CN100412580C - Photoelectric conversion substrate - Google Patents
Photoelectric conversion substrate Download PDFInfo
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- CN100412580C CN100412580C CNB200510116961XA CN200510116961A CN100412580C CN 100412580 C CN100412580 C CN 100412580C CN B200510116961X A CNB200510116961X A CN B200510116961XA CN 200510116961 A CN200510116961 A CN 200510116961A CN 100412580 C CN100412580 C CN 100412580C
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- photoelectric conversion
- substrate
- optic waveguide
- micro optic
- cellular micro
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Abstract
A base plate of photoelectric conversion consists of a base plate with cellular optical microwave guide being buried in base plate and exposing its two end surfaces out, multiple photoelectric element set on base plate and connected to two said end surfaces, multiple IC driving element set on base plate and electric-connected to said photoelectric element for utilizing cellular optical microwave guide to transmit light signal.
Description
Technical field
The invention relates to a kind of photoelectric conversion substrate, particularly about a kind of photoelectric conversion substrate with cellular micro optic waveguide structure of light interconnection technique.
Background technology
The development of light communication element technology, coupled system moves towards broadband high-speed, on the structure packing technique, must meet compact or satisfy the structure dress environmental requirement of high reliability, and because the growth of internet (Internet), people increase day by day for the demand of network bandwidth, and fiber optic network is more and more to high capacity, changeableization, high reliability and the development of economical and effective aspect.Optical communication no longer is confined to telecommunication, and fiber optic networkization (Optical Networking) realizes that step by step the fiber optic network structure also forms gradually.In order to realize optical communication high speed and universalness target, must set up optoelectronic package technology cheaply, development low cost optical communication element and high speed pass connection module, and the optical communication development of technologies promptly is conceived to this.The light interconnection (Optical Interconnect) that remote object is used for data communication in the following high-performance computer of development, the utilization method of optics connects computer chip, module, circuit board, base plate, casing and processor, with high-speed light submode transmission signals, bottleneck problem such as frequency range is limited when solving electric transmission.When the processing speed of computing machine CPU (central processing unit) or other chip developed more and more soon, data transmission must utilize the demand of photon communication to increase day by day.We can predict when computing machine combines with mechanics of communication, and optics therebetween connects and the light data communication will be brought incomparable industry and technical impact.
See also Fig. 6, it is the cross section view of U.S. Patent number US6603915 photoelectric conversion substrate 3.As shown in the figure, in silicon substrate 31, imbed optical waveguide 32 and realize the transmission of the signal between the photovalve 33 on this silicon substrate 31 as the mode of light transmission media, but its technology is etching on this silicon substrate 31, and then the coating layer (cladding layer) 321 of this optical waveguide got on core layer (core layer) 322 is long successively, this technology not only needs loaded down with trivial details manufacture of semiconductor, and such technology and inapplicable a large amount of in the market printed circuit board (PCB) processing procedure that uses.
See also Fig. 7, it is the cross section view of U.S. Patent number US6389202 photoelectric conversion substrate 4.As shown in the figure, one light source 40 is spent reflecting plates 42 by 1 again via an optical waveguide 41, this light source 40 is reflexed on the photovalve 43, because of being difficult to making and this light source 40 and these photovalve 43 even light contrapositions, this 45 degree reflecting plate 42 is difficult for, so still can't reach the processing procedure of general printed circuit board (PCB) in its optical registration accuracy requirement, so its can't with the processing procedure compatibility of present printed circuit board (PCB), and can't effectively improve the tolerance of this photovalve 43 at photoelectric conversion substrate 4 encapsulation top offsets.
Because making, above-mentioned existing optical waveguide 32 goes up loaded down with trivial details manufacture of semiconductor, except producing optical waveguide 41, also must additionally produce 45 degree reflecting plates 42 in addition, light signal could be passed to another photovalve 43 by a photovalve and finish the transmission action, so losing time also must increase extra cost, so can utilize a kind of cellular micro optic waveguide 5 (seeing also Fig. 8), it is applied on the pcb board, overcoming existing optical waveguide 32 makes upward consuming time and the extra problem that increases by one 45 degree reflecting plates 42 of palpus, and this cellular micro optic waveguide 5 is to be applied in the image transmission, not to be applied on the pcb board (or substrate) at present.
This cellular micro optic waveguide 5 is described below, (can consult document Martijn A.VanEijkelenborg, " Imaging with microstructured polymer fibre ", 2004), the section of this cellular micro optic waveguide 5 as shown in Figure 8, it is made of height refraction right cylinder 51 and a plurality of hole 52, the material of this height refraction right cylinder 51 is plastic optical fibres, it has the demand that resistant to elevated temperatures characteristic also meets the pcb board processing procedure, the profile of these a plurality of holes 52 is cellular, its inside is in order to hold air, the refractive index that reflects right cylinder 51 because of this height is approximately 1.5, the refractive index of air is 1, so the absolute value of its difference is 0.5, loss was few more when the high more representative light of the absolute value of this difference transmitted in this cellular micro optic waveguide 5, and the bent angle radius of this cellular micro optic waveguide 5 is more little, bent more, so this cellular micro optic waveguide 5 can be applied on the optical signal transmission of opto-electronic conversion pcb board, wherein the transmission of light in this cellular micro optic waveguide 5 is to reflect right cylinder 51 by this height to transmit but not transmit via a plurality of holes 52.
Because the mode of above-mentioned existing employing etching silicon substrate is imbedded an optical waveguide again, its manufacturing process is very complicated too, and its making quite is difficult for, production cost is high, and photoelectric conversion substrate is because under the too high situation of optical registration accuracy requirement, can't with the processing procedure compatibility of present printed circuit board (PCB).
Therefore, how to solve existing optical waveguide processing procedure problem of very complicated too in manufacturing process, and make this photoelectric conversion substrate can with the processing procedure compatibility of present printed circuit board (PCB), and effectively increase the displacement tolerance of photovalve in the photoelectric conversion substrate encapsulation, really be the problem of urgently facing on the association area.
Summary of the invention
For overcoming the disappearance of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of photoelectric conversion substrate, can increase the displacement tolerance of photovalve in the photoelectric conversion substrate encapsulation.
Another object of the present invention is to provide a kind of photoelectric conversion substrate, can realize three-dimensional multichannel framework.
Another purpose of the present invention is to provide a kind of photoelectric conversion substrate, can overcome existing photoelectric conversion substrate and printed circuit board (PCB) incompatible problem on processing procedure.
A further object of the present invention is to provide a kind of photoelectric conversion substrate, because of the Hight refractive index has high flexual characteristic, therefore has less bending curvature characteristic on cellular micro optic waveguide.
Of the present invention time a purpose is to provide a kind of photoelectric conversion substrate, because more channel transfer in the cellular micro optic waveguide structure tolerable unit area, therefore be not subject to the restriction of the Pitch 250mm of optical fiber, so the Pitch at VCSEL (photoelectricity) element can be less than 250mm, in other words, can have more VCSEL element in the unit area on the VCSEL Wafer.
Another purpose of the present invention is to provide a kind of photoelectric conversion substrate, the structure that on the end face structure of cellular micro optic waveguide, will have asymmetry, contraposition when helping connecting up, because this structure applications is under the structure of M * N array, situation about twisting when the wiring for fear of the structure of this cellular micro optic waveguide, cause the mutual corresponding situation that dislocation takes place of 1 couple 1 of Tx Channel and Rx Channel, on the structure fabrication of micro optic waveguide, use the asymmetry structure as anti-misoperation device.
Therefore, for reaching above-mentioned and other purpose, the photoelectric conversion substrate that the present invention proposes comprises: a substrate has a plurality of perforates; At least one cellular micro optic waveguide is embedded in this substrate, and exposes both ends of the surface on this substrate by this perforate; A plurality of photovalves are arranged on this substrate and are connected in the both ends of the surface of this at least one cellular micro optic waveguide; And a plurality of IC driving elements, be installed on this substrate and and be electrically connected at this photovalve with lead, drive this photovalve by this IC driving element, light signal is transmitted by this at least one cellular micro optic waveguide.
Substrate subdrilling through hole before pressing of at first preparing multilayer makes this substrate be formed with a plurality of perforates, make at least one cellular micro optic waveguide can pass through this perforate, prior art adopts the mode of etching silicon substrate to imbed an optical waveguide again, its manufacturing process is very complicated too, can reduce production costs simply again so this manufacturing process is single mutually.
This at least one cellular micro optic waveguide is made up of a high refraction right cylinder and a plurality of hole, it can overcome existing photoelectric conversion substrate and printed circuit board (PCB) incompatible problem on processing procedure, wherein, this height refraction right cylinder is plastic optical fiber or glass fibre, and this void shape is cellular or circular hole, because of this height refraction right cylinder has high index and high flexual characteristic, therefore this cellular micro optic waveguide has less bending curvature characteristic.
The both ends of the surface of this at least one cellular micro optic waveguide respectively have at least one pair of bit architecture or a pair of bit flag, wherein, this at least one pair of bit architecture or contraposition sign are to carry out contraposition with this photovalve to be connected with optics, so can increase this photovalve in the encapsulation of this photoelectric conversion substrate the displacement tolerance and the number of array type passage, and the structure that on the end face structure of this cellular micro optic waveguide, has asymmetry, contraposition when helping connecting up, because this structure applications is under the structure of M * N array, situation about twisting when the wiring for fear of the structure of this cellular micro optic waveguide, cause the mutual corresponding situation that dislocation takes place of 1 couple 1 of Tx Channel and Rx Channel, on the structure fabrication of this cellular micro optic waveguide, use the asymmetry structure as anti-misoperation device.
This photovalve is directly to be connected as optics with the both ends of the surface of this at least one cellular micro optic waveguide, make light signal between this photovalve, to transmit by this at least one cellular micro optic waveguide, this at least one cellular micro optic waveguide can be utilized the asymmetry of waveguide to carry out contraposition with this photovalve to be connected with optics in addition, wherein, this photovalve is as active member, and this IC driving element is as passive device.
The present invention's invention also relates to another kind of photoelectric conversion substrate, and photoelectric conversion substrate comprises: a substrate has a plurality of perforates; A plurality of cellular micro optic waveguide are embedded in this substrate, and these a plurality of cellular micro optic waveguide all expose both ends of the surface on this substrate by these a plurality of perforates; A plurality of photovalves are arranged on this substrate and are connected in the both ends of the surface of at least one cellular micro optic waveguide in these a plurality of cellular micro optic waveguide; And a plurality of IC driving elements, be installed on this substrate and and be electrically connected at this photovalve with lead, drive this photovalve by this IC driving element, light signal is transmitted by at least one cellular micro optic waveguide in these a plurality of cellular micro optic waveguide.
Wherein, this cellular micro optic waveguide can be crossed over mutually each other, can realize three-dimensional multichannel framework and allow more channel transfer in the unit area because this cellular micro optic waveguide structure can reach, therefore be not subject to the restriction of the Pitch 250mm of optical fiber, so the Pitch at the VCSEL element can be less than 250mm, in other words, can have more VCSEL element in the unit area on the VCSEL Wafer.
Photoelectric conversion substrate of the present invention is a plurality of optical element secondary modules can be applied in the photoelectric conversion substrate of the cellular micro optic waveguide of tool hyperchannel of the present invention, and wherein, this optical element secondary module has been integrated photovalve and IC driving element.
Because the existing mode of etching silicon substrate that adopts is imbedded too very complicated of its manufacturing process of an optical waveguide again, making is quite difficult and production cost is high, and photoelectric conversion substrate is because under the too high situation of optical registration accuracy requirement, can't with the processing procedure compatibility of present printed circuit board (PCB), therefore, photoelectric conversion substrate of the present invention, it is to utilize a cellular micro optic waveguide structure can effectively improve the displacement tolerance of this photoelectric conversion substrate on the printed circuit board (PCB) processing procedure, therefore can solve existing photoelectric conversion substrate and printed circuit board (PCB) incompatible problem on processing procedure, and effectively increase the problems such as displacement tolerance of photovalve in the photoelectric conversion substrate encapsulation, and with since its manufacturing process only need make this substrate be formed with a plurality of perforates substrate subdrilling through hole before pressing of multilayer, make at least one cellular micro optic waveguide can pass through this perforate, so its manufacturing process is quite simple, can reduce production costs.
Description of drawings
Fig. 1 is the representative graph of photoelectric conversion substrate of the present invention;
Fig. 2 is the cellular micro optic waveguide sectional view of photoelectric conversion substrate of the present invention;
Fig. 3 is the cross section view of photoelectric conversion substrate embodiment 1 of the present invention;
Fig. 4 is embodiment 2 synoptic diagram of the connect structure of photoelectric conversion substrate of the present invention with a plurality of cellular micro optic waveguide;
Fig. 5 is applied in embodiment 3 synoptic diagram that photoelectric conversion substrate of the present invention has the structure that connects of a plurality of cellular micro optic waveguide with the optical element secondary module;
Fig. 6 is the cross section view of U.S. Patent number US6603915 photoelectric conversion substrate;
Fig. 7 is the partial cross sectional views of U.S. Patent number US6389202 photoelectric conversion substrate;
Fig. 8 is existing cellular micro optic waveguide cross section view.
Embodiment
See also Fig. 1, it is the representative graph of photoelectric conversion substrate 1 of the present invention.As shown in the figure, photoelectric conversion substrate 1 comprises: a substrate 11; At least one cellular micro optic waveguide 12 is embedded in this substrate 11, and exposes both ends of the surface 123 on this substrate 11; A plurality of photovalves 13 are arranged on this substrate 11 and are connected in the both ends of the surface 123 of at least one cellular micro optic waveguide 12; And a plurality of IC driving elements 14, be installed on this substrate 11 and and be electrically connected at this photovalve with lead, drive this photovalve 13 by this IC driving element 14, light signal is transmitted by at least one cellular micro optic waveguide 12.
At first prepare substrate 11 subdrilling through hole before pressing of multilayer, make this substrate 11 form a plurality of perforates, make at least one cellular micro optic waveguide 12 can be by this perforate (not marking), prior art is to adopt the mode of etching silicon substrate to imbed an optical waveguide again, its manufacturing process is very complicated too, so this manufacturing process can reduce production costs quite simply again.
See also Fig. 2, it is cellular micro optic waveguide 12 sectional views of photoelectric conversion substrate 1 of the present invention.As shown in the figure, this at least one cellular micro optic waveguide 12 is made up of a high refraction right cylinder 121 and a plurality of hole 122, it has overcome existing photoelectric conversion substrate and printed circuit board (PCB) incompatible problem on processing procedure, wherein, this height refraction right cylinder 121 is wherein a kind of of plastic optical fiber or glass fibre, and these hole 122 shapes are cellular or wherein a kind of of circular hole, because of this height refraction right cylinder 121 has high index and high flexual characteristic, therefore this cellular micro optic waveguide 12 has less bending curvature characteristic.
Fig. 3 is the cross section view of photoelectric conversion substrate 1 embodiment 1 of the present invention, the both ends of the surface 123 of this at least one cellular micro optic waveguide 12 respectively have at least one pair of bit architecture or contraposition sign (not marking), wherein, this at least one pair of bit architecture or contraposition sign are to carry out contraposition with this photovalve 13 to be connected with optics, so can increase this photovalve 13 in 1 encapsulation of this photoelectric conversion substrate the displacement tolerance and the number of array type passage, and the structure that on end face 123 structures of this cellular micro optic waveguide 12, has asymmetry, contraposition when helping connecting up, because this structure applications is under the structure of M * N array, situation about twisting when the wiring for fear of the structure of this cellular micro optic waveguide 12, cause the mutual corresponding situation that dislocation takes place of 1 couple 1 of Tx Channel and Rx Channel, on the structure fabrication of this cellular micro optic waveguide 12, use the asymmetry structure as anti-misoperation device.
This photovalve 13 is directly to be connected as optics with the both ends of the surface 123 of this at least one cellular micro optic waveguide 12, make light signal between this photovalve 13, to transmit by at least one cellular micro optic waveguide 12, this at least one cellular micro optic waveguide 12 can be utilized the asymmetry of waveguide to carry out contraposition with this photovalve 13 to be connected with optics in addition, wherein, this photovalve 13 is as active member, and this IC driving element 14 is as passive device.
Fig. 4 is photoelectric conversion substrate 1 embodiment 2 synoptic diagram of the present invention, wherein the difference with Fig. 1 is that photoelectric conversion substrate 1 of the present invention is to have a plurality of cellular micro optic waveguide 12, wherein, this cellular micro optic waveguide 12 can be crossed over mutually each other, it can realize three-dimensional multichannel framework and because the interior more channel transfer of the structure tolerable unit area of this cellular micro optic waveguide 12, therefore be not subject to the restriction of the Pitch 250mm of optical fiber, so the Pitch at the VCSEL element can be less than 250mm, in other words, can have more VCSEL element in the unit area on the VCSEL Wafer.
See also Fig. 5, it is embodiment 3 synoptic diagram for photoelectric conversion substrate 1 of the present invention, wherein the difference with Fig. 4 is that the present invention is applied in the photoelectric conversion substrate 1 with a plurality of cellular micro optic waveguide 12 of the present invention with a plurality of optical element secondary modules 2, wherein, this optical element secondary module 2 is to have integrated photovalve and IC driving element.
In sum, photoelectric conversion substrate 1 structure fabrication that the present invention discloses can reduce production costs easily, overcome existing photoelectric conversion substrate and printed circuit board (PCB) incompatible problem on processing procedure, and can effectively increase the displacement tolerance of photovalve in the photoelectric conversion substrate encapsulation.
Claims (12)
1. a photoelectric conversion substrate is characterized in that, this photoelectric conversion substrate comprises:
One substrate has a plurality of perforates;
At least one cellular micro optic waveguide is embedded in this substrate, and exposes both ends of the surface on this substrate by this perforate;
A plurality of photovalves are arranged on this substrate and are connected in the both ends of the surface of this at least one cellular micro optic waveguide; And
A plurality of IC driving elements are installed on this substrate and with lead and are electrically connected at this photovalve, drive this photovalve by this IC driving element, and light signal is transmitted by this at least one cellular micro optic waveguide.
2. photoelectric conversion substrate as claimed in claim 1 is characterized in that, this at least one cellular micro optic waveguide is made up of a high refraction right cylinder and a plurality of hole.
3. photoelectric conversion substrate as claimed in claim 2 is characterized in that, this height refraction right cylinder is plastic optical fiber or glass fibre.
4. photoelectric conversion substrate as claimed in claim 2 is characterized in that this void shape is cellular or circular hole.
5. photoelectric conversion substrate as claimed in claim 1 is characterized in that, the both ends of the surface of this at least one cellular micro optic waveguide respectively have at least one pair of bit architecture or at least one pair of bit flag.
6. photoelectric conversion substrate as claimed in claim 5 is characterized in that, this at least one pair of bit architecture or contraposition sign are to carry out contraposition with this photovalve to be connected with optics.
7. photoelectric conversion substrate as claimed in claim 1, it is characterized in that, this photovalve is directly to be connected as optics with the both ends of the surface of this at least one cellular micro optic waveguide, makes light signal transmit between this photovalve by this at least one cellular micro optic waveguide.
8. photoelectric conversion substrate as claimed in claim 1 is characterized in that, this at least one cellular micro optic waveguide is utilized the asymmetry of waveguide to carry out contraposition with this photovalve to be connected with optics.
9. photoelectric conversion substrate as claimed in claim 1 is characterized in that this photovalve is as active member.
10. photoelectric conversion substrate as claimed in claim 1 is characterized in that, this IC driving element is as passive device.
11. a photoelectric conversion substrate is characterized in that photoelectric conversion substrate comprises:
One substrate has a plurality of perforates;
A plurality of cellular micro optic waveguide are embedded in this substrate, and these a plurality of cellular micro optic waveguide all expose both ends of the surface on this substrate by these a plurality of perforates;
A plurality of photovalves are arranged on this substrate and are connected in the both ends of the surface of at least one cellular micro optic waveguide in these a plurality of cellular micro optic waveguide; And
A plurality of IC driving elements are installed on this substrate and with lead and are electrically connected at this photovalve, drive this photovalve by this IC driving element, and light signal is transmitted by at least one cellular micro optic waveguide in these a plurality of cellular micro optic waveguide.
12. photoelectric conversion substrate as claimed in claim 11 is characterized in that, these a plurality of cellular micro optic waveguide are crossed over mutually each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510116961XA CN100412580C (en) | 2005-08-31 | 2005-10-28 | Photoelectric conversion substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200520118213 | 2005-08-31 | ||
| CN200520118213.0 | 2005-08-31 | ||
| CNB200510116961XA CN100412580C (en) | 2005-08-31 | 2005-10-28 | Photoelectric conversion substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1955767A CN1955767A (en) | 2007-05-02 |
| CN100412580C true CN100412580C (en) | 2008-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510116961XA Expired - Fee Related CN100412580C (en) | 2005-08-31 | 2005-10-28 | Photoelectric conversion substrate |
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| Country | Link |
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| CN (1) | CN100412580C (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6389202B1 (en) * | 1999-03-03 | 2002-05-14 | Agilent Technologies, Inc. | Method of and a device for coupling optical fibers and opto-electronic components |
| US6603915B2 (en) * | 2001-02-05 | 2003-08-05 | Fujitsu Limited | Interposer and method for producing a light-guiding structure |
| CN1187633C (en) * | 2000-05-23 | 2005-02-02 | 国际商业机器公司 | Optical device with chip level precision alignment |
-
2005
- 2005-10-28 CN CNB200510116961XA patent/CN100412580C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6389202B1 (en) * | 1999-03-03 | 2002-05-14 | Agilent Technologies, Inc. | Method of and a device for coupling optical fibers and opto-electronic components |
| CN1187633C (en) * | 2000-05-23 | 2005-02-02 | 国际商业机器公司 | Optical device with chip level precision alignment |
| US6603915B2 (en) * | 2001-02-05 | 2003-08-05 | Fujitsu Limited | Interposer and method for producing a light-guiding structure |
Non-Patent Citations (2)
| Title |
|---|
| Imaging with microstructured polymer fibre. Martijn A. van Eijkelenborg.OPTICS EXPRESS,Vol.12 No.2. 2004 |
| Imaging with microstructured polymer fibre. Martijn A. van Eijkelenborg.OPTICS EXPRESS,Vol.12 No.2. 2004 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1955767A (en) | 2007-05-02 |
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