CN101317102A - Modular unit for a radar antenna array with integrated HF chip - Google Patents

Abstract

The invention relates to a modular unit for a radar antenna array with integrated HF chip (100). Said modular unit comprises at least one microwave structure antenna element, and a focusing element (200) disposed in the beam path of the radar antenna array upstream of the at least one antenna element by means of which an amplified illumination of the HF chip (100) is achieved. The invention is characterized by an add-on device (115, 120) which allows addition of focusing elements (200) of various antenna characteristics to the modular unit. The add-on device is preferably configured by fastening means such as clamp-on elements (120), plug-in elements or the like. Positioning elements (115) can be additionally provided and are used to add the focusing element (200) to the modular unit with the required precision.

Description

The modular unit that is used for the integrated HF chip of having of scanner unit

Technical field

The present invention relates to modular unit preamble, that be used for scanner unit and a focusing block and a corresponding scanner unit according to corresponding independent claims.The invention still further relates to the method that is used to make this modular unit in addition according to the preamble of affiliated independent claims.

Background technology

Scanner unit with a HF chip is learnt by EP 1 121 726 B1.The HF chip has the emission/receiving element of the form of known microwave structure (Mikrowellenstruktur).This device also comprises so-called " dielectric rod " (" Polyrod "), promptly be located at the dielectric radiator or the prefocus body (focusing block) of each antenna element front in the radiation path of antenna assembly, rod radiator for example can reach the better irradiation of dielectric lens (resonator) and reach the prefocus of radar beam thus by it.

Only when accurately locating, the relative HF chip of focusing block could guarantee that this focusing gathers the intact function of element, even because also can cause the angle mismatching of crossing irradiation, transmitted wave of lens or the enhancing of the electromagnetic coupled between the adjacent media rod in many radiating systems to the very little deviation of desirable installation site.Distance in the described there scanner unit between microwave conductor structure and the dielectric rod downside by one apart from holding device can 0 and 0.2mm between scope in free adjustment.

Also known HF chip such as common SMT printed circuit board device with integrated antenna is applied on the bar grid, and this chip is by the pressure welding silk and terminal electrically contacts and the chip that then will apply like this buries by the mould material envelope.Described SMT (surface mounting technology) technology allows parts directly are weldingly fixed on the printed circuit board (pcb) knownly.But on this member, there is not rod radiator with resonator.

What be worth expectation is, a kind of modular unit is provided, can integrated aforesaid HF chip in this modular unit, wherein can satisfy the described high request of beginning to setting accuracy.Should allow simultaneously use-case as far as possible simply as described the SMT technology or the hole contact technique (Lochkontakttechnik) that the technician was familiar be installed on the low printed circuit board of cost.

Summary of the invention

Modular unit according to the present invention comprises an erecting device or mounting interface, by this erecting device or mounting interface the focusing block of different antennae characteristic or radiation characteristic is installed on the modular unit simply, for example clamping or be plugged on the modular unit.This has its advantage, can just determine the respective application of this scanner unit relatively behindhand on assembly line, that is, which focusing block is installed for the modular unit that is used for corresponding radar antenna application.

Described erecting device also comprises locating device and clamping device, by them the focusing block of a focusing block formation rod radiator, that have any radiation characteristic for example can be installed, this focusing block has positioning element and the hold assembly adaptive with modular unit.

Therefore the result provides a kind of scanner unit according to the present invention, this scanner unit has the modular unit of a radiator general and that be equipped with one or more different radiation characteristics, this modular unit can be made by printed circuit board assembling (Leiterplattenmontage) favourable on simple and the cost, promptly is similar to the described SMT member of beginning.

HF chip with integrated antenna sheet preferably has the surface of contact that is used for the flip-chip projection, by these surface of contact the HF chip is installed on the modular unit very simply.These flip-chip projectioies can be applied on the chip or be applied to chip and install on the conductor part in the case.

According to the first preferred solution, modular unit is made under the situation of using a heating radiator and a mould material by a 2-1/2-MID-SMT plastic components that has " (eingefliptem) that snap in " HF chip.It according to the manufacture method of a conversion of module of the present invention the known flip chip technology (fct) of the HF chip on the printed circuit board of a flexibility.The printed circuit board that has the HF chip in the case bonds to has a flat or only contact contact in the plastic components of crooked face in one direction.A heating radiator is bonded in the groove of correspondingly constructing of plastic components like this, and the feasible back side with the HF chip forms thermo-contact.Last modular unit is finished by mould material.

According to the second preferred solution, (be preferably: rod radiator) modular unit of Gou Chenging is fixed on the carrier member in this wise by a HF chip and a focusing block, preferably be inserted in the carrier, make the back side of HF chip and this carrier member form thermo-contact.Here this thermo-contact also can improve by bonding or welding accordingly.The HF chip then is fixed on the rod radiator of correspondingly constructing in the case, promptly preferably is clamped in the rod radiator.A NF printed circuit board that cost is low is set on this carrier simultaneously, and this NF printed circuit board is perforated in described zone.Required the electrically contacting then of HF chip contact and printed circuit board realizes by traditional NF lead-in wire bonding (Drahtbonds).Should be poured into a mould in the zone then, so that be filled owing to the required separation distance between the resonator on HF chip and the rod radiator works the free space that pre-exists.Here not having SMT member and radiation characteristic is determined by rod radiator at the very start.

The electrical contact of HF chip is not focused parts and (is preferably: rod radiator) cover, do not have being connected of electric current between HF chip and rod radiator in this scheme.

According to the 3rd preferred solution, undressed HF chip is fixed on the carrier member that is provided with platform with being positioned, preferably is bonded on this carrier member or is welded on this carrier member.This carrier member also is used as heating radiator in the case.The rod radiator that has resonator then is inserted in this carrier member on the HF chip with locating, makes rod radiator be supported on the ground mat (Massepads) of HF chip with its interval holding device.This chip is by traditional lead-in wire bonding and printed circuit board electrically contacts and poured into a mould then.This electrically contacts can be before the installation rod radiator or to carry out afterwards.Here there is not the HF module, but constitutes a HF unit by standard technology in electronic circuit inside.

Can in the optimized frequency scope of about 70-140GHz, work according to modular unit of the present invention.

Description of drawings

Describe the present invention hereinafter with reference to accompanying drawing in detail by embodiment, can obtain further feature of the present invention and advantage by these embodiment.Feature identical or that function is identical is denoted by like references in the accompanying drawing.

Expression respectively in the accompanying drawing:

Fig. 1 a: a vertical view of seeing from oblique upper of having made according to modular unit of the present invention;

Fig. 1 b a: sectional view of modular unit shown in Fig. 1;

Fig. 2 a, b: according to the vertical view of the tilted direction of modular unit of the present invention, wherein (a) is according to manufacturing of the present invention and assembles figure preceding, that promptly represent with the figure that disintegrates, and reaching (b) is according to figure after the assembling of the present invention and that comprise a mounted rod radiator (focusing block);

Fig. 3 a-c: the vertical view that has before the load module unit three different rod radiators (a-c) of (below) behind (top) and load module unit according to the tilted direction of modular unit of the present invention;

Fig. 4: according to the oblique below view of second embodiment (seeing described second preferred version) of the focusing block of positioning supports mechanism that has a HF chip that is used to pack into of the present invention and clamping device;

Fig. 5 a-c: according to three different views of the focusing block of the present invention of second embodiment (seeing described second preferred version), wherein for the following view (b) that has the top view (a) of the HF chip of inserting, have the HF chip of inserting and adhesive linkage and be installed in according in the carrier body that is provided with pedestal of the present invention and the top view (c) of the focusing block that has electrically contacted;

Fig. 6 a: according to two sectional views of the focusing block that installs and poured into a mould of second embodiment (seeing described second preferred version); And

Fig. 7 a, b: an embodiment according to the focusing block of the present invention of the 3rd embodiment (seeing described the 3rd preferred version) wherein has one and is pressed in and is bonded in the resonator (a) on the thin slice and have a resonator (b) that directly is pressed on the focusing block.

Embodiment

Shown in Fig. 1 a and 1b and Fig. 2 a and the 2b, of the present invention for the modular unit of printed circuit board technology manufacturing comprises a high frequency (HF) chip 100, this high frequency chip has the integrated antenna sheet that can not see in the drawings and has 160 and heating radiators 105 that are made of metallic stamping pieces of partly appreciable flip-chip projection in the sectional view of Fig. 1 b.

HF chip 100 and heating radiator 105 are set on the matrix (to call " carrier body " in the following text), and this matrix is by (=the plastic injection piece Polyeterimide) made is made and it has locating device 115 and the clamping device 120 determined that is used for unshowned focusing block (be in the present embodiment a rod radiator-see the label 200 of Fig. 2 a and 2b) here with PEI.

Locating device 115 and clamping device 120 with have that (=the pin 125 that contacts conductor structure 130, set MID) made mechanically is connected by the 2-1/2 Coinjection molding apparatus.The all functions parts are saved the plane and are saved ground, space and are provided with mutually nestedly.Rod radiator shown in Fig. 2 especially has the focusing block 200 of radiation characteristic that made by dielectric, predetermined, and it has locating device 205 and the clamping device 210 adaptive with matrix 110.Focusing block 200 is made up of a conical radiating element 215 with " radiator base portion " 217 of arranging towards HF chip 100.Radiating element 215 flexibly is arranged on two on two contact pin parts 220 of centre extension in the present embodiment.On Fig. 2 a, also can see being arranged on and be used for the cast passage 225 that vacuum is poured into a mould in the radiator base portion.

HF chip 100 with integrated in known manner antenna sheet and described flip-chip projection at first is loaded in the carrier body 110 of (" snapping in ") modular unit and thus can not be in sight in Fig. 1 a.This flip chip technology (fct) itself has had necessary good alignment tolerance.Except contactless HF sheet-resonator zone of transition, also make all low frequencies (NF) contact of having finished the contact pin 125 that is used for HF chip 100.In the case on the conducting plane of carrier body 110, promptly the antenna sheet of HF chip top also produces a corresponding resonator sheet together, that is to say No Surcharges.

On a surface of contact between the back side of heating radiator 105 and HF chip 100 or apply welding flux layer or apply bond layer, for example use known dispensing punch stamping technique (Dispensstempeldrucktechnik) to apply.In the carrier body 110 that is provided with respective slot and HF chip 100, insert heating radiator 105 and bonding or welding with the back side of HF chip 100.

Be fixed in this wise on the carrier body 110 according to present embodiment focusing block 200, i.e. being clamped and connected shown in Fig. 2 b for example by clamping device 210 at its x, y setting accuracy aspect improves like this, and promptly clamping device 210 is made up of the functional part that is arranged on the movable spring part 220.

(Fig. 1 a) follows from the back side pore-free ground cast as far as possible and preferably carries out under the vacuum condition of having stated with mould material 135 current structural unit.For example can consider to use (soft) silica gel or (firmly) epoxy resin as mould material, because the damping action that exists in principle of the mould material 135 in the minimum gap of the about 100 μ m between HF chip 100 and resonator (for example seeing Fig. 7 a label ' 700 ') shows not have the shortcoming that can measure.

This modular unit shown in Fig. 1 b in addition, the hot tie-in between not shown for brevity mould material 135 and not shown HF chip 100 and the heating radiator 105.

Conversion ground, modular unit can be from the downside of a printed circuit board 800 by the respective openings the printed circuit board 800, promptly connect by common pin-hole and be inserted into and then just weld mutually with other electronic component.Be arranged in the positioning element that a rod radiator on the plastic components is inserted into modular unit and also " be held ".

In the pouring can of carrier body 110 and cast passage 150, apply at last (unshowned) another mould material of the amount of determining here, on this carrier body, centrally be provided with the radiator base portion 217 (Fig. 2 b) of radiating element 215 basically.Upwards rise in the base portion of the radiating element of this another mould material on respective channel, so that between carrier body 110 and radiating element 215, do not form air gap.

The radiation characteristic of focusing block 200 can be predetermined arbitrarily.For example in Fig. 3 a-3c, provided the example of the possible different configuration of focusing block 200 or preferred cone of radiation element 215.Each top figure of Fig. 3 a-3c represents to be installed to the corresponding layout that each focusing block 200 before the carrier body 110 and each bottom component then represent to be installed to the later focusing block 200 of carrier body 110.Focusing block 200 preferably reaches advantageously to be installed to be clamped on the carrier body 110 and then to water in pouring can 150 by clamping device 210 later on the printed circuit board at carrier body 110 and outpours radiator base portion 217.Conversion ground, this focusing block also can be installed to printed circuit board at carrier body 110 and install in the past.

Basically be each different configuration of cone of radiation element 215 and corresponding radiator base portion 217 in the difference of the form of implementation of the focusing block 200 shown in Fig. 3 a-3c.Fig. 3 a represents to have the focusing block 200 of the radiator base portion of having been poured into a mould 217, and the focusing block 200 of the no mould material of each expression of Fig. 3 b and 3c.

Focusing block 200 shown in Fig. 3 a is corresponding to the configuration shown in Fig. 2 a and the 2b.In the focusing block shown in Fig. 3 b 200, the taper trend of cone of radiation element 215 is opposite with the trend shown in Fig. 3 a.As can clearlyer seeing ground by the bottom component of Fig. 3 b, the radiating element 215 of taper is configured microscler stretching, extension.Based on this version of radiating element 215, the horizontal contact pin in Fig. 3 a makes the transition and is (vertical) post 220 '.The embodiment of the focusing block 200 shown in Fig. 3 c has one and similar (longitudinally extending equally) radiating element 215 of Fig. 3 b, but it is to be configured to same microscler stretching, extension on the direction of relative Fig. 3 b quadrature.Radiating element 215 is fixed on by contact pin 220 in addition " on the hexgonal structure constituting, these contact pin are again by vertical contact pin 220 " carry out the transition in the clamping device 210.

Focusing block 200 comprises the contact pin 220 or 420 that the surperficial face of described relative HF chip 100 is outwards drawn abreast in these embodiments.In these contact pin 220, respectively has post 220 ' that is relatively little or short, that have the locating device that is used for surface level.Be implemented as the spring of (unshowned) fixed part that is used to be positioned at HF chip surface outside according to the contact pin in the embodiment of Fig. 4 to 7 420.This spring is by sizing like this, and the small distance that makes pillar 715 at interval make the downside of focusing block 200 to determine with relative piece element, for example 150 μ m are supported on the HF chip 100, the rising that has wherein absorbed vertical tolerance chain and suppressed to be caused by axial vibration.In the case also advantageously, be provided with conductor surface below the pillar 715 of interval on HF chip 100, these conductor surfaces always are connected with ground by the deposited plating of the through hole in the HF chip 100 and have prevented harmful electrostatic charge thus.Here the earth conductor face is selected greatly in this wise, makes that under the situation of all positions of related features of focusing block 200 surface of contact of pillar 715 can not exceed conductor surface at interval.HF chip 100 be positioned at electrically contacting of outside NF and ZF circuit and be connected 500 by simple bonding and realize, wherein except that direct current supply voltage, only transmit low frequency signal and reach thus printed circuit board and can make as " FR4 " by the low material of a kind of cost.

Fixing on the identical carrier parts 110 that HF chip 100 always also is installed thereon of the contact pin 220 of focusing block 200 carried out in described embodiment.First embodiment that is made by PEI with carrier body wherein differently, carrier body 110 is made (as among first embodiment by good (preferable alloy) material of a kind of heat conduction in second and third embodiment (Fig. 4-6 and Fig. 7), be used to provide heating radiator), for example make by the MIM technology, advantageously with platform 145 manufacturings adaptive with chip size with Zn, Al die-cast metal, Mg die-cast metal or steel.Therefore make originally HF chip 100 expensive installing and locating be transformed into carrier body 110 very accurately and the low manufacturing of cost.HF chip 100 is by bonding or be welded on the platform 145.But for welded H F chip 100, carrier body 110 is preferably formerly by electroplating processes correspondingly.

The fixing z-of focusing block 200 and x/y-location positioning also are that cost is low and cooperation is accurate, because can carry out on a lathe with the manufacturing of platform 145.In such embodiment, location positioning realizes by the hole, and these holes are made with the fixing pin of usefulness and accurately cooperate.These holes and pin can be designed to press fit each other or clearance fit in the case.These parts crimping each other when mounted in the former case, and when clearance fit, be bonded to each other.A fixing means to this conversion is that the use of having described is used for focusing block 200 clamping and fixing devices.

At the focusing block shown in Fig. 7 a-7b corresponding to these embodiment according to modular unit of the present invention, HF chip 100 is by bonding or be welded on the carrier body 110 and the plastic components that will have focusing block (being rod radiator here) 200 is then accurately located on this HF chip and is installed on the carrier body 110 in these embodiments, and wherein platform 145 is similar to Fig. 6 and is used for accurately locating HF chip 100.For low Al of cost or the die-cast part of Mg, in order to reach tens microns degree of accuracy, fixed orifice after die casting is made must on the edge of table on x and y direction by finishing.But for make this finishing reduce to minimum or even avoid this finishing fully, embodiment shown in Fig. 4 of focusing block 200 removes has functional part commonly known in the art as spacer pin, spring, fixed pin 400 towards HF chip 100 surface arrangement, 405 or clamping and fixing device also additionally have outward the x-y-positioning supports mechanism 410 that is used to receive HF chip 100,415, by these positioning supports mechanisms four sides of focusing block 200 relative HF chips 100 are accurately located.The geometry of focusing block 200 is designed in this wise in the case, makes that being used to electrically contact required face above the HF chip 100 can freely be touched.

In the above-described embodiments, more favourable although it is installed on the simpler and cost of relative prior art, the high mechanical degree of accuracy that is based on the required parts of the frequency range of preferred radar wave in 77GHz to 122GHz scope still is reached.And advantageously, cancelled appear on the stage 145 described edge finishing of carrier body.

When this carrier body is advantageously made by Zn die-casting technique or MIM technology, can fully phase out the finishing of the machinery of metallic carrier parts 110.Because the parts with these two kinds of method manufacturings have had desired little manufacturing tolerance.

According to the embodiment shown in Fig. 4, at first HF chip 100 is bonded in the focusing block 200 or by the positioning supports mechanism 410,415 shown in Fig. 4 and is held.Described in the case positioning supports mechanism 410,415 can be configured to folder at least one direction of both direction (x direction and y direction), they can be used for gripping then.Grip if abandon, wherein the position of related features of HF chip 100 relative resonators is still sufficiently good, then can apply a spot of bonding agent on the appropriate location of focusing block 200 or HF chip 100, so that HF chip 100 is not fixed not tear-awayly.Pillar 715 is favourable at this at interval, by these interval pillars, need not add cost and can reach the accurate distance of resonator 700 to HF chip 100 lip-deep antenna elements.

The register pin 405 that is arranged on the respective end of spring 420 can be designed to clearance fit, makes not produce degree of depth restriction (Tiefenanschlag) after the installation between focusing block 200 and carrier body 110.Except that register pin 405, also have at least another to be arranged on a pin 400 (" clamp pin ") on the spring 420 that separates with register pin 405.In carrier body 110, be provided with corresponding (unshowned) mating holes (" folder hole ").The axis of the axis of clamp pin 400 and affiliated folder hole is like this arranged with staggering in the case, make that after installation clamp pin 400 is together with spring 420 distortion and the seamed edge that is hooked in folder hole relatively sharply on the downside of structure and focusing block 200 is fixed on the carrier body 110 reliably.

In order to simplify the installation of corresponding focusing block 200, clamp pin 400, register pin 405 and folder hole are provided with a corresponding clamping backstop 425 that is used for carrier body in the present embodiment each other.The length of clamp pin 400 is selected like this, makes the face of arranging towards spring 420 on clamp pin 400 ends 425 contact with the face of carrier body 110.To guarantee by this installation backstop: spring 420 can excessively do not stretched and after when modular unit being installed in the carrier body 110 HF chip 100 still with its back side by touching on the platform 145 of carrier body 110, this also constitutes heating radiator.Register pin 405 preferably is made to such length, makes that these register pins can automatically be imported in the corresponding folder hole of carrier body 110 when clamp pin 400 is installed.It is more strong than corresponding clamp pin 400 and spring 420 thereof that each register pin 405 and/or its spring 420 are designed to be, and guarantees the uncoupling (Entkopplung) of positioning function and holding function thus.

After installing fully, as described above, carrier body 110 is poured into a mould.Be provided with cast stop (Vergussstopp) 600 at the back side of carrier body 110.Between focusing block 200 and carrier body 110, can cancel above-mentioned bonding agent in this embodiment.The described required machining of platform 145 and register pin 405 and folder hole also can be advantageously from the same side, promptly carry out without rotation vector parts 110 ground.Decide also can fully phase out the finishing of machinery on the manufacture method of carrier body 110.

Two clamp pins 400 rather than at least one above-mentioned clamp pin 400 respectively are set on each register pin 405 next door in configuration shown in Figure 4.Reaching the power distribution that on the HF chip, obtains symmetry on the focusing block thus.

Above-mentioned HF chip has self a antenna structure, that is to say that the high-frequency signal that is provided by the HF chip is not to be directed on the distribution network (Verteilnetzwerk) that is arranged on the described printed circuit board by described bonding or described flip chip technology (fct).Even adopted expensive and bothersome bonding, in described frequency range, will obtain more and more poor characteristic usually.For example a kind of bonding scheme of special enforcement is also enough when 77GHz, and can not use when 122GHz at all, because signal virtually completely is reflected owing to bonding.Therefore printed circuit board can be made by the low traditional material of cost (FR4).

In all embodiments, all having one according to modular unit of the present invention is arranged in the HF chip and determines more than 100 that the second last resonator sheet 700 of distance is (at Fig. 2 b, 4, the rectangle of appreciable centre among 7a and the 7b), this second resonator sheet is arranged on the dielectric substrate, for example has on the Kapton thin slice 730 of copper conductor layer.Substrate also comprises also that with one a carrier body focusing block 200, that be fit to is permanently connected on its downside, for example bonding.Thin slice 730 has positioning hole corresponding 740 in the case, and these holes are corresponding with the interval pillar 715 of focusing block 200.

Conversion ground, the second resonator sheet also can directly be arranged on the downside of carrier body 110 or be applied in the there.Applying of the required thin conductor layer of thickness on described plastic injection piece＜50 μ m can be implemented as the 3D-MID method of having stated by known method, these methods for example comprise hot-pressing technique (

) and two kinds of methods of glue headgear seal technology (Tampoprinttechnik).

Fig. 5 a-5c represents the different views of the embodiment shown in Fig. 4 of focusing block 200, and Fig. 5 a represents to have the oblique upper view of the HF chip 100 of having inserted, and Fig. 5 b represents to have the oblique below view of the HF chip 100 of having inserted.Fig. 5 c represents the vertical view of mounted assembly, focusing block 200 and HF chip 100.In Fig. 5 c, also can see the layout of HF chip to the bonding wire 500 of printed circuit board.Because HF chip 100 is bonded on the carrier body 110, after inserting HF chip 100 or after the back side of HF chip 100 clamps this HF chip, can apply described bonding agent, make the simultaneously wetting positioning supports of this bonding agent mechanism 410,415 reach makes HF chip 100 be positioned in the focusing block 200 thus with getting loose.In this embodiment, no matter HF chip 100 still is a focusing block 200 is fixed on the carrier body 110 together.The bonding agent that is used for HF chip 100 formerly is applied to current metal platform 145 also convertiblely.Fixing with clearance fit and needing under the situation of bonding agent at focusing block 200 and carrier body 110 thus, can be before installation with bonding agent or be applied on the focusing block 200 or be applied on the carrier body 110.Between carrier body 110, focusing block 200, the HF chip 100 and the HF chip on the space that be full of air of pin between the plane of the coboundary of printed circuit board 800 of bonding wire 500 be filled with mould material.

Shown in Fig. 6 a and the 6b presentation graphs 5a, be installed in two orthogonal cross-sections figure of the focusing block 200 on the carrier body 110, wherein Fig. 6 a represents that Fig. 6 b represents along a cross section of the cross-sectional axis ' C ' shown in Fig. 5 c along the ladder cross section of two cross-sectional axis that stagger abreast ' A ' shown in Fig. 5 c with ' B '.Heating radiator of label 110 indications in two Fig. 6 a and 6b, label 600 is indicated housing bottom, another printed circuit boards or is had the external parts of cast stop function.In the figure shown in Fig. 6 a, especially can see contact pin 500 and the spring 420 and the side curve of clamp pin 400 of HF chip 100 with register pin 405.

In installation steps, focusing block 200 is inserted in the pilot hole of relative set by two register pins 405 on the upper side of the carrier body 110 shown in Fig. 6 a and the 6b.Carry out electrically contacting of HF chip 100 and printed circuit board 800 by contact pin (bonding wire) 500 then.Then as described above the space that is full of air is filled with mould material 135.

At last, Fig. 7 a and 7b represent two embodiment of focusing block 200, one of them resonator 700 be positioned in a HF chip 100 of also not packing into above.In embodiment, be arranged in a resonator 700 on the independent carrier sheet 730 and be bonded in focusing block 200 according to Fig. 7 a.Four interval pillars 715 that are determined to the predetermined distance of HF chip 100 are configured for x-, the y-register pin of thin slice 730 and resonator 700 simultaneously by pilot hole (through hole) 740.

Fig. 7 b represents an embodiment, and wherein resonator 700 directly is pressed on the focusing block 200.Be provided with post 705,710 in end two relative radiating element 215 symmetric arrangement and that constitute the contact pin 420 of spring, each is made up of these posts a substrate 710 and a clamp pin or the fitting pin 705 from below spray to cast or assembling that has a sightless hole 720 of opening from the top.Focusing block 200 (unshowned) have in the carrier body 110 of the HF chip 100 that assembles fixing by described fitting pin 705 by the position thereon the hole and be used for plane erecting tools, that be configured on substrate 710 upper sides and realize.

Spring 420 has pure installation function.Guarantee thus at interval pillar 715 before cast by touching on the HF chip.Mould material embeds whole unit then, so no longer need the spring confining force.Be embedded into largely at Fig. 7 b medi-spring arm 420.Especially suppressed mechanical vibration by this embedding, otherwise this mechanical vibration meeting causes reaching on the rodlike resonator 200 power of not expecting on the surface of HF chip 100.

Claims (34)

1. be used for the modular unit of scanner unit, have:

One integrated HF chip (100), this HF chip has the antenna element that at least one has microwave structure;

One is arranged on the focusing block (200) of described at least one antenna element front in the radiation path of this scanner unit, reach the radiation of the enhancing of described HF chip (100) by this focusing block, it is characterized in that an erecting device (115,120), the focusing block (200) of different antennae characteristic can be installed on the described modular unit by this erecting device.

2. according to the modular unit of claim 1, it is characterized in that: in described scanner unit radiation path, between described HF chip (100) and described focusing block (200), be provided with a resonator (700).

3. according to the modular unit of claim 1 or 2, it is characterized in that: a described focusing block (200) and/or a resonator carrier member (730) are made by dielectric.

4. according to one modular unit in the above claim, it is characterized in that: described focusing block (200) is made of a rod radiator with any antenna performance.

5. according to one modular unit in the above claim, it is characterized in that: described erecting device is made of some mechanical fixed mechanisms (120), described focusing block (200) and/or described HF chip (100) preferably removably can be connected with described modular unit by them.

6. according to the modular unit of claim 5, it is characterized in that: described fixed mechanism (120) is made of clamping device, plug assembly or similar device.

7. according to the modular unit of claim 6, it is characterized in that: additionally be provided with some locating devices (115), described focusing block (200) be installed on the modular unit with required degree of accuracy by them.

8. according to the modular unit of claim 7, it is characterized in that: described locating device (115) is made of clamping device, plug assembly or similar device.

9. according to one modular unit in the above claim, it is characterized in that: described HF chip (100) has some flip-chip projectioies, described HF chip (100) can be installed in the described modular unit by these flip-chip projectioies.

10. according to one modular unit in the above claim, it is characterized in that: this modular unit is made of a 2-1/2-MID-SMT plastic components with the HF chip that snaps in.

11. according to one modular unit in the above claim, it is characterized in that a carrier body (110), it is made by a kind of material of heat conduction, preferably make by Zn-, Al-or Mg die-cast metal or by the metal of the linear expansivity with little heat, wherein said carrier body (110) is made by MID technology (metal injection device " Metall-Injected-Devices ").

12. according to one modular unit in the above claim, it is characterized in that one with the adaptive platform (145) of size of described HF chip (100), this installation auxiliary device when described HF chip (100) is installed.

13. according to one modular unit in the above claim, it is characterized in that: described fixed mechanism (120) and/or described locating device (115) are equipped with at least one folder backstop (425).

14. according to one modular unit in the above claim, it is characterized in that: described fixed mechanism (120) always is provided with doubly, goes up and the power of symmetry on described HF chip (100) distributes at described focusing block (200) guaranteeing.

15., it is characterized in that second resonator that a described relatively HF chip (100) is arranged with preset distance according to one modular unit in the above claim.

16. the modular unit according to claim 15 is characterized in that: described second resonator is applied on the dielectric substrate.

17. the modular unit according to claim 16 is characterized in that: described dielectric substrate is connected with dielectric carrier parts, and this carrier body also comprises a focusing block (200).

18. the modular unit according to claim 17 is characterized in that: described second resonator is set directly on the downside of described dielectric carrier parts (110).

19. the modular unit according to claim 18 is characterized in that: the described dielectric substrate that has resonator (700) is by the relative HF chip (100) of preferred four space keepings (715) location.

20. according to one modular unit in the above claim, it is characterized in that: described focusing block (200) keeps by a spring, this spring is embedded in the mould material (135).

21. according to one modular unit in the above claim, it is characterized in that: all members and functional part are saved the plane and are saved ground, space and arrange mutually nestedly.

22. be used in according to the focusing block (200) in one the modular unit in the above claim, it is characterized in that an erecting device (115,120), this focusing block can be installed on this modular unit by this erecting device.

23. the focusing block according to claim 22 is characterized in that: described erecting device is made of some fixed mechanisms (120), described focusing block (200) removably can be connected with described modular unit by these fixed mechanisms.

24. the focusing block according to claim 23 is characterized in that: described fixed mechanism (120) is made of clamping device, plug assembly or similar device.

25. according to the focusing block of claim 23 or 24, it is characterized in that some locating devices (115), described focusing block (200) is installed on the described modular unit with required degree of accuracy by these locating devices.

26. according to one focusing block in the claim 22 to 25, it is characterized in that: this focusing block is by the dielectric manufacturing.

27. according to one focusing block in the claim 22 to 26, it is characterized in that: this focusing block is configured to have the rod radiator of any antenna performance.

28. the focusing block according to claim 27 is characterized in that: the difference of different focusing block (200) is the configuration in the different space of cone of radiation element (215) and radiator base portion (217).

29. the focusing block according to claim 28 is characterized in that: the microscler stretching, extension of described cone of radiation element (215) ground constitutes.

30. have the scanner unit of an integrated HF chip, it is characterized in that one according to one modular unit and/or in the claim 1 to 21 according to one focusing block in the claim 22 to 29.

31. be used for making be used for scanner unit, that have an integrated HF chip, according to the method for the modular unit of one of claim 1 to 21, it is characterized in that: described focusing block (200) is installed on the described modular unit by described erecting device (115,120).

32. the method according to claim 31 is characterized in that: the carrier body (110) of a dielectric of described modular unit is fixed on the upper side of printed circuit board by at least two register pins (140).

33. the method according to claim 11,32 or 33 is characterized in that: in carrier body (110), insert contact pin (125) and conductor structure (130), this carrier body by the 2-1/2 Coinjection molding apparatus (=MID) make.

34. the method according to claim 33 is characterized in that: described resonator (700) is made with described conductor structure (130).

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