CN100481443C - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
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- CN100481443C CN100481443C CN 200610141122 CN200610141122A CN100481443C CN 100481443 C CN100481443 C CN 100481443C CN 200610141122 CN200610141122 CN 200610141122 CN 200610141122 A CN200610141122 A CN 200610141122A CN 100481443 C CN100481443 C CN 100481443C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Variable-Direction Aerials And Aerial Arrays (AREA)
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Abstract
This invention provides one electron device, which comprises one base frequency module, one radio module, at least one electrical parts, one first communication parts and one second communicating parts, wherein, the base module is connected to the radio module by these parts; the first communication parts are set on base module and the second communication parts onto radio module.
Description
Technical field
The invention relates to a kind of electronic installation, and electronic installation particularly less relevant for a kind of volume and that arrangements of components density is higher.
Background technology
For, high frequencyization compact in response to electronic product, modularization and multi-functional trend, electronics unit assembly is required that relatively conformability and integrated level (integration) improve.Therefore, new century high frequency wideband material and Element Technology will be the WeiLai Technology keys.See through the breakthrough of new encapsulation (package) material, the exploitation of new processing procedure and the integration of designing technique, reached systematization module package (system in package, level SIP) now.In addition, further develop high frequency wafer element, integration-type passive element (integrated passive device, IPD), MEMS (micro electro mechanical system) (micro-electro-mechanical system, MEMS) and nano material technology, will be the direction that future value must be made great efforts to set up integrated building block technique and to promote high frequency wideband product usefulness.
Please refer to Fig. 1, it illustrates the schematic perspective view of known a kind of electronic installation.Known electronic 100 comprises a substrate (substrate) 110, a fundamental element (base-band component, BB component) 120, a plurality of passive component (passivedevice) 130, a radio-frequency (RF) component (radio-frequency component, RFcomponent) 140, one antenna (antenna) 150 and a USB (universal serial bus) port (universal serial bus port, USB port) 160.Fundamental element 120, these passive components 130 all are that (surfacemounting technology SMT) disposes and is electrically connected on the substrate 110 by the surface adhering technology with radio-frequency (RF) component 140.Known electronic 100 can be carried out wireless telecommunications (wireless communication) with extraneous other electronic installations (not illustrating) by antenna 150.
Yet, because it is bigger to be disposed at the required bonding area (connection area) of fundamental element 120 on the substrate 110, these passive components 130 and radio-frequency (RF) component 140 by the surface adhering technology, the cost of USB (universal serial bus) port 160 is comparatively expensive and need fixedly that the low-voltage of specification drives, and these passive components 130 must be disposed at respectively on the substrate 110 so that its processing procedure is comparatively loaded down with trivial details, so known electronic 100 has its improved necessity.
Summary of the invention
The purpose of this invention is to provide a kind of electronic installation, its volume is less and its inner member configuration density is higher.
For reaching above-mentioned or other purposes, the present invention proposes a kind of electronic installation, and it comprises one first substrate, a fundamental element, an electronic assembly (electronic assembly) and one first antenna.First substrate has a first surface respect to one another and a second surface.Fundamental element is disposed at first surface and is electrically connected to substrate.Electronic assembly comprises an integration-type passive element and a radio-frequency (RF) component.Integration-type passive element is disposed at second surface and is electrically connected to first substrate, wherein this integration-type passive element is integrated a plurality of active elements and a plurality of passive component in one second substrate, and radio-frequency (RF) component is disposed on the integration-type passive element and be electrically connected to integration-type passive element, and is electrically connected to this first substrate by this integration-type passive element.First antenna is electrically connected to first substrate or integration-type passive element.
Electronic installation of the present invention more comprises: an antenna connector, and it is arranged at this first substrate or this integration-type passive element; And one second antenna, it inserts in this antenna connector and electrically connects this antenna connector.
Electronic installation of the present invention more comprises: a plurality of first electrically connects element, and this fundamental element is electrically connected to this first substrate by this first electric connection element; A plurality of second electrically connects element, and this integration-type passive element is electrically connected to this first substrate by this second electric connection element; The a plurality of the 3rd electrically connects element, and this radio-frequency (RF) component electrically connects element by the 3rd and is electrically connected to this integration-type passive element; And at least one passive component, it is disposed on this first substrate, and is electrically connected to this substrate.
Electronic installation of the present invention, wherein this first substrate has at least one embedded electronic components.
For reaching above-mentioned or other purposes, the present invention proposes a kind of electronic installation, and it comprises a fundamental module (BB module), a radio-frequency module (RF module), at least one electric connection element (electrical connection member), one first communication part (communication component) and one second communication part.Wherein fundamental module electrically connects element and is electrically connected to radio-frequency module via these, and first communication part is arranged on the fundamental module, and second communication part is arranged on the radio-frequency module.
Electronic installation of the present invention, wherein this fundamental module comprises: one first substrate; And a fundamental element, be electrically connected on this first substrate.
Electronic installation of the present invention, wherein this fundamental module more comprises: a memory component is electrically connected on this first substrate; One passive component is electrically connected on this first substrate; And at least one embedded electronic components is arranged in this first substrate.
Electronic installation of the present invention, wherein this first communication part comprises: an antenna connector, it is arranged at this first substrate; And one first antenna element, wherein this antenna connector is fixed on this first substrate this first antenna element.
Electronic installation of the present invention, wherein this first communication part and this second communication part are a wafer antenna or a F molded lines road antenna.
Electronic installation of the present invention, wherein this radio-frequency module comprises: a radio-frequency (RF) component; And an integration-type passive element, be arranged at a side of this radio-frequency (RF) component; Wherein this second communication part comprises: an antenna connector, and it is provided with on this integration-type passive element; And one second antenna element, wherein this antenna connector is fixed on this integration-type passive element this second antenna element.
Less and the arrangements of components density of the volume of electronic installation of the present invention can be higher.
Description of drawings
Fig. 1 illustrates the schematic perspective view of known a kind of electronic installation.
Fig. 2 illustrates the schematic side view of a kind of electronic installation of first embodiment of the invention.
Fig. 3 illustrates the schematic side view of a kind of electronic installation of second embodiment of the invention.
Fig. 4 illustrates the schematic side view of a kind of electronic installation of third embodiment of the invention.
Fig. 5 illustrates the schematic side view of a kind of electronic installation of fourth embodiment of the invention.
Fig. 6 illustrates the schematic side view of a kind of electronic installation of fifth embodiment of the invention.
Fig. 7 illustrates the schematic side view of a kind of electronic installation of sixth embodiment of the invention.
Embodiment
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Please refer to Fig. 2, it illustrates the schematic side view of a kind of electronic installation of first embodiment of the invention.The electronic installation 200 of first embodiment comprises a substrate 210, a fundamental element 220, an electronic assembly 230 and an antenna 240.Substrate 210 has a first surface 212 respect to one another and a second surface 214.Fundamental element 220 is disposed at first surface 212 and is electrically connected to substrate 210.Electronic assembly 230 comprises an integration-type passive element 232 and a radio-frequency (RF) component 234.Integration-type passive element 232 is disposed at second surface 214 and is electrically connected to substrate 210, and radio-frequency (RF) component 234 is disposed on the integration-type passive element 232 and be electrically connected to integration-type passive element 232.Antenna 240 is electrically connected to substrate 210 or integration-type passive element 232.
In this mandatory declaration is that substrate 210 constitutes (compose) fundamental modules with fundamental element 220, and the electronic assembly 230 that is made of integration-type passive element 232 and radio-frequency (RF) component 234 can be considered a radio-frequency module.So-called integration-type passive element 232 is the electronic components that are integrated into an independent function by a plurality of passive components (not illustrating).The basic function mode of electronic installation 200 is, when antenna 240 receives high-frequency signal, the a certain band signal of high-frequency signal (band signal) is transferred to low noise amplifier (the low noise amplifier of radio-frequency (RF) component 234 via the acquisition of integration-type passive element 232 and impedance matching (matching) back, LNA) (do not illustrate), again this band signal is transferred to fundamental element 220 afterwards and makes further signal processing.Otherwise, fundamental element 220 also can be transferred to signal power amplifier (the power amplifier of radio-frequency (RF) component 234, PA) (do not illustrate), the signal that is transmitted afterwards transfers out via antenna 240 via the impedance matching and the filtering (filter) of integration-type passive element 232 afterwards.
In first embodiment, antenna 240 can be wafer antenna (chip antenna), and it is configurable on integration-type passive element 232, but also configurable on substrate 210.Mandatory declaration be, antenna 240 also can be F molded lines road antenna (F-shaped circuitantenna), and it can be made of F molded lines road pattern (wiring pattern) of a certain line layer (wiring layer) (not illustrating) of substrate 210 or integration-type passive element 232.No matter antenna 240 is wafer antenna or F molded lines road antenna, it is a kind of in-building type (built-in) antenna.
In first embodiment, electronic installation 200 more comprises an antenna connector (antenna connector) 252, another antenna 254 and a sealant (encapsulant) 260.Antenna connector 252 is arranged on the substrate 210, but also can be arranged on the integration-type passive element 232.Antenna 254 is an external antenna, and it inserts removably and is fixed in the antenna connector 252 and electric connection antenna connector 252.Antenna 254 constitutes a communication part (communicationcomponent) 250 with antenna connector 252, and sealant 260 coats the part second surface 214 of electronic assembly 230 and substrate 210 at least to expose antenna connector 252.When the antenna connector 252 of electronic installation 200 was inserted into circumscribed (external) antenna 254, the function of above-mentioned in-building type antenna 240 can be replaced by external antenna 254, with the transmission of reinforcement electronic installation 200 and the function of received signal.Certainly, the designer also can be designed to two kinds of antennas 240,254 to start simultaneously, to reach (multifunctional) transmission and the demand of received signal of multiplex (MUX).
The electronic installation 200 of first embodiment more comprises an at least one passive component (passivedevice) 270 and a memory component (memory device) 280.Memory component 280 is configurable on the first surface 212 of substrate 210, and 270 of passive components are configurable on the second surface 214 of substrate 210, and both all are electrically connected to substrate 210.Offer a piece of advice it, by the relative position of Fig. 2 as can be known, memory component 280 and fundamental element 220 are configurable on a side of substrate 210, and passive component 270, electronic assembly 230 (radio-frequency module) and communication part 250 are configurable on the opposite side of substrate 210.In addition, substrate 210 can have at least one embedded electronic components (embedded electronicelement) 216, and it can be active element (active element) or passive component (passive element).In this mandatory declaration be, in the time of can't smoothly this passive component being integrated (integrate) to integration-type passive element 232 if the designer increases for the quantitative requirement of passive component, the designer can dispose above-mentioned passive component 270 on substrate 210, perhaps can in substrate 210 internal configurations for example for the embedded electronic components 216 of passive component to satisfy its design requirement.In addition, passive component 270 is also configurable on integration-type passive element 232, looks closely designer's demand and decides, but do not illustrate with drawing.
Refer again to Fig. 2, electronic installation 200 more comprises a plurality of electric connection elements 292, a plurality of electric connection element 294, a plurality of electric connection element 296 and a plurality of electric connection elements 298.Fundamental element 220 electrically connects element 292 by these and is electrically connected to substrate 210, and integration-type passive element 232 is electrically connected to substrate 210 by these electric connection elements 294.Radio-frequency (RF) component 234 electrically connects element 296 by these and is electrically connected to integration-type passive element 232, and substrate 210 electrically connects the electronic installation (not illustrating) that element 298 is electrically connected to next level by these.In the present embodiment, electrically connect element 292 and can be sealing wire (bonding wire), that is be to be electrically connected to each other between fundamental element 220 and the substrate 210 by routing joining technique (wire bonding technology), and electrically connect element 294 and can be soldered ball (solder ball), its material can be tin, lead or leypewter.In addition, electrically connect element 296 and can be projection (bump), its material can be tin, lead or leypewter, that is be to be electrically connected to each other by flip-chip bonded technology (flip chip bonding technology) between radio-frequency (RF) component 234 and the integration-type passive element 232, can be soldered ball and electrically connect element 298.With regard to the relative position that Fig. 2 illustrated, radio-frequency (RF) component 234 is between integration-type passive element 232 and substrate 210.
Mandatory declaration be, can be electrically connected to each other by surface adhering technology (surface mounting technology) between radio-frequency (RF) component 234 and the integration-type passive element 232, that is be to be electrically connected to each other between the two by tin cream (solder paste) (not illustrating).In addition, fundamental element 220 also can be electrically connected to substrate 210 by the surface adhering technology, but does not illustrate with drawing.
Please refer to Fig. 3, it illustrates the schematic side view of a kind of electronic installation of second embodiment of the invention.The main difference part of the electronic installation 300 of second embodiment and the electronic installation 200 of first embodiment is that these electric connection elements 392 that electrically connect fundamental element 320 and substrate 310 can be projection.
Please refer to Fig. 4 and Fig. 5, it illustrates the schematic side view of a kind of electronic installation of a kind of schematic side view of electronic installation of third embodiment of the invention and fourth embodiment of the invention respectively.The electronic installation 400 of the 3rd embodiment is with the main difference part of the electronic installation 200,300 of the foregoing description, these electric connection elements 494 that electrically connect integration-type passive element 432 and substrate 410 can be projection, and external antenna 454 is configurable on integration-type passive element 432 with antenna connector 452, and in-building type antenna 440 is configurable on substrate 410.In addition, with regard to the relative position that Fig. 4 illustrated, integration-type passive element 432 is between radio-frequency (RF) component 434 and substrate 410.In addition, the electronic installation 500 of the 4th embodiment is similar to the main difference part of the electronic installation 200 of first embodiment with the electronic installation 300 of second embodiment to the main difference part of the electronic installation 400 of the 3rd embodiment, so repeat no more in this.
Please refer to Fig. 6 and Fig. 7, it illustrates the schematic side view of a kind of electronic installation of a kind of schematic side view of electronic installation of fifth embodiment of the invention and sixth embodiment of the invention respectively.The electronic installation 600 of the 5th embodiment is that with the main difference part of the electronic installation 400,500 of the foregoing description these electric connection elements 696 that electrically connect radio-frequency (RF) component 634 and integration-type passive element 632 can be sealing wire.In addition, the electronic installation 700 of the 6th embodiment is similar to the main difference part of the electronic installation 400 of the 3rd embodiment with the electronic installation 500 of the 4th embodiment to the main difference part of the electronic installation 600 of the 5th embodiment, so repeat no more in this.
It should be noted that in the foregoing embodiments, integration-type passive element is about to a plurality of active elements and a plurality of passive component, is integrated on the substrate, utilizes the passive component production technology again, produces the integrated element module with specific function.Remove this, integration-type passive element also can only have at least one passive component, and does not have active element.Also can be provided with active in the integration-type passive element or passive component element in addition.Further, the mode of making integration-type passive element comprise at least low-temp ceramics fire altogether journey (LowTemperature Co-Fired Ceramics, LTCC), thin film technique (ThinFilm Technology), embedded processing procedure (Embedded Passives) or the like technology.
In sum, electronic installation of the present invention has the following advantages at least:
One, these elements owing to electronic installation of the present invention can be engaged with each other by the electric connection technology beyond the surface adhering technology, so the area of the required joint of these elements of electronic installation of the present invention is less, so the volume of electronic installation of the present invention is less and arrangements of components density can be higher.
Two, because electronic installation of the present invention can be by soldered ball but not USB (universal serial bus) port is electrically connected to the electronic installation of next level, therefore comparatively elasticity and cost are lower for the required driving voltage of electronic installation of the present invention.
Three, because electronic installation of the present invention adopts integration-type passive element, therefore the component number of the required assembling of electronic installation of the present invention can be less, and manufacturing time is shorter.
Four, because electronic installation of the present invention can have at least two kinds of antennas, therefore electronic installation of the present invention has the more function selectivity.
The above only is preferred embodiment of the present invention; so it is not in order to limit scope of the present invention; any personnel that are familiar with this technology; without departing from the spirit and scope of the present invention; can do further improvement and variation on this basis, so the scope that claims were defined that protection scope of the present invention is worked as with the application is as the criterion.
Being simply described as follows of symbol in the accompanying drawing:
100,200,300,400,500,600,700: electronic installation
110,210,310,410: substrate
120,220,320: fundamental element
130,270: passive element
140,234,434,634: RF component
150,240,254,440,454: antenna
160: USB port
212,214: the surface
216: embedded electronic components
230: electronic assembly
232,432,632: integration-type passive element
250: communication part
252,452: antenna connector
260: sealant
280: memory component
292,294,296,298,392,494,696: electrically connect element
Claims (10)
1. an electronic installation is characterized in that, described electronic installation comprises:
One first substrate has a first surface respect to one another and a second surface;
One fundamental element is disposed at this first surface and is electrically connected to this first substrate;
One electronic assembly comprises:
One integration-type passive element is disposed at this second surface and is electrically connected to this first substrate, and wherein this integration-type passive element is integrated a plurality of active elements and a plurality of passive component in one second substrate; And
One radio-frequency (RF) component is disposed on this integration-type passive element, and is electrically connected to this integration-type passive element, and is electrically connected to this first substrate by this integration-type passive element; And
One first antenna is electrically connected to this first substrate or this integration-type passive element.
2. electronic installation according to claim 1 is characterized in that, more comprises:
One antenna connector, it is arranged on this first substrate or this integration-type passive element; And
One second antenna, it inserts in this antenna connector and electrically connects this antenna connector.
3. electronic installation according to claim 1 is characterized in that, more comprises:
A plurality of first electrically connects element, and this fundamental element is electrically connected to this first substrate by this first electric connection element;
A plurality of second electrically connects element, and this integration-type passive element is electrically connected to this first substrate by this second electric connection element;
The a plurality of the 3rd electrically connects element, and this radio-frequency (RF) component electrically connects element by the 3rd and is electrically connected to this integration-type passive element; And
At least one passive component, it is disposed on this first substrate, and is electrically connected to this first substrate.
4. electronic installation according to claim 1 is characterized in that, this first substrate has at least one embedded electronic components.
5. an electronic installation is characterized in that, described electronic installation comprises:
One fundamental module;
One radio-frequency module;
At least one electric connection element, wherein this fundamental module is electrically connected to this radio-frequency module via this electric connection element;
One first communication part is arranged on this fundamental module; And
One second communication part is arranged on this radio-frequency module.
6. electronic installation according to claim 5 is characterized in that, this fundamental module comprises:
One first substrate; And
One fundamental element is electrically connected on this first substrate.
7. electronic installation according to claim 6 is characterized in that, this fundamental module more comprises:
One memory component is electrically connected on this first substrate;
One passive component is electrically connected on this first substrate; And
At least one embedded electronic components is arranged in this first substrate.
8. electronic installation according to claim 6 is characterized in that, this first communication part comprises:
One antenna connector, it is arranged at this first substrate; And
One first antenna element, wherein this antenna connector is fixed on this first substrate this first antenna element.
9. electronic installation according to claim 5 is characterized in that, this first communication part and this second communication part are a wafer antenna or a F molded lines road antenna.
10. electronic installation according to claim 5 is characterized in that, this radio-frequency module comprises:
One radio-frequency (RF) component; And
One integration-type passive element is arranged at a side of this radio-frequency (RF) component;
Wherein this second communication part comprises:
One antenna connector, it is provided with on this integration-type passive element; And
One second antenna element, wherein this antenna connector is fixed on this integration-type passive element this second antenna element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610141122 CN100481443C (en) | 2006-10-11 | 2006-10-11 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610141122 CN100481443C (en) | 2006-10-11 | 2006-10-11 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1929132A CN1929132A (en) | 2007-03-14 |
| CN100481443C true CN100481443C (en) | 2009-04-22 |
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ID=37859015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610141122 Active CN100481443C (en) | 2006-10-11 | 2006-10-11 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100481443C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100499116C (en) * | 2007-03-21 | 2009-06-10 | 威盛电子股份有限公司 | Chip package body |
| CN102111164A (en) * | 2009-12-25 | 2011-06-29 | 旭扬半导体股份有限公司 | Digital broadcast receiving device and radio-frequency receiving and playing system for integrating display panel |
| TWI523158B (en) * | 2010-10-11 | 2016-02-21 | 日月光半導體製造股份有限公司 | Semiconductor package having a double sided structure and wireless communication system using the same |
| US8953334B2 (en) * | 2012-01-30 | 2015-02-10 | Mediatek Inc. | Apparatus for performing communication control |
| CN110071099A (en) * | 2014-07-30 | 2019-07-30 | 日月光半导体制造股份有限公司 | The manufacturing method of Electronic Packaging modular structure and Electronic Packaging module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6876836B2 (en) * | 2002-07-25 | 2005-04-05 | Integrated Programmable Communications, Inc. | Layout of wireless communication circuit on a printed circuit board |
-
2006
- 2006-10-11 CN CN 200610141122 patent/CN100481443C/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6876836B2 (en) * | 2002-07-25 | 2005-04-05 | Integrated Programmable Communications, Inc. | Layout of wireless communication circuit on a printed circuit board |
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| CN1929132A (en) | 2007-03-14 |
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