CN100433325C - Laser mark on integrated circuit element - Google Patents
Laser mark on integrated circuit element Download PDFInfo
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- CN100433325C CN100433325C CNB2005100929254A CN200510092925A CN100433325C CN 100433325 C CN100433325 C CN 100433325C CN B2005100929254 A CNB2005100929254 A CN B2005100929254A CN 200510092925 A CN200510092925 A CN 200510092925A CN 100433325 C CN100433325 C CN 100433325C
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- 238000002372 labelling Methods 0.000 claims description 48
- 230000009977 dual effect Effects 0.000 abstract 1
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- 230000008901 benefit Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000011160 research Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Abstract
The invention relates to a laser mark on the integrated circuit. Wherein, it uses laser beam radiation to form at least one word unit; the strike width of word unit has dual laser motion paths; at least two parallel inversed or non-inversed motion laser paths are connected to same laser motion strike, as straight line, curvature or incline connection, to reduce the cross broke wire.
Description
Technical field
The present invention relates to a kind of laser marker technology of integrated circuit component, particularly relate to a kind of laser labelling on integrated circuit component.
Background technology
Existing known integrated circuit component should be formed with laser labelling (laser mark), and for example various numeral, symbol or sample trademark pattern are in order to the kenel that is easy to the identification integrated circuit component, lot number or produce the source.The correlation technique that laser labelling is made at a kind of back side at crystal grain can be illustrated in No. the 395041st, TaiWan, China patent announcement " wafer of laser labelling ", the front of one crystal grain (being active surface) is formed with a plurality of transistor elements, the back side of crystal grain is formed with laser labelling, as crystal grain status identification effect.
Laser labelling is to form with the slice laser beam irradiation, the width of formation that common one laser beam shines is the desired stroke width of character that can't reach a laser labelling, so the irradiation that need utilize multiple tracks laser mobile route equidistant parallel to arrange, but begin as the identification stroke width of a character.
See also shown in Figure 1, a kind of existing known laser labelling 100 on integrated circuit component includes a plurality of characters 110, can be the English alphabet or the Arabic numerals of any capital and small letter, each character 110 has unicursal width 111, and the stroke width 111 of those characters 110 is the width much larger than single road laser mobile route 120.So need repetition, intensive, equidistantly and abreast draw multiple tracks laser mobile route 120, can reach the required stroke width 111 of those characters 110.Each road laser mobile route 120 is independently that laser moves stroke, has too many starting point 121 and end point 122, causes the delay of laser bright dipping.When those characters 110 are non-closed circular character, as C, h, M, S or the like, the starting point 121 and the end point 122 of those laser mobile routes 120 lays respectively at the two ends or the acute angle turning point of character stroke, causes the imperfect of character stroke top, terminal or turnover shape; When those characters 110 are the closed circular character, for example 0, the starting point 121 of those laser mobile routes 120 will be close to mutually with end point 122 and should not be connected, otherwise have the problem that dark and reirradiation causes excessive fusion diffusion of printing.So those laser mobile routes 120 can be divided into one section one section, easily cause the obvious phenomenon of filling out discontented and handing-over broken string (shown in the character of the upper strata laser labelling of Fig. 3).
This shows that above-mentioned existing laser labelling on integrated circuit component obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of the laser labelling existence on integrated circuit component, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing laser labelling on integrated circuit component exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of laser labelling on integrated circuit component of new structure, can improve general existing laser labelling on integrated circuit component, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing laser labelling on integrated circuit component exists, and provide a kind of laser labelling on integrated circuit component of new structure, technical problem to be solved is to make it have remarkable energy to reduce the effect of handing-over broken string, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of laser labelling on integrated circuit component according to the present invention's proposition, it comprises at least one character, it is formed at a surface of an integrated circuit component, this character is shone by laser beam to form, the stroke width of this character includes the width of a plurality of laser mobile routes, wherein at least two parallel mobile laser mobile routes are to be connected to same laser to move stroke, reducing the handing-over broken string, this laser moves that stroke has two independent line ends and be separated by at least one laser mobile route and nothing are cross-linked between this two independent line end.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid laser labelling on integrated circuit component, two parallel laser mobile routes in the wherein said character are reverse each other.
Aforesaid laser labelling on integrated circuit component, the connection between wherein said two parallel laser mobile routes are to connect with straight line or curve.
Aforesaid laser labelling on integrated circuit component, wherein said character are non-closed ring characters.
Aforesaid laser labelling on integrated circuit component, two parallel laser mobile routes in the wherein said character are each other in the same way.
Aforesaid laser labelling on integrated circuit component is oblique connection between the wherein said two parallel laser mobile routes.
Aforesaid laser labelling on integrated circuit component, wherein said character are the closed ring characters.
Aforesaid laser labelling on integrated circuit component, wherein said closed ring character are " 0 " or " 0 ".
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
According to the present invention, a kind of laser labelling on integrated circuit component, comprise at least one character, it is formed at a surface of an integrated circuit component, this character is shone by laser beam to form, the stroke width of this character includes the width of a plurality of laser mobile routes, and wherein at least two parallel reverse or mobile in the same way laser mobile routes are to be connected to same laser to move stroke, to reduce the handing-over broken string.
By technique scheme, the laser labelling of the present invention on integrated circuit component has following advantage at least:
Laser labelling on integrated circuit component of the present invention, by at least two laser mobile routes oppositely parallel or that move in the same way that comprise in the stroke width of same character is to be connected to same laser to move stroke, for example straight line, curve or oblique connection, break to reduce handing-over, thereby be suitable for practicality more.
In sum, a kind of laser labelling on integrated circuit component of the present invention forms at least one character by laser beam irradiation.The stroke width of this character comprises the width of a plurality of laser mobile routes, and wherein at least two parallel reverse or mobile in the same way laser mobile routes are to be connected to same laser to move stroke, to reduce the handing-over broken string.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing laser labelling on integrated circuit component has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of existing known laser labelling on integrated circuit component.
Fig. 2 is according to a specific embodiment of the present invention, a kind of schematic diagram of the laser labelling on integrated circuit component.
Fig. 3 is the existing laser labelling known and of the present invention of comparison, both photographic view.
100: laser labelling
110: character 111: stroke width
120: laser mobile route 121: starting point
122: end point 200: laser labelling
210: character 211: stroke width
220: laser mobile route 221: junction
222: oblique junction 223: starting point
224: end point
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of the laser labelling on integrated circuit component, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also shown in Figure 2ly, a kind of laser labelling 200 on integrated circuit component comprises a plurality of characters 210.Those characters 210 are formed at a surface of an integrated circuit component, for example the back side of the back side of a wafer, a crystal grain or end face of an IC circuit packing structure or the like.Those characters 210 are shone by laser beam to form, and should select the low-energy laser of wavelength between 200 to 850nm for use, and for example wavelength is about the green laser (green laser) of 532nm.In the present embodiment, those characters 210 comprise " C ", " h ", " i ", " p ", " M ", " S ".The stroke width 211 of each character 210 is the width that are several times as much as laser mobile route 220, it is the width that the stroke width 211 of each character 210 includes a plurality of laser mobile routes 220, wherein at least two parallel reverse or mobile in the same way laser mobile routes 220 are to be connected to same laser to move stroke, move stroke number (promptly reducing the number of starting point 223 with the end point 224 of laser mobile route 220) so can reduce laser, and then reduce the handing-over broken string.As shown in Figure 3, Fig. 3 lower pattern is the concrete real laser labelling of doing 200 of the present invention, and Fig. 3 upper layer pattern is existing known laser labelling 100, and laser labelling 200 of the present invention has the remarkable effect that can reduce the handing-over broken string.
It is described please to consult Fig. 2 again, when those characters 210 are non-closed ring characters, for example " C ", " h ", " i ", " p ", " M ", " S " or the like, the two parallel laser mobile routes 220 that move stroke at same laser are to connect with straight line or curve, for example the U-shaped bending connects.Shown in the junction 221 of Fig. 2, wherein this two adjacent parallel laser mobile route 220 that oppositely moves should be rightabout and moves, and is connected into same laser and move stroke, so can promote the complete of character tail end shape.When those characters 210 are closed ring characters, for example " 0 " (English alphabet wherein a kind of), " 0 " (" zero " represented with Arabic numerals) or the like, the two parallel laser mobile routes 220 that move in the same way that move stroke at same laser are oblique connections, the oblique junction 222 of Fig. 2 for example, wherein this two laser mobile route 220 that links to each other should be same parallel to move with crooked.Above laser mobile route 220 can utilize computer aided drawing (for example AutoCad) to design being aligned on earth as far as possible, the starting point 223 that can reduce laser mobile route 220 is imperfect with end point 224 designs, can improve the board efficient of laser marker equipment again.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (8)
1, a kind of laser labelling on integrated circuit component, it is characterized in that it comprises at least one character, it is formed at a surface of an integrated circuit component, this character is shone by laser beam to form, the stroke width of this character includes the width of a plurality of laser mobile routes, wherein at least two parallel mobile laser mobile routes are to be connected to same laser to move stroke, reducing the handing-over broken string, this laser moves that stroke has two independent line ends and be separated by at least one laser mobile route and nothing are cross-linked between this two independent line end.
2, the laser labelling on integrated circuit component according to claim 1 is characterized in that two parallel laser mobile routes in the wherein said character are reverse each other.
3, the laser labelling on integrated circuit component according to claim 2 is characterized in that the connection between wherein said two parallel laser mobile routes is to connect with straight line or curve.
4, the laser labelling on integrated circuit component according to claim 2 is characterized in that wherein said character is non-closed ring character.
5, the laser labelling on integrated circuit component according to claim 1 is characterized in that two parallel laser mobile routes in the wherein said character are each other in the same way.
6, the laser labelling on integrated circuit component according to claim 5 is characterized in that between the wherein said two parallel laser mobile routes be oblique connection.
7, the laser labelling on integrated circuit component according to claim 5 is characterized in that wherein said character is the closed ring character.
8, the laser labelling on integrated circuit component according to claim 7 is characterized in that wherein said closed ring character is " 0 " or " 0 ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100929254A CN100433325C (en) | 2005-08-24 | 2005-08-24 | Laser mark on integrated circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100929254A CN100433325C (en) | 2005-08-24 | 2005-08-24 | Laser mark on integrated circuit element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1921103A CN1921103A (en) | 2007-02-28 |
| CN100433325C true CN100433325C (en) | 2008-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100929254A Expired - Fee Related CN100433325C (en) | 2005-08-24 | 2005-08-24 | Laser mark on integrated circuit element |
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| Country | Link |
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| CN (1) | CN100433325C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538876A (en) * | 1991-08-06 | 1993-02-19 | Nec Corp | Method for marking thick letter |
| CN1187405A (en) * | 1996-12-27 | 1998-07-15 | 欧姆龙株式会社 | Method using laser beam as mark |
| US6570642B2 (en) * | 1999-07-08 | 2003-05-27 | Taiwan Semiconductor Manufacturing Company | Method and apparatus for placing identifying mark on semiconductor wafer |
| US6784002B1 (en) * | 2002-06-21 | 2004-08-31 | Taiwan Semiconductor Manufacturing Company | Method to make wafer laser marks visable after bumping process |
| JP2004255751A (en) * | 2003-02-26 | 2004-09-16 | Keyence Corp | High speed character alteration control method of laser marking system, and laser marking system |
-
2005
- 2005-08-24 CN CNB2005100929254A patent/CN100433325C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538876A (en) * | 1991-08-06 | 1993-02-19 | Nec Corp | Method for marking thick letter |
| CN1187405A (en) * | 1996-12-27 | 1998-07-15 | 欧姆龙株式会社 | Method using laser beam as mark |
| US6570642B2 (en) * | 1999-07-08 | 2003-05-27 | Taiwan Semiconductor Manufacturing Company | Method and apparatus for placing identifying mark on semiconductor wafer |
| US6784002B1 (en) * | 2002-06-21 | 2004-08-31 | Taiwan Semiconductor Manufacturing Company | Method to make wafer laser marks visable after bumping process |
| JP2004255751A (en) * | 2003-02-26 | 2004-09-16 | Keyence Corp | High speed character alteration control method of laser marking system, and laser marking system |
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| Publication number | Publication date |
|---|---|
| CN1921103A (en) | 2007-02-28 |
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