CN101314196A - Laser beam machining apparatus - Google Patents
Laser beam machining apparatus Download PDFInfo
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- CN101314196A CN101314196A CNA2008101001805A CN200810100180A CN101314196A CN 101314196 A CN101314196 A CN 101314196A CN A2008101001805 A CNA2008101001805 A CN A2008101001805A CN 200810100180 A CN200810100180 A CN 200810100180A CN 101314196 A CN101314196 A CN 101314196A
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- 238000003754 machining Methods 0.000 title description 79
- 238000012545 processing Methods 0.000 claims abstract description 140
- 230000010287 polarization Effects 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 27
- 238000013507 mapping Methods 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 11
- 230000006870 function Effects 0.000 description 8
- 230000006386 memory function Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
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- 230000010355 oscillation Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000631 nonopiate Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention acquires a laser processing device capable of narrowing the difference of processing qualities of two beams of lasers in synchronous multi-point irradiation laser processing device, so as to realize improvement of processing quality. The laser processing device includes: a first polarization unit which divides a beam of laser into 2 beams of lasers (Lalpha, Lbeta) having different light paths; an electric scanner which is configured on the light path of the laser (Lalpha) such that the laser (Lalpha) scans in a first direction on a XY worktable; another electric scanner which is configured on the light path of the laser (Lbeta) such that the laser (Lbeta) scans in a second direction on the XY worktable different than the first direction; a second polarization unit which mixes two beams of lasers; a pair of main electric scanners which enable the lasers (Lalpha, Lbeta) to scan in a third and fourth directions that are mutually different on the XY worktable; and a ftheta lens which respectively condenses the lasers (Lalpha, Lbeta) from the main electric scanners on designated positions of processed objects.
Description
Technical field
The present invention relates to a kind of so that machined objects such as printed base plate are carried out the laser processing device that perforate is processed as main purpose, particularly a kind of multiple spot irradiation type laser processing device when being purpose to boost productivity.
Background technology
Currently proposed a kind of laser processing device, it will be 2 bundles from 1 bundle laser beam split of LASER Light Source in order to boost productivity, and can process 2 holes (for example, with reference to patent documentation 1) simultaneously.In this laser processing device, be 2 bundle laser with 1 bundle laser by the 1st polarization unit beam split, guide to the 2nd polarization unit then, wherein, the 2nd polarization unit is used to make the light path of this 2 bundle laser roughly consistent.At this moment, the beam of laser in the laser that is split by the 1st polarization unit (below be called main beam) guides to the 2nd polarization unit via 1 group of speculum (deflection mirror).In addition, another Shu Jiguang (below be called side beam), guides to the 2nd polarization unit and mixes after 2 that are not parallel to each other axial enterprising line scannings by a pair of the 1st electrical scanner (galvano-scanner) group.2 bundle laser by the 2nd polarization unit after 2 that are not parallel to each other axial enterprising line scannings, are incident to f θ lens by a pair of the 2nd electrical scanner group, expose to the machined object on the workbench.Here, side beam scans by the 1st electrical scanner group, thus with compare by the main beam of 1 group of speculum, there is certain deviation in its angle, so be radiated at respectively on the diverse location on the workbench by main beam behind the f θ lens and side beam.Thus, can utilize 1 f θ lens to process 2 holes simultaneously, productivity ratio improves.
In addition, following laser processing device has also been proposed, it is 2 bundle laser with 1 bundle laser by the 1st polarization unit beam split, make each Shu Jiguang by a pair of electrical scanner 2 axial enterprising line scannings, and with behind 2 bundle laser aimings to the, 2 polarization units, utilize 1 f θ lens to carry out 2 holes and process simultaneously, thereby boost productivity (for example, with reference to patent documentation 2).
In addition, for the laser processing device shown in the patent documentation 1, also known generation is used for carrying out the technology (for example, with reference to patent documentation 3) of each electrical scanner angle command value of perforate on destination locations.
Patent documentation 1: the international collected works that disclose No. 03/041904
Patent documentation 2: the spy opens the 2005-230872 communique
Patent documentation 3: the international collected works that disclose No. 03/080283
Summary of the invention
But in the laser processing device of patent documentation 1 record, the side beam side after beam split is compared more through amounting to 2 groups of (promptly 4) electrical scanners with 1 group (2) of main beam side.Use owing to electrical scanner makes the rotation of speculum portion, compare instability with situation, so in any case also have the problem of the easy variation of processing quality via the side beam of more above-mentioned electrical scanner via stationary mirror.
And,, be light beam to be scanned by locational the 1st electrical scanner group that is arranged on front focus position (the beam flying ideal positions before the f θ lens) away from f θ lens for side beam.Therefore, existence is far away more from the distance of front focus position to the 1 electrical scanner group of f θ lens, the poor more trend just of the machining hole quality as machining hole circularity or focus surplus on the characteristic of f θ lens then, there is the also problem of variation of machining hole quality on the machined object in its result.
In addition, the laser processing device of patent documentation 2 records constitutes, by the 1st polarization unit beam split is the laser of 2 bundles, not via stationary mirror, but scan via electrical scanner, like this, owing between f θ lens and electrical scanner, need to be used to be provided with the space of the 2nd polarization unit, so each Shu Jiguang is in the enterprising line scanning in position away from the front focus position of f θ lens.Its result, the machining hole quality that has each Shu Jiguang is the problem of variation all.
In addition, in the such structure of the laser processing device of patent documentation 1 record, because optical system complexity, so in the calibrating operation of the angle command value etc. of each essential electrical scanner in order to control light-beam position of patent documentation 3 record, exist examination processing to need more counting thereby time-consuming problem.
The present invention is exactly in view of the above problems and proposes, and its purpose is to obtain a kind of laser processing device, and it is at the same time in the multiple spot irradiation type laser processing device, and the difference between the processing quality of 2 bundle laser is diminished, and realizes the raising of processing quality.In addition, its purpose is to obtain a kind of laser processing device, and it is easy that its Working position that can make contrast penetrate laser is controlled necessary calibrating operation transfiguration.
To achieve these goals, laser processing device involved in the present invention, its be disposed at machined object on the workbench more than or equal to 2 points on irradiating laser and processing simultaneously, it is characterized in that, have: the 1st polarization unit, it is the 1st and the 2nd a different laser of light path with 1 bundle laser beam split; The 1st electrical scanner, it is configured on the light path of above-mentioned the 1st laser, and above-mentioned the 1st laser is scanned along the 1st direction on the above-mentioned workbench; The 2nd electrical scanner, it is configured on the light path of above-mentioned the 2nd laser, and above-mentioned the 2nd laser is scanned along the 2nd different with the 1st direction on above-mentioned workbench directions; The 2nd polarization unit, it mixes the above-mentioned the 1st and the 2nd laser; Main electrical scanner, it is made of the a pair of the 3rd and the 4th electrical scanner, and they make the mixed the above-mentioned the 1st and the 2nd laser scan along the mutually different the 3rd and the 4th direction on the above-mentioned workbench; And f θ lens, it makes from the above-mentioned the 1st and the 2nd laser of the above-mentioned main electrical scanner assigned position place optically focused on above-mentioned machined object respectively.
The effect of invention
According to the present invention, make any beam of laser that obtains by the 1st polarization unit beam split all via 3 electrical scanners owing to constitute, so have the effect that can in the productivity ratio of keeping multiple spot irradiation simultaneously, improve processing quality.
Description of drawings
Fig. 1 is the figure of structure of the embodiment 1 of expression laser processing device involved in the present invention.
Fig. 2 is near the figure of the configuration relation of the electrical scanner the f θ lens front focus position of laser processing device of presentation graphs 1.
Fig. 3-the 1st schematically represents the figure of machining hole quality good state.
Fig. 3-the 2nd schematically represents the figure of the state of machining hole inferior quality.
Fig. 4 is the figure of an example of the evaluation method of expression machining hole quality.
Fig. 5-the 1st, the machining hole quality of judging main beam and side beam in the existing laser processing device of expression is the figure of an example of good scope.
Fig. 5-the 2nd, the machining hole quality of judging α light beam and β light beam in the laser processing device of expression present embodiment 1 is the figure of an example of good scope.
Fig. 6 is the figure of structure of the embodiment 2 of expression laser processing device involved in the present invention.
Fig. 7-the 1st, the figure of the secondary electrical scanner of the laser processing device of expression Fig. 6 when X-direction is observed and the configuration relation of main electrical scanner.
Fig. 7-the 2nd, near the figure of the configuration relation of the electrical scanner the f θ lens front focus position of the laser processing device of presentation graphs 6.
Fig. 8 is the figure of structure of the embodiment 3 of expression laser processing device involved in the present invention.
Fig. 9 is the block diagram that concerns between the coordinate in the mirror angle of each electrical scanner of expression in the existing while multiple spot irradiation type laser processing device and the hole that processed.
Figure 10 is the block diagram that concerns between the coordinate in the mirror angle of each electrical scanner in the expression laser processing device involved in the present invention and the hole that processed.
Figure 11 is the figure that machining hole position under the situation of existing while multiple spot irradiation type laser processing device is used in expression.
Figure 12 is the figure that machining hole position under the situation of laser processing device involved in the present invention is used in expression.
Figure 13 is the figure of the required machining hole quantity of expression calibration.
Figure 14 is the expression figure of the conventional example of the structure of multiple spot irradiation type laser processing device simultaneously.
The specific embodiment
Below, the preferred implementation of present invention will be described in detail with reference to the accompanying related laser processing device.In addition, the present invention is not limited to these embodiments.
Before explanation laser processing device involved in the present invention, the schematic configuration of existing laser processing device is described.Fig. 14 is expression figure of the conventional example of the structure of multiple spot irradiation type laser processing device simultaneously.Laser processing device has: XY worktable 211, and machined objects 212 such as its mounting printed base plate can move in horizontal plane (XY plane); And optical system, its laser L that is used to make never illustrated laser oscillator to penetrate is radiated at the machined object 212 on the XY worktable 211.In addition, in the figure, making the plane of the XY worktable 211 of mounting machined object 212 is horizontal plane, and making 2 mutually orthogonal in this horizontal plane axles is X-axis and Y-axis, makes with the two vertical axle of above-mentioned X-axis and Y-axis to be the Z axle.
Optical system has: the 1st polarization unit 222, and it is made of polarizing beam splitter etc., and the laser L beam split that this polarizing beam splitter is used for illustrated laser oscillator is never penetrated is 2 bundle laser La, Lb; The 2nd polarization unit 223, it is made of polarizing beam splitter etc., and 2 bundle laser La, Lb that this polarizing beam splitter is used for being advanced on different light paths by 222 beam split of the 1st polarization unit mix, and guide on the roughly the same light path; And f θ lens 228, it makes mixed laser La, the Lb optically focused on machined object 212 from the 2nd polarization unit 223.In addition, identical by the optical path length of 2 bundle laser La, the Lb of beam split between the 1st polarization unit 222 and the 2nd polarization unit 223.In addition, be in order to use 1 f θ lens 228 to process 2 holes simultaneously by above-mentioned the 2nd polarization unit 223 with the reason that 2 bundle laser La, Lb mix.
For simplicity, describe at following situation, that is, speculum 221a～221d and electrical scanner 224a, 224b, 226a, 226b are set on the light path of laser L, La, Lb, make X-axis, the Y-axis of the light path of laser L, La, Lb and above-mentioned setting, one of them almost parallel of Z axle.In the case, be configured in the speculum 221a～221d on the light path, for the angles bendings (reflection) of the light path that makes laser L with 90 degree, for example with respect to some axles of illustrated XYZ coordinate system with 45 angle configurations of spending.In addition, a pair of electrical scanner 224a, 224b are set on the light path by the 1st polarization unit 222 laser light reflected Lb, they are used to make laser Lb 2 axial enterprising line scannings and guide to the 2nd polarization unit 223.Electrical scanner 224a is configured to the rotating shaft of speculum 225a along X-direction, and electrical scanner 224b is configured to the rotating shaft of speculum 225b along Y direction.224a scans by electrical scanner, can make laser Lb in the enterprising line scanning of the X-direction of XY worktable 211, and 224b scans by electrical scanner, can make laser Lb in the enterprising line scanning of the Y direction of XY worktable 211.
In addition, between the 2nd polarization unit 223 and f θ lens 228 a pair of electrical scanner 226a, 226b are set, they are used to make mixed laser La, Lb from the 2nd polarization unit 223 2 axial enterprising line scannings and guide to machined object 212.Electrical scanner 226a is configured to the rotating shaft of speculum 227a along Z-direction, and electrical scanner 226b is configured to the rotating shaft of speculum 227b along X-direction.226a scans by electrical scanner, can make laser La, Lb in the enterprising line scanning of the X-direction of XY worktable 211, and 226b scans by electrical scanner, can make laser La, Lb in the enterprising line scanning of the Y direction of XY worktable 211.
The action of the laser processing device with said structure here, is described.Never the laser L that illustrated laser oscillator penetrates, its polarization direction is adjusted to 45 these directions of degree, is incident to the 1st polarization unit 222 by 2 speculum 221a, 221b reflections.By 222 beam split of the 1st polarization unit is the polarization direction and the laser of the laser of the vertical P ripple of the plane of incidence and the polarization direction S ripple parallel with the plane of incidence.
See through laser (below the be called main beam) La of the 1st polarization unit 222, guide to the 2nd polarization unit 223 via 2 speculum 221c, 221d.On the other hand, by the 1st polarization unit 222 laser light reflected (below be called side beam) Lb, after 2 axial enterprising line scannings, guide to the 2nd polarisation unit 223 by electrical scanner 224a, 224b.Here, main beam La guides to the 2nd polarization unit 223 with same position all the time, and side beam Lb then can pass through the angle of oscillation of control electrical scanner 224a, 224b, thereby adjusts position and the angle that is incident to the 2nd polarization unit 223.
Then, main beam La is by 223 reflections of the 2nd polarization unit, and side beam Lb sees through the 2nd polarization unit 223, makes 2 bundle laser La, Lb guide to electrical scanner 226a, 226b with roughly the same light path thus.Then, after 2 axial enterprising line scannings, guide to f θ lens 228 by electrical scanner 226a, 226b, optically focused on the assigned position of machined object 212 is processed respectively.At this moment, scan, main beam La and side beam Lb are radiated on the machined object 212 any different 2 by making electrical scanner 224a, 224b, 226a, 226b.After perforate processing in scanning area is all over, move along the XY direction among the figure, can carry out the processing of next scanning area by making XY worktable 211.
Here, if make the 1st group of electrical scanner 224a, 224b become certain angle respectively, the laser Lb that then splits advances with same trajectories after the 2nd polarization unit 223, processes on same position.Now, if have 2 very approaching hole site a, b that will process, then at first if by the 2nd group of electrical scanner 226a, 226b 2 axial enterprising line scannings can (for example being that a) hole site processes, just can on a of this position, carrying out perforate to some by main beam La.Then, if by the 1st group of electrical scanner 226a, 226b further 2 axially on from the scanning direction of hole site a to another hole site b, just can make side beam Lb process another hole site b.
Like this, in the laser processing device of structure with Figure 14, can think that the effect of the 2nd group of electrical scanner 226a, 226b is to carry out main scanning, the effect of the 1st group of electrical scanner 224a, 224b is the scanning of carrying out from above-mentioned hole site a to the residual quantity of hole site b, understands its structure easily intuitively.In addition, in fact as above-mentioned effect, the angle of oscillation of the 1st group of electrical scanner 224a, 224b scanning is littler than the angle of oscillation of the 2nd group of electrical scanner 226a, 226b scanning.
But in above-mentioned laser processing device, the side beam Lb that splits is via more 2 groups of (promptly 4) electrical scanner 224a, 224b, 226a, the 226b of amounting to.Owing to making the rotation of speculum portion, uses by electrical scanner, so compare instability with the situation via stationary mirror, in any case all there are all problems of variation easily of processing quality (so-called processing quality is meant these 2 kinds of machining hole quality that the circularity focus surplus in the hole in the scanning area is such and Working position accuracy errors) here in the processing that utilizes side beam Lb to carry out.In addition, the distance from the front focus position of f θ lens 228 to beam flying till the distance electrical scanner 224a farthest is longer, also becomes a reason of processing quality (particularly machining hole quality) variation.
So, a kind of laser processing device is provided in the present invention, though it can make the processing qualities of 2 bundle laser compare relatively poorly with the main beam processing quality of existing laser processing device, compare better with the processing quality of side beam.Below, laser processing device involved in the present invention is described.
Fig. 1 is the figure of structure of the embodiment 1 of expression laser processing device involved in the present invention, and Fig. 2 is near the figure of the configuration relation of the electrical scanner the f θ lens front focus position of laser processing device of presentation graphs 1.This laser processing device has: XY worktable 11, and machined objects 12 such as its mounting printed base plate can move in horizontal plane (XY plane); Laser oscillator 20, it penetrates laser L; Optical system, its laser L that is used for penetrating from laser oscillator 20 exposes to the machined object 12 on the XY worktable 11; Image units 29 such as CCD (Charge-Coupled Device) camera, its Working position that examination is added on the XY worktable 11 in man-hour is taken; And control part 30, mirror angle and the image unit 29 of its control laser oscillator 20, the aftermentioned electrical scanner 23a that constitutes optical system, 23b, 26a, 26b.In addition, in the figure, making the plane of the XY worktable 11 of mounting machined object 12 is horizontal plane, and making 2 mutually orthogonal in this horizontal plane axles is X-axis and Y-axis, makes with the two vertical axle of above-mentioned X-axis and Y-axis to be the Z axle.
Optical system has: the 1st polarization unit 21, and it comprises the polarizing beam splitter etc. of the laser L beam split that will penetrate from laser oscillator 20; A plurality of speculum 22a～22f, they are with the laser L α, the L β that split reflection and by the light path channeling conduct; Electrical scanner 23a, 23b (below, above-mentioned electrical scanner 23a, 23b are also referred to as secondary electrical scanner 23a, 23b), they make laser L α, the L β of each light path scan in XY worktable 11 upper edge different directions from each other; The 2nd polarization unit 25, it is made of following polarizing beam splitter etc., and 2 bundle laser L α, L β that this polarizing beam splitter will be advanced in different light paths by 21 beam split of the 1st polarization unit mix, and guide on the roughly the same light path; Electrical scanner 26a, 26b (below, above-mentioned electrical scanner 26a, 26b are also referred to as main electrical scanner 26), it makes mixed laser L α, L β from the 2nd polarization unit 25 scan in XY worktable 11 upper edge different directions from each other; And f θ lens 28, it makes mixed laser L α, L β optically focused on machined object 12.Here, secondary electrical scanner 23a, 23b are corresponding with the 1st and the 2nd electrical scanner in claims, and main electrical scanner 26a, 26b are corresponding with the 3rd and the 4th electrical scanner.
In addition, for simplicity, describe at following situation, promptly, be configured in speculum 22a～22f on the light path and electrical scanner 23a, 23b, 26a, 26b, for example become the angles ground configuration of 45 degree, with laser L, L α, L β angles bendings (reflection), thereby make the light path of laser L, L α, L β and one of them almost parallel of X-axis, Y-axis and Z axle with 90 degree with respect to a certain axle of illustrated XYZ coordinate system.In addition, light path constitutes and makes that beam of laser L α that sees through the 1st polarization unit 21 by 25 reflections of the 2nd polarization unit, and that beam of laser L β that is reflected by the 1st polarization unit 21 sees through the 2nd polarization unit 25.Make between the 1st polarization unit 21 and the 2nd polarization unit 25 identical by the optical path length of each Shu Jiguang L α, L β of beam split.
In this embodiment 1, on the light path of the 2 bundle laser L α, the L β that are split by the 1st polarization unit 21, the quantity of the speculum 22a～22f that is disposed equates that on 2 light paths the quantity of electrical scanner 23a, the 23b that is disposed also equates on 2 light paths.In addition, also the collocation method to electrical scanner designs, so that the characteristic of 2 bundle laser L α, L β does not have difference.That is, the optical path length till from f θ lens to the allocation position of electrical scanner 23a, 23b is designed to equate in 2 light paths.
That is, arrive on the light path of the 2nd polarization unit 25 seeing through the laser of the 1st polarization unit 21 (below be called the α light beam) L α, n (n is a natural number) piece speculum (22a～22c) and 1 electrical scanner 23a are set.In addition, arrive on the light path of the 2nd polarization unit 25, n piece of speculum (22d～22f) and 1 electrical scanner 23b are being set by the 1st polarization unit 21 laser light reflected (below be called the β light beam) L β.In addition, under the situation of this Fig. 1, n=3 piece.Because by said structure, the speculum and the electrical scanner of configuration equal number on 2 light paths are so the quality of the laser by 2 light paths is identical.
In addition, for example illustrated in figures 1 and 2 in present embodiment 1, the rotating shaft that consideration is configured to speculum 27a with main electrical scanner 26a is along Z-direction, and main electrical scanner 26b is configured to the rotating shaft of speculum 27b along X-direction.
Speculum 27a, the 27b of above-mentioned electrical scanner 26a, 26b that laser scans are positioned on the front focus position F of f θ lens 28.But, because in fact can not be with a plurality of mirror arrangement on same position, so consider as far as possible near this situation.Promptly, main electrical scanner 26a, 26b are configured to, make the speculum 27b of the speculum 27a of electrical scanner 26a and electrical scanner 26b be positioned at the position of the front focus position F of as close as possible f θ lens 28, make the mid point of line of center of the speculum 27b of the center of the speculum 27a that links electrical scanner 26a and electrical scanner 26b be positioned at the front focus position F of f θ lens 28.But consider each speculum 27a of main electrical scanner 26a, 26b, the rotation of 27b this moment, thus must select between 2 speculum 27a, the 27b ( electrical scanner 26a, 26b) apart from 2Y, so that do not interfere between above-mentioned speculum 27a, the 27b.
, in example shown in Figure 2, if consideration is fixed the position of rotation of the speculum 27a of electrical scanner 26a, and make the situation of electrical scanner 26b rotation here, then laser L α, L β change along Y direction to the incoming position of f θ lens 28.On the contrary, if consideration is fixed the position of rotation of the speculum 27b of electrical scanner 26b, and make the situation of electrical scanner 26a rotation, then laser L α, L β change along X-direction to the incoming position of f θ lens 28.Thus, scan, can change laser L α, L β incoming position (incident angle) to f θ lens 28 by making electrical scanner 26a, 26b.
In addition, optical system makes the scanning direction of the electrical scanner 23b that electrical scanner 23a that α light beam L α uses and β light beam L β use different as shown in Figure 1.In the example of this Fig. 1, electrical scanner 23a is configured to the rotating shaft of speculum 24a along Z-direction, so that the scanning direction of the electrical scanner 23a that (when being assumed to be desirable f θ lens) α light beam L α uses is a directions X in positive downstream, on XY worktable 11 directions X.In addition, the rotating shaft that electrical scanner 23b is configured to speculum 24b is along Y direction, so that the scanning direction of the electrical scanner 23b that β light beam L β uses is the Z direction in positive downstream, is the Y direction on XY worktable 11.That is, scan, can make laser L α, scan, can make the enterprising line scanning of the Y direction of laser L β on XY worktable 11 by making electrical scanner 23b in the enterprising line scanning of the X-direction of XY worktable 11 by making electrical scanner 23a.
Below, the action of the laser processing device with said structure is described.By the laser L that laser oscillator 20 starting of oscillations form, be the laser L α of transmissive side and the laser L β of reflection side by 21 beam split of the 1st polarization unit.The laser of transmissive side (being the α light beam) L α guides to the 2nd polarization unit 25 via a plurality of stationary mirror 22a～22c and 1 α light beam with electrical scanner 23a.In the same manner, the laser of reflection side (being the β light beam) L β also guides to the 2nd polarization unit 25 via other a plurality of stationary mirror 22d～22f and 1 β light beam with electrical scanner 23b.Each Shu Jiguang L α, L β through behind the 2nd polarization unit 25 scan by main electrical scanner 26a, 26b, and by f θ lens 28, thereby be radiated on 2 points of machined object 12.Thus, machined object 12 is processed.At this moment, secondary electrical scanner 23a, 23b and main electrical scanner 26a, 26b control mirror angle by control part 30 based on predefined machining information.
Here, explanation can improve the reason of processing quality by present embodiment 1 related laser processing device.Because it is, therefore identical between the 1st polarization unit 21 and the 2nd polarization unit 25 by the quality of 2 bundle laser L α, the L β of beam split by the speculum and the electrical scanner of equal number.Thus, can improve this 2 aspect of processing stand positional precision deviation and machining hole quality.
Processing stand positional precision deviation is the position deviation at the processing stand place, is the error deviation with respect to ideal position.The main cause of this processing stand positional precision deviation is the electrical scanner angular deviation in when scanning, 1 bundle laser the platform number of electrical scanner of process few more, just can improve this deviation more.According to present embodiment 1 because α light beam L α and β light beam L β be respectively via 3 electrical scanners, with the side beam Lb of existing example via 4 compare less, so can improve the deviation of Working position precision.
On the other hand, machining hole quality display electrical scanner in Z axle height change scans in scanning area and adds the machining hole circularity in man-hour.Usually, good if the circularity in hole, then is judged as the machining hole quality more than or equal to setting, it is big more to be judged as the good Z axle scope of this machining hole quality, and then the focus surplus is big more, and the machining hole quality is good more.Here, the Z axle comprises secondary electrical scanner 23a, 23b, the 2nd polarization unit 25, main electrical scanner 26a, 26b and f θ lens 28 and constitutes, be have with the direction parallel perpendicular to XY worktable 11 upper surface directions (Z-direction) on the parts group of the mechanism that moves.
Usually have following trend, that is, the quantity of the speculum that inserts in the light path till the processing stand is many more, and then the quality of the laser of Chuan Diing (circularity) is poor more, and the beam quality at processing stand place is poor more.Its result, the machining hole quality is variation also.This be because, the plane of speculum is concavo-convex situation difference on direction in length and breadth mostly strictly speaking, transmits the laser that comes via many pieces of above-mentioned speculums, the diffusion angle of light beam and the Z shaft position of focal point have than big-difference on the direction in length and breadth.Especially, because the speculum of electrical scanner is the speculum with special shape, and the flatness that has is relatively poor relatively, so under the situation that has many electrical scanners on the light path, the beam quality at processing stand place worsens highly significant.
Fig. 3-the 1st schematically represents the figure of machining hole quality good state, and Fig. 3-the 2nd schematically represents the figure of the state of machining hole inferior quality.Shown in Fig. 3-1, under the less situation of piece number of the speculum of laser L process or electrical scanner speculum, shape when laser L is cut off on the XZ plane and the YZ plane that with illustrated reference axis are benchmark is consistent, so the focus height equates, it is just round that light beam is always, no matter cut off near the optional position of the Z axle the focal position, laser L is for just round.But, shown in Fig. 3-2, under the more situation of piece number of the speculum of laser L process or electrical scanner speculum, be that shape when cutting off on the XZ plane of benchmark and the YZ plane is inconsistent with illustrated reference axis with laser L.That is focus height (Z axle) difference.Its result if cut off laser L with the direction vertical with the Z axle near the focal position, then becomes elliptical shape.In Fig. 3-2, illustrate since on the direction in length and breadth of laser L the diffusion of light beam or spot position different and be changed to vertical oval situation from horizontal ellipse.
Fig. 4 is the figure of an example of the evaluation method of expression machining hole quality.The evaluation method of machining hole quality is estimated by obtaining following Z axle scope, in this Z axle scope, make Z axle height change and the circularity of machining hole shape when forming the hole more than or equal to the percentage of regulation.That is, this Z axle scope is the good scope of machining hole quality.In addition, this Z axle scope is big more, easy more processing.
Fig. 5-the 1st, the machining hole quality of judging main beam and side beam in the laser processing device of the existing Figure 14 of expression is the figure of an example of good scope, Fig. 5-the 2nd, the machining hole quality of judging α light beam and β light beam in the laser processing device in the expression present embodiment 1 is the figure of an example of good scope.At first, shown in Fig. 5-1, for main beam La, the number of electrical scanner 226a, 226b that laser passes through is less to be 2, but for side beam Lb, electrical scanner 224a, the 224b that laser passes through, the quantity of 226a, 226b mostly are 4.Therefore, only the machining hole quality of the main beam La by 2 electrical scanner 226a, 226b is higher, but very low through the machining hole quality of the side beam Lb of 4 electrical scanner 224a, 224b, 226a, 226b.Relative with it, shown in Fig. 5-2, for α light beam L α and β light beam L β, the quantity of the electrical scanner that laser passes through is 3, and the machining hole quality is all than the machining hole quality better of the side beam Lb of the existing laser processing device shown in Fig. 5-1.Like this, the machining hole quality judgings of 2 bundle laser are that good scope is roughly the same, and the scope that both overlap, promptly by the good Z axle scopes of quality of the machining hole of 2 bundle Laser Processings is compared with the situation of the existing laser processing device of Fig. 5-1 and to be become big.That is,, can improve the machining hole quality of laser processing device integral body by improving the beam quality of relatively poor that Shu Jiguang of beam quality.In addition, the configuration distance between secondary electrical scanner 23a, the 23b shown in Figure 1 and the front focus position F of f θ lens 28 is short more, and then the machining hole quality is good more.Promptly, as shown in Figure 1, according to the structure of present embodiment 1, owing to can on each light path that α light beam L α and β light beam L β are passed through, dispose 1 secondary electrical scanner 23a, 23b respectively, make its allocation position near front focus position F, so can improve the machining hole quality.On this basis, because each secondary electrical scanner 23a, 23b being provided with respect to front focus position F apart from equating, so the machining hole quality of 2 bundle laser L α, L β is identical.
According to present embodiment 1, by making any beam of laser L α, the L β that split all only via 3 electrical scanners, make from the front focus position F of f θ lens 28 to beam flying that the distance till distance farthest secondary electrical scanner 23a, the 23b shortens, thereby can keep and the identical productivity ratio of existing while multiple spot irradiation type laser processing device, solve the problem of existing side beam processing quality deterioration simultaneously.In addition because the processing quality of 2 bundle laser L α, L β is identical, so have following effect: can enlarge the Z axle altitude range that can carry out the good processing of processing quality, can with process in existing laser processing device is compared wideer condition and range.
Embodiment 2
Fig. 6 is the figure of structure of the embodiment 2 of expression laser processing device involved in the present invention, Fig. 7-the 1st, the figure of the secondary electrical scanner of the laser processing device of expression Fig. 6 when X-direction is observed and the configuration relation of main electrical scanner, Fig. 7-the 2nd, near the figure of the configuration relation of the electrical scanner that the f θ lens front focus position of the laser processing device of presentation graphs 6 is.This laser processing device is characterised in that with respect to Fig. 1 of embodiment 1, the rotating shaft of the speculum 27a of electrical scanner 26a is configured to tilt with angle θ with respect to the Z axle.Accompany therewith, secondary electrical scanner 23a, 23b also are configured to respectively tilt with angle θ with respect to the position of the situation of embodiment 1.Speculum 24a, the 24b of above-mentioned electrical scanner 23a, 23b, 26a, the rotating shaft of 27a constitute same orthogonal coordinate system respectively.And, in 2 light paths of embodiment 1, between speculum 22b and the secondary electrical scanner 23a, and between speculum 22d and secondary electrical scanner 23b, dispose 2 among speculum 22g～2 2j on each light path respectively, this speculum 22g～22j is used for the system of the XYZ coordinate shown in the figure is changed to the orthogonal coordinate system with angle θ inclination with respect to this XYZ coordinate system.In addition, than the light path of more close laser oscillator 20 sides of speculum 22g, 22i, constitute parallel with one of them of X-axis, Y-axis and Z axle that with XY worktable 11 is the XYZ orthogonal coordinates that are provided with of benchmark.This is owing in order to adjust the processing stand height, need meet at right angles with respect to the XY plane.
Under the situation of this embodiment 2, it is characterized in that the state configuration that electrical scanner 26a tilts with the oblique lower side to electrical scanner 26b.Specifically, shown in Fig. 7-1～Fig. 7-2, electrical scanner 26a is configured to, and compares with the allocation position of embodiment 1 shown in Figure 2, tilts to the Y-axis positive direction in the YZ plane with angle θ.By such inclination,, then can make 2 distances between speculum 27a, the 27b compare narrower with the situation of embodiment 1 if consider the distance that both can not disturb according to the movable range of speculum 27a, 27b.Its result can make the front focus position (f θ lens 28 before beam flying ideal positions) of f θ lens 28 and the distance Y between 2 speculum 27a, the 27b, compares shortlyer with the situation of Fig. 2 of embodiment 1, can improve the machining hole quality of laser.In addition, be accompanied by electrical scanner 26a and tilt with angle θ, electrical scanner 23a, 23b compare with the allocation position of embodiment 1 shown in Figure 2, tilt to Z axle positive direction in the YZ plane with angle θ.
Make under the situation that electrical scanner 23a, 23b, 26a tilt above-mentioned, carry out under the scan condition at each electrical scanner 23a, 23b, 26a, 26b, the scanning direction of laser L α, L β on the XY worktable 11 is the direction parallel with Y-axis with X-axis.
According to present embodiment 2, because on the basis of the effect of embodiment 1, make electrical scanner 26a, 26b be configured to more so compare, to have the effect that the machining hole quality is further improved with embodiment 1 near the front focus position F of f θ lens 28.
Embodiment 3
In embodiment 2, for the action that can not carry out owing to the guiding mechanism up and down (carrying out the structure that the focal position is adjusted by processing head is partly moved) of Z axle changes light-beam position, so need in the light path way, the optical axis parallel with the Z axle be set, thereby generation following problems: the 1st beam split (the 1st polarization unit 21) speculum piece number is afterwards compared with embodiment 1, has more more than or equal to 2 pieces in 1 light path.So, in present embodiment 3, the situation that the speculum piece number that makes after the 1st beam split and embodiment 1 are identical is described.
Fig. 8 is the figure of structure of the embodiment 3 of expression laser processing device involved in the present invention.This laser processing device is characterised in that, with respect to Fig. 1 of embodiment 1, and the state configuration that electrical scanner 26a is tilted with the oblique lower side to electrical scanner 26b only.Because the allocation position of this electrical scanner 26a is identical with the position shown in Fig. 7-2 of embodiment 2, so omit its explanation.
In addition, in present embodiment 3, only electrical scanner 26a is disposed obliquely with angle θ, other secondary electrical scanner 23a, 23b and speculum 22g～22j are identical with embodiment 1, are configured to light path and X-axis, Y-axis and Z axle some parallel that with XY worktable 11 is the XYZ coordinate system of benchmark.Thus, the action that can not carry out owing to the guiding mechanism up and down of Z axle changes light-beam position.
Under the situation of present embodiment 3, make each electrical scanner 23a, 23b, 26a, when 26b scans, the scanning direction of laser L α, L β on the XY worktable 11 is not the direction parallel with Y-axis with X-axis, but with and 2 directions that axle is parallel intersecting of the predetermined angular of on-right angle.
According to present embodiment 3, the scanning coordinate of main electrical scanner 26a, 26b that the 2nd polarization unit 25 is later is to be the orthogonal coordinate system of benchmark with XY worktable 11, the scan coordinate system of secondary polarization electrical scanner 23a, 23b is then also nonopiate, but has a certain angle θ, but, the 1st beam split (the 1st polarization unit 2 1) speculum piece number afterwards gets final product because having the less structure identical with embodiment 1, so compare with embodiment 2, have the effect that can suppress the machining hole quality badness.
Embodiment 4
In embodiment 1～3, the electrical scanner in the laser processing device and the configuration of speculum have been described.As noted above, for example in the optical system of embodiment 1, make scanning direction quadrature between the electrical scanner 23b that electrical scanner 23a that α light beam L α uses and β light beam L β use as shown in Figure 1, then directly perceived going up easily understood, and can make the scan area maximum.For example in embodiment 1 (Fig. 1), suppose it is desirable f θ lens 28, then the scanning direction of the electrical scanner 23a that uses of α light beam L α is an X-direction in positive downstream, it on XY worktable 11 X-direction, the scanning direction of the electrical scanner 23b that β light beam L β uses is a Z-direction in positive downstream, is Y direction on XY worktable 11.But, owing in fact be difficult to make desirable f θ lens 28, and the restriction of speculum installation accuracy, so the scanning direction of 1 electrical scanner can't become straight line on XY worktable 11.In addition, owing to the scan method that can utilize electrical scanner (control method) is controlled the machining hole position, so shown in enforcement mode 2,3, can constitute and make the scanning direction of the electrical scanner 23b that electrical scanner 23a that α light beam L α uses and β light beam L β use non-orthogonal.Thus, under above-mentioned any one situation,, all must determine the angle of each electrical scanner 23a, 23b, 26a, 26b in order on the target hole coordinate, to carry out perforate processing.So, in present embodiment 4, the control method of the electrical scanner that is used for carrying out perforate processing on the target hole coordinate is described.
As Fig. 1, Fig. 6, shown in Figure 8, carry out above-mentioned laser processing device control be control part 30.This control part 30 has: calibration function 31, and it is used to obtain the mirror angle of electrical scanner 23a, 23b, 26a, 26b and is formed on relation between the machining hole position on the XY worktable 11; Model memory function 32, it is used to store the model of being obtained by calibration function 31, and above-mentioned model is used to obtain in order to carry out perforate processing required electrical scanner 23a, 23b, the mirror angle of 26a, 26b on as the position of target; Machining information memory function 33, it is used to store the machining informations such as position that machined object 12 carried out perforate processing; And machining control function 34, its use is stored in the machining information in the machining information memory function 33, utilizes the model of model memory function 32, carries out the control of electrical scanner 23a, 23b, 26a, 26b and laser oscillator 20.
Below, the summary of the control method in the laser processing device at first is described, then the explanation calibration steps that is used to control.
Laser processing device need have following function, that is, at the hole coordinate on the XY worktable 11 that will process (target hole coordinate), obtain in order to realize the angle (angle command value) of this processing required electrical scanner 23a, 23b, 26a, 26b.
Fig. 9 is the block diagram that concerns between the coordinate in the mirror angle of each electrical scanner of expression in the existing while multiple spot irradiation type laser processing device shown in Figure 14 and the hole that processed.As shown in Figure 9, in existing while multiple spot irradiation type laser processing device, adopt following method: the machining hole coordinate (a that obtains main beam La
x, a
y), then according to the machining hole coordinate (a of this main beam La
x, a
y) between residual quantity obtain the machining hole coordinate (b of side beam Lb
x, b
y).That is the machining hole coordinate (a of main beam La,
x, a
y) determine by the mirror angle of the 2nd group of electrical scanner 226a, 226b.Machining hole coordinate (the b of the side beam Lb of opposite side
x, b
y), on the basis of the mirror angle of the 2nd group of electrical scanner 226a, 226b, also by the mirror angle decision of the 1st group of electrical scanner 224a, 224b.But above-mentioned main beam La and side beam Lb then have the relation of 4 inputs, 4 outputs on the whole,, if determine the mirror angle of 4 electrical scanner 224a, 224b, 226a, 226b, have then determined the coordinate (4 coordinate components) of 2 machining holes that is.Thus, above-mentioned relation can be regarded as mapping relations (detailed content is with reference to patent documentation 2).
But, because in laser processing device involved in the present invention, as noted above, the 2 bundle laser that obtained by 21 beam split of the 1st polarization unit are the electrical scanner by equal number all, thereby making beam quality not have the branch of quality, so do not have main beam and the such classification of side beam, is equal.Promptly, because in laser processing device involved in the present invention, can't use following method, promptly, utilize above-mentioned existing mapping relations shown in Figure 9 and obtain the mirror angle of 4 electrical scanners, to determine the coordinate of 2 machining holes, so need the new control method that is used for determining the machining hole coordinate.
Figure 10 is the block diagram that concerns between the coordinate in the mirror angle of each electrical scanner in the expression laser processing device involved in the present invention and the hole that processed.As shown in Figure 10, in laser processing device involved in the present invention, for α light beam L α, on the basis of the mirror angle of main electrical scanner 26a, 26b, also according to the mirror angle that is configured in the secondary electrical scanner 23a on the light path of α light beam L α, and the position coordinates (α of decision machining hole
x, α
y).In addition, for β light beam L β, on the basis of the mirror angle of main electrical scanner 26a, 26b, also according to the mirror angle of the secondary electrical scanner 23b on the light path that is configured in β light beam L β, and the position coordinates (β of decision machining hole
x, β
y).So, in general, then have following mapping relations as can be known, that is,, then determined 4 machining hole coordinate α if determine the mirror angle of 4 electrical scanner 23a, 23b, 26a, 26b
x, α
y, β
x, β
y(because 2 holes have X coordinate and Y coordinate respectively, institute thinks 4 variablees).
Thus, in present embodiment 4, it is characterized in that use is by the inverse mapping model of the mapping of the block representation of Figure 10, with the coordinate (4 machining hole coordinate components) of obtaining 2 machining holes.In addition, it is characterized by 4 inputs, 4 outputs as can be seen according to Figure 10, that is, and with respect to the target location coordinate α of 2 machining holes
x, α
y, β
x, β
yThese 4 inputs, output is at this hole coordinate α
x, α
y, β
x, β
yRealize the presumed value g of the mirror angle of processing required 4 electrical scanner 23a, 23b, 26a, 26b
a e, g
b e, g
c e, g
d eThese 4 variablees.Like this, the inverse mapping model that uses in this embodiment 4 uses to comprise the polynomial multinomial model of 4 inputs, 4 outputs, realizes obtaining 4 machining hole coordinate α according to the mirror angle of 4 electrical scanner 23a, 23b, 26a, 26b
x, α
y, β
x, β
yFunction.Here, multinomial is meant the formula that is only calculated by the arithmetic of constant and variable, can be any kind of.
If the inverse mapping model that uses in this embodiment 4 is represented by the formula that uses determinant, is then become following formula (1).Here, B
eMatrix for the presumed value of the mirror angle of representing 4 electrical scanner 23a, 23b, 26a, 26b, A is the matrix of expression by the target hole coordinate of n (n is a natural number) multinomial model representative, and X is the coefficient matrix (perhaps being matrix of unknown parameters) of matrix A.
B
e＝AX …(1)
For example, under the situation of 1 order polynomial model, becoming item number is the form of 5 following formula (2), under the situation of 2 order polynomial models, becoming item number is the form of 15 following formula (3), and under the situation of 3 order polynomial models, becoming item number is the form of 35 following formula (4).In addition, except multinomial shown here, for example use in the multinomial model of the part of formula (4) is also included within.
In above-mentioned formula, the component k of coefficient matrix X
1-1, k
1-2... be polynomial coefficient, cooperate with the characteristic of optical system and by the decision of the calibration steps that describes below.Shown in above-mentioned formula (2)～formula (4), matrix X is the matrix of only being made up of polynomial coefficient.For example under the situation of 1 order polynomial model, coefficient matrix X is 5 * 4 matrix, and under the situation of 2 order polynomial models, coefficient matrix is 15 * 4 matrix, and under the situation of 3 order polynomial models, coefficient matrix is 35 * 4 matrix.
If polynomial number of times is uprised and increase item number, then can carry out the Position Control of more high-precision machining hole, but need more data for the coefficient matrix of obtaining this multinomial model.Can use the multinomial of arbitrary number of times, but as can be known according to the result who tests, in the perforate of printed base plate etc. with under the situation of laser processing device, be less than or equal to all multinomial models that constitute (item number=35) of 3 if use by number of times, then can generate the inverse mapping model that precision satisfies the specification that requires.
Coefficient (unknown parameter) in order to obtain above-mentioned multinomial model need carry out calibration process.This calibration process is realized by the calibration function 31 of control part 30.In calibration process, the mirror angle of each electrical scanner 23a, 23b, 26a, 26b is rocked to a plurality of values and tries processing, measure the actual hole coordinate that has carried out processing by image units such as CCD camera 29.Angle-data g according to each electrical scanner 23a, 23b, 26a, 26b
a, g
b, g
c, g
dWith the hole coordinate data α that is processed this moment
x, α
y, β
x, β
y, use methods such as least square method or weighted least-squares method to determine the coefficient (unknown parameter) of above-mentioned multinomial model.With utilizing the inverse mapping model (multinomial model) of the calibration function 31 following mappings that calculate as noted above, be stored in the model memory function 32, above-mentioned mapping is meant from the mirror angle of each electrical scanner and maps to 2 hole coordinates being processed.
In this calibration process, laser processing device involved in the present invention also has to compare with existing while multiple spot irradiation type laser processing device and can shorten this remarkable result of activity duration.By comparing this effect is shown with following simple case.
At the present invention and existing calibration process, compare based on following situation, promptly, the 1st group of electrical scanner 23a, 23b (or 224a, 224b) make mirror angle be rocked to 4 kinds of values respectively, the 2nd group electrical scanner 26a, 26b (or 226a, 226b) makes mirror angle be rocked to 3 kinds of values respectively, and tries processing.Figure 11 is the figure that the machining hole position under the situation of existing while multiple spot irradiation type laser processing device is used in expression, and Figure 12 represents to use the machining hole position under the situation of laser processing device involved in the present invention.In addition, for simplicity, suppose that here f θ lens 28,228 are desirable f θ lens, scan with straight line on XY worktable 11,211.In above-mentioned figure, transverse axis is represented the X-axis on the XY worktable 11,211, and the longitudinal axis is represented the Y-axis on the XY worktable 11,211.In addition, " zero " mark illustrates the position of the machining hole that is formed by main beam La or α light beam L α, and " * " mark illustrates the position of the machining hole that is formed by side beam Lb or β light beam L β.
Figure 13 is the figure of the required machining hole quantity of expression calibration.Under the situation of utilizing existing laser processing device (Figure 14) to try to process, the mirror angle of electrical scanner be combined as 3 * 3 * 4 * 4=144 kind, but because laser La, Lb are 2 bundles, so what need confirm is 288 kinds.But,, exist in the repeating part of processing on the same position according to the characteristic of optical system.For example as can be known according to the block diagram of Fig. 9, in the time of in the prior art in the multiple spot irradiation type laser processing device, because the optical system of main beam La does not rely on the reflector position of electrical scanner 224a, 224b, so what need confirm is that 3 * 3=9 kind gets final product.That is,, it is 153, so the hole count that needs to confirm is lacked than 288 because the identical situation in position does not need to repeat processing.
On the other hand, under the situation of utilizing laser processing device involved in the present invention to try to process, the mirror angle of electrical scanner be combined as 3 * 3 * 4=36 kind because laser L α, L β are 2 bundles, so what need to confirm is 72 kinds.
Even in this simple example, compared with prior art, the hole count of trying to process in the time of also can making calibration reduces 81 under the situation of laser processing device involved in the present invention.In the calibration process of reality because the mirror angle of electrical scanner is swung more subtly, so and between the prior art difference of hole count become remarkable.In calibration process, the coordinate in the hole that this examination is processed to form is measured by image unit 29, and hole count is many more, and it is just consuming time more that this measures operation.
Calibration process by above-mentioned explanation is obtained coefficient matrix, the coefficient of decision multinomial model.Then, in reality processing, the machining control function 34 of control part 30 obtains coordinate (α on the XY worktable 11 from machining information memory function 33 as position that will perforate on machined object 12
x, α
y), (β
x, β
y), the obtained position coordinates of wanting perforate of input in the multinomial model in being stored in model memory function 32, the mirror angle of control electrical scanner 23a, 23b, 26a, 26b is so that it becomes the mirror angle g of the electrical scanner that obtains after the computing
a, g
b, g
c, g
dThus, can be as the position perforate on the machined object 12 of target.
In addition, in the above description, situation with the laser processing device of embodiment 1 is an example, but can control the reflector position of electrical scanner 23a, 23b, 26a, 26b by using multinomial model too under the situation of embodiment 2,3, and the position of control machining hole.
According to present embodiment 4, owing to the electrical scanner of configuration equal number on 2 light paths that split by the 1st polarization unit 21, so have following remarkable result: can reduce the required processing hole count of calibration process, can significantly shorten the calibration process time.In addition, for laser processing device with above-mentioned optical system, can be by the inverse mapping model of following mapping, the position of control machining hole, above-mentioned mapping is meant from the mirror angle of 4 electrical scanners and maps to 2 hole coordinates being processed.
In addition, in above-mentioned embodiment 1～4, be illustrated in beam split and be the example of 3 electrical scanners of configuration on the light path separately of laser of 2 bundles, but, can dispose the electrical scanner of any amount as long as on each light path, be equal number.In addition, also can use this design, utilizing beam split is that the further beam split of laser behind 2 bundles is the methods of 2 bundles, perhaps prepares many laser oscillators, increases the hole count of processing simultaneously thus.
Industrial applicibility
As noted above, laser processing device involved in the present invention is applicable to simultaneously high accuracy Ground carries out the situation of a plurality of perforate processing.
Claims (10)
1. laser processing device, its be disposed at machined object on the workbench more than or equal to 2 points on irradiating laser and processing simultaneously,
It is characterized in that having:
The 1st polarization unit, it is the 1st and the 2nd a different laser of light path with 1 bundle laser beam split;
The 1st electrical scanner, it is configured on the light path of above-mentioned the 1st laser, and above-mentioned the 1st laser is scanned along the 1st direction on the above-mentioned workbench;
The 2nd electrical scanner, it is configured on the light path of above-mentioned the 2nd laser, and above-mentioned the 2nd laser is scanned along the 2nd different with the 1st direction on above-mentioned workbench directions;
The 2nd polarization unit, it mixes the above-mentioned the 1st and the 2nd laser;
Main electrical scanner, it is made of the a pair of the 3rd and the 4th electrical scanner, and they make the mixed the above-mentioned the 1st and the 2nd laser scan along the mutually different the 3rd and the 4th direction on the above-mentioned workbench; And
F θ lens, it makes from the above-mentioned the 1st and the 2nd laser of the above-mentioned main electrical scanner assigned position place optically focused on above-mentioned machined object respectively.
2. laser processing device according to claim 1 is characterized in that,
The the above-mentioned the 1st and the 2nd electrical scanner is configured in respectively on the following position, and this position is positioned on the above-mentioned the 1st and the 2nd laser propagation light path separately, and equates from the optical path length between front focus position to this position of above-mentioned f θ lens.
3. laser processing device according to claim 1 is characterized in that,
Making the direction with the above-mentioned the 1st and the 2nd this both direction quadrature of direction is under the situation of the 5th direction,
Above-mentioned the 1st to the 4th electrical scanner is configured to, and the rotating shaft direction of the speculum of above-mentioned the 1st to the 4th electrical scanner is one of them the identical direction with above-mentioned the 1st, the 2nd, the 5th direction.
4. laser processing device according to claim 1 is characterized in that,
Making the direction with the above-mentioned the 1st and the 2nd this both direction quadrature of direction is under the situation of the 5th direction,
Above-mentioned the 1st, the 2nd and the 4th electrical scanner is configured to, and the rotating shaft direction of the speculum of above-mentioned the 1st, the 2nd, the 4th electrical scanner is one of them the identical direction with above-mentioned the 1st, the 2nd, the 5th direction,
Above-mentioned the 3rd electrical scanner is configured in above-mentioned the 2nd polarization unit side with respect to above-mentioned the 4th electrical scanner, and the rotating shaft direction of speculum that is configured to above-mentioned the 3rd electrical scanner is with respect to one of them inclination predetermined angular of above-mentioned the 1st, the 2nd, the 5th direction.
5. laser processing device according to claim 1 is characterized in that,
The quantity of the electrical scanner that on 2 light paths between the above-mentioned the 1st and the 2nd polarization unit, is disposed and the above-mentioned the 1st and the 2nd laser is identical to the quantity of the speculum of prescribed direction guiding.
6. laser processing device according to claim 1 is characterized in that,
Also has control module, it is based on operational model, and the mirror angle of computing above-mentioned 1st to 4th electrical scanner corresponding with the purpose Working position of above-mentioned machined object, and control the mirror angle of above-mentioned the 1st to the 4th electrical scanner, this operational model represent the mirror angle of above-mentioned the 1st to the 4th electrical scanner and when this mirror angle by the relation between the coordinate that exposes to the hole that the above-mentioned the 1st on above-mentioned workbench and the 2nd laser processes.
7. laser processing device according to claim 6 is characterized in that,
Above-mentioned operational model is the inverse mapping model of following mapping, and above-mentioned mapping is that the mirror angle from above-mentioned the 1st to the 4th electrical scanner maps to the irradiation coordinate of the above-mentioned the 1st and the 2nd laser on above-mentioned workbench.
8. laser processing device according to claim 7 is characterized in that,
Above-mentioned inverse mapping model represents by comprising the polynomial multinomial model of 4 inputs, 4 outputs, wherein, with 4 components constituting above-mentioned irradiation coordinate as input, with the mirror angle of above-mentioned the 1st to the 4th electrical scanner as output.
9. laser processing device according to claim 8 is characterized in that,
Above-mentioned multinomial model is by following polynomial repressentation, this multinomial comprise above-mentioned irradiation coordinate 4 components be less than or equal to 3 times item.
10. laser processing device according to claim 6 is characterized in that,
Above-mentioned control module also has following function: when making above-mentioned the 1st to the 4th electrical scanner mirror angle separately be rocked to arbitrary value, measure 4 components of the irradiation coordinate of the above-mentioned the 1st and the 2nd laser on above-mentioned workbench, the operational model that concerns between the mirror angle of above-mentioned the 1st to the 4th electrical scanner of calculating expression and 4 components of above-mentioned irradiation coordinate.
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| JP2007140210A JP4297952B2 (en) | 2007-05-28 | 2007-05-28 | Laser processing equipment |
| JP2007140210 | 2007-05-28 |
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| JP (1) | JP4297952B2 (en) |
| KR (1) | KR100955149B1 (en) |
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-
2007
- 2007-05-28 JP JP2007140210A patent/JP4297952B2/en active Active
-
2008
- 2008-05-23 TW TW097119012A patent/TW200902207A/en unknown
- 2008-05-28 KR KR1020080049651A patent/KR100955149B1/en active IP Right Grant
- 2008-05-28 CN CN2008101001805A patent/CN101314196B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4297952B2 (en) | 2009-07-15 |
| CN101314196B (en) | 2012-06-27 |
| JP2008290137A (en) | 2008-12-04 |
| KR20080104993A (en) | 2008-12-03 |
| TWI343850B (en) | 2011-06-21 |
| KR100955149B1 (en) | 2010-04-28 |
| TW200902207A (en) | 2009-01-16 |
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