CN101360398B - Circuit board construction of inner fovea type conductive column and preparation thereof - Google Patents
Circuit board construction of inner fovea type conductive column and preparation thereof Download PDFInfo
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- CN101360398B CN101360398B CN2007101434370A CN200710143437A CN101360398B CN 101360398 B CN101360398 B CN 101360398B CN 2007101434370 A CN2007101434370 A CN 2007101434370A CN 200710143437 A CN200710143437 A CN 200710143437A CN 101360398 B CN101360398 B CN 101360398B
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- conductive
- insulating barrier
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Abstract
The invention discloses a preparing method of the circuit board structure of a concave conductive pole, which includes that: firstly, a conductive layer is provided; a plurality of conductive poles are formed on a surface of the conductive layer; an insulating layer is formed on the conductive surface which shapes the conductive pole; the top end of the conductive poles is exposed on the surface of the insulating layer relatively far from the conductive layer; the top end exposed by the conductive poles is removed, and the height of the conductive poles is relatively lower than that of the insulating layer and concave inwards the insulating layer. Through the insulating layer replacing a weld-prevent layer, partial conductive layer can be guaranteed not to contact welding material. In additionally, because of the conductive poles being concave inwards the insulating layer, the joint reliability of the welding material and the conductive pole can be improved when collocating the welding material.
Description
Technical field
The present invention relates to a kind of board structure of circuit and manufacture method thereof, and particularly relevant for a kind of board structure of circuit and manufacture method thereof of inner fovea type conductive column.
Background technology
Generally speaking, existing in order to carrying and the circuit board that electrically connects a plurality of electronic building bricks mainly be by a plurality of patterned conductive layers (patterned conductive layers) and a plurality of insulating barrier (dielectric layers) be superimposed constitute.Wherein, these patterned conductive layers are directly to pass through patterning process by copper foil layer (copper foil), or increase conductive layer thickness by copper foil layer through electroplating process and defined through patterning process and form.These insulating barriers are to be disposed at respectively between adjacent these patterned conductive layers, in order to isolate these patterned conductive layers.In addition, be to be electrically connected to each other between these overlapped patterned conductive layers through conduction duct (conductive via).In addition, also configurable various electronic building bricks on the surface of circuit board (for example driving component or passive component), and reach the purpose of electrical signals transmission (electrical signalpropagation) by the circuit board internal wiring.
Fig. 1 is the generalized section of existing a kind of circuit board.Please refer to Fig. 1, the patterned conductive layer 120 of available circuit plate 100 is disposed on the insulating barrier 110, and patterned conductive layer 120 has a plurality of connection pads (pad) 122.Patterning welding cover layer (patterned solder mask layer) 130 is disposed on the insulating barrier 110 with cover part patterned conductive layer 120.Patterning welding cover layer 130 has a plurality ofly opens 132, to expose these connection pads 122 respectively.In addition, these soldered balls (solderball) 140 are disposed on these connection pads 122 respectively and are electrically connected to these connection pads 122 respectively.
Yet, in the manufacturing process of available circuit plate 100, when forming patterning welding cover layer 130, the position of these openings 132 possibly can't be distinguished and accurately aims at these connection pads 122 and produce skew, and it is excessive to make that these connection pads 122 of part (can with reference to the connection pad 122 on figure 1 the right) are patterned the scope that welding cover layer 130 covered.In addition, when image transfer, also might be subjected to reasons such as exposure, under-exposure, development capability deficiency or underdevelopment and cause opening 132 too small.Therefore, when these soldered balls 140 are formed on these connection pads 122 respectively, these soldered balls 140 of part (can with reference to the soldered ball 140 on figure 1 the right) diminish with bonding area between the corresponding connection pad 122, and then the reduction joint reliability between these soldered balls 140 and the corresponding connection pad 122 partly.
Summary of the invention
The object of the invention provides board structure of circuit of a kind of inner fovea type conductive column and preparation method thereof, in order to make the circuit board of inner fovea type conductive column, to make the conjugation grade of welding material and conductive pole better.
The present invention proposes a kind of method of making the board structure of circuit of inner fovea type conductive column, and it comprises: at first, provide a conductive layer; Form the surface of a plurality of conductive poles in conductive layer; Form an insulating barrier on the conductive layer surface that forms conductive pole; Make the top of these conductive poles be revealed in insulating barrier relatively away from a surface of conductive layer; And remove the top that these conductive poles appear, indent is in insulating barrier so that the height of these conductive poles is lower than the insulating barrier height relatively.
In one embodiment of this invention, the step that forms these conductive poles comprises pattern etched (etching) conductive layer.
In one embodiment of this invention, the method for removing the top that these conductive poles appear comprises etching.
In one embodiment of this invention, after removing the top that these conductive poles appear, also comprise configuration one welding material to indent these conductive poles in insulating barrier and evagination in insulating barrier.
The present invention also proposes a kind of method of making the board structure of circuit of inner fovea type conductive column, comprising: at first, provide a conductive layer; Form an insulating barrier on a surface of conductive layer; Form a plurality of ducts in insulating barrier, wherein these ducts manifest the surface of conductive layer; Insert an electric conducting material in these ducts,, make the top of these conductive poles be revealed in insulating barrier relatively away from a surface of conductive layer to form a plurality of conductive poles on the surface of conductive layer; And remove the top that these conductive poles appear, indent is in insulating barrier so that the height of these conductive poles is lower than the insulating barrier height relatively.
In one embodiment of this invention, insert the method for electric conducting material in these ducts and comprise plating (electroplating), wire mark conducting resinl or conducting polymer composite.
In one embodiment of this invention, conducting resinl comprises copper glue or elargol.
In one embodiment of this invention, remove the top that these conductive poles appear after, also comprise configuration one welding material to indent these conductive poles in insulating barrier and evagination in insulating barrier.
The present invention reintroduces a kind of board structure of circuit of inner fovea type conductive column, comprises a conductive layer, a plurality of conductive pole and a patterned insulation layer.These conductive stud are formed in a surface of conductive layer, and electrically connect with conductive layer.Patterned insulation layer is covered in the surface of conductive layer, and wherein the top of these conductive poles is revealed in patterned insulation layer relatively away from a surface of conductive layer, and the height of these conductive poles be lower than the patterned insulation layer height relatively and indent in patterned insulation layer.
In one embodiment of this invention, also comprise a weld material layer, be formed on these conductive poles and evagination in patterned insulation layer.
The present invention can replace the function of welding resisting layer because insulating barrier is formed at the skin of conductive layer, thus can avoid that welding resisting layer needs the contraposition connection pad and causes anti-welding opening skew in the prior art, or the problem of the anti-welding too small openings that is caused during image transfer.In addition,, make welding material can insert insulating barrier and engage effectively with conductive pole because the conductive pole indent is in insulating barrier, and can allow welding material and conductive pole engage the reliability lifting, do not need the additional configuration connection pad yet.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the generalized section of existing a kind of circuit board;
Fig. 2 A～Fig. 2 F is the schematic flow sheet of board structure of circuit of the making inner fovea type conductive column of first embodiment of the invention;
Fig. 3 A～Fig. 3 F is the schematic flow sheet of board structure of circuit of the making inner fovea type conductive column of second embodiment of the invention.
[primary clustering symbol description]
100: circuit board
110: insulating barrier
120: patterned conductive layer
122: connection pad
130: the patterning welding cover layer
132: opening
140: soldered ball
200,300: the board structure of circuit of inner fovea type conductive column
210: conductive layer
210a: patterned conductive layer
212,232: the surface
220: conductive pole
222: the top
230: insulating barrier
240: weld material layer
310: conductive layer
310a: patterned conductive layer
312: the surface
320: insulating barrier
322: the duct
322a: opening
324: the surface
330: conductive pole
332: the top
340: weld material layer
H1, h2, h3, h4: highly
Embodiment
First embodiment
Fig. 2 A～Fig. 2 F is the schematic flow sheet of board structure of circuit of the making inner fovea type conductive column of first embodiment of the invention.Please refer to Fig. 2 A, a conductive layer 210 at first is provided, this conductive layer 210 for example is a metal level, and its material can be copper.Then, please refer to Fig. 2 B, conductive layer 210 is carried out pattern etched, to allow the surface 212 of conductive layer form a plurality of conductive poles 220.In the embodiment that another does not illustrate, conductive pole 220 can also bonding equipment directly breaks into the surface 212 that projection or other suitable mode are formed at conductive layer 210.
Come, please refer to Fig. 2 C, the surface 212 that forms conductive pole 220 at conductive layer 210 forms an insulating barrier 230.Form the mode of insulating barrier 230 on conductive layer 210 and comprise a dielectric material and conductive layer 210 pressing each other, perhaps the mode by the printing dielectric material is formed at insulating barrier 230 on the conductive layer 210.Then, please refer to Fig. 2 D, make the top 222 of these conductive poles 220 be revealed in insulating barrier 230 relative surfaces 232 away from conductive layer 210.For example before dielectric material is uncured with conductive layer 210 and dielectric material pressing till the top 222 of these conductive poles 220 is revealed in dielectric material, till also the processing procedure that can grind again after dielectric material solidifies allows the top 222 of these conductive poles 220 be revealed in dielectric material.
Then, please refer to Fig. 2 E, can remove the top 222 of these conductive poles 220, make the height h1 of conductive pole 220 be lower than the height h2 of insulating barrier 230 relatively by methods such as etchings.In addition, in the present embodiment, when the processing procedure of etching conductive pole 220 carries out, can carry out pattern etched to conductive layer 210 simultaneously, with formation patterned conductive layer 210a, and the step of minimizing processing procedure.Then, please refer to Fig. 2 F, in the present embodiment, finish the top 222 that removes conductive pole 220 after, also can be by electroplating or mode such as printing disposes a welding material in indent in insulating barrier on these conductive poles 220 in 230, to form a weld material layer 240.
That is to say,, can produce the board structure of circuit 200 of an inner fovea type conductive column through after the aforesaid manufacture method.Further, the board structure of circuit 200 of inner fovea type conductive column comprises a conductive layer 210 (patterned conductive layer 210a), a plurality of conductive pole 220 and a patterned insulation layer 230.
Shown in Fig. 2 E, these conductive poles 220 are formed at a surface 212 of conductive layer 210, and electrically connect with conductive layer 210.Patterned insulation layer 230 is covered in surface 212, wherein the top 222 of these conductive poles 220 is revealed in patterned insulation layer 230 relatively away from surfaces 232 of conductive layer 210, and the height of these conductive poles 220 be lower than patterned insulation layer 230 relatively and indent in patterned insulation layer 230.In addition, in Fig. 2 F, the board structure of circuit 200 of inner fovea type conductive column also comprises a weld material layer 240, its be formed on these conductive poles 220 and evagination in patterned insulation layer 230.In addition, conductive layer 210 can be identical with the material of conductive pole 220, and its material comprises copper, aluminium or its alloy.
This mandatory declaration be, the board structure of circuit 200 of inner fovea type conductive column can be applicable to multi-form chip-packaging structure, its external form can be according to designer's demand changes to some extent.In addition, the board structure of circuit 200 of inner fovea type conductive column also can comprise a plurality of conductive layers 220 and a plurality of patterned insulation layers 230 of the configuration that overlaps each other.Therefore, just non-limiting the present invention of present embodiment in order to give an example.In addition, the board structure of circuit 200 of inner fovea type conductive column also is not limited to be made by the manufacture method of present embodiment.
Second embodiment
Fig. 3 A～Fig. 3 F is the schematic flow sheet of board structure of circuit of the making inner fovea type conductive column of second embodiment of the invention.Present embodiment and last embodiment are similar, and its difference is in after: last embodiment is forming conductive pole 220, forms insulating barrier 230 again; Present embodiment then is after forming insulating barrier 320, forms conductive pole 330 again.Detailed process please refer to following explanation, and its resemblance will repeat no more.
Please refer to Fig. 3 A, at first form a conductive layer 310, it has at least one surperficial 312.Then, please refer to Fig. 3 B, form an insulating barrier 320 on the surface 312 that conductive layer 310 forms conductive pole 330 by modes such as pressing or printings.Come again, please refer to Fig. 3 C, insulating barrier 320 is carried out modes such as laser drill or little shadow, in insulating barrier 320, forming a plurality of ducts 322, and manifest the part surface 312 of conductive layer 310.
Then, please refer to Fig. 3 D, for example by printing the mode of filling, plating, sputter or vapour deposition, one electric conducting material is inserted among these ducts 322, form a plurality of conductive poles 330 with the surface at conductive layer 310, wherein the top of these conductive poles 330 can reveal from these ducts 322 respectively.In the present embodiment, electric conducting material comprises copper, copper glue, elargol or conducting polymer composite.Come again, please refer to Fig. 3 E, for example remove the top 332 that these conductive poles 330 reveal, to allow the height h3 of these conductive poles 330 be lower than the height h4 of insulating barrier relatively with etching method.When the top 332 of etching conductive pole 330, also can form patterned conductive layer 310a simultaneously.Follow again, please refer to Fig. 3 F, form a weld material layer 340 on the surface of these conductive poles 330.
Subsidiary one carry be, in another embodiment, by modes such as plating insert electric conducting material in the duct 322 middle the time, also can electroplate the last layer metal on the surface 324 of insulating barrier 320 (shown in Fig. 3 D).Next, can allow the surface 324 of insulating barrier 320 reveal by grinding or etched mode.In addition, in another embodiment, when inserting electric conducting material among these ducts 322, can control the height h3 (shown in Fig. 3 E) of formed conductive pole 330 by configuration one anti-coating in the opening 322a in duct 322 (shown in Fig. 3 C), make the height h3 of conductive pole 330 be lower than the height h4 of insulating barrier (shown in Fig. 3 E) relatively, just can save the step on the top 332 of removing these conductive poles 330.
After aforesaid making, can produce the board structure of circuit 300 (please refer to Fig. 3 F) of an inner fovea type conductive column, be similar to the board structure of circuit 200 (please refer to Fig. 2 F) of the inner fovea type conductive column of last embodiment on its structure.In simple terms, the board structure of circuit 300 of inner fovea type conductive column comprises a conductive layer 310 (patterned conductive layer 310a), a plurality of conductive pole 330 and a patterned insulation layer 320, and wherein, these conductive pole 330 indents are in patterned insulation layer 320.In addition, in Fig. 3 F, the board structure of circuit 300 of inner fovea type conductive column more can comprise a weld material layer 340.
In sum, the present invention can replace welding resisting layer and guarantee that the conductive layer of part can not touch welding material owing to the skin that insulating barrier is formed at conductive layer.Therefore, can avoid existing in welding resisting layer need the contraposition connection pad and cause anti-welding opening skew, or the problem of the anti-welding too small openings that is caused during image transfer.In addition, because the conductive pole indent in insulating barrier, makes welding material can insert insulating barrier, make that structural intensity is preferable, to allow welding material engage effectively with conductive pole.Therefore, welding material promotes with the reliability that engages of conductive pole, does not also need the additional configuration connection pad.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (11)
1. method of making the board structure of circuit of inner fovea type conductive column is characterized in that comprising:
One conductive layer is provided;
Form the surface of a plurality of conductive poles in this conductive layer;
Form an insulating barrier on this surface of this conductive layer;
Make the top of these conductive poles be revealed in this insulating barrier relatively away from a surface of this conductive layer; And
Remove this top that these conductive poles appear, indent is in this insulating barrier so that the height of these conductive poles is lower than this insulating barrier relatively.
2. the method for the board structure of circuit of making inner fovea type conductive column as claimed in claim 1 is characterized in that, the step of described these conductive poles of formation comprises:
This conductive layer of pattern etched.
3. the method for the board structure of circuit of making inner fovea type conductive column as claimed in claim 1 is characterized in that, the method for removing this top that these conductive poles appear comprises grinds or etching.
4. the method for making solderless cushion board structure of circuit as claimed in claim 1 is characterized in that, behind this top that these conductive poles of removal appear, also comprises:
Dispose a welding material to indent these conductive poles in this insulating barrier and evagination in this insulating barrier.
5. method of making the board structure of circuit of inner fovea type conductive column is characterized in that comprising:
One conductive layer is provided;
Form an insulating barrier on a surface of this conductive layer;
Form a plurality of ducts in this insulating barrier, wherein these ducts manifest this surface of this conductive layer;
Insert an electric conducting material in these ducts,, make the top of these conductive poles be revealed in this insulating barrier relatively away from a surface of this conductive layer to form a plurality of conductive poles on this surface of this conductive layer; And
Remove this top that these conductive poles appear, indent is in this insulating barrier so that the height of these conductive poles is lower than this insulating barrier relatively.
6. the method for the board structure of circuit of making inner fovea type conductive column as claimed in claim 5 is characterized in that, inserts the mode that the method for this electric conducting material in these ducts comprises printing filling, plating, sputter or vapour deposition.
7. as the method for the board structure of circuit of claim 5 or 6 described making inner fovea type conductive columns, it is characterized in that the electric conducting material of inserting in these ducts comprises copper or conducting polymer composite.
8. as the method for the board structure of circuit of claim 5 or 6 described making inner fovea type conductive columns, it is characterized in that the electric conducting material of inserting in these ducts comprises copper glue or elargol.
9. the method for making solderless cushion board structure of circuit as claimed in claim 5 is characterized in that, behind this top that these conductive poles of removal appear, also comprises:
Dispose a welding material to indent these conductive poles in this insulating barrier and evagination in this insulating barrier.
10. the board structure of circuit of an inner fovea type conductive column is characterized in that comprising:
One conductive layer;
A plurality of conductive poles are formed at a surface of this conductive layer, and electrically connect with this conductive layer; And
One patterned insulation layer is covered in this surface of this conductive layer, and wherein the top of these conductive poles is revealed in this insulating barrier relatively away from a surface of this conductive layer, and the height of these conductive poles be lower than this insulating barrier relatively and indent in this insulating barrier.
11. solderless cushion board structure of circuit as claimed in claim 10 is characterized in that, also comprises a weld material layer, be formed on these conductive poles and evagination in this insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101434370A CN101360398B (en) | 2007-07-31 | 2007-07-31 | Circuit board construction of inner fovea type conductive column and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101434370A CN101360398B (en) | 2007-07-31 | 2007-07-31 | Circuit board construction of inner fovea type conductive column and preparation thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101360398A CN101360398A (en) | 2009-02-04 |
| CN101360398B true CN101360398B (en) | 2010-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101434370A Expired - Fee Related CN101360398B (en) | 2007-07-31 | 2007-07-31 | Circuit board construction of inner fovea type conductive column and preparation thereof |
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| CN (1) | CN101360398B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101865123B1 (en) * | 2011-10-31 | 2018-07-13 | 해성디에스 주식회사 | Method for manufacturing substrate with metal post and substrate manufactured by the same method |
| CN105451473A (en) * | 2014-09-02 | 2016-03-30 | 富葵精密组件(深圳)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN105636365B (en) * | 2014-10-27 | 2018-03-13 | 健鼎（无锡）电子有限公司 | The preparation method of pinboard |
| CN114205989A (en) * | 2020-09-17 | 2022-03-18 | 欣兴电子股份有限公司 | Circuit board and method for manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6674017B1 (en) * | 1998-12-24 | 2004-01-06 | Ngk Spark Plug Co., Ltd. | Multilayer-wiring substrate and method for fabricating same |
-
2007
- 2007-07-31 CN CN2007101434370A patent/CN101360398B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6674017B1 (en) * | 1998-12-24 | 2004-01-06 | Ngk Spark Plug Co., Ltd. | Multilayer-wiring substrate and method for fabricating same |
Non-Patent Citations (3)
| Title |
|---|
| JP特开平8-236240A 1996.09.13 |
| JP特开平9-260793A 1997.10.03 |
| 全文. |
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| CN101360398A (en) | 2009-02-04 |
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