CN101207049A - Tin paste printing apparatus and CSP, BGA chip repairing method using the same - Google Patents
Tin paste printing apparatus and CSP, BGA chip repairing method using the same Download PDFInfo
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- CN101207049A CN101207049A CNA2006101576771A CN200610157677A CN101207049A CN 101207049 A CN101207049 A CN 101207049A CN A2006101576771 A CNA2006101576771 A CN A2006101576771A CN 200610157677 A CN200610157677 A CN 200610157677A CN 101207049 A CN101207049 A CN 101207049A
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Abstract
The invention relates to the repair field of the CSP and BGA chips, which aims at providing a solder paste printing device, and a CSP and BGA chips repair method ofusing the solder paste printing device to the solder past. The invention provides a solder paste printing device, which comprises a chip fixing device, a position adjusting device, a template fixing device and a printing template; the chip fixing device is used for fixing the CSP and BGA chips; the position adjusting device is used for adjusting the relative position of the CSP and BGA chips, and the printing template, to ensure the bonding pads of the CSP and BGA chips to be aligned with the mesh openings of the printing template, and so as to be convenient for printing the solder paste. The invention provides the repair method of the CSP and BGA chips , which comprises the following steps: A, for the CSP and BGA chips which are well cleaned up through bonding pads, the solder past printing device is printed by using the solder paste provided by the invention; B, a furnace temperature curve is selected, and reflow soldering is performed to the CSP and BGA chips which are printed with the solder past and is waitting to be repaired. The solder paste printing device provided by the invention has the advantages that the operation is convenient, and the efficiency can be greatly improved through using the device to perform the CSP and BGA chip reparation.
Description
[technical field]
The present invention relates to the field of reprocessing of CSP (chip size packages), BGA (BGA Package) chip, particularly relate to paste-tin printing apparatus that uses when the defective that occurs through X-ray examination after CSP, the bga chip Reflow Soldering in the various electronic products reprocessed and CSP, the bga chip repair method that uses this device.
[background technology]
Continuous development along with the BGA device, all developed the miniature BGA of littler encapsulation in the U.S. and Japan, its package dimension only is no more than 20% than chip is big, their soldered ball minimum has reached 0.2mm, the space between solder balls minimum has reached 0.35mm, for little space between solder balls like this, SMT (surface mounting technology) technical matters difficulty is very high.
Because the circuit board assembling to the high-density trend development, must be tending towards strict to the poorly controlled of product; And variation along with market, highdensity wiring board demand also progressively improves, so its processing factory requires also to promote to production capacity thereupon, when production capacity promotes, bad also being difficult to of various bad especially CSP, bga chip avoided, when improving the product yields, reducing production costs also is the inevitable requirement of factory.Because CSP, bga chip are very expensive, so for the reprocessing of CSP, bga chip, it is very necessary that the replacement soldered ball becomes, wherein soldered ball regeneration is technological difficulties.Existing treating method mostly is scraps or adopt the tin ball to plant the pearl mode: smear weld-aiding cream on CSP, bga chip pad, afterwards that the tin ball is up sticking, the method need be used a large amount of man-hours, can only be used for reprocessing of a small amount of CSP, bga chip.Chinese patent CN1434673A has announced a kind of " being beneficial to the paste-tin printing apparatus that tin cream initiatively comes off ", can improve and reprocess efficient, but it does not have position adjusting mechanism, use inconvenience, thereby efficient is not very high.
[summary of the invention]
The present invention is intended to solve and reprocesses not high, the awkward problem of efficient in the prior art, and a kind of paste-tin printing apparatus is provided, and the CSP, the bga chip repair method that use this paste-tin printing apparatus to realize.
A kind of paste-tin printing apparatus provided by the invention, its technical scheme is: a kind of paste-tin printing apparatus comprises chip fixture apparatus, fixing templates and printing stencil and apparatus for adjusting position; Printing stencil is fixed on the fixing templates, be positioned at the chip fixture apparatus top, and fixing templates is positioned at chip fixture apparatus one side, and chip fixture apparatus is arranged on the adjusting device of position, and apparatus for adjusting position is used to adjust the relative position of chip fixture apparatus and printing stencil.The technical program can be fixed chip easily, and regulates the relative position of chip and printing stencil, makes them aim at, be close to, and is to make things convenient for print solder paste, easy to use.
Apparatus for adjusting position comprises longitudinal feeding device and cross feed device and the angle regulator that overlaps and be provided with; Angle regulator is between cross feed device and chip fixture apparatus, by adjusting position adjusting device each several part, regulate chip fixture apparatus in the position of horizontal plane, make that the chip on the chip fixture apparatus can be aimed at the template on the fixing templates.
Longitudinal feeding device comprises base plate, longitudinal slide and vertical screw mandrel; Base plate is provided with vertical chute; Longitudinal slide is positioned on the base plate, and its lower surface is provided with vertical slide rail, and upper surface is provided with horizontal slide rail; Vertically screw mandrel passes base plate connection longitudinal slide.By rotating vertical screw mandrel, make the relative base plate longitudinal sliding motion of longitudinal slide, regulate the lengthwise position of the relative printing stencil of chip with this.
Cross feed device comprises cross slide and cross lead screw; Cross slide is positioned at above the longitudinal feeding device, and its lower surface is provided with the horizontal slide rail that cooperates with longitudinal feeding device; Cross lead screw passes cross slide and connects longitudinal feeding device.By rotating cross lead screw, make the relative longitudinal slide longitudinal sliding motion of cross slide, regulate the lateral attitude of the relative printing stencil of chip with this.
Angle regulator comprises cylinder and cylinder; Cylinder is fixed in the upper surface middle part of cross slide, and cylinder is fixed in the chip fixture apparatus bottom, and stretches in the cylinder, and the cooperation of cylinder and cylinder makes chip fixture apparatus to rotate by relative base, and the angle of regulating the relative printing stencil of chip.
Chip fixture apparatus comprises slide block base, left slider, right slide block and forward lead screw; The relative slide block base with right slide block of left slider center is symmetrical set; Forward lead screw is passed slide block base and left slider, right slide block successively.Can be by rotating forward lead screw so that left slider and right slide block move toward one another clamp or separately, can clamp or unclamp chip easily with this.
Chip fixture apparatus can further include backstay, and backstay is arranged on left slider or the right slide block, can make things convenient for chip to clamp more easily to the workpiece location.
For the fixing printing template, make things convenient for paste solder printing, be provided with fixing templates, comprise pillar and groove and screw; Groove on base plate, is used for fixing printing stencil by shore supports; Screw is used for groove is fixed on pillar, and can regulate the height of groove on pillar.
Can bearing be set further, make groove pass through bearing and better be connected with pillar.
A kind of CSP provided by the invention, bga chip repair method comprise the steps: that A, CSP, bga chip that pad is cleared up adopt paste-tin printing apparatus print solder paste provided by the invention, comprise select positioner with CSP, bga chip pad towards on be fixed in paste-tin printing apparatus; The selection template also is fixed on the paste-tin printing apparatus; Make template mesh and CSP, bga chip pad match by adjusting apparatus for adjusting position; Reconciling apparatus for adjusting position is close to template and CSP, bga chip; Tin cream is spread upon template surface and drawout, finish paste solder printing; B, selection furnace temperature curve set furnace temperature; CSP to be reprocessed, the bga chip of printed tin cream are carried out Reflow Soldering.Owing to use paste-tin printing apparatus provided by the invention, improved the efficient that CSP, bga chip are reprocessed greatly.
[description of drawings]
Fig. 1, be the general assembly schematic diagram of paste-tin printing apparatus in the embodiment of the invention.
Fig. 2, be the structural representation of apparatus for adjusting position in the embodiment of the invention.
Fig. 3, be the structural representation of embodiment of the invention chips fixture.
Fig. 4, be the structural representation of fixing templates in the embodiment of the invention.
Fig. 5, be furnace temperature curve chart in the embodiment of the invention.
[specific implementation method]
Paste-tin printing apparatus provided by the present invention comprises apparatus for adjusting position 1, chip fixture apparatus 2 and fixing templates 3, printing stencil 4 and base 5 (as Fig. 1); Apparatus for adjusting position 1 is fixed on the middle part of base 5, is used to adjust the chip on the chip fixture apparatus 2 and the relative position of printing stencil 4; Chip fixture apparatus 2 is positioned on the apparatus for adjusting position 1, is used for fixing chip; Fixing templates 3 comprises two pillars 32, is fixed in a side of base 5 by pillar 32; Printing stencil 4 is fixed on the fixing templates 3, is positioned at described chip fixture apparatus 2 tops.Apparatus for adjusting position 1 (as Fig. 2) comprises the longitudinal feeding device 1A and cross feed device 1B and the angle regulator 1C that overlap and be provided with; Angle regulator 1C is between cross feed device 1B and chip fixture apparatus 2.Longitudinal feeding device 1A comprises base plate 10, longitudinal slide 11 and vertical screw mandrel 12; Base plate 10 is provided with vertical chute 13; Longitudinal slide 11 is positioned on the base plate 10, and its lower surface is provided with vertical slide rail 14, and upper surface is provided with horizontal concrete chute 17; Vertically screw mandrel 12 passes base plate 10 connection longitudinal slides 11.By rotating vertical screw mandrel 12, make longitudinal slide 11 relative base plates 10 slide, regulate the lengthwise position of the relative printing stencil of chip with this.Cross feed device 1B comprises cross slide 15 and cross lead screw 16; Cross slide 15 is positioned at longitudinal feeding device 1A top, and its lower surface is provided with the horizontal slide rail 18 that cooperates with horizontal concrete chute 17 on longitudinal slide 11 upper surfaces; Cross lead screw 16 passes the longitudinal slide 11 that cross slide 15 connects longitudinal feeding device 1A.By rotating cross lead screw 16, make cross slide 15 relative longitudinal slides 11 laterally slide, regulate the lateral attitude of the relative printing stencil of chip with this.Angle regulator 1C comprises cylinder 21 that is positioned at chip fixture apparatus 2 lower surfaces and the cylinder 11 that is positioned at cross slide 15 upper surfaces; Cylinder 11 stretches in the cylinder 21, and can rotate therein, regulates the relative angle of chip and printing stencil with this.By longitudinal adjustment apparatus 1A, lateral adjustment device 1B, fit angle adjusting device 1C again, finally make the template 4 of being fixed on the chip fixed on the chip fixture apparatus 2 and the fixing templates 3 aim at, be the mesh aligning on bonding pads and the template, bonding pads carried out paste solder printing with convenient.Chip fixture apparatus 2 (as Fig. 3) comprises slide block base 20, left slider 22, right slide block 23 and forward lead screw 24; Left slider 22 is symmetrical set with right slide block 23 relative slide block bases 20 centers; Forward lead screw 24 is passed slide block base 20 and left slider 22, right slide block 23 successively.By rotate forward lead screw 24 can so that left slider 22, right slide block 23 relative slide block bases 20 centers are close or away from, clamp or unclamp with this.Chip fixture apparatus 2 also comprises backstay 25, and reference column 25 is arranged on the left slider 22 in the present embodiment, with convenient chip fixed thereon is located.Fixing templates 3 (as Fig. 4) comprises groove 31, pillar 32 and screw 33; Groove 31 is supported by pillar 32, is used for fixing printing stencil 4; Screw is used for groove 31 is fixed in pillar 32, and regulates the position of groove 31 on pillar 32 with this, makes printing stencil 21 and the chip that is fixed on the chip fixture apparatus be close to, to make things convenient for print solder paste.
Treat the pad of reprocessing CSP, bga chip when reprocessing earlier and clear up, CSP to be reprocessed, bga chip body are heated to the tin remelting, take off, clean pad with washing plate water again, make pad clean no dirt with remaining tin point on the flatiron cleaning pad.Select then positioner with CSP, bga chip pad towards on be fixed in paste-tin printing apparatus; The selection template also is fixed on the paste-tin printing apparatus, and the adjusting position adjusting device makes template mesh and CSP, bga chip pad match, and template and CSP, bga chip are close to; Tin cream is spread upon template surface and drawout.Set the temperature curve of reflow ovens, this is a whole ring of reprocessing most critical in the technology.Present embodiment adopts the reflow ovens of five warm areas, and the temperature of each bringing-up section of reflow ovens satisfies following table:
| The 1st bringing-up section | The 2nd bringing-up section | The 3rd bringing-up section | The 4th bringing-up section | The 5th bringing-up section | |
| Last warm area | 170 |
180 |
180℃ | 255℃ | 245℃ |
| Following warm area | 170 |
180 |
180℃ | 255℃ | 245℃ |
The reflow ovens that refers to of warm area 5 calandrias up and down up and down, it is the same being divided into each warm area design temperature of 5 warm areas, purpose can reach the consistent BGA of helping of hygral equilibrium, CSP and be heated evenly, and especially in the weld zone, guarantee that all solder joints fully melt.Otherwise will form cold solder connection inadequately owing to temperature, the solder joint rough surface, cause following bad if temperature is set improper meeting: 1, temperature rise too fast chip enter high temperature suddenly at the normal temperature state can defective chip, solder(ing) paste can shift to an earlier date that the slump fusing produces the tin ball and other is bad.2, temperature cross low can cause that tin cream does not melt, the various compositions in the short soldering paste of constant temperature time fully activation do not have best welding effect, the activator in the long soldering paste of constant temperature time the bad of particle or powdery occur after having dried Reflow Soldering.If 3 temperature too high weld time of long BGA CSP is subjected to occurring in thermal shock defective chip internal wiring, the surperficial scolding tin crackle, solder joint tarnish, weld strength decline.If 4 reflux temperature curves fall short of weld time, the gas that volatilizees in the scaling powder has little time to overflow, the welding of fusion entered the cooling zone become solid-state, just formed the cavity.
The furnace temperature curve (see Fig. 5, wherein ordinate is represented temperature, and unit is degree centigrade, the abscissa express time, unit for second) be: detailed process is for rising to 120 ℃, A line segment in the corresponding diagram with furnace temperature with 1～3 ℃/second speed; Speed with 0.5～1.5 ℃/second rises to 180 ℃ in 60～90 seconds time then, B line segment in the corresponding diagram; Rise to 230 ℃, C line segment in the corresponding diagram with 2～3 ℃/second speed then; Keep 230 ℃ 20～30 seconds, D line segment in the corresponding diagram; Cooling at last, E line segment in the corresponding diagram.Wherein the scheme of You Huaing is for guaranteeing that furnace temperature is 60～90 seconds in the time more than 220 ℃.The furnace temperature test need meet rear shown in Fig. 1 temperature curve and can cross stove, and reflux course finishes CSP, bga chip is just reprocessed and repaired.This table temperature is that the design temperature purpose can reach the consistent BGACSP of the helping chip of hygral equilibrium thermally equivalent, because each reflow ovens design temperature might different difference to some extent but also can be loosened to ± and 10 degrees centigrade, but in fact still will be as the criterion with the observed temperature curve chart.
Paste-tin printing apparatus provided by the invention is with low cost, versatility good, can satisfy various sizes CSP, the bga chip print request, simple to operate flexibly, the printing precision height, need not buy the problem that expensive printing equipment and CSP, bga chip rework equipments just can solve CSP, bga chip print solder paste in rework process, can effectively reduce operation, reduce cost.This device can also be followed according to needs and be carried out a plurality of CSP, bga chip print solder paste simultaneously.Use this device can improve chip repairing efficient greatly.
Claims (9)
1. a paste-tin printing apparatus comprises chip fixture apparatus 2, fixing templates 3 and printing stencil (4); Described printing stencil (4) is fixed on the fixing templates (3), be positioned at chip fixture apparatus (2) top, and fixing templates is positioned at chip fixture apparatus one side, it is characterized in that also comprising apparatus for adjusting position (1), described apparatus for adjusting position (1) is used to adjust the relative position of chip fixture apparatus (2) and printing stencil (4).
2. paste-tin printing apparatus according to claim 1 is characterized in that described apparatus for adjusting position comprises longitudinal feeding device (1A) and cross feed device (1B) and angle regulator (1C); The vertical overlapping with cross feed device (1B) of described longitudinal feeding device (1A) is provided with; Described angle regulator (1C) is between cross feed device and chip fixture apparatus.
3. paste-tin printing apparatus according to claim 2 is characterized in that described longitudinal feeding device (1A) comprises base plate (10), longitudinal slide (11) and vertical screw mandrel (12); Described base plate (10) is provided with vertical chute (13); Described longitudinal slide (11) is positioned on the base plate (10), and its lower surface is provided with and vertical suitable vertical slide rail (14) of chute (13), and upper surface is provided with horizontal slide rail (18); Described vertical screw mandrel (12) passes base plate (10) and connects longitudinal slide (11).
4. paste-tin printing apparatus according to claim 2 is characterized in that described cross feed device (1B) comprises cross slide (15) and cross lead screw (16); Described cross slide (15) is positioned at above the longitudinal feeding device (1A), and its lower surface is provided with the horizontal slide rail (17) that cooperates with longitudinal feeding device (1A); Described cross lead screw (16) passes cross slide (15) and connects longitudinal feeding device (1A).
5. paste-tin printing apparatus according to claim 2 is characterized in that described angle regulator (1C) comprises cylinder (19) and cylinder (21); Described cylinder (19) is fixed in the upper surface middle part of cross feed device (1B), and described cylinder (21) is fixed in middle part, chip fixture apparatus bottom surface, and stretches in the cylinder (19).
6. paste-tin printing apparatus according to claim 1 is characterized in that described chip fixture apparatus comprises slide block base (20), left slider (22), right slide block (23) and forward lead screw (24); The relative slide block base with right slide block (23) of described left slider (22) (20) center is symmetrical set; Described forward lead screw (24) is passed slide block base (20) and left slider (22), right slide block (23) successively.
7. paste-tin printing apparatus according to claim 6 is characterized in that described chip fixture apparatus also comprises backstay (25), and described backstay is arranged on slide block (22) or the slide block (23).
8. paste-tin printing apparatus according to claim 1 is characterized in that described fixing templates (3) comprises groove (31), pillar (32) and screw (33); Said groove (31) is used for fixing template (4); Described screw (33) is used for groove (31) is fixed on pillar (32).
9. CSP, a bga chip repair method that uses the paste-tin printing apparatus described in arbitrary claim in the claim 1 to 8 comprises the steps:
A, select positioner with CSP, bga chip pad towards on be fixed in paste-tin printing apparatus; Selection printing stencil (4) also is fixed on the fixing templates (3), and adjusting position adjusting device (1) makes the mesh of printing stencil (4) and CSP, bga chip pad match, and printing stencil (4) and CSP, bga chip are close to; Tin cream is spread upon printing stencil (4) surface and drawout, finish paste solder printing;
B, selection furnace temperature curve set furnace temperature and afterwards CSP to be reprocessed, the bga chip of printed tin cream are carried out Reflow Soldering.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610157677A CN100576481C (en) | 2006-12-18 | 2006-12-18 | A kind of paste-tin printing apparatus and the CSP, the bga chip repair method that use this device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610157677A CN100576481C (en) | 2006-12-18 | 2006-12-18 | A kind of paste-tin printing apparatus and the CSP, the bga chip repair method that use this device |
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| CN101207049A true CN101207049A (en) | 2008-06-25 |
| CN100576481C CN100576481C (en) | 2009-12-30 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101920418A (en) * | 2010-04-02 | 2010-12-22 | 无锡华联精工机械有限公司 | Box pile assembling machine centralizer |
| CN102623371A (en) * | 2012-02-28 | 2012-08-01 | 苏州市易德龙电器有限公司 | Chip scale package (CSP) chip mounting loading device and mounting method |
| CN102794995A (en) * | 2012-08-24 | 2012-11-28 | 珠海天威飞马打印耗材有限公司 | Printing template and plate printer |
| CN102883552A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | LGA and BGA repair process |
| CN105472959A (en) * | 2014-09-04 | 2016-04-06 | 上海唐盛信息科技有限公司 | BGA repairing encapsulation method |
| CN105704943A (en) * | 2016-01-29 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | A BGA rework method which can reduce rework cost and raise product reliability |
| CN107734869A (en) * | 2017-11-16 | 2018-02-23 | 无锡市同步电子制造有限公司 | Superposing type BGA Rework Technics |
| CN107864567A (en) * | 2017-11-07 | 2018-03-30 | 威创集团股份有限公司 | A kind of BGA repair methods, device, system |
| CN109671615A (en) * | 2018-12-21 | 2019-04-23 | 成都嘉泰华力科技有限责任公司 | The reworking method of bare chip in a kind of microwave components or module depth chamber |
| CN110653441A (en) * | 2019-09-30 | 2020-01-07 | 昂纳信息技术（深圳）有限公司 | Local solder paste brushing device and system |
| CN113707785A (en) * | 2020-05-20 | 2021-11-26 | 佛山市国星光电股份有限公司 | Preparation method of LED light-emitting device, LED light-emitting device and display panel |
| CN115008878A (en) * | 2022-06-17 | 2022-09-06 | 西安微电子技术研究所 | Tin paste printing device and method for BTC packaging device for repair |
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2006
- 2006-12-18 CN CN200610157677A patent/CN100576481C/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101920418A (en) * | 2010-04-02 | 2010-12-22 | 无锡华联精工机械有限公司 | Box pile assembling machine centralizer |
| CN102623371A (en) * | 2012-02-28 | 2012-08-01 | 苏州市易德龙电器有限公司 | Chip scale package (CSP) chip mounting loading device and mounting method |
| CN102623371B (en) * | 2012-02-28 | 2015-05-27 | 苏州市易德龙电器有限公司 | Chip scale package (CSP) chip mounting loading device and mounting method |
| CN102794995A (en) * | 2012-08-24 | 2012-11-28 | 珠海天威飞马打印耗材有限公司 | Printing template and plate printer |
| CN102794995B (en) * | 2012-08-24 | 2015-08-19 | 珠海天威飞马打印耗材有限公司 | Printing template and flat-panel printer |
| CN102883552A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | LGA and BGA repair process |
| CN102883552B (en) * | 2012-09-18 | 2016-01-20 | 奈电软性科技电子(珠海)有限公司 | LGA and BGA Rework Technics |
| CN105472959A (en) * | 2014-09-04 | 2016-04-06 | 上海唐盛信息科技有限公司 | BGA repairing encapsulation method |
| CN105704943A (en) * | 2016-01-29 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | A BGA rework method which can reduce rework cost and raise product reliability |
| CN107864567A (en) * | 2017-11-07 | 2018-03-30 | 威创集团股份有限公司 | A kind of BGA repair methods, device, system |
| CN107734869A (en) * | 2017-11-16 | 2018-02-23 | 无锡市同步电子制造有限公司 | Superposing type BGA Rework Technics |
| CN109671615A (en) * | 2018-12-21 | 2019-04-23 | 成都嘉泰华力科技有限责任公司 | The reworking method of bare chip in a kind of microwave components or module depth chamber |
| CN110653441A (en) * | 2019-09-30 | 2020-01-07 | 昂纳信息技术（深圳）有限公司 | Local solder paste brushing device and system |
| CN113707785A (en) * | 2020-05-20 | 2021-11-26 | 佛山市国星光电股份有限公司 | Preparation method of LED light-emitting device, LED light-emitting device and display panel |
| CN113707785B (en) * | 2020-05-20 | 2024-04-09 | 佛山市国星光电股份有限公司 | Preparation method of LED light-emitting device, LED light-emitting device and display panel |
| CN115008878A (en) * | 2022-06-17 | 2022-09-06 | 西安微电子技术研究所 | Tin paste printing device and method for BTC packaging device for repair |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150909 |
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