CN100416222C - Film thickness measuring method and microwave measuring apparatus - Google Patents
Film thickness measuring method and microwave measuring apparatus Download PDFInfo
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- CN100416222C CN100416222C CNB031373984A CN03137398A CN100416222C CN 100416222 C CN100416222 C CN 100416222C CN B031373984 A CNB031373984 A CN B031373984A CN 03137398 A CN03137398 A CN 03137398A CN 100416222 C CN100416222 C CN 100416222C
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Abstract
The present invention relates to a film thickness measurement method and a microwave measurement device. The film thickness measurement method comprises the steps that firstly, an object is provided; secondly, the time t0 of a signal reaching the surface of the object from a measurement point is measured, and the wavelength range of the signal is in a microwave band; thirdly, an object to be measured is provided; the surface of the object is processed; the surface of the object is provided with a surface processing layer object; fourthly, the time t1 of a signal reaching the surface of the object to be measured from a measurement point is measured, and the wavelength range of the signal is in the microwave band; the wavelength of the signal is the same with the wavelength of the signal for measuring t0; finally, the film thickness d of the surface processing layer object of the object is estimated by the wavelength lambda of the signals and time difference (t0-t1); the estimation formula is d=lambda(t0-t1). Because the present invention measures film thickness by transmitting, reflecting and receiving signals and setting ranges in the high-frequency microwave band of short waves, the thickness of thin films can be easily and accurately measured.
Description
Technical field
The present invention relates to thickness method for measurement and microwave measurement equipment in the metering of a kind of instrument, fields of measurement thickness, particularly relate to and a kind ofly can accurately measure nonplanar thickness method for measurement and microwave measurement equipment.
Background technology
The development of 3C Product is along with client's demand at present, and the direction of moving towards diversification and outward appearance upsweep gradually develops, and then gives technology such as different sprayings, sputter, transfer printing, plating, or even impregnation on shell.And these technology are controlled for the thickness of shell is very difficult usually, therefore cause the variability of product to increase easily.This is not that product itself has many problems, but can't grasp really for the distribution of thickness, so that provide the client to design guide.For instance, the shell thickness of mobile phone can be along with the influence of the specific factor (as pressure, nozzle form and direction etc.) of anchor clamps rotational speed, gravity and spray gun, thereby reach more than 7.5 microns in the difference of the minimum and peak of thickness, this is equivalent to the thickness of one deck lacquer.
And the existing known method for measurement for thickness or film thickness distribution is to utilize so-called single-point to destroy or measurement of single-point non-destructive and ultrasonic C scan method mostly, and obtains thickness or film thickness distribution.The greatest problem of its existence is to destroy or with regard to the single-point non-destructive measures with regard to single-point, and the data that is obtained seldom so can't propose information accurately, and causes gauge point position itself very big with regard to making a variation.And for ultrasonic C scan method, can only measure minimum thickness (deviate has the precision of known scan method now at present about ± 1 micron) more than 15 microns, therefore the difficult thickness that approaches that precisely records, and very big problem can take place, be the measurement of film thickness distribution on the nonplanar object surface still more.
This shows that above-mentioned existing thickness method for measurement and measurement equipment still have many defectives, and demand urgently further being improved.In order to solve the defective of existing thickness method for measurement and measurement equipment, relevant manufacturer there's no one who doesn't or isn't seeks the road that solves painstakingly, but does not see always that for a long time suitable design finished by development, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing thickness method for measurement and measurement equipment exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, actively studied innovation, in the hope of founding a kind of new thickness method for measurement and microwave measurement equipment, can improve general existing thickness method for measurement and measurement equipment, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
Fundamental purpose of the present invention is, overcome the defective that above-mentioned existing thickness method for measurement and measurement equipment exist, and provide a kind of new thickness method for measurement and microwave measurement equipment, technical problem underlying to be solved is to make it can be easily and accurately record thin thickness, and can record the lip-deep film thickness distribution of nonplanar object accurately, thereby have more practicality, and have the value on the industry.
Another object of the present invention is to, a kind of thickness method for measurement and microwave measurement equipment are provided, technical matters to be solved is to make its surface-treated layer thing that can prevent determinand destroyed during measuring thickness.
Another purpose of the present invention is, a kind of thickness method for measurement and microwave measurement equipment are provided, and technical matters to be solved is to make it can avoid measuring signal to be sponged by the surface-treated layer thing of determinand.
A further object of the present invention is, a kind of thickness method for measurement and microwave measurement equipment are provided, and technical matters to be solved is to make it can make signal receiver measure the time difference value easily, and is not subject to ectocine.
Purpose of the present invention and to solve its technical problem underlying be to adopt following technical scheme to realize.According to a kind of thickness method for measurement that the present invention proposes, it may further comprise the steps: an object is provided; Measure wavelength coverage and arrive the required time t of this body surface from a gauge point at a signal of microwave section
0One determinand is provided, and this determinand is this surface-treated object, and wherein this object has a surface-treated layer thing; Measure wavelength coverage and arrive the required time t in this determinand surface from this gauge point at this signal of microwave section
1And the wavelength X and the mistiming (t that utilize this signal
0-t
1) estimate the thickness d of this surface-treated layer thing of this object, wherein estimation equation is d=λ (t
0-t
1).
The object of the invention to solve the technical problems can also adopt following technical measures further to realize.
Aforesaid thickness method for measurement, the wavelength of wherein said signal are between 0.01～10 centimeter, and the frequency of this signal is between 3GHz～3000GHz.
Aforesaid thickness method for measurement, the wherein said step that this determinand is provided comprise to this object spray, sputter, transfer printing, plating or impregnation, to form this surface-treated layer thing at this body surface.
Aforesaid thickness method for measurement, wherein said object has concave plane.
Aforesaid thickness method for measurement wherein more comprises and utilizes fast fourier transform to calculate whole film thickness distribution.
Purpose of the present invention and solution technical problem underlying also realize by the following technical solutions.A kind of thickness method for measurement according to the present invention's proposition, be suitable for measuring and carry out a surface-treated one sample, it may further comprise the steps: a signal that utilizes a microwave transmission/reception emission wavelength lambda is to a sample surface, and wherein this signal can reflect one first reflection signal after arriving this sample; Utilize this microwave emitting/receiving to receive this first reflection signal, to obtain this signal arrives this sample from this microwave transmission/reception required time t
0Utilize this microwave transmission/reception emission wavelength to have this sample of a surface-treated layer thing for this signal of λ to carrying out this surface treatment, wherein this signal can reflect one second reflection signal after arriving this surface-treated layer thing; Utilize this microwave emitting/receiving to receive this second reflection signal, to obtain this signal arrives this surface-treated layer thing from this microwave transmission/reception required time t
1And utilize wavelength X and reflect the poor (t of time of reception
0-t
1) estimate the thickness d of this surface-treated layer thing of this sample, wherein estimation equation is d=λ (t
0-t
1).
Purpose of the present invention and technical solution problem also can adopt following technical measures further to realize.
Aforesaid thickness method for measurement, the wavelength of wherein said signal is between 100 microns～100000 microns, and the frequency of this signal is between 3GHz～3000GHz.
Aforesaid thickness method for measurement, the wherein said step of utilizing this signal of this microwave transmission/reception emission wavelength lambda to this sample surfaces comprises: fix this sample; And move this microwave transmission/reception with respect to this sample.
Aforesaid thickness method for measurement, wherein said microwave transmission/reception comprises the shifting axle that contains a plurality of microwave emitters.
Aforesaid thickness method for measurement, wherein said surface treatment comprises spraying, sputter, transfer printing, plating or impregnation.
Aforesaid thickness method for measurement, wherein said object has concave plane.
Aforesaid thickness method for measurement wherein more comprises and utilizes fast fourier transform to calculate whole film thickness distribution.
Purpose of the present invention and solve its technical problem underlying and also realize by the following technical solutions.A kind of microwave measurement equipment according to the present invention's proposition, be suitable for measuring a determinand of tool non-planar surfaces, this microwave measurement equipment comprises at least: a microwave transmission/reception, setting is positioned at this determinand top, wherein this microwave transmission/reception has a plurality of transmitters and a plurality of receiver with arrayed, and wherein those transmitters are to arrive this determinand surface in order to emission wavelength ranges in the plurality of signals of microwave section; Those receivers are in order to the reflection via this determinand surface, receive those signals that those transmitters are launched; And a treating apparatus, link to each other with this microwave transmission/reception, and measure the required time of those signals to this determinand according to the transmission difference of those signals.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid microwave measurement equipment wherein more comprises a shifting axle, connects those transmitters of this microwave transmission/reception, in order to move those transmitters simultaneously.
Aforesaid microwave measurement equipment wherein more comprises a shifting axle, connects those receivers of this microwave transmission/reception, in order to move those receivers simultaneously.
Aforesaid microwave measurement equipment wherein more comprises a location device, in order to locate this determinand.
Aforesaid microwave measurement equipment, the wavelength of wherein said those signals is between 100 microns～100000 microns, and the frequency of those signals is between 3GHz～3000GHz.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present invention thes contents are as follows:
The present invention proposes a kind of thickness method for measurement, and it is that an object is provided earlier, measures wavelength coverage again and arrives the required time t of body surface at a signal of microwave section from a gauge point
0Then, provide a determinand, this determinand is surface-treated object, and wherein object has a surface-treated layer thing.Afterwards, measure wavelength coverage and arrive the required time t in determinand surface from gauge point at the signal of microwave section
1, wherein signal needs and measures t before as used herein
0Employed signal wavelength is the same.Then, utilize the wavelength X and the mistiming (t of signal
0-t
1) estimate the thickness d of object surfaces processing layer thing, wherein estimation equation is d=λ (t
0-t
1).
The present invention reintroduces a kind of thickness method for measurement, and its step comprises: a signal that utilizes a microwave transmission/reception emission wavelength lambda is to a sample surface, and wherein signal can reflect one first reflection signal after arriving sample.Then, utilize the microwave emitting/receiving to receive the first reflection signal, to obtain signal arrives sample from the microwave transmission/reception required time t
0Then, the signal that utilizes microwave transmission/reception emission wavelength to be all λ has the sample of a surface-treated layer thing to carrying out surface treatment, and wherein signal can reflect one second reflection signal after arriving the surface-treated layer thing.Subsequently, utilize the microwave emitting/receiving to receive the second reflection signal, to obtain signal arrives the surface-treated layer thing from the microwave transmission/reception required time t
1Afterwards, utilize wavelength X and the poor (t of reflection time of reception
0-t
1) estimate the thickness d of the surface-treated layer thing of sample, wherein estimation equation is d=λ (t
0-t
1).
In addition, the present invention proposes a kind of microwave measurement equipment again, is suitable for measuring the determinand with non-planar surfaces, again according to the surface thickness difference of resulting data estimation determinand before and after surface treatment.This microwave measurement equipment comprises a microwave transmission/reception and a treating apparatus at least, and wherein the microwave transmission/reception has several transmitters and several receivers with arrayed.The microwave transmission/reception is to be positioned at determinand top, transmitter wherein be in order to emission wavelength ranges at the signal of microwave section to the determinand surface, receiver then is in order to the reflection via the determinand surface, the signal that the reception transmitter is launched.Treating apparatus then links to each other with the microwave transmission/reception, to measure the required time of signal to determinand according to the transmission difference of signal.
The present invention is because by signal emission, reflection and reception, and setting range is in the microwave section of shortwave high frequency, so can accurately record thin thickness easily.
In sum, thickness method for measurement that the present invention is special and microwave measurement equipment can be easily and accurately record thin thickness, and can record the lip-deep film thickness distribution of nonplanar object accurately, thereby have more practicality, and have the value on the industry; Its surface-treated layer thing that can prevent determinand is destroyed during measuring thickness; Can avoid measuring signal is sponged by the surface-treated layer thing of determinand; And can make signal receiver measure the time difference value easily, and not be subject to ectocine.It has above-mentioned plurality of advantages and practical value, it really belongs to innovation on method for measurement and measurement equipment, bigger improvement is arranged on function, and have large improvement technically, more existing method for measurement and measurement equipment have the multinomial effect of enhancement, and have produced handy and practical effect, and has the effect of enhancement really, thereby being suitable for practicality more, having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Concrete method for measurement of the present invention and microwave measurement equipment are provided in detail by following examples and accompanying drawing.
Description of drawings
Figure 1A, Figure 1B are the principle simplified schematic diagram that measures according to thickness of the present invention.
Fig. 2 is the thickness measurement step figure according to the first embodiment of the present invention.
Fig. 3 is the structural representation according to the microwave measurement equipment of the second embodiment of the present invention.
100: object 102a, 304: transmitter
102b, 306: receiver 104: signal
106,106a: reflection signal 108: moving direction
110: surface-treated layer thing 120,310: determinand
200: a signal that utilizes a microwave transmission/reception emission wavelength lambda is to a sample surface, and sample is without surface treatment, and wherein signal can reflect one first reflection signal after arriving sample
202: utilize the microwave transmission/reception to receive the first reflection signal, to obtain signal arrives sample from the microwave transmission/reception required time t
0
204: utilize microwave transmission/reception emission wavelength for the signal of λ to carrying out the sample that surface treatment has a surface-treated layer thing, wherein signal can reflect one second reflection signal after arriving the surface-treated layer thing
206: utilize the microwave transmission/reception to receive the second reflection signal, to obtain signal arrives the surface-treated layer thing from the microwave transmission/reception required time t
1
208: utilize wavelength X and the poor (t of reflection time of reception
0-t
1) estimate the thickness d of the surface-treated layer thing of sample, wherein estimation equation is d=λ (t
0-t
1)
300: the microwave measurement equipment
302: the microwave transmission/reception
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, to thickness method for measurement and its concrete method for measurement of microwave measurement equipment, step, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Seeing also shown in Figure 1A, Figure 1B, is the principle simplified schematic diagram that thickness of the present invention measures.Shown in Figure 1A, suppose to measure one when having the thickness of the surface-treated layer thing on the object 100 of concave plane, an object 100 can be provided earlier, it is without surface-treated, mainly is the measurement that is worth as a setting.Then, launch a signal 104 to this not surface-treated object 100 by a transmitter 102a, and the wavelength coverage of setting signal 104 is in the microwave section of shortwave high frequency, for example (,) the wavelength of signal 104 between 0.01～10 centimeter, frequency is between 3GHz～3000GHz.After signal 104 arrives object 100 surfaces, can reflect signal 106.At this moment, can utilize a receiver 102b to receive this reflection signal 106, thus measure wavelength coverage the signal 104 of microwave section from transmitter 102a (being gauge point) to object the required time t in 100 surfaces
0In addition, when utilizing transmitter 102a emission signal 104 to object 100, can first fixed object 100, with respect to object 100 transmitter 102a is moved toward a moving direction 108 again.
Afterwards, see also Figure 1B, utilize the principle identical with Figure 1A, to surface-treated and object 100 (i.e. a determinand 120) that have a surface-treated layer thing 110 measures, wherein this determinand 120 for example is to form surface-treated layer things 110 through spraying, sputter, transfer printing, plating or impregnation on object 100 surfaces.And the measurement principle here is identical with Figure 1A, comprises that by transmitter 102a emission signal 104 wherein the wavelength of signal 104 needs with Figure 1A is employed the same before to determinand 120.In addition, when utilizing transmitter 102a emission signal 104, can fix this determinand 120 earlier, with respect to this determinand 120 transmitter 102a be moved toward a moving direction 108 again to determinand 120.After signal 104 arrives determinand 120 surfaces, can be from another reflection signal of surface body layer thing 110 surface reflections 106a.At this moment, can utilize receiver 102b to receive this reflection signal 106a, thus measure wavelength coverage the signal 104 of microwave section from transmitter 102a to determinand the required time t1 in 120 surfaces.Therefore, can utilize the wavelength X and the poor (t of reflection time of reception of signal 104
0-t
1) estimate the thickness d of the surface-treated layer thing 110 of object 100, wherein estimation equation is as follows:
d＝λ(t
0-t
1)
In addition, measure the whole thickness Distribution calculation of the surface-treated layer thing 110 of object 100, one connect one and receive the characteristic, still can see through fast fourier transform (FastFourier Transform, abbreviation FFT) mode and be obtained except that what can utilize aforementioned signal with microwave.
And according to above-mentioned principle, the present invention can be applicable to following examples.
First embodiment
Seeing also shown in Figure 2ly, is the thickness measurement step figure according to the first embodiment of the present invention.In step 200, utilize the surface of a signal of a microwave transmission/reception emission wavelength lambda to a sample, and this sample is without surface treatment, wherein signal can reflect one first reflection signal after arriving sample, and the wavelength X of signal is for example between 0.01～10 centimeter (frequency is then between 3GHz～3000GHz).In addition, at the signal that utilizes microwave transmission/reception emission wavelength lambda during to sample surfaces, can first fixed sample, with respect to sample the microwave transmission/reception is moved toward a moving direction again, wherein the microwave transmission/reception for example is the shifting axle that contains a plurality of microwave emitters.Afterwards, in step 202, utilize the microwave transmission/reception to receive the first reflection signal, to obtain signal arrives sample from the microwave transmission/reception required time t
0
Then, please continue to consult shown in Figure 2, in step 204, utilize microwave transmission/reception emission wavelength for the signal of λ to carrying out the sample that surface treatment has a surface-treated layer thing, wherein signal can reflect one second reflection signal after arriving the surface-treated layer thing, and needs the same with the wavelength of the signal launched in the step 200 at the wavelength of the signal of this emission.Moreover, the surface treatment that sample carried out is comprised spraying, sputter, transfer printing, plating or impregnation.In addition, when utilizing microwave transmission/reception emission signal to surface-treated layer thing surface, can first fixed sample, with respect to sample the past moving direction of microwave transmission/reception is moved again, wherein, the microwave transmission/reception for example is the shifting axle that contains a plurality of microwave emitters.Then, in step 206, utilize the microwave transmission/reception to receive the second reflection signal, to obtain signal arrives the surface-treated layer thing from the microwave transmission/reception required time t1.
Please consult shown in Figure 2ly again, carry out step 208, utilize wavelength X and the poor (t of reflection time of reception
0-t
1) estimate the thickness d of the surface-treated layer thing of sample, wherein estimation equation is d=λ (t
0-t
1).In addition, measure the whole thickness Distribution calculation of the surface-treated layer thing of sample, one connect one and receive the characteristic, still can see through the fast fourier transform mode and be obtained except that what can utilize signal with microwave.Below for using two examples of the present invention:
1, with the 3GHz microwave transmission/reception of (wavelength is equivalent to 10 centimeters or 100000 microns), utilizing method of the present invention to measure to estimate thickness is 10 microns coating, as long as there is the 0.1ms of reaching the then required mistiming, the relative precision of microwave emitting/receiving is in 0.01ms, then, can obtain the whole film thickness distribution of curved surface in the synchronous scanning process.
2, with the 3000GHz microwave transmission/reception of (wavelength is equivalent to 0.01 centimeter or 100 microns), utilizing method of the present invention to measure to estimate thickness is 10 microns coating, as long as there is the 100ms of reaching the then required mistiming, the relative precision of microwave transceiver is in 10ms, then, can obtain the whole film thickness distribution of curved surface in the synchronous scanning process.
By above-mentioned example as can be known, the present invention utilizes wavelength coverage to measure at the signal of microwave section, the prior receivers of can arranging in pairs or groups, and obtain the thickness of object under test easily.In addition, for advantage of the present invention is described, please see Table one.
Table one
| Scope | Wavelength (cm) | Frequency (Hz) | Energy (eV) |
| Radio magnetic wave | ＞10 | ＜3×10 9 | ＜10 -5 |
| Microwave | 10～0.01 | 3×10 9～3×10 12 | 10 -5～0.01 |
| Infrared ray | 0.01～7×10 -5 | 3×10 12～4.3×10 14 | 0.01～2 |
| Visible light | 7×10 -5～4×10 -5 | 4.3×10 14～7.5×10 14 | 2～3 |
| Ultraviolet ray | 4×10 -5～10 -7 | 7.5×10 14～3×10 17 | 3～10 3 |
| X ray | 10 -7-10 -9 | 3×10 17～3×10 19 | 10 3～10 5 |
| Gamma rays | ＜10 -9 | ＞3×10 19 | ＞10 5 |
Table one is general signal radiation frequency spectrum, and by table one as can be known, the present invention does not select for use the main cause of X ray, gamma rays to be that its energy of carrying secretly is very big, causes problems such as operator's gene pathology easily.If select ultraviolet ray, visible light for use,, easily the surface-treated layer thing is destroyed though its energy is not high.Infrared ray then is to be absorbed with rotation, concussion and simple harmonic motion mode by surface-treated layer thing molecule.As for wireless signal then is that wavelength is oversize, and receiver is not easy to measure the time difference value at present, and is subject to ectocine.Generally speaking, it is thick that the present invention selects for use wavelength coverage to measure mill at the signal of microwave section, not only can accurately record thin thickness easily, and can avoid aforesaid shortcoming.
Second embodiment
The present invention also proposes a kind of microwave measurement equipment, can see also shown in Figure 3 in order to reach thickness method for measurement of the present invention.
Seeing also shown in Figure 3ly, is the structural representation according to the microwave measurement equipment of the second embodiment of the present invention.Microwave measurement equipment 300 of the present invention is suitable for measuring a determinand 310 of tool non-planar surfaces, and this microwave measurement equipment 300 comprises a microwave transmission/reception 302 and a treating apparatus 308.Microwave transmission/reception 302 is that the top that is positioned at determinand 310 is set, wherein this microwave transmission/reception 302 has several transmitters 304 and several receivers 306 with arrayed (array arrangement), wherein transmitter 304 be in order to emission wavelength ranges at the signal of microwave section to determinand 310 surfaces, receiver 306 then is in order to the reflection via determinand 310 surfaces, receives the signal that transmitter 304 is launched.Treating apparatus 308 then links to each other with microwave transmission/reception 302, and measures the required time of signal to determinand 310 according to the transmission difference of signal.In addition, equipment 300 of the present invention more can comprise a shifting axle (not shown), connects the transmitter 304 and/or the receiver 306 of microwave transmission/reception 302, in order to while mobile transmitter 304 and/or receiver 306.In addition, equipment 300 of the present invention can also add a location device (not shown), in order to location determinand 310.
In sum, characteristics of the present invention are by the signal emission, reflect and reception, and set its wavelength coverage in the microwave section, so can accurately record thin thickness easily.In addition, the present invention also proposes a kind of microwave emitter that has with arrayed, can more effectively measure the determinand of curved surface.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, any those skilled in the art may utilize the method for above-mentioned announcement and the equivalent embodiment that technology contents was changed or be modified to equivalent variations, but every technical solution of the present invention content that do not break away from,, all still belong in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (17)
1. thickness method for measurement is characterized in that it may further comprise the steps:
One object is provided;
Measure wavelength coverage and arrive the required time t of this body surface from a gauge point at a signal of microwave section
0
One determinand is provided, and this determinand is this surface-treated object, and wherein this object has a surface-treated layer thing;
Measure wavelength coverage and arrive the required time t in this determinand surface from this gauge point at this signal of microwave section
1And
Utilize the wavelength X and the mistiming (t of this signal
0-t
1) estimate the thickness d of this surface-treated layer thing of this object, wherein estimation equation is d=λ (t
0-t
1).
2. thickness method for measurement according to claim 1, the wavelength that it is characterized in that wherein said signal is between 0.01～10 centimeter, and the frequency of this signal is between 3GHz～3000GHz.
3. thickness method for measurement according to claim 1, it is characterized in that the wherein said step that this determinand is provided comprise to this object spray, sputter, transfer printing, plating or impregnation, to form this surface-treated layer thing at this body surface.
4. thickness method for measurement according to claim 1 is characterized in that wherein said object has concave plane.
5. thickness method for measurement according to claim 1 is characterized in that wherein more comprising and utilizes fast fourier transform to calculate whole film thickness distribution.
6. a thickness method for measurement is suitable for measuring and need carries out a surface-treated one sample, it is characterized in that it may further comprise the steps:
A signal that utilizes a microwave transmission/reception emission wavelength lambda is to a sample surface, and wherein this signal can reflect one first reflection signal after arriving this sample;
Utilize this microwave emitting/receiving to receive this first reflection signal, to obtain this signal arrives this sample from this microwave transmission/reception required time t
0
Utilize this microwave transmission/reception emission wavelength to have this sample of a surface-treated layer thing for this signal of λ to carrying out this surface treatment, wherein this signal can reflect one second reflection signal after arriving this surface-treated layer thing;
Utilize this microwave emitting/receiving to receive this second reflection signal, to obtain this signal arrives this surface-treated layer thing from this microwave transmission/reception required time t
1And
Utilize wavelength X and the poor (t of reflection time of reception
0-t
1) estimate the thickness d of this surface-treated layer thing of this sample, wherein estimation equation is d=λ (t
0-t
1).
7. thickness method for measurement according to claim 6, the wavelength that it is characterized in that wherein said signal is between 100 microns～100000 microns, and the frequency of this signal is between 3GHz～3000GHz.
8. thickness method for measurement according to claim 6 is characterized in that the wherein said step of utilizing this signal of this microwave transmission/reception emission wavelength lambda to this sample surfaces, comprising:
Fix this sample; And
Move this microwave transmission/reception with respect to this sample.
9. thickness method for measurement according to claim 8 is characterized in that wherein said microwave transmission/reception comprises the shifting axle that contains a plurality of microwave emitters.
10. thickness method for measurement according to claim 6 is characterized in that wherein said surface treatment comprises spraying, sputter, transfer printing, plating or impregnation.
11. thickness method for measurement according to claim 6 is characterized in that wherein said object has concave plane.
12. thickness method for measurement according to claim 6 is characterized in that wherein more comprising and utilizes fast fourier transform to calculate whole film thickness distribution.
13. a microwave measurement equipment is suitable for measuring a determinand of tool non-planar surfaces, it is characterized in that this microwave measurement equipment comprises at least:
One microwave transmission/reception, setting are positioned at this determinand top, and wherein this microwave transmission/reception has a plurality of transmitters and a plurality of receiver with arrayed, wherein
Those transmitters are to arrive this determinand surface in order to emission wavelength ranges in the plurality of signals of microwave section;
Those receivers are in order to the reflection via this determinand surface, receive those signals that those transmitters are launched; And
One treating apparatus links to each other with this microwave transmission/reception, and measures the required time of those signals to this determinand according to the transmission difference of those signals.
14. microwave measurement equipment according to claim 13 is characterized in that wherein more comprising a shifting axle, connects those transmitters of this microwave transmission/reception, in order to move those transmitters simultaneously.
15. microwave measurement equipment according to claim 13 is characterized in that wherein more comprising a shifting axle, connects those receivers of this microwave transmission/reception, in order to move those receivers simultaneously.
16. microwave measurement equipment according to claim 13 is characterized in that wherein more comprising a location device, in order to locate this determinand.
17. microwave measurement equipment according to claim 13, the wavelength that it is characterized in that wherein said those signals is between 100 microns～100000 microns, and the frequency of those signals is between 3GHz～3000GHz.
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| CNB031373984A CN100416222C (en) | 2003-06-23 | 2003-06-23 | Film thickness measuring method and microwave measuring apparatus |
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|---|---|---|---|
| CNB031373984A CN100416222C (en) | 2003-06-23 | 2003-06-23 | Film thickness measuring method and microwave measuring apparatus |
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| BR112017001205A2 (en) * | 2014-07-30 | 2017-11-21 | Nippon Steel & Sumitomo Metal Corp | method for measuring the thickness of floating slag on the surface of the molten metal |
| JP6096725B2 (en) * | 2014-09-09 | 2017-03-15 | アイシン精機株式会社 | Film thickness measuring apparatus and film thickness measuring method |
| CN111412847A (en) * | 2015-10-10 | 2020-07-14 | 江苏新思达电子有限公司 | Method for measuring thickness of non-conductive material coating film |
| CN105975125A (en) * | 2016-04-29 | 2016-09-28 | 宇龙计算机通信科技(深圳)有限公司 | Method and device for adjusting touch panel parameters and terminal equipment |
| CN108981624B (en) * | 2018-06-20 | 2020-07-24 | 长江存储科技有限责任公司 | Film thickness measuring method and film thickness measuring device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158512A (en) * | 1982-03-16 | 1983-09-20 | Showa Electric Wire & Cable Co Ltd | Film thickness measuring device |
| CN86106814A (en) * | 1986-09-08 | 1988-03-30 | 唐纳德·福特·沙利文 | The pattern of the high definition liquid photopolymerizable polymer coating on irregular print circuit board surface conductor |
| JPH09126747A (en) * | 1995-10-27 | 1997-05-16 | Babcock Hitachi Kk | Measuring device for scale thickness on tube inside face |
| CN1158659A (en) * | 1994-09-21 | 1997-09-03 | 格拉斯哥大学大学董事会 | Appts. and method for carrying out analysis of samples |
| JP2002022416A (en) * | 2000-07-07 | 2002-01-23 | Hitachi Cable Ltd | Film pressure measuring method with considering refraction factor |
| CN1363820A (en) * | 2002-02-05 | 2002-08-14 | 北京大学 | Short-pulse laser and ultrasonic method and equipment for presisely measuring thickness |
-
2003
- 2003-06-23 CN CNB031373984A patent/CN100416222C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158512A (en) * | 1982-03-16 | 1983-09-20 | Showa Electric Wire & Cable Co Ltd | Film thickness measuring device |
| CN86106814A (en) * | 1986-09-08 | 1988-03-30 | 唐纳德·福特·沙利文 | The pattern of the high definition liquid photopolymerizable polymer coating on irregular print circuit board surface conductor |
| CN1158659A (en) * | 1994-09-21 | 1997-09-03 | 格拉斯哥大学大学董事会 | Appts. and method for carrying out analysis of samples |
| JPH09126747A (en) * | 1995-10-27 | 1997-05-16 | Babcock Hitachi Kk | Measuring device for scale thickness on tube inside face |
| JP2002022416A (en) * | 2000-07-07 | 2002-01-23 | Hitachi Cable Ltd | Film pressure measuring method with considering refraction factor |
| CN1363820A (en) * | 2002-02-05 | 2002-08-14 | 北京大学 | Short-pulse laser and ultrasonic method and equipment for presisely measuring thickness |
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| Publication number | Publication date |
|---|---|
| CN1566902A (en) | 2005-01-19 |
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