Wafer-carrier device and manufacturing approach thereof, the layer system that is used for the wafer-carrier device and manufacturing approach thereof
Summary of the invention
Therefore the object of the invention is, particularly a kind of layer system that is improved is being provided aspect the carrier layer structure.
According to the present invention, this purpose arranges through a kind of wafer-carrier and is achieved that said layout comprises
-wafer,
-carrier layer system and
-be arranged on the boundary layer between carrier layer system and the wafer,
Wherein, said carrier layer system comprises
(i) carrier layer and
(ii) the boundary layer side by solidify, partly solidified or layer that the curable elastomer material constitutes, perhaps form by these two layers, and
Wherein, said boundary layer does
(iii) plasma polymer layer and
(iv) the adhesive strength between carrier layer system and the boundary layer after elastomeric material solidifies greater than the adhesive strength between wafer and the boundary layer.
Elastomeric material except the elastomer of polymerization, also comprises its low molecular precursor (Vorstufe) (until monomer) in this article.It can be as yet not or only partial cross-linked low molecular liquid or be similar to the material of pasty state.
Corresponding therewith, the curable elastomer material is the commercial habitual precursor of polymer elastomer in the framework of this paper.Partly solidified elastomeric material has been in this article for having produced polymerization/crosslinked curable elastomer material, but polymerization/crosslinked does not finish as yet and/or can carry out further polymerization/crosslinked through selectable chemistry or physical mechanism when needing.The elastomeric material that solidifies is its polymerization/crosslinked elastomer that finishes basically in the framework of this paper.It should be noted that in this case that polymerization/crosslinked end is meant exists traditional elastomer.
" plasma polymer layer " is a kind of layer that can make by the plasma polymerization effect in the framework of Ben Wenben.The plasma polymerization effect is a kind of method, and wherein the precursor of gaseous state (being also referred to as monomer usually) is deposited upon on the substrate that can freely select as highly cross-linked through plasma excitation.The prerequisite of plasma polymerization effect is to have atom such as carbon or the silicon that forms chain in the working gas.Through excitation, the molecule of gaseous material (precursor) is splinter through the bombardment that utilizes electronics and/or high energy ion.Meanwhile produce the free radical that highly encourages or the molecular fragment of ion, they in gas compartment, react to each other and be deposited on the surface that will apply.The discharge of plasma and strong ion thereof and electron bombard continuous action are further reacted the height combination that also can realize molecule deposition in this sedimentary deposit thereby can on sedimentary deposit, cause.
In the framework of Ben Wenben, notion " plasma polymer layer " also comprises can be by the layer of plasma enhanced chemical vapor deposition (PE-CVD) manufacturing.In this case, for the control reaction is extra substrate is heated.So for example can make SiO by silane and oxygen
2-coating.It is emphasized that in addition the atmospheric pressure plasma method also can be used to make according to the present invention the plasma polymer layer that will use, although preferred lower pressure Plasma Polymerization at present.
In the framework of Ben Wenben, will be used for being called " monomer " (gaseous precursors) as gas or vapor to the material of plasma through plasma polymerization effect cambium layer.What be called " liquid precursor " is that the for example effect through plasma particle, electronics or the UV radiation of highly excitation (for example through) can be crosslinked and evaporated liquid in advance.
Plasma polymer layer is obviously different with polymeric layer on its micro-composition.Under the polymer situation; The cohesive process of monomer carries out with foreseeable mode; And at plasma polymerization on; Employed monomer is through contacting acute variation (until destroying fully) and with reactive materials form deposition with plasma, thereby forms a kind of highly cross-linked layer, and the zone of repetition regularly not.Corresponding therewith, plasma polymerization acts on the meaning of this paper different with plasma-induced polymerization.This point also is applicable to so-called " forming the plasma polymerization effect of structure ", because under " gentleness " condition of plasma, also unpredictalbe molecular breakdown can occur.
Among the WO2004/051708A2 that mentions in front, disclose and be applicable to plasma polymer layer of the present invention.Said document is incorporated this paper into way of reference.This is specially adapted to be used among the WO2004/051708A2 make the information of plasma polymer boundary layer and boundary layer itself.
Patent documentation DE100 34 737C2 equally also disclose and can be used for plasma polymer boundary layer of the present invention.But what need consider here is; Must be with respect to wafer orientation and therefore be deposited under the situation on the wafer in the plasma polymer boundary layer in the surface of the stronger attachment removal effect of the disclosed plasma polymer boundary layer in there, the reaction of plasma process control correspondingly with DE10034 737C2 in disclosed mode carry out on the contrary.Under this prerequisite, therefore the disclosure of DE100 34 737C2 particularly incorporates this paper into way of reference in deposition process and the plasma polymer boundary layer disclosure aspect own.
The professional can confirm the adhesive strength between each layer and it is defined as " total adhesion between coating and its background " according to DIN971-1:1996-09.
The advantage of arranging according to wafer-carrier of the present invention is, because the characteristic (pliability, dilatancy) of elastomeric material, is between the boundary layer on the wafer when needing in carrier layer and can produces desirable being connected.Particularly the adhesive strength between the layer of plasma polymer layer and elastomeric material formation can be adjusted like this; When separating between the carrier layer system that the layer that carrier layer and elastomeric material are constituted is formed and the wafer, boundary layer remains adhered on the elastomer layer.Exist on the wafer under the recessed situation of three-dimensional surface structure such as flange and side simultaneously, also can with the wafer good separation.
Elastomer layer advantage in addition is, it is the tension force that occurs owing to the different heat expansion coefficient of linear expansion between carrier layer of using in each case and the wafer of balance within the specific limits.Another major advantage of elastomer layer is; Its convexity on the front wafer surface that the mechanical stress that prevents under the enough situation of thickness to occur owing at wafer grinding the time causes is flange extruding wafer for example, thereby injustice possibly occur and breaking-up wafer under extreme case.
For purposes of the invention importantly, the selection of elastomeric material and plasma polymer boundary layer both with this material also with various situation under the coupling of the wafer surface that exists.(perhaps PECVD method) adjustment plasma polymer boundary layer when the professional is controlled at the plasma polymer deposition process through appropriate method.The boundary layer of plasma polymer is facilitated required attachment characteristic in this regard, and making that wafer-carrier is arranged under the coating systems situation can be so that operation.This point especially also is applicable to the processing during the attenuate.On the other hand, the carrier layer system must can be by rights and wafer-separate.The plasma polymer boundary layer is mentioned formation aspect its adhesive strength, makes between wafer surface (for example equally also can comprise other layers as passivation layer) and the boundary layer to have predetermined breaks (Sollbruchstelle).In this regard, for the attachment characteristic of this predetermined breaks, the load tolerance (Belastungstoleranz) of wafer behind the attenuate between operability before separating (or the load that occurs here) and separation period importantly.
Self-evident, as the to play an important role layer that also has elastomeric material to constitute.The hardness of elastomeric material must make said material enough soft, preferably the wafer surface of no cavity investing mechanismization (interface that wherein, can have the structure postforming on the structure on surface).In addition; Silicone materials must be enough hard or cocoa change sufficiently rigid state into; The carrier layer system is applied on the wafer surface (indirectly) afterwards, guarantees the operability of wafer-carrier layout because the plasma polymer boundary layer is arranged between wafer surface and the boundary layer system.Particularly elastomer layer itself must be enough firmly, make and separate between wafer and the plasma polymer boundary layer and elastomer layer itself does not ftracture basically.
Self-evident, the professional be readily appreciated that two layers forming the carrier layer system (carrier layer and by solidify, partly solidified or layer that the curable elastomer material constitutes) each other adhesive strength must be greater than the adhesive strength between boundary layer and the wafer.
When structure was arranged according to wafer-carrier of the present invention, elastomeric material must be enough soft as already mentioned, so that surround the form of wafer surface fully.This point for example can realize thus that promptly curable elastomeric material is with spin coating or spraying or be applicable to that other technology mode liquid state of coating liquid material are coated on the wafer that is coated with the plasma polymer boundary layer.The elastomeric material of liquid curable must be cured subsequently, so that can satisfy its function.As selection, also can curable or partly solidified elastomeric material be coated on the carrier layer and continue when needing partly solidified, thereby produce gelatinous denseness.Self-evident, offer being connected of the layer that constitutes for carrier layer and elastomeric material the professional from for example through the bonding a large amount of possibilities of sulfuration (Vulkanisieren) until extruding.Here, the professional selects appropriate method according to employed material under the various situation.
In case made the carrier layer system, just can it be connected with the top wafer that has deposited the plasma polymer boundary layer.This point for example can be carried out through extruding, but the technology that also can use other physics and/or chemical generation to adhere to.The material that the professional here also uses according to reality was both also selected corresponding method as the layer that elastomeric material constitutes as boundary layer.In addition, if desired with boundary layer and wafer-separate, the professional considers the residing state of elastomeric material in this regard.This point is particularly significant under following situation, promptly when when wafer surface is connected, full solidification-this is not a kind of preferred scheme to elastomeric material as yet with (being coated with plasma polymer).
Self-evident, the professional it is understandable that for the plasma polymer boundary layer with enough elasticity and expansiveness, said plasma polymer boundary layer also can be deposited on the layer of curable elastomer material formation.In this case, in the step of back, just will deviate from the carrier layer system that comprises plasma polymer layer on the face of carrier layer and be connected with the proper method that wafer adheres to through generation.Important here also is to surround structurized wafer surface when needing well.The professional it should be noted that especially; When manufacturing is arranged according to wafer-carrier of the present invention; The layer that elastomeric material constitutes carries out whole surface distributed and said layer system as far as possible with respect to wafer surface, does not have fully preferably that air is mingled with or cavity is made.This point particularly realizes in a kind of preferred version of the present invention thus; Be the curable elastomer material of the layer that constitutes of elastomeric material or partly solidified elastomeric material enough " liquid state ", so that (because the plasma polymer boundary layer is indirect) surrounds the structure on wafer surface.Then can be cured then.Self-evident, lamination also can carry out under vacuum condition.
The curing of curable elastomer material or partly solidified elastomeric material through by the professional that select with mode match materials, for example through carrying or extract the energy of hot form or for example polymerization and/or sulfurization are carried out through suitable chemical reaction.
Self-evident, the professional should understand layer that elastomeric material constitutes and needn't be made up of also this material fully and can also comprise suitable additive.But wherein mechanical property embodies through elastomeric material basically.This layer is self-evident to be elastomer layer after solidifying as beforely.
What for the professional, be readily appreciated that is, arranges according to wafer-carrier of the present invention also to comprise other layers, for example resemble that carrier layer and elastomeric material constitute layer between adhesive phase.At last importantly, said layer all can be realized its function under various situation, that is to say, particularly
Adhesive strength between-boundary layer and the wafer is a minimum adhesive strength between two layers in the whole layer system, thereby predetermined breaks is provided between boundary layer and wafer,
The layer that-elastomeric material constitutes has surface texture besieged denseness on required degree of guaranteeing wafer when layer system is connected with wafer,
The layer that-elastomeric material constitutes makes layer system enough stable for the further processing of wafer after solidifying, and it is particularly enough stable, so that wafer is when separating (perhaps opposite) with boundary layer, and not layer not the breaking of elastomeric material formation, and
It is enough stable that-carrier layer is arranged wafer-carrier.
The layer that constitutes at elastomeric material in some cases can also be born the function of carrier layer simultaneously.
At last, be arranged in the back side processing that can make wafer under the above-mentioned prerequisite according to wafer-carrier of the present invention and obviously carry out with being more prone to, because simple to operate and have a suitable stabilizing layer system.Particularly can be with wafer attenuate greatly, because because the mechanical stress of relatively little (and can control to a great extent through the selection plasma polymer layer) appears in the plasma polymer boundary layer when wafer separates with layer system.
What aspect boundary layer, note also is, self-evident it is understandable that for the professional, and the plasma polymer boundary layer not necessarily must or be deposited on the wafer or be deposited on the layer that elastomeric material constitutes.Boundary layer also can at first be independent of the layer manufacturing of wafer and elastomeric material formation and for example be connected through extruding with them subsequently in principle.But preferred boundary layer is deposited on the wafer surface, because the profile tracer of wafer surface obtains best the assurance through the plasma polymer boundary layer like this.
Preferred in addition a kind of foundation wafer-carrier of the present invention arranges, said layout is included in the connection material layer and second carrier layer on the face (back side of wafer) that wafer back separates interlayer.
Be understood that easily, after the processed wafer back side, just produce the wafer-carrier of just having introduced certainly and arrange.It is emphasized that in this regard second carrier layer can be different fully with first carrier layer on material.Connecting material layer is used for second carrier layer is connected with wafer.Concerning these materials that can construct, importantly, guarantee separable by rights connection the between second carrier layer and the wafer differently.Connecting material layer for example can be the adhesive phase of UV or thermal release, and it reduces under the effect of UV light radiation or heat energy or loses its adhesive force.Self-evident, preferably after the corresponding reduction of adhesive force, the least possible at this, particularly preferably do not connect material layer and stay on the wafer.Connecting material layer when needing can be the plasma polymer boundary layer from its that aspect, its to the adhesive force of second carrier layer greater than adhesive force to wafer.
The advantage of this second carrier layer can be to be convenient to attenuate and/or the operation of the wafer cut apart, and can make or help layer system and the wafer-separate (this being continued to consult the hereinafter content) on the front wafer surface when needing.
Part of the present invention also has a kind of carrier layer system that is used for according to wafer-carrier layout of the present invention, and said layer system comprises
(i) carrier layer,
(ii) by solidify, partly solidified or layer that the curable elastomer material constitutes and
(iii) deviate from the diaphragm of taking off on the face of carrier layer at the layer that elastomeric material constitutes.
The diaphragm that can take off is the film that can remove from elastomeric material according to mechanical approach noresidue ground at this.
The foundation of being introduced carrier layer of the present invention system uses according to the preparatory stage of wafer-carrier layout of the present invention and when manufacturing is arranged according to wafer-carrier of the present invention.This point can be carried out thus, promptly removes the diaphragm that can take off and subsequently the carrier layer system is pushed perhaps with the wafer that has the plasma polymer boundary layer to be connected with other suitable modes.
The advantage of this carrier layer system particularly since diaphragm can finely deposit and transport and also can produce in place away from wafer manufacturing and processing.
Part of the present invention also relates to a kind of layer system that is used for according to wafer-carrier layout of the present invention, and it comprises
(i) carrier layer,
(ii) by solidify, partly solidified or layer that the curable elastomer material constitutes and
(iii) deviate from the plasma polymer boundary layer on the face of carrier layer, wherein, also preferably on the plasma polymer boundary layer deviates from the face of carrier layer, the diaphragm that can take off is provided here at the layer that elastomeric material constitutes.
As long as aforementioned prerequisite is fit to the plasma polymer boundary layer, this product also can be used for making according to wafer-carrier of the present invention especially effectively to be arranged.Being also advantageous in that here, layer system can be made and can be used as prefabrication separately and used.
Part of the present invention also relates to a kind of foundation wafer-carrier of the present invention and arranges or a kind of foundation layer system of the present invention; Wherein, Said elastomeric material is starkly lower than the typical Shore-A hardness under the solid state in the Shore-A hardness under the partly solidified state; This typical Shore-A hardness is 15~78, and is preferred 20~70, further preferred 30~60 with especially preferred 40-55.
Significantly lower Shore-A hardness is meant than the Shore-A hardness of hanging down 10%, preferred 20% and preferred especially 40% under the solid state at least under the partly solidified state.There is not Shore-A hardness to widely applying particularly preferably in reality under the partly solidified state; Because elastomeric material (going back) is not the mould that has Shore-A hardness on the traditional sense body (Formhaertkoerper) of quenching; But with pasty state, when needing or even the state that can flow exist.
As stated; The partly solidified state of the layer that elastomeric material constitutes is used to facilitate elastomeric material to produce suitable denseness; Make it surround (being covered) wafer surface form, when lamination, do not flow freely but then by the plasma polymer boundary layer with enough degree.
The partly solidified state of elastomeric material can produce according to different modes.If the curing of elastomeric material (for example polymerization) realizes with thermal control, just only carry heat energy, until reaching desired partly solidified state to elastomeric material.Solidify (polymerization) reaction when needing accordingly also can for example interrupt perhaps on desired degree, slowing down as cooling off through discharging heat targetedly.This point is particularly suitable under the only thermoinducible situation of curing reaction.
Can solidify the elastomeric material of (polymerization and/or crosslinked) by two kinds of mechanism as selecting to use.This point for example can realize through different reactive groups is provided in the curable elastomer material.For example, can at first carry out curing/polymerized/cross-linked that UV facilitates, and (self-evident facilitate through the plasma polymer boundary layer) just begins for example second kind of reaction mechanism of chemistry afterwards only on contact wafer surface.
For many application, also can preferably use the curable elastomer material, it is perhaps during partly solidified process, depending on continuous energy delivery (for example light/UV light/heat) during the solidification process at least, to keep solidification process.
Arrange or a kind of foundation layer system of the present invention that according to the preferred a kind of foundation of the present invention wafer-carrier of the present invention wherein, elastomeric material is perhaps being made on the polysiloxanes basis on the material foundation that is similar to polysiloxanes aspect its characteristic.
Important in this respect characteristic in this case particularly mechanical strength, thermal endurance, vacuum compatible property and with the low chemical reactivity of other materials.
The preferred material of elastomeric material is silicone elastomer, rubber and the material that is similar to rubber.
Preferred in addition a kind of foundation wafer-carrier of the present invention arranges or a kind of foundation layer system of the present invention that wherein, carrier layer is polyimides or aramid layer, preferably adopts the mode of Kapton or Ultem film, is glassy layer or silicon layer.
Preferred especially a kind of foundation wafer-carrier of the present invention arranges, wherein thermal coefficient of expansion and the thermal coefficient of expansion of wafer of carrier layer linear expansion under 20 ℃ differs maximum 10.0*10
-6/ ℃, preferred maximum 5*10
-6/ ℃, further preferred maximum 2.5*10
-6/ ℃, preferred especially maximum 1.8*10
-6/ ℃.
The advantage that the last foundation of being mentioned wafer-carrier of the present invention is arranged is, selects the effect of carrier layer materials to be according to thermal coefficient of expansion, makes to occur very little between wafer and the carrier layer or the mechanical stress based on the different expansions of material preferably do not occur.
Corresponding therewith, the glass of carrier layer preferred glass or modification, this glass aspect its thermal coefficient of expansion with the thermal coefficient of expansion of wafer only have very little difference or with form the wafer identical materials in fact.In this case, it is desirable to use the Borofloat33 glass like supplier Planoptik, its thermal coefficient of expansion under 20 ℃ of room temperatures is 3.2*10
-6/ ℃, therefore very approaching with the thermal coefficient of expansion of silicon.
But preferred especially a kind of at this at the glass that is complementary aspect its thermal coefficient of expansion, because this glass is quite inexpensive generally speaking and light and/or UV light can see through the layer that can (part) curing elastomer material constitutes by it in addition.
Also preferred a kind of foundation wafer-carrier of the present invention arranges, wherein, second carrier layer is flexible greater than first carrier layer of film and preferred especially second carrier layer flexible.
Flexiblely carry out more as follows: for carrying out the flexible comparison of two layers, produce respectively by the material of forming layer and to have equal length and width and highly be the body of bed thickness separately.Preferred these body longitudinal extensions.Subsequently an end of body is fixed, and applied definite power to the other end.Relatively original plane that body that bigger (elasticity) deflection occurs has bigger flexible through on loose end, applying power.In this regard, the flexible strain that relates generally to, rather than stiff for example as press-bending.
Particularly carrier layer less by flexibility/situation that flexible materials with smaller is for example formed as glass under; Advantage for wafer and boundary layer mechanical separation is; (attenuate) wafer can be crooked jointly together with the layer system on its back side; Thereby wafer is on the one hand through the protection of the carrier layer on its back side, and occurs mechanical shear stress on the other hand, makes to throw off being connected between wafer and the boundary layer to become easy.Self-evident, separation process can for example be supported (to this also referring to following content) as slewing rollers and advantageously carrier layer fixed in addition through the mechanical assistance instrument.
The special preferable material of second carrier layer is by one deck or the film formed of multilayer PP, PE, PET and/or other plastics more at this.The material of preferred second carrier layer can expand.This film for example is saw film (being also referred to as " blue film (bluetape) " in the industry usually), as being provided by manufacturer such as Lintec or Nitto.
The foundation wafer-carrier of the present invention that preferably has second carrier layer arranges that wherein, said connection material layer comprises or is made up of the material that is preferably adhesive, and this material perhaps disappears to adhesive force reduction under the effect of radiation and/or heat of wafer.
This preferred connection material layer can make the also preferred noresidue of second carrier layer and wafer separate.This separation is carried out at wafer and plasma polymer boundary layer after separating usually.The last wafer that can obtain not have the layer system that is used to process in this manner.
Concerning many application; Preferred a kind of foundation wafer-carrier of the present invention is arranged or a kind of foundation layer system of the present invention; Wherein, The layer and/or second carrier layer that carrier layer and/or elastomeric material constitute constitute like this, make them can the static loading and/or can be fixed by the face of static loading.
Be the corresponding layer of preferred formation (but static loading), professional's a series of possibilities capable of using.Desired effect on the one hand can be through selecting each layer (mainly) but material or through mention to one or more layer in the particle of the corresponding static loading of adding obtain.
The advantage of this preferred implementation of the present invention is, can also can fix according to wafer-carrier of the present invention with the surface generation interaction of static loading by the static characteristic of layer and arrange (for example being used for transporting).Self-evident, also can for example fix for different processes as attenuate or back face metalization.The static fixedly processing under the against vacuum condition is particularly advantageous.
According to the also preferred a kind of foundation of the present invention layer system with diaphragm of the present invention, wherein said diaphragm for example can be to be coated with the paper of polysiloxanes or the film of being made up of PP, PE, PET or other plastics.The key characteristic of film is can be easy to separate with the elastomer layer of carrier with preferred noresidue ground again.
When part of the present invention also relates to the boundary layer of layer that the elastomeric material of curing constitutes and plasma polymer and/or is arranged in the processed wafer back side according to layer system of the present invention and/or foundation wafer-carrier of the present invention, preferably at the attenuate of wafer and/or the purposes when cutting apart.
Part of the present invention also relates to according to the purposes of layer system of the present invention when manufacturing is arranged according to wafer-carrier of the present invention.
In addition, part of the present invention also comprises a kind of method that is used to make foundation layer system of the present invention, said method comprising the steps of:
A) formation of carrier layer,
B) formation of the layer of curable elastomer material formation,
C) will be at step a) and b) in the layer that produces be connected, preferably with step a) or b) simultaneously,
Solidify the layer that perhaps partly solidified curable elastomer material constitutes when d) needing,
Deviate from deposition plasma polymer boundary layer on the face of carrier layer at the layer that elastomeric material constitutes when e) needing,
The diaphragm that can take off when f) needing is applied on the face that layer that elastomeric material constitutes deviates from carrier layer or the plasma polymer boundary layer deviates from the face of carrier layer.
What for the professional, be readily appreciated that in this regard is, is called as step when needing and depends on the execution mode that should make which kind of layer system (preferred when needing) in this method respectively and implement.
Particularly in step d), the layer segment that preferred curable elastomer material constitutes solidifies, and accomplishes its task and can solidify afterwards contacting (facilitating through the plasma polymer boundary layer) with wafer surface with the best.
Part of the present invention also relates to a kind of method that is used to make foundation wafer-carrier layout of the present invention, said method comprising the steps of:
A) wafer is provided,
B) provide according to layer system of the present invention; Wherein, If the layer system that is provided comprises the plasma polymer boundary layer, this boundary layer constitutes like this, make between carrier layer system and the boundary layer adhesive strength the carrier layer system be connected with wafer and elastomeric material solidify after greater than the adhesive strength between wafer and the boundary layer; Wherein said connection is facilitated through boundary layer
Take diaphragm off from layer system when c) needing,
D) if the layer system that is provided does not comprise the plasma polymer boundary layer; Be deposited upon on the layer that wafer or elastomeric material constitute this so; Make between carrier layer system and the boundary layer adhesive strength the carrier layer system be connected with wafer and elastomeric material solidify after greater than the adhesive strength between wafer and the boundary layer; Wherein said connection is facilitated through boundary layer
E) wafer that layer system is applied with the plasma polymer boundary layer when needing be connected and
F) curing of elastomeric material.
In said foundation method of the present invention, key is the starting point of professional's introduction from the front is particularly selected each layer relatively with its function a material.The degree that elastomeric material solidifies, preferably through at first partly solidified and curing subsequently, the professional also will adjust according to demand separately.
It is also noted that, for producing and being connected each layer and having various possibilities can supply the professional to use.Lamination for example can carry out through extruding, bonding or chemical connection, wherein, must satisfy the prerequisite that the front is introduced all the time aspect layer and the layer adhesive strength to each other, so that make layer can realize that it is according to function of the present invention.
Also have different possibilities can supply the professional to use according to material chosen to producing layer, therefore, layer for example can be at first with the spin coating that is applicable to coating liquid material or spraying process is liquid applies, but they can be from the beginning apply with the mode of film.Only otherwise the above-mentioned functions of influence layer, also can use promote to adhere to or reduce the material that adheres to and this use according to the layer function that will obtain also be suitable.
Part of the present invention also has a kind of method that is used for the processed wafer back side, said method comprising the steps of:
A) make according to wafer-carrier layout of the present invention, it (is gone back) on chip back surface and is not comprised the connection material layer and second carrier layer, and
B) back side of processed wafer.
In the preferred in the end said foundation method of the present invention with the thinning back side of wafer.This point can for example be carried out as wear down, grinding, grinding or corrosion through traditional method.
Self-evident, also can on the basis of arranging according to wafer-carrier of the present invention, effectively take other measures that is used for the processed wafer back side, for example as the metallization at the back side, by the structureization of corrosion and the doping at the back side.
For the professional, can directly be understood that, also can under vacuum condition, implement according to many steps of method of the present invention.This point preferably is applicable to be connected (the particularly extruding) of layer with the wafer of elastomeric material formation; Wherein, the plasma polymer boundary layer that is between the layer that wafer and elastomeric material constitute is being on the wafer on the time point that contact or unimportant on elastomeric material constitutes layer.
Preferred a kind of foundation method of the present invention wherein, applies the connection material layer and second carrier layer on the back side at wafer after the back side processing of accomplishing chip back surface.
Self-evident, mention at last the layer apply like this, make these layers to each other and and wafer between adhesive strength greater than the adhesive strength between wafer and the plasma polymer boundary layer.
Corresponding therewith, preferably a kind ofly be used for the method at the processed wafer back side according to the present invention, wherein after step c), separate between wafer and the plasma polymer boundary layer after step b) and when needing.
In carrier layer is under the situation of the layer that for example this flexibility is very little as sheet glass, preferred especially this method.Particularly using than this carrier layer under the flexible second higher carrier layer situation, wafer can carry out according to method for optimizing of the present invention from the separation of boundary layer is corresponding as follows:
Carrier layer is fixed on it deviates from the face of wafer.This for example especially for sheet glass as accomplishing by the suction of vacuum under the situation of carrier layer.But also can be for example through clamping mechanical fixation.Second carrier layer that will preferably exist with the film mode is now mentioned by proper device.This device for example can be a guide roller; Designing like this aspect its radius; Make its by wafer, connect system that material layer and second carrier layer form when crooked, only by maybe or even getting rid of hardly because the masterpiece of mechanical stress damage wafer is used for wafer.Self-evident in this regard it is understandable that, wafer grinding is many more, and just it becomes thin more, and the bending that it bore is high more.
Through mentioning by second carrier layer, connect the system that material layer and wafer are formed, on the predetermined breaks between plasma polymer boundary layer and the wafer, separate.As by the agency of, this separation preferred mechanical ground carries out.In this regard, for example using under the situation of guide roller and can select feed speed like this, making the wafer nonoverload but the plasma polymer boundary layer is separated with wafer fully.After separating does not produce also can continue processing when needed for the front wafer surface of processing the layer system that is applied.
Preferred a kind of foundation method of the present invention is wherein also separated second carrier layer with the boundary layer after separating at wafer.This preferably carries out under the adhesive force situation that reduces between connection material layer and the wafer.For example reducing or losing under the adhesive case of its bonding effect, perhaps carry heat energy to reduce adhesive force through the UV radiation through UV radiation or heat energy.This point also is the part according to method for optimizing of the present invention.
Preferred in addition a kind of foundation method of the present invention, wherein wafer is cut apart before removing the plasma polymer boundary layer and/or before removing second carrier layer.This point for example can be carried out thus, and promptly the plasma polymer boundary layer is divided into microplate (chip) by appropriate method (to this for example with reference to foregoing) after separating with wafer.But corresponding separation also can be before applying second carrier layer, and the plasma polymer boundary layer is still carried out during on the wafer.
The advantage of this method is, the wafer of cutting apart (just in fact its part of having cut apart) as long as also just contact with the carrier layer or second carrier layer keeps together, and the single matrix of layer system also keeps together separately.Naturally it is understandable that for the professional suitable in many cases is when wafer is cut apart, not separate or at least not exclusively separate each layer system.
Below about doing further prompting with making according to wafer-carrier layout of the present invention or according to layer system of the present invention according to method of the present invention:
-use liquid precursor:
As WO2004/051708A2 by the agency of, be the attachment characteristic (or attachment removal characteristic, stalling characteristic) of adjustment plasma polymer layer, it can be favourable using liquid precursor.Mixture as liquid precursor particularly suitable silicone oil and appropriate solvent in framework of the present invention.
Liquid precursor for example can be by spin coating, spraying, and wherein wafer rotates respectively, pours into a mould, and wherein utilizes precursor from top cast wafer surface, or dipping, wherein wafer is immersed in the precursor (back side that covers together with film when needing) and is coated on the wafer.
In this regard; For many application, advantageously be coated in precursor on the wafer like this; Even bear on the position of extra high shear action when in the recessed zone of side of key or between wafer and the plasma polymer boundary layer, separating, produce thicker precursor layer.
Crosslinked when precursor needs as introducing in the foregoing open source literature, this also can carry out when the plasma polymer boundary layer deposits by plasma.If precursor layer is thickness big (thicker) on several positions, sedimentation or cross-linking method just can constitute like this, make precursor not crosslinked or not exclusively crosslinked on the position of key especially.Therefore it also for example exists and in the tack between extra reduction wafer surface and the boundary layer on the crucial especially position as oil or with partial cross-linked mode.On position crucial on the form, be more prone to separating particularly between wafer and the boundary layer thus.
Can preferably solvent evaporation be fallen (if precursor comprises solvent) after applying precursor.This for example can be through the suction solvent steam, place vacuum chamber or support through heating.
-elastomeric material
The elastomer that preferred elastomeric material is based on polysiloxanes is the Wacker of manufacturer for example, and Burghausen adheres to liquid polysiloxane rubber, ELASTOSIL LR3070 or LR3070 type certainly.As the other materials of selecting to use natural gum, the rubber of solid state or have rubber elastomer characteristics.Certainly can also use the suitable mixture or the layer compound of different elastomeric materials.
Certainly the Shore hardness of the layer that constitutes of elastomeric material under partly solidified and solid state, be complementary with its function respectively (with reference to noted earlier).For the professional suitable material and possibility is provided at this.
If it highly is the flange of 50 μ m for example that wafer to be processed for example has in its surface, Shore hardness is 20~60th, and is favourable.Self-evident for the professional is that the thickness of the layer that elastomeric material constitutes must enough surpass the height of flange.
Coating can for example be carried out through scraper plate by the layer that the curable elastomer material constitutes.The crosslinked of this layer can carry out through a plurality of steps (partly solidified, curing) as stated.The for example above-mentioned Wacker of manufacturer, the polysiloxane rubber of Burghausen can be through being squeezed within 5 minutes sulfuration and crosslinked/cured thus under 165 ℃.
With the partial cross-linked temporary transient curing that similarly it is also conceivable that the layer that elastomeric material constitutes, for example through cooling or deep cooling.This process also obviously can be used to interrupt curing reaction (cross-linking reaction) as stated.Corresponding cooling preferably under dry atmosphere, stops the air humidity condensation under protective gas atmosphere when needing.
If the layer that elastomeric material is constituted cools down, when then this layer contacts with wafer surface or before (for example through pushing) for example heating/the thawing under protective gas atmosphere be suitable.
-lamination
Lamination can utilize connector (Bonder) to carry out, and wherein the pressure of vacuum, temperature, UV light, lamination or these parameters of duration are used as required and/or selected by the professional.
The layer thickness of the layer that-elastomeric material constitutes is set
This can preferably utilize two extruding punch dies of mechanical brake (Anschlags) and/or parallel importing connector to carry out.
Thickness (highly) control of arranging from the purpose implementation basis of quality assurance wafer-carrier of the present invention can be favourable.
-the second carrier layer:
Can use the saw film (being also referred to as blue film) that preferably has expansion characteristics as second carrier layer.This saw film is provided by manufacturer such as Lintec, Nitto or Advantek.Preferably use the film of the Advantek of manufacturer as second carrier layer, for example have the sort of of the responsive adhesive of presser sensor adhesive (for example DX112A type) or UV (for example DU099D type) with adhesive linkage.The adhesive force of this saw film as second carrier layer is measured as 700gr. according to ASM D 1000 methods.Considering under the situation of this adhesion that separating between plasma polymer boundary layer and the wafer can be carried out under the situation that applies pulling force to second boundary layer (also with reference to below content).
In this respect importantly, wafer is enough big with the adhesive force of second carrier layer (facilitating through being connected material layer when needing), makes its adhesive force that surpasses wafer and boundary layer (also comprising the knockout press that for example when the flange demoulding (Entformen), occurs).If second carrier layer is made up of DU099D type saw film, the adhesive force that radiation that just can be through UV light will be measured according to ASM D 1000 methods drops to 20gr also so prepare separating of second carrier layer and wafer from original 700gr.