CN100556243C - The transmission hole of high-frequency wideband impedance matching - Google Patents
The transmission hole of high-frequency wideband impedance matching Download PDFInfo
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- CN100556243C CN100556243C CNB200510002500XA CN200510002500A CN100556243C CN 100556243 C CN100556243 C CN 100556243C CN B200510002500X A CNB200510002500X A CN B200510002500XA CN 200510002500 A CN200510002500 A CN 200510002500A CN 100556243 C CN100556243 C CN 100556243C
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- impedance matching
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Abstract
The present invention relates to a kind of transmission hole of high-frequency wideband impedance matching, with the multilayer board is example, combination for a plurality of circuit layers and insulating barrier, circuit layer and insulating barrier intersecting are provided with, it comprises a plurality of signal transmssion lines, vertical signal via and vertical ground connection via, each signal transmssion line is arranged at different circuit layers, connects with the vertical signal transmission hole between signal transmssion line, and makes the vertical signal transmission hole reach impedance matching by corresponding vertical ground connection via is set.
Description
Technical field
The present invention relates to a kind of transmission hole, be applied to multilayer circuit board, LTCC, IC, thick film ceramic, thin-film ceramics, silicon substrate glass substrate processing procedure etc., particularly relate to a kind of transmission hole of high-frequency wideband impedance matching.
Background technology
In the electronic system product, comprise circuit board, LTCC (Low-TemperatureCofired Ceramics, LTCC), IC, thick film ceramic, thin-film ceramics, silicon substrate glass substrate processing procedure, wherein in order to carry printed circuit board (PCB) (the Printed Circuit Board of electronic component, PCB), usually the plane substrate that uses glass fabric or flexible substrate to form republishes conducting channel.Along with the design concept of electronic product trend " compact ", printed circuit board (PCB) also towards the small-bore, high density, multilayer number, the development of fine rule road.Wherein, multilayer board is the good solution that improves line density.
Yet under the situation that the printed circuit board (PCB) number of plies increases, signal transmssion line certainly will will pass each layer and cause serious disturbance; In addition, electronic product now is towards the trend of high-frequency wideband, high speed development, and is higher for the requirement of impedance precision between effectiveness and transmission, because of unmatched impedance meeting causes the signal bounce-back, the lighter can make system's shakiness, and serious words will cause system damage.Therefore printed circuit board (PCB) needs further design at transmission line live width and line-spacing, sets up balanced impedance design, but existing PCB design is only considered interplanar transmission mostly, lessly considers that vertical signal transmits.Because the vertical signal transmission is the difficult point on the circuit design between the plate of multilayer board always, many high-frequency wideband circuit design can be avoided doing the vertical signal transmission by via between plate (via).
The described multilayer board of application case as No. the 20040053014th, the early stage publication number of the U.S., it has first and second signal transmssion line, and first and second ground plane, be connected with the vertical signal via between first signal transmssion line and the secondary signal transmission line.Connect with the earth-continuity hole between first and second ground plane, the earth-continuity hole near but be not attached to via, first ground plane protrudes in second ground plane and than the second ground plane approach signal via, the interference of stablizing first signal transmssion line.Cooperate the staggered designs of first ground plane and second ground plane can reach good impedance Control again.Yet the method can cause the complexity in many designs, reduces the flexibility ratio of circuit application, and the control of the precision of integral multi-layered printed circuit board (PCB) is difficult for.
Summary of the invention
Given this, main purpose of the present invention is to provide a kind of high-frequency wideband impedance matching transmission hole, with the multilayer board is example, between signal transmssion line, connect with the vertical signal transmission hole, and make the vertical signal transmission hole reach impedance matching by vertical ground connection via, utilize the vertical signal transmission hole among each layer metal, to dispose transmission line flexibly, make that high-frequency wideband and electric signal at a high speed are more complete in the solid space transmission.
Therefore, for achieving the above object, the present invention proposes a kind of high-frequency wideband impedance matching transmission hole, is applied to various base materials, comprises first signal transmssion line, secondary signal transmission line, vertical signal via and vertical ground connection via.First signal transmssion line and secondary signal transmission line are arranged at the different surface of base material, and first signal transmssion line connects the secondary signal transmission line by the vertical signal via that is arranged in the base material; A plurality of vertical ground connection vias then are adjacent to the vertical signal via, and all described vertical ground connection vias and described vertical signal via be same specific distance at interval.So then can control group by the control specific distance, make the signal transmission of vertical signal via have impedance matching.
Wherein, be similar to co-plane waveguide as two vertical ground connection vias of symmetry being set, can be considered around the vertical signal via.In addition, also can adopt two with last vertical junction ground via be surrounded on the signal transmission hole around, to be similar to the structure of coaxial wire (cable), also can to add conductive part and connect each vertical ground connection via, further to promote electrical characteristic.
In addition, cooperate different circuit design, the present invention also can be applicable to the transmission of differential right signal, and its structure comprises that the first signal transmission differential pair and secondary signal transmission differential are to, a pair of signal conduction hole, planar conductor line and a plurality of vertical ground connection via.The first signal transmission differential pair and secondary signal transmission differential are to being arranged at two surfaces of base material respectively, and it is right with the secondary signal transmission differential to connect the first signal transmission differential pair with a pair of signal conduction hole, a plurality of vertical ground connection vias then are adjacent to signal conduction hole and interval one specific distance, and cooperate the signal conduction hole to be arranged in the insulating barrier symmetrically.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the generalized section of first embodiment of the invention;
Fig. 2 is the generalized section of second embodiment of the invention;
Fig. 3 A, 3B are the perspective diagram of third embodiment of the invention;
Fig. 4 A is the three-dimensional structure schematic diagram of the present invention first emulation embodiment;
Fig. 4 B is the distribution of impedance schematic diagram of the present invention's first emulation embodiment simulation result;
Fig. 5 A, 5B are the three-dimensional structure schematic diagram of the present invention second emulation embodiment; And
Fig. 6 is the three-dimensional structure schematic diagram of the present invention the 3rd emulation embodiment.
Wherein, Reference numeral:
The 110-circuit layer
111-first signal transmssion line
112-secondary signal transmission line
113-vertical signal via
The vertical ground connection via of 114-
The 120-insulating barrier
The 311-first signal transmission differential is right
312-secondary signal transmission differential is right
Many vertical ground connection vias of 314-
316-hollow conductive part
The 320-insulating barrier
The 311-first signal transmission differential is right
312-secondary signal transmission differential is right
313-vertical signal via
The vertical ground connection via of 314-
The 315-planar conductor line
The 316-conductive part
The 317-conductive part
411-first signal transmssion line
412-secondary signal transmission line
413-vertical signal via
The vertical ground connection via of 414-
415-ring-type conductive part
416-semicircular conductive part
The 420-insulating barrier
The D-specific distance
Embodiment
High-frequency wideband impedance matching transmission hole disclosed in this invention, be applied to various base materials, be multilayer circuit board, LTCC, IC, thick film ceramic, thin-film ceramics, silicon substrate glass substrate processing procedure etc. for example, by the earth-continuity hole be disposed at the signal conduction hole around, make the signal transmission of vertical signal via have impedance matching.Following structure is example with the multilayer circuit board, makes multilayer circuit board reach the purpose of impedance matching by structural design.The multilayer circuit plate structure is the combination of a plurality of insulating barriers of storehouse and circuit layer, utilize the vertical signal via that the electric connection of circuit layer is provided, and in structure, add vertical ground connection via, make the signal transmission of vertical signal via reach impedance matching, the embodiment of its structural design discloses as follows.
Multilayer board is the combination of a plurality of circuit and insulating barrier, and circuit layer and insulating barrier intersecting are provided with.Please refer to Fig. 1, it is the generalized section of first embodiment of the invention.With the 6-layer circuit board structure is example, it has six circuit layers 110 from the bottom to top, 110 of circuit layers are spacer insulator layer 120 then, and structure of the present invention comprises first signal transmssion line 111 and secondary signal transmission line 112, vertical signal via 113 and vertical ground connection via 114.First signal transmssion line 111 is arranged at bottom surface circuit layer 110 (can be considered the first surface of base material), secondary signal transmission line 112 is arranged at top circuit layer 110 (can be considered the second surface of base material), and at interval a plurality of insulating barrier 120, the first signal transmssion lines 111 pass through 113 conductings of vertical signal via in secondary signal transmission line 112; Vertical 114 of ground connection vias are adjacent to vertical signal via 113, the circuit layer 110 of vertical ground connection via 114 inleakages and with vertical signal via 113 a specific distance D at interval.Like this, then can control group by control specific distance D, make the signal transmission of vertical signal via 113 have impedance matching.
The a plurality of vertical ground connection via of symmetry also can be set around the vertical signal via in addition, can be considered approximate co-plane waveguide.Please refer to Fig. 2, it is the generalized section of second embodiment of the invention.Be example with the 6-layer circuit board structure equally, it has six circuit layers 110 from the bottom to top, 110 of circuit layers are separated with insulating barrier 120 between then, and structure of the present invention comprises first signal transmssion line 111 and secondary signal transmission line 112, vertical signal via 113 and two vertical ground connection vias 114.First signal transmssion line 111 is arranged at bottom surface circuit layer 110, and secondary signal transmission line 112 is arranged at top circuit layer 110, and at interval a plurality of insulating barrier 120, the first signal transmssion lines 111 pass through 113 conductings of vertical signal via in secondary signal transmission line 112; 114 vicinities of two vertical ground connection vias also are symmetrical in vertical signal via 113 and are provided with, vertical ground connection via 114 respectively inleakages circuit layer 110 and with vertical signal via 113 a specific distance D at interval.Conductive part in a second embodiment is the hollow and annular conductive part, and this hollow and annular conductive part connects ground hole.
In addition, the present invention can be applicable to differential right signal transmission, please refer to Fig. 3 A, it is the perspective diagram of third embodiment of the invention, its structure comprise the first signal transmission differential to 311 with the secondary signal transmission differential to 312, a pair of signal conduction hole, a plurality of vertical ground connection via 314 and hollow conductive part 316.The first signal transmission differential to 311 with the secondary signal transmission differential to 312 spacer insulator layer 320, and with a plurality of signal conductions hole connect the first signal transmission differential to 311 with the secondary signal transmission differential to 312.The signal conduction hole is made up of a plurality of vertical signal vias 313 and planar conductor line 315, vertical signal via 313 is crisscross arranged in insulating barrier 320, vertical electric connection is provided, 313 of vertical signal vias pass through planar conductor line 315 and connect, planar conductor line 315 is arranged at insulating barrier 320, and electrically conducting of plane is provided; Vertical 314 of ground connection vias are adjacent to the signal conduction hole and are symmetricly set in both sides, and cooperate vertical signal via 313 to be arranged in the insulating barrier 320, the conductive part 316 mutual conductings that vertical ground connection via hollows out by the centre.
As shown in Figure 3A, the conductive part 316 that the centre hollows out encloses fully and is around in vertical signal via 313, in addition, also it can be designed to utilize conductive part 317 only to enclose and be around in vertical signal via 313 1 sides (seeing Fig. 3 B).
Be clearer description the present invention, adopt the printed circuit board arrangement of six laminates to carry out the emulation of high-frequency electromagnetic effect, its specification is as follows: each thickness of insulating layer is 10mil (mil), metal layer thickness is 1mil, the via diameter is 10mil, the diameter of ring-type conductive part is 20mil, and the transmission line total length is 200mil; The insulating barrier material be glass fibre FR4 (DK=4.2, DF=0.03).Below be the simulation result and the three-dimensional structure schematic diagram of being correlated with.
Please refer to Fig. 4 A, it is the three-dimensional structure schematic diagram of the present invention first emulation embodiment, and structure comprises first signal transmssion line 411 and secondary signal transmission line 412, vertical signal via 413 and two vertical ground connection vias 414.First signal transmssion line 411 passes through 413 conductings of vertical signal via in secondary signal transmission line 412 with secondary signal transmission line 412 spacer insulator layer 420, the first signal transmssion lines 411; 414 contiguous vertical signal vias 413 of two vertical ground connection vias and interval one specific distance D, two vertical ground connection vias 414 are symmetricly set in the both sides of vertical signal via 413.
Please refer to Fig. 4 B, it is the distribution of impedance schematic diagram of the present invention's first emulation embodiment simulation result, and the longitudinal axis is impedance (Z), and transverse axis is time (T).With the same structure that do not have vertical ground connection via in contrast, carry out emulation with the first emulation example structure again with different D values.Its result is not for to have the structure of vertical ground connection via, and its impedance utmost point does not match, and maximum different value is 40.1%.And vertical ground connection via and vertical signal via are about the first emulation example structure of 10mil (D=10mil) at interval, and the maximum different value of its impedance matching is 9.5%.Vertical ground connection via and vertical signal via are about the first emulation example structure of 15mil (D=15mil) at interval, and the maximum different value of its impedance matching is 5.3%.By simulation result as can be known the present invention can improve the unmatched situation of impedance effectively, and can obtain preferable impedance matching by the specific distance D that adjusts vertical ground connection via and vertical signal via.
Also can add conductive part and connect each vertical ground connection via.Please refer to Fig. 5 A, it is the three-dimensional structure schematic diagram of the present invention second emulation embodiment, and its structure comprises first signal transmssion line 411 and secondary signal transmission line 412, vertical signal via 413, two ring-type conductive parts 415 and two vertical ground connection vias 414.First signal transmssion line 411 passes through 413 conductings of vertical signal via in secondary signal transmission line 412 with secondary signal transmission line 412 spacer insulator layer 420, the first signal transmssion lines 411; 414 contiguous vertical signal vias 413 of two vertical ground connection vias, and two vertical ground connection vias 414 are symmetrical in the both sides that vertical signal via 413 is set, connect two vertical ground connection vias 414 by two ring-type conductive parts 415, each vertical ground connection via 414 is electrically connected.On the other hand, please refer to Fig. 5 B, also can directly utilize a plurality of vertical ground connection vias 414 to be arranged at symmetrically around the vertical signal via 413, reach the structure that is similar to coaxial wire (cable).
In addition, conductive part also can be semicircular, please refer to Fig. 6, it is the three-dimensional structure schematic diagram of the present invention the 3rd emulation embodiment, and its structure comprises first signal transmssion line 411 and secondary signal transmission line 412, vertical signal via 413, two ring-type conductive parts 415, two semicircular conductive parts 416 and two vertical ground connection vias 414.First signal transmssion line 411 passes through 413 conductings of vertical signal via in secondary signal transmission line 412 with secondary signal transmission line 412 spacer insulator layer 420, the first signal transmssion lines 411; 414 contiguous vertical signal vias 413 of two vertical ground connection vias, and two vertical ground connection vias 414 are symmetricly set in the both sides of vertical signal via 413, connect two vertical ground connection vias 414 by two ring-type conductive parts 415, each vertical ground connection via 414 is electrically connected, and in the top and the bottom surface of two vertical ground connection vias 414, each electrically conducts to provide with 416 connections of semicircular conductive part.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (6)
1, a kind of transmission hole of high-frequency wideband impedance matching is applied to a base material, it is characterized in that, described base material has a relative first surface and a second surface, and described transmission hole comprises:
One first signal transmission differential is right, is arranged at the first surface of described base material;
One secondary signal transmission differential is right, is arranged at the second surface of described base material;
A pair of signal conduction hole is arranged in the described base material, and is right to connecting described secondary signal transmission differential by described signal conduction hole for the described first signal transmission differential; And
A plurality of earth-continuities hole, contiguous and be arranged at described signal conduction hole symmetrically.
2, the transmission hole of high-frequency wideband impedance matching according to claim 1, it is characterized in that, described signal conduction hole comprises a plurality of vertical signal vias and a plurality of planar conductor line, described vertical signal via is arranged in the described base material, so that vertical electric connection to be provided, and described vertical signal via by described planar conductor line connect with form described first signal transmission differential pair and described secondary signal transmission differential between electrically conduct.
3, the transmission hole of high-frequency wideband impedance matching according to claim 1 is characterized in that, also comprises a conductive part, connects a plurality of described earth-continuities hole.
4, the transmission hole of high-frequency wideband impedance matching according to claim 3 is characterized in that, described conductive part is the middle conductive part that hollows out.
5, the transmission hole of high-frequency wideband impedance matching according to claim 3 is characterized in that, described conductive part circle is around in described signal conduction hole.
6, the transmission hole of high-frequency wideband impedance matching according to claim 3 is characterized in that, described conductive part connects described earth-continuity hole and only encloses a side that is around in described signal conduction hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510002500XA CN100556243C (en) | 2005-01-25 | 2005-01-25 | The transmission hole of high-frequency wideband impedance matching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510002500XA CN100556243C (en) | 2005-01-25 | 2005-01-25 | The transmission hole of high-frequency wideband impedance matching |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101715246A Division CN101662882B (en) | 2005-01-25 | 2005-01-25 | Transmission hole of matched high frequency broadband impedance |
Publications (2)
| Publication Number | Publication Date |
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| CN1812697A CN1812697A (en) | 2006-08-02 |
| CN100556243C true CN100556243C (en) | 2009-10-28 |
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| CNB200510002500XA Expired - Fee Related CN100556243C (en) | 2005-01-25 | 2005-01-25 | The transmission hole of high-frequency wideband impedance matching |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101335987B1 (en) * | 2007-01-11 | 2013-12-04 | 삼성전자주식회사 | Multi-layer substrate |
| CN101389182B (en) * | 2007-09-13 | 2011-03-30 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN101557683B (en) * | 2008-04-09 | 2011-06-15 | 旺矽科技股份有限公司 | Probe card used for IC wafer electrical property testing |
| CN102711362A (en) * | 2011-03-28 | 2012-10-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN108063362A (en) | 2015-03-30 | 2018-05-22 | 青岛海信宽带多媒体技术有限公司 | A kind of laser |
| CN108321674A (en) * | 2015-03-30 | 2018-07-24 | 青岛海信宽带多媒体技术有限公司 | Laser emitter |
| CN104836619B (en) | 2015-03-30 | 2017-08-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical device |
| CN107041073A (en) * | 2017-05-27 | 2017-08-11 | 郑州云海信息技术有限公司 | A kind of wiring method for reducing high speed signal crosstalk |
| WO2019232749A1 (en) * | 2018-06-07 | 2019-12-12 | 华为技术有限公司 | Integrated circuit |
| CN109561571B (en) * | 2018-11-29 | 2021-03-09 | 四川九洲电器集团有限责任公司 | System and method for shielding strip line and connecting pipe in printed board and printed board |
| CN111244600B (en) * | 2018-11-29 | 2021-11-23 | 荷兰移动驱动器公司 | Antenna structure and wireless communication device with same |
| CN111601451A (en) * | 2019-02-20 | 2020-08-28 | 大唐移动通信设备有限公司 | Interconnection structure subassembly and millimeter wave antenna module |
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2005
- 2005-01-25 CN CNB200510002500XA patent/CN100556243C/en not_active Expired - Fee Related
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Granted publication date: 20091028 Termination date: 20190125 |