CN101031193B - Radiating molding set - Google Patents

Radiating molding set Download PDF

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Publication number
CN101031193B
CN101031193B CN2006100341707A CN200610034170A CN101031193B CN 101031193 B CN101031193 B CN 101031193B CN 2006100341707 A CN2006100341707 A CN 2006100341707A CN 200610034170 A CN200610034170 A CN 200610034170A CN 101031193 B CN101031193 B CN 101031193B
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CN
China
Prior art keywords
heat
radiating fin
fin group
heat pipe
radiation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100341707A
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Chinese (zh)
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CN101031193A (en
Inventor
黄清白
孟劲功
彭界波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CN2006100341707A priority Critical patent/CN101031193B/en
Publication of CN101031193A publication Critical patent/CN101031193A/en
Application granted granted Critical
Publication of CN101031193B publication Critical patent/CN101031193B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention comprises heat pip and a group of radiating fins. The heat pip has an evaporation end touched with a heat-generated electronic component, and a condensation end coupled with the radiating fins; the condensation end shapes a curvilinear figure in order to increase the touch area between heat pipe and radiating fins so as to improve the cooling effect.

Description

The heat radiation module
[technical field]
The present invention relates to a kind of heat radiation module, particularly relates to a kind of heat radiation module to the heat-generating electronic elements heat radiation.
[background technology]
Along with the fast development of electronic industry, the high speed of electronic component, high frequency and integrated its caloric value that makes increase severely, and therefore heat radiation has become the problem that dealer institute emphasis is considered.
In the heat radiation field, prior art normally adopts a kind of heat radiation module that heat-generating electronic elements is dispelled the heat, as shown in Figure 4, this heat radiation module 30 comprises the plate body 31 with an accepting groove 311, be located at some radiating fin groups 32 on these plate body 31 tops, be used for fan 33 to 32 heat radiations of this radiating fin group, an and heat pipe 34, this heat pipe 34 have one be contained in this plate body 31 accepting grooves 311 and with the evaporation ends 341 of heat-generating electronic elements thermo-contact, an and condensation end 342 that is attached on this radiating fin group 32, this condensation end 342 is a linear, and the heat transferred that this heat radiation module 30 produces heat-generating electronic elements by heat pipe 34 is on radiating fin group 32 and utilize air-flow that fan 33 runnings produce that the heat at radiating fin group 32 places is dispersed in the surrounding air.
The size of heat pipe 34 and radiating fin group 32 contacts area is directly connected to the height of radiating efficiency in the described heat radiation module 30, for improving radiating efficiency, the dealer normally flattens heat pipe 34 to increase the contact area of heat pipe 34 and radiating fin group 32, but in the process of making this type of heat pipe 34, it is destroyed that the capillary structure of a large amount of conveying liquid that exist in the heat pipe 34 has part, and beat flatly more, the ruined degree of capillary structure is serious more, the thermal resistance of heat pipe 34 will increase substantially like this, makes heat pipe 34 decreased performance; And heat pipe 34 is flat excessively, and the cross-sectional area of its transmission medium is reduced, and causes the ability drop of heat pipe transmission heat, so method is not satisfactory, need seek a kind of mode that increases heat pipe 34 and radiating fin group 32 contacts area in addition for this reason.
[summary of the invention]
In view of this, be necessary to provide a kind of heat radiation module that increases heat pipe and radiating fin contact area.
This heat radiation module comprises heat pipe and radiating fin group, this heat pipe is a flat, this heat pipe has the evaporation ends with a heat-generating electronic elements thermo-contact, and the condensation end that combines with this radiating fin group, this heat radiation module also comprises a fan, be formed with an air outlet on this fan, this radiating fin group is positioned at this air outlet place, this radiating fin group comprises some radiating fins, each radiating fin is provided with a flanging in the one end place, these flangings are common to be formed one and connects end face, being shaped as shaped form and being attached on this connections end face of this condensation end, and the condensation end of this heat pipe is an arc with the part that combines of the radiating fin group that is positioned at fan maximum air output place.
With the shaped form that is shaped as of the condensation end of heat pipe, can increase the contact area of heat pipe and radiating fin group, thereby can effectively promote radiating effect in this heat radiation module.In addition, when heat transferred arrives the condensation end of heat pipe, be mind-set radiating fin group diffusion in the thermal source promptly with the diverse location on the condensation end, pass to the heat mutual superposition of radiating fin group by diverse location on the condensation end, make the distribution of the density of heat flow rate on the radiating fin group more even, be more conducive to heat radiation with respect to the linear heat pipe.
[description of drawings]
Fig. 1 is the dispel the heat three-dimensional exploded view of module of the present invention.
Fig. 2 is the dispel the heat three-dimensional assembly diagram of module of the present invention.
Fig. 3 is the enlarged drawing of Fig. 2 centre circle III part.
Fig. 4 is the three-dimensional assembly diagram of prior art heat radiation module.
[embodiment]
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Please refer to Fig. 1 and Fig. 2, the present invention's module 10 that dispels the heat comprises radiating fin group 12, be used for fan 13 to 12 heat radiations of this radiating fin group, the plate body 11 that is connected with this fan 13, and be used at heat-generating electronic elements (figure does not show) and 12 heat pipes 14 that transmit heat of radiating fin group, heat is delivered on the heat pipe 14 from heat-generating electronic elements, and is the thermal source center with heat pipe 14, and heat is spread to radiating fin group 12 places by heat pipe 14.
This plate body 11 is provided with an accepting groove 111, and this fan 13 is located on the end of plate body 11, and it comprises housing 131, be installed in stator (figure does not show) and the rotor 132 that clockwise rotates of this stator relatively on this housing 131.These fan 13 housings 131 are provided with air inlet 133, and at the vertical air outlet 134 of housing 131 sidewall settings and air inlet 133, these air outlet 134 places are provided with a supporting bracket 135.
This radiating fin group 12 is installed on the supporting bracket 135 at air outlet 134 places of this fan 13, this radiating fin group 12 comprises some radiating fins 121, each radiating fin 121 in its top and the bottom be respectively equipped with flanging 124, these radiating fins 121 combine, the flanging 124 on top is common to be formed one and is connected end face 122 with heat pipe 14 fits, and flanging 124 and this supporting bracket 135 of bottom fit.During these fan 13 runnings, the air inlet 133 of the cold air around it by fan 13 sucked in the housing 131, after pressurizeing, discharge, blow to radiating fin group 12, form the air-flow of this radiating fin group 12 of cooling by air outlet 134 places.
This heat pipe 14 is a flat, its thickness is 2.5~3.0mm, these heat pipe 14 1 ends are provided with an evaporation ends 141 that is contained in these plate body 11 accepting grooves 111 and is used for fitting with heat-generating electronic elements, the other end is provided with one and is attached at the condensation end 142 that this radiating fin group 12 connects on the end face 122, this condensation end 142 bends to the arc that is similar to the S shape, thereby make heat pipe 14 have bigger contact area with the end face 122 that is connected of radiating fin group 12, the radian size of these condensation end 142 bendings is decided by the size of the connection end face 122 of radiating fin group 12, and this condensation end 142 farthest is distributed on the connection end face 122 of radiating fin group 12.
Fig. 3 is the dispel the heat enlarged drawing of an end 123 of radiating fin group 12 in the module 10 of the present invention, this end 123 is positioned at fan 13 maximum air output places, the condensation end 142 of heat pipe 14 bends to the arc that is similar to the S shape in this heat radiation module 10, and also just in time be arc in these 123 places, end, compare with the radiating fin group 12 of same position on the radiating fin group 32 shown in Figure 4, the condensation end 142 and the radiating fin group 12 of this place's heat pipe 14 have bigger contact area, thereby make radiating fin group 12 herein more by the heat that heat pipe 14 absorbs, because air output maximum herein, therefore this more heat can distribute effectively, thereby can improve the radiating efficiency of heat radiation module 10.
In this heat radiation module 10 condensation end 142 of heat pipe 14 bent to the arc that is similar to the S shape and contact with radiating fin group 12, with condensation end 342 shown in Figure 4 linearly the heat pipe 34 that is attached on the radiating fin group 32 of shape compare, this heat pipe 14 has long distribution length on radiating fin group 12, thereby increased the contact area of heat pipe 14, thereby can effectively promote radiating effect with radiating fin group 12.When heat transferred arrives the condensation end 142 of heat pipe 14, be mind-set radiating fin group 12 diffusions in the thermal source promptly with the diverse location on the condensation end 142, pass to the heat mutual superposition of radiating fin group 12 by diverse location on the condensation end 142, make the distribution of the density of heat flow rate on the radiating fin group 12 in the present embodiment more even with respect to the linear heat pipe, the air quantity of fan 13 also just can be fully used, it is excessive and cause deficiency in draught to avoid producing position, radiating fin group 12 top density of heat flow rate, part position density of heat flow rate is too small and cause the phenomenon of air quantity surplus, more helps heat radiation.
Among the present invention, the condensation end 142 of heat pipe 14 bends to the arc that is similar to the S shape, in actual applications, the extensible waveform that links together for the arc of the some S of being similar to shapes of the shape of this condensation end 142 also can be C shape, semicircle, other shaped forms such as arc.

Claims (6)

  1. One kind the heat radiation module, comprise heat pipe and radiating fin group, this heat pipe is a flat, this heat pipe has the evaporation ends with a heat-generating electronic elements thermo-contact, and the condensation end that combines with this radiating fin group, it is characterized in that: this heat radiation module also comprises a fan, be formed with an air outlet on this fan, this radiating fin group is positioned at this air outlet place, this radiating fin group comprises some radiating fins, each radiating fin is provided with a flanging in the one end place, the common connection end face that forms of these flangings, being shaped as shaped form and being attached on this connection end face of this condensation end, the condensation end of this heat pipe is an arc with the part that combines of the radiating fin group that is positioned at the maximum air output of fan place.
  2. 2. heat radiation module as claimed in claim 1 is characterized in that: the thickness of this heat pipe is 2.5~3.0mm.
  3. 3. heat radiation module as claimed in claim 1 is characterized in that: this heat pipe one end is provided with an evaporation ends, and the other end is provided with a condensation end.
  4. 4. heat radiation module as claimed in claim 1 is characterized in that: the air outlet place of this fan is provided with a supporting bracket, and this radiating fin group is positioned on this supporting bracket.
  5. 5. heat radiation module as claimed in claim 4 is characterized in that: this heat radiation module also comprises a plate body away from air outlet that is connected with this fan, and this plate body is provided with a resettlement section of accommodating this heat pipe evaporation ends.
  6. 6. as any described heat radiation module of claim 1 to 5, it is characterized in that: this condensation end be shaped as S shape.
CN2006100341707A 2006-03-03 2006-03-03 Radiating molding set Expired - Fee Related CN101031193B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2006100341707A CN101031193B (en) 2006-03-03 2006-03-03 Radiating molding set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2006100341707A CN101031193B (en) 2006-03-03 2006-03-03 Radiating molding set

Publications (2)

Publication Number Publication Date
CN101031193A CN101031193A (en) 2007-09-05
CN101031193B true CN101031193B (en) 2010-09-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100341707A Expired - Fee Related CN101031193B (en) 2006-03-03 2006-03-03 Radiating molding set

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102006762B (en) * 2009-08-31 2014-12-24 富瑞精密组件(昆山)有限公司 Heat-radiating device
CN104780738A (en) * 2014-01-15 2015-07-15 奇鋐科技股份有限公司 Heat pipe structure and heat dissipation module
CN105526816B (en) * 2014-09-30 2018-03-13 富瑞精密组件(昆山)有限公司 Heat pipe, the manufacture method of heat pipe and the heat abstractor using the heat pipe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2458551Y (en) * 2000-12-15 2001-11-07 沈利 Tray pipe type water evaporating radiator
CN1489787A (en) * 2000-12-05 2004-04-14 ض� Electronic assembly having heat pipe that conducts heat from semicanductor substrate
CN2664178Y (en) * 2003-09-12 2004-12-15 珍通科技股份有限公司 Circulating type radiator
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
CN2758851Y (en) * 2004-11-30 2006-02-15 福华电子股份有限公司 Modularized radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
CN1489787A (en) * 2000-12-05 2004-04-14 ض� Electronic assembly having heat pipe that conducts heat from semicanductor substrate
CN2458551Y (en) * 2000-12-15 2001-11-07 沈利 Tray pipe type water evaporating radiator
CN2664178Y (en) * 2003-09-12 2004-12-15 珍通科技股份有限公司 Circulating type radiator
CN2758851Y (en) * 2004-11-30 2006-02-15 福华电子股份有限公司 Modularized radiator

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