CN100520679C - Reconfigurable chassis module - Google Patents
Reconfigurable chassis module Download PDFInfo
- Publication number
- CN100520679C CN100520679C CNB2007100962904A CN200710096290A CN100520679C CN 100520679 C CN100520679 C CN 100520679C CN B2007100962904 A CNB2007100962904 A CN B2007100962904A CN 200710096290 A CN200710096290 A CN 200710096290A CN 100520679 C CN100520679 C CN 100520679C
- Authority
- CN
- China
- Prior art keywords
- junction surface
- chassis module
- female
- public
- modular unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.
Description
[technical field]
The casing design of the relevant a kind of electronic installation of the present invention, the reconfigurable chassis module of particularly a kind of upgradable computer system.
[background technology]
The enclosure designs of traditional electronic devices needs a fixing and predefined integrated support casing, so that the mechanical support to internal electrical components to be provided.This restriction hinders the part of the basic engineering that is selected to single-piece frame and inner structure that some can be type recombined.Generally speaking, anyly do not require that whole reconstitutable systems have unnecessary weight, untapped idle space and unwanted cost.Along with the technical development in future, mechanism design possibly can't meet new kenel factor, and may need to redesign new casing with the supporting technology feature, and will need extra cost.For example: the upgrading of new CPU (central processing unit) (CPU) and internal memory needs new power supply unit or new interface slot to satisfy higher power density and access speed demand faster.The thing followed will be extra cost, because all profile factor of traditional casing are all fixed.
Moreover traditional casing design comprises the combo architectures by the sheet metal multiple-piece, and such framework has hindered the degree of chassis moduleization.And traditional design also makes the maintenance service of intraware become difficult, and must spend the long time to go to finish.
[summary of the invention]
In order to solve the existing problem of prior art, the invention provides a kind of reconfigurable chassis module that is applied to the upgradable computer system.Chassis module comprises several modular units can be provided with hardware cell, and the public junction surface of configurations match and female junction surface are to mutually combine.Modular unit adopts back-and-forth mode and/or side opposite side mode to connect, can be in order to adjust the size of computer system.
Chassis module of the present invention comprises:
At least one first modular unit comprises one first casing, 2 first public junction surfaces and 2 first female junction surfaces, and this first casing comprises two relative open ends, in order to this first public junction surface and this first female junction surface to be set respectively; And
At least one second modular unit comprises one second casing, 2 second public junction surfaces and 2 second female junction surfaces, and this second casing comprises two relative open ends, in order to this second public junction surface and this second female junction surface to be set respectively;
Wherein, this the first/the second public junction surface is a L type Extendible flake, be arranged at the front end of the first/the second modular unit dual-side, this the first/the second female junction surface is a S type Extendible flake, be arranged at the rear end of the first/the second modular unit dual-side, this first female junction surface forms an elongated slot and is matched with this second public junction surface.
The invention has the advantages that the enclosure designs of electronic apparatus moduleization, one elasticity casing is provided, can change the degree of depth, width and height, be included in nonconforming intersection block in the three-dimensional space, allow the external form factor of different electronic installations, and the utilization in space is maximized, reduces weight and cost.Also allow different electric substrates or module once to design and be used in Anywhere, therefore reduce cost of development and accelerate listing speed.The Flexible Design of chassis moduleization allows different feature and assemblies to form system very fast to meet customer need.Large-scale and complicated system can adopt basic chassis module mode to amplify, and development time and main tool cost are minimized.When system upgrade, can ensure that the individual component that the client invests is reusable.
For purpose of the present invention, structural attitude and function thereof are had further understanding, conjunction with figs. is described in detail as follows now:
[description of drawings]
Fig. 1 is a first embodiment of the invention upgradable computer system, the exploded view of first and second modular unit and Jie's plate.
Fig. 2 is the synoptic diagram of the present invention's the firstth embodiment intermediate plate.
Fig. 3 is a first embodiment of the invention, the synoptic diagram of public and female junction surface combination in first and second modular unit.
Fig. 4 is a first embodiment of the invention, the combination synoptic diagram that back-and-forth mode connects.
Fig. 5 is a second embodiment of the invention upgradable computer system, first and second modular unit, Jie's plate, the support member that strengthens combined strength and the exploded view of clamp.
Fig. 6 is a second embodiment of the invention, the combination synoptic diagram that side opposite side mode connects.
Fig. 7 is a third embodiment of the invention upgradable computer system schematic.
[embodiment]
Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4.Computer system of the present invention comprises the necessary hardware unit, and for example: motherboard 30, built-in inserted plate 40, power supply module 50, fan 61,62,63 and Jie's plate 70 are arranged at first modular unit 10 and second modular unit 20 of chassis module respectively.
Motherboard 30 is a printed circuit board (PCB), dispose different circuit units, for example: CPU (central processing unit) (CPU), Installed System Memory, north and south bridge chip, input/input controller, network interface controller and input/input connector etc., said modules is connected in specific bus, carries out the work of data processing under operating system.Built-in inserted plate 40 provides extra function of computer system and compatibility, has different interfaces under different operations is implemented.According to computer system of the present invention, display card, network card, servo control card even CPU (central processing unit) card can be a kind of embodiment of built-in inserted plate 40.In some special kenels, it is built-in inserted plate 40 that another piece motherboard also can be used as.
Please refer to Fig. 2, Fig. 1 and Fig. 4.Jie's plate 70 is fixed on the framework 111 (or directly being fixed on first modular unit 10), is used for connecting the hardware cell that is arranged at first modular unit 10 and second modular unit 20 respectively.At Fig. 2, be arranged at four home slots 71 on Jie's plate 70, in order to connect main interface 31 corresponding on the motherboard 30.Similarly, six expansion slots 72 are in order to connecting the extended interface 41 of built-in inserted plate 40, and are disposed at three power connections 73 on Jie's plate 70, connect the power interface 52 of power supply module 50.Several pores 74 are arranged on 70 whole of Jie's plates as much as possible, cross Jie's plate 70 to allow air communication.Framework 11/111/21 also together.If adopt the individual layer layout to cause the remaining space deficiency of Jie's plate 70, can adopt multilayer board technology Jie Yu plate 70.Connecting circuit between home slot 71, expansion slot 72 and the power connection 73 also can be reached in this way.Except that aforesaid slot and joint, the general power distribution circuit of prior art arrangement on the power distribution plate also can be arranged at Jie's plate 70.
In Fig. 1, Fig. 2 and Fig. 4, first modular unit 10 adopts back-and-forth mode to be connected with second modular unit 20.Two modular units 10,20 have closely similar mechanical framework (identical in some example), the first/the second casing, 12/22, the first/the second public junction surface 13/23 that includes the square type is arranged on the preceding lower edge of the first/the second modular unit 10/20, and the first/the second female junction surface 14/24 is configured in the back edge of the first/the second modular unit 10/20.The first/the second casing 12/22 is rectangle or tubular container, has two relative open ends, allows the hardware cell of computer system to install or to remove via front side and rear side.The first/the second public junction surface 13/23 is a L type Extendible flake, and the position is in the open end of the first/the second casing 12/22.The first/the second female junction surface 14/24 is a S type Extendible flake, the position in relative open end, formation can with the first/the second public junction surface, 13/23 mutual ccontaining elongated slot.Basically, public junction surface and female junction surface are arranged at the open end and relative open end of modular unit.The elongated slot 141 of female joint 14 is in order to hold the end at public junction surface 23, and if necessary, elongated slot 241 can engage (direction exchange) with public junction surface 13 or other public junction surface engages.One or more fixtures 15 are for example: screw or other possible fixedly kenel, and in order to public junction surface/female junction surface 14/23 of fixed engagement.Be positioned at corresponding screw hole (not shown) on public junction surface/female junction surface 14/23 as if adopting screw to fix, then needing.In addition, one or more modular units can be coupled to the front side of first modular unit 10 or the rear side of second modular unit 20, in order to expand computer system.And another Jie's plate can be used as the articulation set of additional hardware unit.
For the outside by the first/the second modular unit 10/20 provides support structure, stiffening rib 16/26 is arranged at the outside of the first/the second casing 12/22, and strong fixing by several fixtures 161/261.Stiffening rib 16/26 can be strip or any other structure corresponding to fixture 161/261 with screw hole.Two fairleads 162/262 are extended by stiffening rib 16/26, and go deep into the inboard of the first/the second casing 12/22, can be used as the track that motherboard 30 (or built-in inserted plate 40) skids off/slips into.The substrate tray (not shown) motherboard 30 (or built-in inserted plate 40) that can be coupled earlier slides into and skids off along fairlead 162/262 then.Especially fairlead 162/262 can be in order to guide or to fix other hardware cell, for example: built-in inserted plate 40 and power supply module 50.
Please refer to Fig. 5 and Fig. 6.First and second modular units 10,20 of previous embodiment can adopt side opposite side mode to connect.Present embodiment is as follows with the main Discrepancy Description of previous embodiment.
At first, first and second modular units, 10,20 aligned adjacent, in the side or upper-lower position coupled to each other, closely align in the first public junction surface 13 and the second public junction surface 23, first female junction surface 14 and the second female junction surface, 24 dresses are attached to together.One plate bending becomes to have the support member 171 of W shape intersection block, can hold the first and second public junction surfaces 13,23.Fixture 15 and nut 151 then, or other any existing means that can be used to fix all can be in order to the strong first and second public junction surfaces 13,23 of fixing.On the other hand, chimeric 172 on U type can insert in the elongated slot 141,142 at first and second female junction surfaces 14,24 and fixes.Can adopt breech lock/screw/member or other any existing means such as joggle for chimeric 172, in order to engage first and second female junction surfaces 14,24.In addition, chimeric 172 can predetermined fixed on Jie's plate 70.
In addition, home slot 71, expansion slot 72 and power connection 73 are arranged on the both sides of Jie's plate among the aforesaid embodiment, and home slot 71, expansion slot 72 and power connection 73 all are arranged on the same side of Jie's plate in the present embodiment.And the size of Jie's plate 70 needs bigger, also reaches in all slots and joint so that extend to other modular unit.The plate 70 that just is situated between is the two adjacent open ends that are arranged at first and second modular units 10,20.Because Jie's plate 70 covers first and second modular units 10,20, framework 111,211 should be configured to dress and invest Jie's plate 70.
Please refer to Fig. 7.For reaching better structural arrangements, the first and second female junction surfaces 14,24 or first and second modular units 10,20 may not be complete symmetry.Second female junction surface 24 among Fig. 7 is a U type Extendible flake, and an end inserts in first female junction surface 14.Allow second female junction surface 24 direct and first female junction surface 14 combinations.Another U type folder 174 can be in order to clamp first and second female junction surfaces 14,24.U type folder 174 also can set in advance on Jie's plate 70.And second female junction surface 24 of U type can allow the first and second public junction surfaces 13,23 rely on tightr mutually.Another U type fastener 173 can be in order in conjunction with the first and second public junction surfaces 13,23.
The adjacent side of first and second modular units 10,20 is shorter than other side in Fig. 7.Therefore allow that pure frame 112 is arranged at the rear side edge of first and second modular units 10,20 (adjacent open end), can provide more structural support the modular unit of combination.Simultaneously, extra fan can be adorned and be attached on the pure frame 112, reaches the demand of scalable cooling system.
The explanation of the above embodiments is disclosed novel concepts according to the present invention, comprises casing method for designing, module mechanism interface and the module cooling of external-to-internal.
The structural group component (stiffening rib that fixture is arranged) that the invention provides all mechanism supports of forming module is a modular, can be entered and be assembled by the outside of basic outer casing space (the first/the second modular unit), defines a method from outside to inside.Traditional casing design relates to the structural block of casing, assembled by the metal shell thin plate, and the metal shell thin plate can hinder the degree of chassis moduleization.And traditional design makes intraware be difficult to approaching and need take a long time maintenance.In the present invention, basic modular unit forms the border, and all electronic packages remain on the inboard, border, and without any the structural member of inboard.All structural members all can by the outside adorn attached with remove.The method can obtain intraware easily, and reduces the cycle length of maintenance service.
Wherein, each modular unit provides the interface (public affairs/female junction surface that fixture/support member/clamper is arranged) of standard to allow any chassis module pairing and reaches the demand of mechanism's intensity and electromagnetic interference (EMI).The present invention discloses the structure fixture that standardized public affairs and female junction surface and standardization are removable and can serve, and allows that whereby computer system is scalable.The built-in structure-reinforced equipment of versatility on the junction surface will be easy to development.
Though the foregoing description has disclosed man-to-man combination, computer system can comprise four (two pairs two), nine (three pairs three) or more modular unit according to the present invention.Side opposite side and back-and-forth mode connect, chassis module that can be applied to integrate or single.
For the demand of upgradable computer system and reconfigurable chassis module thereof, the electronic package of himself should be supported in the individual modules unit of chassis module in mechanism, comprise for example fan of cooling unit.In some specific embodiments, each cooling unit can provide electric power and repay the inductor function by adorning attached modular unit, then by identical or other the modular unit receiving element level or the supervisory instruction of systemic hierarchial.This represents that the cooling unit of each module is the some of modular unit, and together adjusts size with other modular unit.Provide suitable cooling to the regions module electronic package.Above-mentioned mentioned embodiment, the cooling unit of each module via the pore of position on Jie's plate or framework, meets whole system cools framework (from the front to the back).In addition, each module cooling unit combination in system can be strengthened mutually, and unnecessary other unit that is cooled to computer system is provided.
Claims (10)
1. reconfigurable chassis module is characterized in that this reconfigurable chassis module comprises:
At least one first modular unit comprises one first casing, 2 first public junction surfaces and 2 first female junction surfaces, and this first casing comprises two relative open ends, in order to this first public junction surface and this first female junction surface to be set respectively; And
At least one second modular unit comprises one second casing, 2 second public junction surfaces and 2 second female junction surfaces, and this second casing comprises two relative open ends, in order to this second public junction surface and this second female junction surface to be set respectively;
Wherein, this the first/the second public junction surface is a L type Extendible flake, be arranged at the front end of the first/the second modular unit dual-side, this the first/the second female junction surface is a S type Extendible flake, be arranged at the rear end of the first/the second modular unit dual-side, this first female junction surface forms an elongated slot and is matched with this second public junction surface.
2. reconfigurable chassis module as claimed in claim 1 is characterized in that: this elongated slot at this first female junction surface with back-and-forth mode in conjunction with this second public junction surface.
3. reconfigurable chassis module as claimed in claim 2, it is characterized in that: this chassis module more comprises at least one fixture, fixing this first female junction surface and this second public junction surface of combination, and the more indivedual at least one frameworks that comprise of this first and second modular unit with several pores, described framework is positioned at first and second module rear and front end, and fits in described first and second casing.
4. reconfigurable chassis module as claimed in claim 1, it is characterized in that: this first and second modular unit more comprises at least one stiffening rib, be disposed at the outside of this first/the second casing dual-side, and this stiffening rib comprises at least one fairlead, is embedded in the inboard of this first/the second casing dual-side.
5. reconfigurable chassis module as claimed in claim 1 is characterized in that: this first and second modular unit dual-side aligned adjacent makes first and second public junction surface alignment close to each other of adjacent both sides.
6. reconfigurable chassis module as claimed in claim 5 is characterized in that: this chassis module more comprises a W type support member, in conjunction with this first and second public junction surface.
7. reconfigurable chassis module as claimed in claim 5, it is characterized in that: this second female junction surface is a S type Extendible flake, form an elongated slot and be matched with this first public junction surface, this chassis module more comprises chimeric of a U type, insert this first and second female junction surface this elongated slot and in conjunction with this first and second female junction surface.
8. reconfigurable chassis module as claimed in claim 5 is characterized in that: this second female junction surface is a U type Extendible flake, and an end inserts this first female junction surface.
9. reconfigurable chassis module as claimed in claim 8 is characterized in that: this chassis module more comprises:
One U type fastener is in conjunction with this first and second public junction surface; And
One U type folder is in conjunction with this first and second female junction surface.
10. reconfigurable chassis module as claimed in claim 5 is characterized in that: the adjacent side of this first and second modular unit is shorter than other side, and this chassis module more comprises a framework, is arranged at the contiguous open end of this first and second modular unit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82241106P | 2006-08-15 | 2006-08-15 | |
| US60/822,411 | 2006-08-15 | ||
| US11/554,375 | 2006-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101126947A CN101126947A (en) | 2008-02-20 |
| CN100520679C true CN100520679C (en) | 2009-07-29 |
Family
ID=39095001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100962904A Expired - Fee Related CN100520679C (en) | 2006-08-15 | 2007-04-10 | Reconfigurable chassis module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100520679C (en) |
-
2007
- 2007-04-10 CN CNB2007100962904A patent/CN100520679C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101126947A (en) | 2008-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7656669B2 (en) | Scalable computer system and reconfigurable chassis module thereof | |
| US20090097200A1 (en) | Modular blade for providing scalable mechanical, electrical and environmental functionality in the enterprise using advancedtca boards | |
| CN105676972B (en) | Electronic device | |
| US9295169B1 (en) | Common chassis for instrumentation | |
| US20080218987A1 (en) | Monolithic backplane having a first and second portion | |
| US20110007470A1 (en) | Cell board interconnection architecture | |
| US20080043405A1 (en) | Chassis partition architecture for multi-processor system | |
| CN102053669B (en) | Layout structure of server chassis | |
| EP2865253B1 (en) | Electronic interconnect method and apparatus | |
| EP3367766B1 (en) | Symmetrical sled blind mating in unsymmetrical chassis placement | |
| EP3518635B1 (en) | Design to expand panel port number | |
| US7136283B2 (en) | Multi-computer system | |
| US8358511B2 (en) | Electronic board arrangement and electronic interconnect board of an electronic board arrangement | |
| US7236358B2 (en) | Computer system | |
| CN100428874C (en) | Process-oriented board with modular SPS integration and expansion | |
| US8134842B2 (en) | Systems and methods for converting a computer rear transition input/output (I/O) to front panel I/O | |
| US8456857B2 (en) | Backplane for an electronic mounting rack | |
| CN100520679C (en) | Reconfigurable chassis module | |
| EP3614815B1 (en) | Server system | |
| WO2017101056A1 (en) | Digital equipment industrial control platform | |
| CN115066115B (en) | Control cabinet for robot drive and assembling method thereof | |
| WO2017107042A1 (en) | Industrial control platform for digital equipment | |
| CN215006490U (en) | Industrial control machine | |
| CN211859104U (en) | Switching subassembly and specification type subassembly thereof | |
| CN209842460U (en) | Extension type control device and host machine of extension type control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20071228 Address after: No. three, 213 Road, Zhabei District, Shanghai Applicant after: Huanda Computer (Shanghai) Co., Ltd. Address before: 2 floor, Huajing building, No. 678, Huashan Road, Shanghai Applicant before: Tai'an computer technology (Shanghai) Co., Ltd. Co-applicant before: Tyan Computer Corporation |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090729 Termination date: 20130410 |