum flat-panel monitor of moisture that flows into from the outside.
Fig. 7 shows the perspective view of the structure of the representative flat panel display of the 5th exemplary embodiments according to the present invention.As shown in FIG., heat transfer piece 140 forms film shape, and can form multilayer in frit 130.For example, heat transfer piece 140 can have the thickness of 5 μ m to 50 μ m.If the thickness of heat transfer piece 140 is less than 5 μ m, it will not only be difficult to form heat transfer piece 140 so, and be difficult to produce 300 ℃ or higher temperature from the resistance angle.On the other hand, if the thickness of heat transfer piece 140 greater than 50 μ m, it will not be a film so.Consider that from the viewpoint of resistance the width d4 of film heat transfer piece 140 should for example, be 0.1mm to 5mm greater than the width among first embodiment.As shown in Figure 7, film heat transfer piece 140 can be at least one the relative lateral surface and inner formation of frit 130.Here, heat transfer piece 140 can form by sputter side or chemical vapour deposition (CVD) (" CVD ") method.Because heat transfer piece 140 forms film shape, so heat can put on frit 130 equably, thus full solidification frit 130.In addition, provide a kind of and can make oxygen and the minimum flat-panel monitor of moisture that flows into from the outside.
Fig. 8 shows the cross sectional view of the representative flat panel display of the 6th exemplary embodiments according to the present invention.As shown in Figure 8, heat transfer piece 140 is between between insulated substrate 100 and the frit 130 and between covered substrate 120 and frit 130.That is to say that heat transfer piece 140 at first forms along the edge of two substrates 110 and 120, to be formed with frit 130, then between heat transfer piece 140 and form frit 130 on every side.Here, width d1, the d4 of frit 130 and heat transfer piece 140 and thickness d 2, d3 can be basically with first exemplary embodiments in identical.Therefore, heat can put on frit 130 equably, thus full solidification frit 130.In addition, provide a kind of and can make oxygen and the minimum flat-panel monitor of moisture that flows into from the outside.Replacedly, heat transfer piece 140 can only be arranged between insulated substrate 100 and the frit 130, perhaps only is arranged between covered substrate 120 and the frit 130.
The flat-panel monitor of the 7th exemplary embodiments according to the present invention is described with reference to Fig. 9.In the 7th exemplary embodiments, frit 130 and heat transfer piece 140 are applied to as the typical OLED shown in the flat-panel monitor typical case.Fig. 9 is the diagrammatic plan view as one type typical OLED of flat-panel monitor.
With reference to Fig. 9, the viewing area B of flat-panel monitor comprises: many gate lines 210, and along continuous straight runs, first direction extend; Many data wires 220 vertically, the second direction that is substantially perpendicular to first direction extends, and intersect with gate line 210 and define pixel; Many drive voltage line 230 are arranged to parallel with data wire 220; A plurality of pixel TFT are formed in the zone that gate line 210 and data wire 220 intersect; And a plurality of drive TFT, be formed at the zone that gate line 210 and drive voltage line 230 are intersected.Here, gate line 210, data wire 220, common voltage bar 280 and output end 240 and 250 holding wires as transmission signals.
In addition, at least one side at the non-display area C of flat-panel monitor is provided with gate driver circuit that is connected to gate line 210 ends and the data drive circuit that is connected to data wire 220 ends.Here, gate driver circuit and data drive circuit are respectively to the various drive signals of gate line 210 and data wire 220 supplies from the outside.As the connection type between gate driver circuit and the data drive circuit, can be glass top chip (chip on glass, " COG ") (wherein driver is directly installed on the substrate), carrier band encapsulation (tape carrierpackage, " TCP ") chip (chip on film, " COF ") (wherein driver is installed and then invested on the drive circuit substrate) on (wherein drive circuit invests or is installed on the polymeric membrane), the film, or the like.In the B of viewing area, gate line 210 and data wire 220 extend towards the outside, and are connected to gate driver circuit and data drive circuit by gate pads (not shown) and data pads (not shown) respectively.Simultaneously, at least one grid output end 240 and at least one data output end portion 250 be respectively formed between gate line 210 and the gate driver circuit and data wire 220 and data drive circuit between join domain in.In grid and data output end portion 240,250, gate line 210 and data wire 220 have narrower interval respectively betwixt.
Non-display area C comprises: driving voltage bar (driving voltage bar) 260 is connected to each drive voltage line 230 1 end; And at least one driving voltage pad 270, apply driving voltage to driving voltage bar 260.Drive voltage line 230 receives electric power by driving voltage bar 260 and driving voltage pad 270 from the outside, and drive TFT is given in this supply of electric power.Drive TFT applies predetermined voltage to pixel electrode, thus can be in organic luminous layer transporting holes and electronics.In addition, each pixel electrode comprises organic luminous layer, with response from voltage that pixel electrode was applied and luminous.Common voltage bar 280 is arranged on a side relative with the grid of gate line 210 output end 240, but is not limited thereto.Replacedly, common voltage bar 280 can be arranged on a side relative with the data output end portion 250 of data wire 220.In addition, common voltage bar 280 can be arranged on grid output end 240 and data output end portion 250 one of at least in.Here, common voltage bar 280 is electrically connected to common electrode, putting on viewing area B fully, thereby applies common voltage to common electrode.
According to the 7th exemplary embodiments of the present invention, frit 130 can overlap with driving voltage bar 260 or driving voltage pad 270 at least in part.In addition, frit 130 can be at least in part together electricity consumption press strip 280 overlap.And frit 130 can overlap with one of grid output end 240 and data output end portion 250 at least in part.
That is to say the common voltage bar 280 that insulated substrate 100 is provided with common electrode and is used for applying to common electrode voltage.Frit 130 has the zone that electricity consumption press strip together 280 overlaps, and this zone can have and the different width of width in the zone of electricity consumption press strip 280 overlappings together not, so as with interaction (electrical interference) minimum of common voltage.For example, comprise the frit 130 of metallic particles, perhaps metal heat transfer spare 140 narrows down in the zone that electricity consumption press strip 280 overlaps together, thereby has advantageously reduced interaction (or electrical interference).In addition, be formed with many gate lines 210 and grid output end 240 on insulated substrate 100, the interval in grid output end 240 between the gate line 210 narrows down.Heat transfer piece 140 can have and the different width of width of not exporting the zone of end 240 overlappings with grid with frit 130.For example, comprise the frit 130 of metallic particles, perhaps metal heat transfer spare 140 narrows down in the zone that overlaps with grid output end 240, thereby has advantageously reduced interaction (or electrical interference).
The representative flat panel display of the 8th exemplary embodiments according to the present invention is described with reference to Figure 10 A, 10B and Figure 11.The 8th exemplary embodiments relates to a kind of hermetically-sealed construction of OLED, and the sealing structure is different with first exemplary embodiments, specifically, relates to a kind of hermetically-sealed construction that uses frit to seal OLED.In the 8th exemplary embodiments, will only describe the feature different, and describe for the abridged with first exemplary embodiments, can be with reference to first exemplary embodiments or known structure.For convenience, identical label is represented components identical.
Figure 10 A shows the perspective view of the structure of the representative flat panel display of the 8th exemplary embodiments according to the present invention; Figure 10 B is the enlarged perspective of the part B among Figure 10 A; Figure 11 is the partial view along the intercepting of the line XI-XI among Figure 10 A of representative flat panel display.
Be placed on according to the frit 130 of the 8th exemplary embodiments of the present invention in the perimeter of not display image of display element 110.The width of frit 130 is d1 (0.1mm to 5mm), and thickness is d2 (5 μ m to 3mm).If the width d1 of frit less than 0.1mm, then is difficult to use distribution method, method for printing screen, narrow slit applies (slit-coating) method or rolling applies (roll-printing) method, to form frit 130.On the other hand, if the width d1 of frit greater than 5mm, then external margin becomes bigger, and does not have anything to be used for overcoming described shortcoming.Simultaneously, if the thickness d 2 of frit 130 less than 5 μ m, then will be difficult to use distribution method, method for printing screen, narrow slit painting method or rolling painting method, to form frit 130.On the other hand, if the thickness d 2 of frit 130 greater than 3mm, then will be unsuitable for making flat-panel monitor.For example, the width d1 of frit 130 is 1mm to 2mm, and thickness d 2 is 100 μ m to 600 μ m, but the exemplary embodiments of frit 130 is not limited thereto.Replacedly, the width d1 of frit 130 and thickness d 2 can and reduce by the proportional increase of the size of flat-panel monitor.
A surface in the face of insulated substrate 100 of frit 130 can be processed to the plane by glossing.Therefore, the top surface of frit 130 is being improved aspect planarization and the uniformity, thereby has strengthened bonding uniformity and bonding effect between two substrates 100 and 200.
And frit 130 has the low-down permeability for moisture and oxygen, for example about 1g/m
2Every day is to 10g/m
2Every day, thus this can be avoided the organic light emission degraded layer of display element 110 inside.And frit 130 is formed on the covered substrate 120, and then is cured combining with insulated substrate 100, thereby reduced the defective that causes owing to curing glass material 130 caused high temperature.Here, frit 130 can be cured by laser or by heated filament or with the contacted baking oven of heated filament.Preferably, frit 130 can be thermoplastic.
A kind of method that inserts 160 can pass through in distribution method, method for printing screen, narrow slit painting method or the rolling painting method forms.The size of the width in space 161 is provided with fully to form hydroscopic substance (moisture absorber) 170 within it.For example, hydroscopic substance 170 comprises melamine (melamine) resin, urea (urea) resin, phenol (phenol) resin, resorcinol (resorcinol) resin, epoxy (epoxy) resin, unsaturated polyester (UP) (unsaturated polyester) resin, polyethylene (poly urethane) resin, acrylic acid (acrylic) resin etc., but is not limited only to this.
With reference to accompanying drawing 12 to 14, will the flat-panel monitor of the 9th to the 11 exemplary embodiments according to the present invention be described.The the 9th to the 11 exemplary embodiments relates to the flat-panel monitor with the hermetically-sealed construction that is different from the 8th embodiment.In the 9th to the 11 exemplary embodiments, will only describe the characteristics different, and, can omit known structure simultaneously possibly with reference to the 8th embodiment with the 8th embodiment.For example, same numeral is represented similar elements.
Figure 12 shows the perspective view of the structure of the representative flat panel display of the 9th exemplary embodiments according to the present invention.Different with the 8th exemplary embodiments, in the 9th exemplary embodiments, do not provide as shown in figure 11 space 161 and hydroscopic substance 170, and inserts 160 extends partly between frit 130 and insulated substrate 100 along the direction of arrow.According to the present invention, frit 130 has excellent durability and for the low-down permeability of moisture, thereby makes the permeability of moisture and oxygen drop to minimum reliably, and need not to use hydroscopic substance 170.When not needing to use hydroscopic substance 170 in this embodiment, production cost has reduced.Here, when insulated substrate 100 or covered substrate 120 were subjected to pushing, the inserts 160 that is arranged on insulated substrate 100 or the covered substrate 120 was filled between frit 130 and the insulated substrate 100, thereby has formed flat-panel monitor, as shown in figure 12.Therefore, provide production cost that reduce and oxygen and the minimized flat-panel monitor of moisture that introduce from the outside.
Figure 13 shows the perspective view of the structure of the representative flat panel display of the tenth exemplary embodiments according to the present invention.As shown in figure 13, first inoranic membrane 180 is formed between display element 110 and the inserts 160.First inoranic membrane 180 can also extend between insulated substrate 100 and the frit 130 and between hydroscopic substance 170 and the space 161.The thickness d 6 of first inoranic membrane 180 is about 100nm to 3000nm, and insulation single or multiple lift structure.Under the situation of sandwich construction, corresponding layer can be made or be formed by distinct methods by different materials.Therefore, provide first inoranic membrane 180 that comprises impermeable inorganic material, thereby protection display element 110 is avoided the infringement of moisture and oxygen with excellent blocks moisture characteristic and moisture.
Figure 14 is the perspective view according to the structure of the flat-panel monitor of the 11 exemplary embodiments of the present invention.As shown in figure 14, inserts 160 and additional inserts 165 are arranged between insulated substrate 100 and the covered substrate 120, and second inoranic membrane 185 is arranged between inserts 160 and the additional inserts 165.Be set on covered substrate 120 and the additional inserts 165 and after second inoranic membrane 185 was set on the insulated substrate 100, two substrates 100 and 120 were bonded to each other at inserts 160.Replacedly, inserts 160, second inoranic membrane 185 and additional inserts 165 sequentially are formed on in insulated substrate 100 and the covered substrate 120 one, and then this substrate combines with another substrate.Identical with first inoranic membrane 180 shown in Figure 13, the thickness of second inoranic membrane 185 can be about 100nm to 3000nm, and has the single or multiple lift structure.In addition, the same with the tenth exemplary embodiments in the 11 exemplary embodiments, though be not illustrated, first inoranic membrane 180 also can be configured to cover display element 110.Thereby, a kind of flat-panel monitor that makes the moisture from the outside be subjected to effectively stopping is provided.
The representative flat panel display that to describe according to the 12 exemplary embodiments of the present invention with reference to accompanying drawing 15 to 18B.The 12 exemplary embodiments relates to the hermetically-sealed construction that is different from first exemplary embodiments of OLED, relates more specifically to use frit to seal the hermetically-sealed construction of OLED.In the 12 exemplary embodiments, will describe the characteristics different, and will perhaps omit known structure with reference to first exemplary embodiments with first exemplary embodiments.For example, same numeral is represented similar elements.
Shown in Figure 15 to 17, comprise first frit 130a that contacts with insulated substrate 100 and the second frit 130b that contacts with covered substrate 120 according to the frit 130 of the 12nd embodiment of the present invention.The first and second frit 130a, 130b can provide a kind of method in method for printing screen, distribution method and dipping (dipping) method and form.The width d1 of each among the first and second frit 130a, the 130b is 0.1mm to 5mm, and thickness d 2 is 5 μ m to 3mm.The scope of width and thickness makes two substrates stably combine and brings advantage for OLED 1.
Shown in Figure 15 to 18B, heat transfer piece 140 is inserted in the frit 130.
With reference to Figure 18 A and 18B, heat transfer piece 140 is a rectangle substantially, and comprises first daughter board (sub-plate) 140a, the second daughter board 140b, the 3rd daughter board 140c and the 4th daughter board 140d.Each daughter board 140a, 140b, 140c, 140d comprise main body 141 between the first and second frit 130a, the 130b that is inserted into frit 130 and the cutting part 142 that leaves frit 130 and thickness minimizing from main body 140 extensions.That is, the thickness on the end of cutting part 142 is less than the thickness d 7 of main body 141.And, cutting part 142 vertically be along each the long limit among first to fourth daughter board 140a, 140b, 140c, the 140d.Below will be by for the purpose of setting forth the described structure of heat transfer piece 140 according to the description of the manufacture process of the flat-panel monitor of the 12 exemplary embodiments.
The thickness d 7 of main body 141 is 10 μ m to 1000 μ m, and the thickness d 8 at place, cutting part 142 ends is 30% to 80% of thickness d 7.If the thickness d 7 of main body 141 is less than 10 μ m, then it is unsuitable for being used for the radiation heating of curing glass material.For curing glass material 130, need 300 ℃ or higher temperature.Therefore, if the thickness d 7 of body 141 less than 10 μ m, then may be short-circuited when the high pressure effect is on it, and it is unsuitable for the heat of 300 ℃ of radiation or higher temperature.And, if the thickness d 7 of main body 141 less than 10 μ m, frit 130 can't fully be cured, thereby causes defective bonding.On the other hand, if the thickness d 7 of main body 141 greater than 1000 μ m, then will be difficult to suitably make display compact.And, if the thickness d 7 of main body 141 greater than 1000 μ m, the heat of 700 ℃ or higher overtemperature can act on the main body 141, and the interior metal distribution of display element 110 can be subjected to the influence of heat, thereby causes defective.Wherein, the gate line of interior metal distribution or data wire can comprise aluminium, and heat of high temperature can change the resistance of gate line or data wire, because the fusing point of aluminium is lower.Therefore, vision signal may be transmitted singularly, thereby can demonstrate the image that is not hoped.The long limit of heat transfer piece 140 is set to have the length with the same length of insulated substrate 100.In other words, the long limit of heat transfer piece 140 can approximate greatly, greater than or less than the limit of insulated substrate 100.And the minor face L1 of heat transfer piece 140 is greater than the width d1 of frit 130.
Therefore, for curing glass material 130 preferably, the thickness d 7 of main body 141 and length L 1 are formed in proportion to the width d1 and the thickness d 2 of frit 130.
With reference to accompanying drawing 19A to 19E the method for making representative flat panel display according to an exemplary embodiment of the present invention will be described.Figure 19 A to 19E shows the partial view according to the typical manufacture method of first exemplary embodiments of the present invention.
At first, shown in Figure 19 A, provide covered substrate 120.The same with the situation of insulated substrate 100, covered substrate 120 is made by glass and plastic base.Replacedly, covered substrate 120 can be made by soda lime glass substrate, borosilicate glass substrate, silicate glass substrate and lead glass etc.The thickness of covered substrate 120 can be 0.1mm to 10mm, more preferably is 1mm to 10mm, and thickness prevents that moisture or oxygen from penetrating into display element 110 by covered substrate 120 so that have sufficiently.And, can on covered substrate 120, form the barrier layer (not shown) by spray method, this barrier layer comprises SiON, SiO
2, SiN
x, Al
2O
3Deng.Here, the barrier layer prevents that oxygen or moisture are introduced into from the outside.
With reference to Figure 19 B, the first frit 130a forms along the edge of covered substrate 120.The first frit 130a can form by distribution method or method for printing screen.Such frit 130a comprises bonding glass dust, as SiO
2, TiO
2, PbO, PbTiO
3, Al
2O
3Deng.And frit 130a has the low-down permeability for moisture and oxygen, thereby has prevented the degeneration of the organic luminous layer of display element inside, and does not need hydroscopic substance (water getter).And the first frit 130a has enough durabilities and installs to bear vacuum, thereby OLED can be manufactured in vacuum tank, and this is reduced to minimum with oxygen and moisture from the permeability of outside.The width d1 of the first frit 130a is 0.1mm to 5mm, and thickness d 2 is 5 μ m to 3mm.Such scope is set to make two substrates 100 and 120 stably combine togather and has above-mentioned advantage.
Then, the first frit 130a is by semi-solid preparation, thereby impurity in being contained in the first frit 130a and the bubble that produces when solidifying are removed.Semi-solid preparation technology is to carry out under 100 ℃ to 250 ℃ temperature.And baking oven and heat dish can be used for semi-solid preparation technology.Replacedly, laser can be used for semi-solid preparation technology.This process is an optics, but helps improving the performance and the life-span of product.After semi-solid preparation technology, can additionally carry out planarization process, to remove the bubble that produces among the first frit 130a and to strengthen adhesiveness for insulated substrate 100 with display element 110 for the first frit 130a.
With reference to Figure 19 C, heat transfer piece 140 forms along the first frit 130a.Heat transfer piece 140 is the distributions such as heated filament, and can be made into linear, zigzag, netted, sheet, film etc.In Figure 19 C, heat transfer piece 140 typically forms distribution or sheet.In this example, the thickness d 3 of heat transfer piece 140 is 50 μ m to 5mm, and width is 5 μ m to 5mm.It is for the angle from resistance improves the frit 130a that is cured, the temperature of 130b that such scope is set, and with the bonding minimum of reducing to of defective.And, this scope is set makes that flat-panel monitor is very thin and make the defective in the metal wiring minimize.
Here, heat transfer piece 140 comprises at least a in nickel, tungsten, kanthalsuper (kanthal) and the alloy thereof, and forms by sputtering method or CVD method.And heat transfer piece 140 can conduct electricity.As shown in Figure 1, the two ends of heat transfer piece 140 are connected on the power supply 150.When power supply 150 during to heat transfer piece 140 power supply, heat transfer piece 140 produces heat and curing glass material 130.In addition, heat transfer piece 140 can be passivated layer (not shown) and cover, and is oxidized to prevent heat transfer piece 140.Here, passivation layer can be at least a inorganic material that comprises in oxide layer, nitration case and the pyrocarbon.
Wherein when using baking oven, heat dish and laser to have any problem, perhaps when under the situation of the first frit 130a at no separator during by semi-solid preparation, the heat transfer piece 140 that is arranged on first frit 130 can be used for the first frit 130a is carried out semi-solid preparation.In this case, after forming the first frit 130a, heat transfer piece 140 forms along the first frit 130a, and then is connected to power supply 150, as shown in Figure 1, thus can semi-solid preparation frit 130a.
With reference to Figure 19 D, the second frit 130b is formed on the heat transfer piece 140.The second frit 130b can and form under identical condition by the method identical with the first frit 130a.
With reference to Figure 19 E, the insulated substrate 100 that is provided with display element 110 is incorporated in to covered substrate 120, then when pushing two substrates 100 and 120, power to heat transfer piece 140 by means of power supply 150, thus curing glass material 130a, 130b.Preferably, curing process carries out under 400 ℃ or higher temperature so that fully curing glass material 130a, 130b.And, heat transfer piece 140 can two substrates 100 and 120 combine before or after be connected to power supply 150.Preferably, in vacuum tank, carry out, and pressure wherein is about 760 holders (torr) in conjunction with the process of two substrates 100 and 120.And power supply 150 can be general well known device.Power supply 150 can be the RF power supply of supply high-frequency electrical.Power supply 150 is not included among the OLED 1, thereby it can removed after heat transfer piece 140 power supplies are finished for curing glass material 130a, 130b.Thereby protected display element 110 to avoid the infringement of moisture and oxygen effectively.Such packaging technology is simple, thereby is easy to be applied in the large-scale production.
The typical method of making according to the representative flat panel display of another exemplary embodiments of the present invention will be described now.Here, and compare, will omit the description that repeats based on the method for Figure 19 A to 19E.
In OLED 1 according to another exemplary embodiments opposite with Figure 19 D, the second frit 130b is formed on the insulated substrate 100 that is provided with display element 110, in the face of the first frit 130a of covered substrate 120, then, two substrates 100 and 120 are combined together simultaneously.
According to another exemplary embodiments, be provided with covered substrate 120 and insulated substrate 100 with display element 110.In this embodiment, heat transfer piece 140 along in two substrates 100 and 120 at least one the edge and form, then frit 130a, 130b and heat transfer piece 140 are formed on in two substrates 100,120 at least one accordingly.Then, two substrates 100 and 120 are combined together and be cured.
With reference to Figure 20 A to 20G, will be described for the typical method of manufacturing according to the representative flat panel display of the 8th exemplary embodiments of the present invention.
With reference to Figure 20 A, frit 130 forms along the edge of covered substrate 120.Here the width d1 of frit 130 can be 0.1mm to 5mm, and thickness d 2 can be 5 μ m to 3mm, has wherein above described the importance of such scope.Similarly, the material of frit 130 and effect are with above-mentioned identical.After frit 130 formed, by to for example applying high temperature on the covered substrate 120, frit 130 was cured.For curing glass material 130, need about 300 ℃ or higher high temperature.And the typical method of curing glass material 130 comprises and applies laser on frit 130, use baking oven or to the heated filament power supply that is arranged on frit 130 inside.
In conventional method, after frit is formed on the insulated substrate or be under insulated substrate and the covered substrate state combined together, frit is cured.But the display element that is arranged on the insulated substrate may be owing to the high temperature that is applied for the curing glass material defectiveness that becomes.In other words, according to the present invention, frit 130 just is cured after on being formed on covered substrate 120, thus since the defective of the display element 110 that high temperature causes be minimized or avoided.After frit 130 was cured, the surface of frit 130 experience glossing also was flattened.Therefore, the top surface of frit 130 is being improved aspect flatness and the uniformity, thereby has strengthened bonding uniformity and bonding effect between two substrates 100 and 120.
Then, shown in Figure 20 B and 20C, inserts 160 is formed on the covered substrate 120.Here, inserts 160 can be by a kind of formation the in distribution method, method for printing screen, slit spraying method and the rolling printing process.According to the 8th exemplary embodiments, inserts 160 comprise be arranged on covered substrate 120 with display element 110 corresponding zones on the 160a of first and be formed on the frit 130 with the separated second portion 160b of the 160a of first.The 160a of first protects display element 110, and second portion 160b combines frit 130 with insulated substrate 110.Replacedly, inserts 160 can be formed on the insulated substrate 100.
Then, shown in Figure 20 D and 20E, liquid moisture absorbent solution drops onto among the first space 160a and the space 161 between the frit 130 of inserts 160, thereby forms hydroscopic substance 170 on covered substrate 120.Here, can form hydroscopic substance 170 by when move in space 161, the moisture absorption drips of solution being fallen in the space 161 or by method for printing screen at distributor.Hydroscopic substance 170 has the very low permeability of corresponding moisture and oxygen, thereby has prevented the organic luminous layer quality degradation of display element 110 inside.
Replacedly, hydroscopic substance 170 can be before forming inserts 160 and be formed on the covered substrate 120.Then hydroscopic substance 170 and frit 130 can be cured simultaneously, and perhaps hydroscopic substance 170 can be solidified after curing glass material 130 more individually.
Then, shown in Figure 20 F, insulated substrate 100 and covered substrate 120 alignment also combine togather.Preferably, two substrates 100 and 120 are pressed so that inserts 160 covers the display element 110 that is formed uniformly on insulated substrate 100.In addition, two substrates 100 and 120 are pressed so that distance minimization therebetween, thereby the oxygen and the moisture that can be introduced between two substrates 100 and 120 are minimized.
Then, shown in Figure 20 G, when two substrates 100 and 120 by under the states that combine togather, at least a in the light and heat be applied on the inserts 160 and hydroscopic substance 170 on, thereby inserts 160 and hydroscopic substance 170 are cured, and then finish OLED1.
To be described for the typical method of manufacturing with reference to Figure 21 A to 21F according to the representative flat panel display of the 12 exemplary embodiments of the present invention.
At first, shown in Figure 21 A, frit 130 is formed on insulated substrate 100 and the covered substrate 120.In more detail, the first frit 130a and the second frit 130b form along insulated substrate 100 and covered substrate 120 respectively.The first frit 130a and the second frit 130b can be by a kind of formation the in method for printing screen, distribution method and the dipping method.The process that forms the first and second frit 130a, 130b can be carried out simultaneously, also can sequentially carry out.
Shown in Figure 21 B and 21C, insulated substrate 100, covered substrate 120 and heat transfer piece 140 alignment, thus partly be inserted between the first frit 130a respect to one another and the second frit 130b by heat transfer piece 140 injection-molded or that extrusion molding is made.With reference to Figure 21 B, heat transfer piece 140 mainly comprises rectangular slab.Heat transfer piece 140 comprises the first daughter board 140a, the second daughter board 140b, the 3rd daughter board 140c and the 4th daughter board 140d.Shown in Figure 21 C, each among daughter board 140a, 140b, 140c, the 140d all comprises the main body 141 that will be inserted between the first and second frit 130a and the 130b and stretches out and be formed with the cutting part 142 of cutting groove 143 from main body 141.Heat transfer piece 140 is arranged to main body 141 is inserted between the first and second frit 130a and the 130b.And each daughter board 140a, 140b, 140c, 140d thickness in cutting groove 143 reduces.Each cutting groove 143 is configured in abutting connection with each long limit of first to fourth daughter board 140a, 140b, 140c, 140d.The thickness d 7 of main body 141 is 10 μ m to 1000 μ m, and the thickness d 8 at cutting groove 143 places of cutting part 142 is 30% to 80% of thickness d 7.The long limit of first to fourth daughter board 140a, 140b, 140c, 140d is configured to have the length identical with the edge of insulated substrate 100 substantially.And the length L 1 of the minor face of heat transfer piece 140 is greater than the width d1 of frit 130.From the preference temperature of acquisition curing glass material 130a, 130b and with the bonding aspect of reducing to minimum of defective, such size is essential.In addition, reduce to minimum aspect from the densification of display and with the defective of lower metal distribution, such size is essential.
Then, shown in Figure 21 D, insulated substrate 100 and covered substrate 120 are making display element 110 in the face of in the covered substrate 120 and combine.Preferably, this cohesive process is to carry out under the pressure of about 760 holders in vacuum chamber.The main body 141 of heat transfer piece 140 is alignd between frit 130a and 130b, thereby the cutting part 142 of heat transfer piece 140 is positioned in the outside of frit 130.
Then, shown in Figure 21 E, power supply 150 is connected between the relative two ends of heat transfer piece 140, and to heat transfer piece 140 power supplies, thereby curing glass material 130.In more detail, when electric power is supplied on the heat transfer piece 140,, thereby solidified frit 130 owing to the internal resistance of heat transfer piece 140 has produced heat.For curing glass material 130 fully, power, make heat transfer piece 140 in 300 ℃ to 700 ℃ temperature range, be heated.Power supply 150 can be connected on the heat transfer piece 140 after two substrates 100 and 120 combine.Replacedly, power supply 150 can be connected on the heat transfer piece 140 before two substrates 100 and 120 combine.Here, power supply 150 can be realized by the well known device that can power usually.For example, the RF power supply of supply high-frequency electrical can be used as power supply 150.Because power supply 150 is not included among the OLED 1, after heat transfer piece 140 power supplies, it can removed for curing glass material 130.Therefore, can protect display element 110 to avoid the infringement of moisture and oxygen effectively.Such encapsulation is simple, therefore is easy to be applied in the large-scale production.
Shown in Figure 21 F, for example by working angles, the cutting part 142 of heat transfer piece is removed from main body 141.By with cutting part 142 with respect to cutting groove about in the of 142 bending carry out excision process for cutting part 142.Replacedly, cut out groove 143, cutting part 142 is removed from main body 141 by utilizing cutting tools such as cutter.Therefore, heat transfer piece 140 comprises the cutting groove 143 of the thickness with relative thin, thereby makes just do not have the cutting part of value 142 to be removed at an easy rate after curing process is finished behind curing glass material 130.Therefore, when cutting part 142 end portion thickness when the thickness than main body 141 reduces, shown in Figure 18 B, OLED 1 is accomplished.
With reference to Figure 22 A, 22B and 22C, will be described for the typical method of manufacturing according to the representative flat panel display of the 12 exemplary embodiments of the present invention.In the following description, with only describe with above-mentioned typical manufacture method different characteristics, so to perhaps can omit technique known, or only it is briefly described with reference to above-mentioned manufacture method.For example, same numeral is represented similar elements.
At first, shown in Figure 22 A and 22B, the first frit 130a and the second frit 130b are connected on the facing surfaces of the heat transfer piece of making by injection-molded or extrusion molding 140.In more detail, the first frit 130a is formed on the surface of main body 141, and the second frit 130b is formed on the facing surfaces of main body 141.Here, frit 130 can have predetermined viscous characteristics, and can be connected to the apparent surface of main body 141 by distribution method, method for printing screen or dipping method.
Shown in Figure 22 C, form after the first frit 130a, the 130b on the apparent surface of each in daughter board 140a, 140b, 140c, 140d, insulated substrate 100, covered substrate 120 and heat transfer piece 140 alignment, thus the first and second frit 130a and 130b are arranged between the edge of insulated substrate 100 and covered substrate 120.
In the manufacture method of first exemplary embodiments, power supply is connected to heat transfer piece 140 and is that heat transfer piece 140 power supplies are with curing glass material 130.And then cutting part 142 is removed at cutting groove 143 places, to finish OLED.As mentioned above, the invention provides and to make from the oxygen of outside and the minimized flat-panel monitor of inflow of moisture.
And, the invention provides the method that make to make from the minimized flat-panel monitor of inflow of the oxygen of outside and moisture.
Though illustrated and described some embodiments of the present invention, under the prerequisite that does not deviate from principle of the present invention and spirit, those skilled in the art can have various modifications and replacement, and they all should be included within claims and the equivalent institute restricted portion thereof.
Claims (14)
1. flat-panel monitor comprises:
Insulated substrate which is provided with display element;
Covered substrate is connected in the face of described insulated substrate and with described insulated substrate;
Frit forms along the edge between described insulated substrate and the described covered substrate; And
Inserts, between described insulated substrate and described covered substrate and with described insulated substrate and described covered substrate, link together, described inserts comprises the first that separates and cover described display element with described frit, and the second portion between described frit and described insulated substrate.
2. flat-panel monitor according to claim 1, wherein, described frit has 100 microns thickness in 600 micrometer ranges.
3. flat-panel monitor according to claim 2, wherein, described frit can have 1g/m every day
2To 10g/m every day
2Moisture permeability.
4. flat-panel monitor according to claim 1 also comprises the hydroscopic substance in the space between the described first that is located at described frit and described inserts.
5. flat-panel monitor according to claim 4, wherein, at least one preset distance of being separated by in described hydroscopic substance and described frit and the described first, and comprise at least a in calcium and the barium.
6. flat-panel monitor according to claim 1 also comprises first inoranic membrane between described display element and described inserts.
7. flat-panel monitor according to claim 6, the first of wherein said inserts is first inserts, and comprises second inoranic membrane and auxiliary inserts between described first inserts and described insulated substrate,
Wherein said second inoranic membrane is placed on described first inserts, and described auxiliary inserts is placed between described second inoranic membrane and the described covered substrate.
8. flat-panel monitor according to claim 7, wherein, described first and second inoranic membranes have the thickness of 100 nanometers in 3000 nanometer range, and have sandwich construction.
9. flat-panel monitor according to claim 1, wherein, surperficial flattened in the face of described insulated substrate of described frit.
10. method of making flat-panel monitor, described method comprises:
Prepare covered substrate;
Edge along described covered substrate forms frit;
Solidify described frit;
At described covered substrate be formed with in the insulated substrate of display element at least one and form inserts; And
After being linked together, described covered substrate and described insulated substrate solidify described inserts.
11. method according to claim 10 after solidifying described frit, also comprises a flattening surface in the face of described frit that makes described insulated substrate.
12. method according to claim 11, wherein, described inserts comprise with described insulated substrate or described covered substrate in the corresponding first of described display element on any one, an and lip-deep second portion that is formed on described frit.
13. method according to claim 12 also is included in to form before or after the described inserts and in the space between the described first of described frit and described inserts hydroscopic substance is set.
14. method according to claim 11 also is included in and forms the inoranic membrane that forms at least a portion that covers described display element before or after the described inserts.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2005-0103745 | 2005-11-01 | ||
| KR1020050103745A KR100671197B1 (en) | 2005-11-01 | 2005-11-01 | Flat panel display and manufacturing method thereof |
| KR1020050103745 | 2005-11-01 | ||
| KR1020060032881 | 2006-04-11 | ||
| KR1020060032881A KR20070101635A (en) | 2006-04-11 | 2006-04-11 | Display device and manufacturing method thereof |
| KR10-2006-0032881 | 2006-04-11 | ||
| KR1020060084737 | 2006-09-04 | ||
| KR10-2006-0084737 | 2006-09-04 | ||
| KR1020060084737A KR20080021382A (en) | 2006-09-04 | 2006-09-04 | Flat panel display and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101378215A Division CN1959999B (en) | 2005-11-01 | 2006-11-01 | Flat panel display and fabricating method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN101504951A true CN101504951A (en) | 2009-08-12 |
| CN101504951B CN101504951B (en) | 2011-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101378215A Active CN1959999B (en) | 2005-11-01 | 2006-11-01 | Flat panel display and fabricating method thereof |
| CN2009101260931A Active CN101504951B (en) | 2005-11-01 | 2006-11-01 | Flat panel display and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101378215A Active CN1959999B (en) | 2005-11-01 | 2006-11-01 | Flat panel display and fabricating method thereof |
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| Country | Link |
|---|---|
| KR (1) | KR100671197B1 (en) |
| CN (2) | CN1959999B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468451A (en) * | 2010-10-28 | 2012-05-23 | 三星移动显示器株式会社 | Display device, manufacturing method of the display device, organic light emitting diode display |
| CN104124179A (en) * | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
| CN110970573A (en) * | 2019-11-21 | 2020-04-07 | 福建华佳彩有限公司 | Panel and packaging method thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102939270B (en) * | 2010-06-14 | 2015-11-25 | 旭硝子株式会社 | Sealing material is stuck with paste and is used its manufacture method of electron device |
| KR101810052B1 (en) * | 2010-10-27 | 2017-12-19 | 삼성디스플레이 주식회사 | Flat panel display apparatus and method of manufacturing flat panel display apparatus |
| TWI476491B (en) * | 2011-11-07 | 2015-03-11 | Au Optronics Corp | Packaging structure and packaging method of display apparatus |
| TWI750421B (en) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | Display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000138029A (en) * | 1998-11-02 | 2000-05-16 | Canon Inc | Manufacture of glass envelope and its device |
| JP2001222016A (en) | 2000-02-09 | 2001-08-17 | Nec Kagoshima Ltd | Liquid crystal display panel and its manufacturing method |
| JP2004014332A (en) * | 2002-06-07 | 2004-01-15 | Pioneer Electronic Corp | Flat display panel and its manufacturing method |
-
2005
- 2005-11-01 KR KR1020050103745A patent/KR100671197B1/en active IP Right Grant
-
2006
- 2006-11-01 CN CN2006101378215A patent/CN1959999B/en active Active
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468451A (en) * | 2010-10-28 | 2012-05-23 | 三星移动显示器株式会社 | Display device, manufacturing method of the display device, organic light emitting diode display |
| CN102468451B (en) * | 2010-10-28 | 2015-10-07 | 三星显示有限公司 | The manufacture method of display unit, display unit and organic light emitting diode display |
| CN104124179A (en) * | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
| CN104124179B (en) * | 2013-04-26 | 2017-08-29 | 上海和辉光电有限公司 | The packaging technology and device of display device |
| CN110970573A (en) * | 2019-11-21 | 2020-04-07 | 福建华佳彩有限公司 | Panel and packaging method thereof |
| CN110970573B (en) * | 2019-11-21 | 2022-03-08 | 福建华佳彩有限公司 | Panel and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1959999A (en) | 2007-05-09 |
| CN101504951B (en) | 2011-01-12 |
| CN1959999B (en) | 2010-06-02 |
| KR100671197B1 (en) | 2007-01-19 |
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