CN100386855C - Automatic chip feeder and control thereof - Google Patents
Automatic chip feeder and control thereof Download PDFInfo
- Publication number
- CN100386855C CN100386855C CNB2005100361922A CN200510036192A CN100386855C CN 100386855 C CN100386855 C CN 100386855C CN B2005100361922 A CNB2005100361922 A CN B2005100361922A CN 200510036192 A CN200510036192 A CN 200510036192A CN 100386855 C CN100386855 C CN 100386855C
- Authority
- CN
- China
- Prior art keywords
- control circuit
- stepping motor
- wafer
- feeder
- blanking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Die Bonding (AREA)
Abstract
The present invention relates to an automatic chip feeder and a control method thereof. The chip feeder comprises a machine frame, wherein a control box is fixed at the lower end of the machine frame, and the top end is provided with a wafer round table and a feed chute. A thimble is installed below the wafer round table. Both ends of the feed chute are respectively connected with a feeding device, a blanking device, hook claws and welding arms, an image collecting device is installed above the feed chute, and a heater is installed below the feed chute. The image collecting device is connected with a control circuit in the control box. The present invention completely adopts a Linux system to process visual images and develop a motion control system, realizes the dispatch algorithm of multiple threads and enhances the utilization rate and the executing efficiency of programming system resources. The present invention can carry out quality inspection and rapid binding to chips, pack triodes rapidly, complete the development of multitask coordinated processing dispatchers simultaneously and solve the difficult technological problem of complicated mechanical multitask dispatch of like device.
Description
Technical field
The present invention relates to optical, mechanical and electronic integration chips production equipment technical field, specifically be meant a kind of automatic chip feeder and control method thereof.
Background technology
Core during IC makes and critical equipment comprise coremaking (preceding operation) and encapsulation (back operation) two large divisions.The trend of preceding operation Equipment Development is equipment such as the novel hyperfine mask aligner of development; Then the operation equipment high-speed, high precision that then to be development adapt with closeer, littler, lighter novel encapsulated technology, sealed in unit cheaply, and realize the full automation of whole encapsulation process.
Chip feeder is one of key equipment of operation production line behind the semiconductor, and it is mainly finished chip is carried out various reliable quality testings, accurate localization, and delivers to subsequent processing and carry out lead packages.At present, China does not still have the independent development exploitation of chip feeder, the almost whole dependence on import of the automatic chip feeder of chip production enterprise, not only annual expensive more than one hundred million dollars, increase production cost, but also have a strong impact on China IC industry competitiveness in the international market, and also influence the level and the ability of China's chip autonomous production simultaneously to a certain extent, be unfavorable for that electronics industry is long-term, stable, healthy development.
Summary of the invention
Purpose of the present invention is exactly in order to solve above-mentioned the deficiencies in the prior art part, and a kind of automatic chip feeder and control method thereof are provided.This chip feeder has been realized the quality testing of chip and binding are fast encapsulated triode fast, has solved the technical barrier of this kind equipment complicated machinery multi-task scheduling simultaneously.
Purpose of the present invention is achieved through the following technical solutions: described automatic chip feeder comprises frame, described frame lower end is fixed with control cabinet, the top is equipped with wafer platform and chute feeder, described wafer platform below is equipped with thimble, described chute feeder two ends are connected with loader and blanking device respectively, and are connected with and collude pawl and welding arm, and its top is equipped with image collecting device, the below is equipped with heater, and described image collecting device is connected with control circuit in the control cabinet.
In order to realize the present invention better, described wafer platform comprises brilliant unit dish, described brilliant unit dish is connected with directions X stepping motor and Y direction stepping motor respectively by directions X drive lead screw and Y direction drive lead screw, described directions X drive lead screw and Y direction drive lead screw also are connected with the same transducer in directions X transducer and Y side respectively, described X side is connected with control circuit by the signal amplification circuit plate with transducer with Y side with transducer, and described directions X stepping motor is connected with control circuit by driving integrated circuit board with Y direction stepping motor.Described chute feeder comprises groove, described groove bottom is fixed with stepping motor, described stepping motor is connected with hook by belt, transmission device, double cam and connecting rod successively, constitute and collude the pawl structure, and be connected with control circuit by driving integrated circuit board, described transmission device also is connected with and colludes the pawl transducer, described groove two ends are separately installed with material loading detecting sensor and blanking detecting sensor, and described pawl transducer, material loading detecting sensor and the blanking detecting sensor of colluding is connected with control circuit by the signal amplification circuit plate respectively.Described loader comprises hopper, the described hopper of going up is connected with shovel material platform, described shovel material platform is connected with eccentric runner by connecting rod, described eccentric runner is connected with stepping motor and position transducer respectively, described position transducer is connected with control circuit by the signal amplification circuit plate, and described stepping motor is connected with control circuit by driving integrated circuit board.Described blanking device comprises stepping motor, described stepping motor is connected with the blanking tray by drive lead screw and catch bar, and be connected with control circuit by driving integrated circuit board, described blanking tray upper fixed has magazine, have the blanking breach between described blanking tray and the magazine, described stepping motor one side also is equipped with position transducer, and described position transducer is connected with control circuit by the signal amplification circuit plate.Described welding arm comprises Z axle and Y-axis servomotor, described Z axle and Y-axis servomotor are connected with suction nozzle by driving belt and four connecting rods respectively, and be connected with control circuit by driving integrated circuit board, described Z axle and Y-axis servomotor also are connected with position transducer respectively, and described position transducer all is connected with control circuit by the signal amplification circuit plate.Described image collecting device is interconnected by camera, camera lens and light source to be formed, and described camera is connected with four connecting rods of welding arm.The syringe needle of described thimble places in the box for needle or pin, described syringe needle is with reinforcing device outward, its front end is equipped with suction nozzle, the rear end is equipped with fixture, and is connected with degree of tightness adjustment dish, and described degree of tightness adjustment dish is connected with directions X respectively and adjusts screw and Y direction adjustment screw, and be connected with stepping motor by transmission device, described stepping motor is equipped with position transducer, and is connected with control circuit by driving integrated circuit board, and described position transducer is connected with control circuit by the signal amplification circuit plate.Described control circuit is made up of motion control card.
The control method of described automatic chip feeder comprises the steps and process conditions:
Start automatic chip feeder;
The material loading detecting sensor detects no lead frame, and loader shovels a new lead frame out;
Collude pawl and collude in the loader and get lead frame, and send forward along the chute feeder order;
Image collecting device constantly carries out IMAQ to the wafer on the wafer platform correspondence position, and gives control circuit with image signal transmission, and the vision detection system in the control circuit carries out image processing and analyzing;
Judge when wafer is qualified, the thimble suction nozzle tightly holds the plastic film of brilliant unit dish, thimble pierces through plastic film and the jack-up circular wafer then, welding arm moves to wafer platform top simultaneously, its suction nozzle is drawn circular wafer, move to chute feeder top again, circular wafer is attached on the lead frame correspondence position on the chute feeder;
Heater below chute feeder is latter half of constantly heats the lead frame on the chute feeder, and the circular wafer and the lead frame that are placed on the lead frame are bonded together;
Collude pawl the lead frame of finishing chip attachment is sent to blanking device;
Whether the blanking detecting sensor detects magazine and installs, and packaged magazine moves down discharging.
The present invention compared with prior art has following advantage and beneficial effect:
1, for satisfying the requirement of operation production equipment high-speed, high precision high reliability behind the IC, the present invention adopts linux system to carry out visual pattern processing and kinetic control system exploitation fully, avoided existing based on the IMAQ under the Windows system and treatment system in stability aspect the real-time and speed limit, also overcome the deficiency that has internal memory 640K restriction and INTERFACE DESIGN difficulty based on the DOS system simultaneously.
2, under (SuSE) Linux OS, realized the dispatching algorithm of multithreading, improve the utilance of programming system resource and carried out efficient.The present invention is divided into a plurality of concurrent tasks with the control task of system, can improve the utilance of resources such as CPU, internal memory, and the while is the time of the execution of minimizing system on the whole also.The present invention has improved the intelligibility of system, convenient management and structure, convenient function analysis.
Adopt customer service/server architecture 3.Unix/Linux go up traditional GUI system, efficient is low, is not suitable for the real-time needs of embedded system.The present invention adopts the MiniGUI design interface, has effectively overcome above-mentioned defective.
4, the operation key equipment required control system to have relatively high expectations aspect stable after IC produced, (SuSE) Linux OS overcomes effectively not only that the operation production equipment also is the inevitable development direction that the crucial production equipment of operation domesticizes behind the IC in the bottleneck technology of aspects such as stability, reliability behind the existing IC.The present invention not only realizes the controlling schemes of the moving chip feeder of full order under (SuSE) Linux OS, can carry out quality testing and binding fast to chip, encapsulate triode fast, finish multi-task coordination simultaneously and handle the exploitation of scheduler, can solve the technical barrier of this kind equipment complicated machinery multi-task scheduling.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the structural representation of wafer platform among the present invention;
Fig. 3 is the structural representation of loader among the present invention;
Figure 4 and 5 are structural representations of chute feeder among the present invention;
Fig. 6 is the structural representation of welding arm and image collecting device among the present invention;
Fig. 7 and 8 is structural representations of thimble among the present invention;
Fig. 9 and 10 is structural representations of blanking device among the present invention;
Figure 11 is the circuit theory diagrams of sensor signal magnification circuit plate among the present invention;
Figure 12 is the circuit theory diagrams of motor driven integrated circuit board among the present invention;
Figure 13 is a Linux plateform system multitask basic structure schematic diagram among the present invention;
Figure 14 is an INTERFACE DESIGN schematic diagram of the present invention;
Figure 15 is a Control Software structure chart of the present invention;
Figure 16 is a dependence graph between the multi-task coordination processing components among the present invention;
Figure 17 is control sequence figure of the present invention;
Figure 18 is control timing figure of the present invention;
Figure 19 is a system of the present invention control flow chart.
Embodiment
Below in conjunction with drawings and Examples, the present invention is done detailed description further, but implementation of the present invention is not limited thereto.
As shown in Figure 1, the described automatic chip feeder of present embodiment comprises frame 1, frame 1 lower end is fixed with control cabinet 2, the top is equipped with wafer platform 3 and chute feeder 5, and wafer platform 3 is connected with thimble 9, and chute feeder 5 two ends are connected with loader 4 and blanking device 10 respectively, and be connected with and collude pawl 6 and welding arm 7, its top is equipped with image collecting device 8, and the below is equipped with heater 100, and image collecting device 8 is connected with control circuit in the control cabinet.Wherein, frame 1 provides the stable operation platform for entire machine, protects control cabinet 2 simultaneously; A series of controls, testings such as control cabinet 2 main realization circuit controls, motor-driven, vision-based detection; The wafer platform 3 main step pitches of brilliant unit dish that realize move; Loader 4 is mainly put into original lead frame wherein; Chute feeder 5 is operating paths of lead frame; Collude pawl 6 with the sending forward of framework order, realize transmission agency; Welding arm 7 is realized picking up, be bundled in wafer on the lead frame; Image collecting device 8 is gathered and is obtained stable wafer images, and imports the image processing system in the control circuit into, cooperates complete machine work; Thimble 9 cooperates with welding arm 7, guarantees that each welding only has a wafer to be drawn, weld; Blanking device 10 is used to store the good lead frame of binding.
As shown in Figure 2, wafer platform 3 comprises brilliant unit dish 17, brilliant unit dish 17 is connected with directions X stepping motor 12 and Y direction stepping motor 11 respectively by directions X drive lead screw 13 and Y direction drive lead screw 14, directions X drive lead screw 13 and Y direction drive lead screw 14 also are connected with directions X transducer 16 and Y direction sensor 15 respectively, and directions X transducer 16 is connected with control circuit with Y direction sensor 15.Wafer platform 3 realizes that under the effect of directions X stepping motor 12 and Y direction stepping motor 11 and directions X drive lead screw 13 and Y direction drive lead screw 14 brilliant unit dish 17 is according to the good path movement of planning.After brilliant unit dish 17 moves, for image collecting device 8 provides stable visual pattern source.Directions X transducer 16 and Y direction sensor 15 are used for the initialized location of directions X stepping motor 12 and Y direction stepping motor 11 and determine zero point.
As shown in Figure 3, loader 4 comprises hopper 19, and last hopper 19 is connected with shovel material platform 18, and shovel material platform 18 is connected with eccentric runner 21 by connecting rod 20, eccentric runner 21 is connected with stepping motor 22 and position transducer 23 respectively, and position transducer 23 is connected with control circuit.Loader 4 will be bound the lead frame of wafer and put into hopper 19, stepping motor 22 drives eccentric runner 21 motions, drive shovel material platform 18 stretching motions by connecting rod 20, the lead frame that realization will be gone up in the hopper 19 shovels out one by one, for subsequent pipeline work.Dead-center position determined when position transducer 23 was used for stepping motor 22 initialization.
Shown in Figure 4 and 5, chute feeder 5 comprises groove 28, and groove 28 bottoms are fixed with stepping motor 24, and stepping motor 24 is connected with hook 32 by belt 25, transmission device 27, double cam 31 and connecting rod 33 successively, constitutes to collude pawl 6 structures; Transmission device 27 also is connected with and colludes pawl transducer 26, and groove 28 two ends are separately installed with material loading detecting sensor 29 and blanking detecting sensor 30, colludes pawl transducer 26, material loading detecting sensor 29 and blanking detecting sensor 30 and is connected with control circuit respectively.Chute feeder 5 is finished the propagation function of lead frame.Stepping motor 24 makes transmission device 27 drive double cam 31 by the induced effect of belt 25, and the rotation of double cam 31 causes pumping of hook 32.The great circle of appropriate design double cam 31, roundlet radius size can accurately be controlled each hook 32 motions, realize moving of a welding position of lead frame.Connecting rod 33 drives another hook 32 and is synchronized with the movement.Groove 28 is headspaces that hook 32 moves downward.Collude pawl transducer 26 and determine initialized location when stepping motor 24 initialization, material loading detecting sensor 29 and blanking detecting sensor 30 are finished the measuring ability of material loading, blanking respectively.
As shown in Figure 6, welding arm 7 comprises Z axle and Y-axis servomotor 35,41, Z axle and Y-axis servomotor 35,41 are connected with suction nozzle 37 by driving belt 34 and four connecting rods 36 respectively, Z axle and Y-axis servomotor 35,41 also are connected with position transducer 43,42 respectively, and position transducer 43,42 all is connected with control circuit.Image collecting device 8 is interconnected by camera 40 and camera lens 39 to be formed, and is connected with coaxial light source 38, takes the photograph idea 40 and is connected with four connecting rods 36 of welding arm 7.Welding arm 7 is realized picking up wafer on the brilliant unit dish 17 and is put into function on the lead frame.Z axle and Y-axis servomotor 35,41 are by the control of transmission device realization to four connecting rods 36, and four connecting rods 36 are realized front-rear reciprocation movement up and down, and drive suction nozzle 37 is finished wafer and picked up, places function.Welding arm 7 has adopted servomotor, and it drives and adopts servo-driven module, to improve speed, precision and the stability of welding arm 7 motions.44 fixations of support, coaxial light source 38, camera lens 39 and camera 40 are formed the fore device of IMAQ.Position transducer 43,42 is determined its dead-center position when Z axle and 35,41 initialization of Y-axis servomotor.
Shown in Fig. 7 and 8, the syringe needle 53 of thimble 9 places in the box for needle or pin 45, the syringe needle 53 outer reinforcing devices 54 that are with, its front end is equipped with suction nozzle 52, and the rear end is equipped with fixture 55, and is connected with degree of tightness adjustment dish 51, degree of tightness adjustment dish 51 is connected with directions X respectively and adjusts screw 47 and Y direction adjustment screw 48, and be connected with stepping motor 50 by transmission device 46, stepping motor 50 is equipped with position transducer 49, and position transducer 49 is connected with control circuit.Thimble 9 is finished the work that qualified wafer jack-up is cooperated welding arm 7.Box for needle or pin 45 protection syringe needles 53; stepping motor 50 is realized moving up and down of syringe needle 53 by the transmission of transmission device 46; directions X adjusts screw 47 and the Y direction is adjusted the fine setting that screw 48 is realized syringe needle 53 both directions; degree of tightness adjustment dish 51 realizes syringe needle 53 is installed the degree of tightness adjusting of unloading; suction nozzle 52 holds the plastic film of brilliant unit dish 17 on syringe needle 53 moves upward; reinforcing device 54 and fixture 55 are fixture, and position transducer 49 is determined dead-center position when stepping motor 50 initialization.
As shown in Figures 9 and 10, blanking device 10 comprises stepping motor 58, stepping motor 58 is connected with blanking tray 56 by drive lead screw 60 and catch bar 55, blanking tray 56 upper fixed have magazine 57, have blanking breach 54 between described blanking tray 56 and the magazine 57, stepping motor 58 1 sides also are equipped with position transducer 59, and position transducer 59 is connected with control circuit.Blanking device 10 is realized the function with packaged lead frame storage.The lead frame that binding is good is transferred to blanking breach 54 from chute feeder 5, continues to send toward magazine 57 the insides, whenever send one, and magazine 57 moves down one.After magazine 57 was filled, stepping motor 58 was delivered to magazine 57 on the blanking tray 56 by the gearing of drive lead screw 60, and catch bar 55 is released magazine 57 then.
All the sensors is connected with control circuit by the signal amplification circuit plate, and all motors are connected with control circuit by driving integrated circuit board, and control circuit is made up of motion control card (adopting the DMC9400 type of Galil company).
As shown in figure 11, after the major function of signal amplification circuit plate is the sensor signal shaping that will collect, link to each other with the I/O point of motion control card by interface.S1～S8 represents transducer.Wherein transducer S1, S2 distance is far away, there is signal attenuation, need to add amplifying circuit, pin 3 is its main holding wire, signal is through the amplification of operational amplifier LM393, and after the effect of 42 input NAND gate (CD74HC132E), homophase 8 bus transceivers (74ls641) link to each other then, other 6 tunnel sensor signals realize that directly by linking to each other with homophase 8 bus transceivers after the pull-up resistor effect interface links to each other with the I/O of motion control card.
As shown in figure 12, the major function that drives integrated circuit board is that pulse that motion control card is sent and direction signal are after the oversampling circuit conversion, as the drive signal of stepping motor.Its principle is as follows: after circuit board receives the pulse and direction signal of control card, by photoelectric isolating circuit (device such as 6N137 is finished), consider and remove interference signal, then as the input signal of single-chip microcomputer (model is AT89C2051), become the step motor control signal that two-phase four is clapped by the single-chip microcomputer internal processes, four control signals link to each other with amplifying circuit by four output ports of AT89C2051 (P1.2, P1.3, P1.4, P1.5) respectively, and amplifying circuit is mainly finished by the chip (SLA7026) of realizing this amplification principle.The motion that is divided into a stepping motor of four tunnel output signals control of each SLA7026, every drive plate is realized the driving of three stepping motors.
As shown in figure 13, simplifying under the Linux, except that man-machine interaction was realized by several threads, task dispatcher and other each task all realized as a thread.After the system start-up, at first the various system parameterss of initialization are carried out reset operation to each mechanical part, start scheduler and human-computer interaction interface.Pass through human-computer interaction interface, the user can be provided with various system parameterss, observe that vision system collects and wafer images information and system's current state information through amplifying, can carry out single-step debug to each task of system in addition, but repertoire just often start-up system carry out full-automatic assembly line operation.Task dispatcher is the core of whole system, it is responsible for handling the request that each task is submitted, these tasks normally of asking will be carried out the signal that next step operation must be satisfied, synchronous signal promptly and between the different task, and these signals comprise hard signal and soft signal.By the mode of this centralized dispatching, greatly made things convenient for the analysis and the programming of logic, signal relation between each task, solved problems such as the deadlock in the multi-thread programming, resource contention.In addition, system has also designed a soft house dog, and task is carried out overtime, wakes the house dog program automatically up, and assurance chip feeder system safety is reliably shut down.
As shown in figure 14, the important work of another one of the present invention is the INTERFACE DESIGN to man-machine interaction, and control system adopts the INTERFACE DESIGN scheme of minigui, and minigui flies the company of the overflowing product of increasing income, and design is mainly used document and exploitation document with reference to the user.
The software implement scheme of present embodiment is as follows: for guaranteeing whole system to greatest extent in the requirement aspect the real-time, system constructing adopts the (SuSE) Linux OS of simplifying.By the multiple line distance management under the utilization linux system, realize the Task Distribution of chip feeder system, developed the dispatching algorithm of multi-task coordination and optimization, dispatching algorithm by core realizes the multithreading co-ordination, and has finished a plurality of functions such as interface operation of wafer inspection, chip flame transmission, the upper and lower material of chip flame and wafer binding and hommization.Aspect motion control, present embodiment adopts the motion control card of specialty to finish relevant Control work.The INTERFACE DESIGN of the described automatic chip feeder of present embodiment has adopted the MiniGUI INTERFACE DESIGN system that makes to measure according to the application characteristic of embedded system.
As shown in figure 15, the control procedure of present embodiment can be divided into motion control, image processing and graphic user interface three parts, and these control programs all are to develop on the basis of the function library that system provides.Wherein, the motion control function library is the api interface of the control motor movement that provided by Galil company, can realize to motor at a high speed, high-precision control.Company of Daheng provides DH-CG400 basic images acquired function interface, and what image processing adopted is IPP (Integrated PerformancePrimitives) the image processing function library of Intel Company.IPP is a cross-platform signal and multimedia software storehouse, comprise one with function from the abstract low-level layers of coming out of floor processor.Like this, application program just can be used the up-to-date enhancement function of intel architecture pellucidly, for example MMX technology, SSE technology, SSE2 technology and Itanium architecture and Intel XScale microarchitecture.In the present embodiment, adopt Beijing to fly the MiniGUI lightweight graphic user interface support function storehouse of casual software engineering company exploitation.MiniGUI is a graphic user interface back-up system towards the lightweight of Linux real time embedded system, very ripe and stable, in the checking of hardware platforms such as Intel x86, ARM, PowerPC, MIPS, be widely used in aspects such as industrial digital control system, hand-held information terminal product and financial terminal.
As shown in figure 16, the multi-task coordination processing module is the core of present embodiment control system software, and its function class is similar to the scheduler of operating system.In the control system of present embodiment, the function of whole system is realized jointly that by a plurality of tasks these tasks are according to the concurrent execution of specific order.Because these tasks must be carried out according to specific sequential, need each other to communicate, if allow these tasks directly can cause between the task coupled relation closely alternately, be easy to deadlock.The multi-task coordination processing module has been served as the role of coordinator between each subtask, is responsible for coordinating the synchronous of each subtask.Like this, just do not need directly to communicate between each subtask, have loose coupled relation each other, but also can independently change mutual between them.The multi-task coordination processing module is made up of multithreading assembly, abnormality processing assembly, control interface assembly and thread pool assembly four parts.
As shown in figure 17, the UML sequence chart has described the mutual of present embodiment system object and external system in detail.Vertical dimension among the figure is represented the time, in chronological sequence ordering downwards successively.Laterally dimension is represented different objects.Object is represented as the object lifeline, and promptly they are at the existence of special time.Message between the arrow indicated object.Activation point denoted object in the lifeline is carried out the period of action.
As shown in figure 18, the chip feeder system of present embodiment is as a real-time control system, in the performance that improves hardware facility such as CPU, motor, motion control card etc. and software facility such as operating system, image processing storehouse, each step of accurate Calculation running time, the coordination optimization overall system efficiency also is vital.Sequential chart has described each part of system in detail: the time sequencing of the Y-axis of welding arm, Z axle and suction nozzle, thimble and suction nozzle thereof, the operation of wafer platform.The running time of everything and sequencing all are to obtain through repeatedly debugging among the figure, have showed the Total tune of the optimum of system.
As shown in figure 19, the control procedure of the described automatic chip feeder of present embodiment comprises the steps and process conditions:
Start automatic chip feeder;
The material loading detecting sensor detects no lead frame, and loader shovels a new lead frame out;
Collude pawl and collude in the loader and get lead frame, and send forward along the chute feeder order; (repeating back work this moment)
Image collecting device constantly carries out IMAQ to the wafer on the wafer platform correspondence position, and gives control circuit with image signal transmission, and the vision detection system in the control circuit carries out image processing and analyzing;
Judge when wafer is qualified, the thimble suction nozzle tightly holds the plastic film of brilliant unit dish, thimble pierces through plastic film and the jack-up circular wafer then, welding arm moves to wafer platform top simultaneously, its suction nozzle is drawn circular wafer, move to chute feeder top again, circular wafer is attached on the lead frame correspondence position on the chute feeder;
Heater below chute feeder is latter half of constantly heats the lead frame on the chute feeder, and the circular wafer and the lead frame that are placed on the lead frame are bonded together;
Collude pawl the lead frame of finishing chip attachment is sent to blanking device;
Whether the blanking detecting sensor detects magazine and installs, and packaged magazine moves down discharging.
As mentioned above, can realize the present invention preferably.
Claims (9)
1. automatic chip feeder, it is characterized in that, comprise frame, described frame lower end is fixed with control cabinet, and the top is equipped with wafer platform and chute feeder, described wafer platform below is equipped with thimble, described chute feeder two ends are connected with loader and blanking device respectively, and are connected with and collude pawl and welding arm, and its top is equipped with image collecting device, the below is equipped with heater, and described image collecting device is connected with control circuit in the control cabinet; Described wafer platform comprises brilliant unit dish, described brilliant unit dish is connected with directions X stepping motor and Y direction stepping motor respectively by directions X drive lead screw and Y direction drive lead screw, described directions X drive lead screw and Y direction drive lead screw also are connected with directions X transducer and Y direction sensor respectively, described directions X transducer is connected with control circuit by the signal amplification circuit plate with the Y direction sensor, and described directions X stepping motor is connected with control circuit by driving integrated circuit board with Y direction stepping motor.
2. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that, described chute feeder comprises groove, described groove bottom is fixed with stepping motor, described stepping motor passes through belt successively, transmission device, double cam is connected with hook with connecting rod, constitute and collude the pawl structure, and be connected with control circuit by driving integrated circuit board, described transmission device also is connected with and colludes the pawl transducer, described groove two ends are separately installed with material loading detecting sensor and blanking detecting sensor, the described pawl transducer that colludes, the material loading detecting sensor is connected with control circuit by the signal amplification circuit plate respectively with the blanking detecting sensor.
3. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that, described loader comprises hopper, the described hopper of going up is connected with shovel material platform, described shovel material platform is connected with eccentric runner by connecting rod, described eccentric runner is connected with stepping motor and position transducer respectively, and described position transducer is connected with control circuit by the signal amplification circuit plate, and described stepping motor is connected with control circuit by driving integrated circuit board.
4. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that, described blanking device comprises stepping motor, described stepping motor is connected with the blanking tray by drive lead screw and catch bar, and be connected with control circuit by driving integrated circuit board, described blanking tray upper fixed has magazine, has the blanking breach between described blanking tray and the magazine, described stepping motor one side also is equipped with position transducer, and described position transducer is connected with control circuit by the signal amplification circuit plate.
5. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that, described welding arm comprises Z axle and Y-axis servomotor, described Z axle and Y-axis servomotor are connected with suction nozzle by driving belt and four connecting rods respectively, and be connected with control circuit by driving integrated circuit board, described Z axle and Y-axis servomotor also are connected with position transducer respectively, and described position transducer all is connected with control circuit by the signal amplification circuit plate.
6. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that described image collecting device is interconnected by camera, camera lens and light source to be formed, described camera is connected with four connecting rods of welding arm.
7. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that, the syringe needle of described thimble places in the box for needle or pin, described syringe needle is with reinforcing device outward, its front end is equipped with suction nozzle, the rear end is equipped with fixture, and be connected with degree of tightness adjustment dish, described degree of tightness adjustment dish is connected with directions X respectively and adjusts screw and Y direction adjustment screw, and be connected with stepping motor by transmission device, described stepping motor is equipped with position transducer, and is connected with control circuit by driving integrated circuit board, and described position transducer is connected with control circuit by the signal amplification circuit plate.
8. according to the described a kind of automatic chip feeder of claim 1, it is characterized in that described control circuit is made up of motion control card.
9. the control method of the described a kind of automatic chip feeder of claim 1 is characterized in that, comprises the steps and process conditions:
Start automatic chip feeder;
The material loading detecting sensor detects no lead frame, and loader shovels a new lead frame out;
Collude pawl and collude in the loader and get lead frame, and send forward along the chute feeder order;
Image collecting device constantly carries out IMAQ to the wafer on the wafer platform correspondence position, and gives control circuit with image signal transmission, and the vision detection system in the control circuit carries out image processing and analyzing;
Judge when wafer is qualified, the thimble suction nozzle tightly holds the plastic film of brilliant unit dish, thimble pierces through plastic film and the jack-up circular wafer then, welding arm moves to wafer platform top simultaneously, its suction nozzle is drawn circular wafer, move to chute feeder top again, circular wafer is attached on the lead frame correspondence position on the chute feeder;
Heater below chute feeder is latter half of constantly heats the lead frame on the chute feeder, and the circular wafer and the lead frame that are placed on the lead frame are bonded together;
Collude pawl the lead frame of finishing chip attachment is sent to blanking device;
Whether the blanking detecting sensor detects magazine and installs, and packaged magazine moves down discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100361922A CN100386855C (en) | 2005-08-01 | 2005-08-01 | Automatic chip feeder and control thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100361922A CN100386855C (en) | 2005-08-01 | 2005-08-01 | Automatic chip feeder and control thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1747142A CN1747142A (en) | 2006-03-15 |
| CN100386855C true CN100386855C (en) | 2008-05-07 |
Family
ID=36166582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100361922A Expired - Fee Related CN100386855C (en) | 2005-08-01 | 2005-08-01 | Automatic chip feeder and control thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100386855C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101350288B (en) * | 2007-07-20 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | Method for testing automatic material-feeding/discharging machine |
| CN101901773B (en) * | 2010-03-17 | 2013-04-17 | 中国电子科技集团公司第四十五研究所 | Automatic loading system suitable for stacking silicon chips in automatic equipment |
| CN102951323B (en) * | 2011-08-19 | 2015-01-28 | 汕头市宇信科技有限公司 | Tube pulling mechanism for test sorting machine |
| CN103426800B (en) * | 2013-07-20 | 2015-09-30 | 福州派利德电子科技有限公司 | Semiconductor chip automatic charging double checkout gear |
| CN110364468B (en) * | 2019-06-21 | 2022-02-15 | 华南理工大学 | LED chip positioning method suitable for automatic feeding mechanism |
| CN111627792B (en) * | 2020-07-29 | 2020-10-16 | 山东元旭光电股份有限公司 | Automatic tray loading device for wafers |
| CN113517212B (en) * | 2021-06-23 | 2021-11-19 | 四川通妙科技有限公司 | Lead frame is with gluing core device |
| CN113627117A (en) * | 2021-07-19 | 2021-11-09 | 深圳新益昌科技股份有限公司 | Die bonding path planning method and device, terminal equipment and readable storage medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3695501A (en) * | 1970-05-21 | 1972-10-03 | Automated Equipment Corp | Die bonder apparatus |
| US3738560A (en) * | 1970-12-08 | 1973-06-12 | Kulicke & Soffa Ind Inc | Semiconductor die bonder |
| CN1180242A (en) * | 1996-10-15 | 1998-04-29 | 三星电子株式会社 | Die bonding apparatus having heat generating means |
| CN1072398C (en) * | 1997-03-26 | 2001-10-03 | 财团法人工业技术研究院 | Chip connection method and device |
| JP2003037122A (en) * | 2001-07-24 | 2003-02-07 | Mitsubishi Electric Corp | Bonding device and bonding method |
| CN1121714C (en) * | 1998-04-02 | 2003-09-17 | 三星电子株式会社 | Die bonding apparatus |
| CN2833881Y (en) * | 2005-08-05 | 2006-11-01 | 华南理工大学 | Full-automatic chip loader |
-
2005
- 2005-08-01 CN CNB2005100361922A patent/CN100386855C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3695501A (en) * | 1970-05-21 | 1972-10-03 | Automated Equipment Corp | Die bonder apparatus |
| US3738560A (en) * | 1970-12-08 | 1973-06-12 | Kulicke & Soffa Ind Inc | Semiconductor die bonder |
| CN1180242A (en) * | 1996-10-15 | 1998-04-29 | 三星电子株式会社 | Die bonding apparatus having heat generating means |
| CN1072398C (en) * | 1997-03-26 | 2001-10-03 | 财团法人工业技术研究院 | Chip connection method and device |
| CN1121714C (en) * | 1998-04-02 | 2003-09-17 | 三星电子株式会社 | Die bonding apparatus |
| JP2003037122A (en) * | 2001-07-24 | 2003-02-07 | Mitsubishi Electric Corp | Bonding device and bonding method |
| CN2833881Y (en) * | 2005-08-05 | 2006-11-01 | 华南理工大学 | Full-automatic chip loader |
Non-Patent Citations (4)
| Title |
|---|
| 半导体生产后工序设备中的若干视觉检测与伺服系统设计技术. 胡跃明，吴忻生，戚其丰，袁鹏，刘海明.广东自动化与信息工程，第2003年第1期. 2003 |
| 半导体生产后工序设备中的若干视觉检测与伺服系统设计技术. 胡跃明，吴忻生，戚其丰，袁鹏，刘海明.广东自动化与信息工程，第2003年第1期. 2003 * |
| 芯片键合的自动化. 742厂.半导体技术，第1977年第2期. 1977 |
| 芯片键合的自动化. 742厂.半导体技术，第1977年第2期. 1977 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1747142A (en) | 2006-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100386855C (en) | Automatic chip feeder and control thereof | |
| CN2833881Y (en) | Full-automatic chip loader | |
| CN110202388B (en) | Automatic production line and production method for small-size parts | |
| CN204632100U (en) | A kind of Infrared remote controller ATE (automatic test equipment) and test macro | |
| CN207036661U (en) | A kind of Systems for optical inspection based on six-joint robot | |
| CN103368795A (en) | Automatic feeding, testing and sorting system and operation method thereof | |
| WO2019080678A1 (en) | Parcel supply method and apparatus, electronic device, and storage medium | |
| CN201068341Y (en) | Full-automatic loader for quartz wafer | |
| CN203054446U (en) | Multi-station camera module optical automatic testing equipment | |
| CN107345346A (en) | The intelligence of sewing machine is reckoned by the piece method, system, memory and sewing machine | |
| CN101652838A (en) | A recipe-and-component control module and methods thereof | |
| CN105964567A (en) | Sorting control system for glass bottles in household garbage | |
| CN110992343A (en) | Flying filament flying impurity visual inspection method based on robot, storage medium and electronic equipment | |
| CN109822907A (en) | A kind of long-range control, the unattended 3D printer auxiliary system continuously printed | |
| CN107203177A (en) | A kind of multi-shaft motion control system based on FPGA | |
| CN106808463B (en) | A kind of carbide chip automation disc filling method of integrated manipulator | |
| CN208289155U (en) | A kind of vehicle nut lathe automatic loading and unloading device | |
| CN205008248U (en) | Equipment is examined to lamp | |
| CN103190225B (en) | Method for transporting corn by using corn automatic test clusters clamp | |
| Gullander et al. | Generic resource models and a message-passing structure in an FMS controller | |
| CN105107748A (en) | Light inspection equipment | |
| Bangsow et al. | Simulation of Robots and Handling Equipment | |
| CN207061186U (en) | Intelligent feeding system and Intelligent feeding machine | |
| CN205201515U (en) | Automatic sabot system of carbide blade of integrated manipulator | |
| CN204974335U (en) | Full -automatic work piece is gluey equipment in batches based on PLC control |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: ZHAOQING HONGHUA ELECTRONIC TECHNOLOGY CO.,LTD. Assignor: South China University of Technology Contract record no.: 2010440000628 Denomination of invention: Automatic chip feeder and control thereof Granted publication date: 20080507 License type: Exclusive License Open date: 20060315 Record date: 20100603 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080507 Termination date: 20210801 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |