CN100375586C - Coating film structure for printed circuit board - Google Patents
Coating film structure for printed circuit board Download PDFInfo
- Publication number
- CN100375586C CN100375586C CNB021565783A CN02156578A CN100375586C CN 100375586 C CN100375586 C CN 100375586C CN B021565783 A CNB021565783 A CN B021565783A CN 02156578 A CN02156578 A CN 02156578A CN 100375586 C CN100375586 C CN 100375586C
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- plated film
- coating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The present invention relates to a film coating structure for printed circuit boards, which comprises a printed circuit board and electronic elements, wherein the electronic elements are installed on the printed circuit board, and are supported under the printed circuit board; simultaneously, film coating solution put on the printed circuit board is guided so that the film coating solution can not flow to a film coating appliance under the printed circuit board. Under the condition that the printed circuit board needs coating with a film in order to make the electronic elements installed on the printed circuit board mutually insulated, a supporting part is formed on the peripheric part of the present invention in the film coating appliance for putting the printed circuit board, and is made of insulating material. The present invention has the advantage that the electronic elements are mutually insulated even if the use quantity of the film coating solution is reduced.
Description
Technical field
The present invention relates to a kind of plated film structure of printed circuit board (PCB).
Background technology
In general, printed circuit board (PCB) is by surface mounting technology (Surface MountedTechnology with electronic component, hereinafter to be referred as SMT) mounted thereto plank (Board) as PSB etc., owing on its surface electronic component is housed, therefore will between electronic component, does electric insulation and handle.
Such printed circuit board (PCB) all has application in all electronic products, in the time of particularly on being applied in machines such as the washing machine that makes water and dishwasher, in order to prevent to be short-circuited between the electronic component, must carry out insulation processing to it.
Fig. 1 is the sectional view of existing printed circuit board (PCB) plated film structure.
As shown in the figure, electronic component 2 is housed above the existing printed circuit board (PCB), above-mentioned printed circuit board (PCB) 4 is placed on the plated film apparatus 6, pour into coating liquid 8 in the plated film guide 9 after, be installed between the electronic component 2 on the printed circuit board (PCB) 4 and can be insulated.
Here, plated film apparatus 6 is the box-like of a kind of top opening.
Therefore, if be put into printed circuit board (PCB) in the above-mentioned plated film apparatus 6 and coating liquid 8 poured into, so coating liquid 8 will be coated in the top of printed circuit board (PCB) 4 with below.
Particularly, on electronic component 2, form terminal for being electrically connected with the outside realization, and this electronic component 2 is when being installed on the printed circuit board (PCB) 4 by such terminal, needs to be put into electronic component 2 in the plated film apparatus 6 and coating liquid 8 is poured in order to cover terminal.
But in the plated film structure of existing printed circuit board (PCB), because the plated film apparatus is the box-like of a kind of top opening, pour into if therefore printed circuit board (PCB) is put in the plated film apparatus and coating liquid, so coating liquid also can flow to printed circuit board (PCB) below, the problem that this will exist the use amount of coating liquid to increase.
Summary of the invention
If for plated film structure existence printed circuit board (PCB) is put in the plated film apparatus and coating liquid that overcomes existing printed circuit board (PCB) poured into, so coating liquid also can flow to printed circuit board (PCB) below, and the problem that the use amount that produces coating liquid increases, the invention provides a kind of plated film structure of printed circuit board (PCB), it makes between the electronic component that is installed on the printed circuit board (PCB) and reaches electric insulation, and the use amount that can save coating liquid when printed circuit board (PCB) carried out plated film.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of plated film structure of printed circuit board (PCB), it is characterized in that, comprise printed circuit board (PCB), be installed in the electronic component above the printed circuit board (PCB), be supported in above-mentioned printed circuit board (PCB) below, guiding is simultaneously rendered to this coating liquid above printed circuit board (PCB) so that coating liquid can not flow to the plated film apparatus below the printed circuit board (PCB).
The plated film of aforesaid printed circuit board (PCB) is constructed, and wherein the plated film apparatus is the box-like of top opening, top inclination to the inside and formation support portion on the part all around of its bottom surface.
The plated film structure of aforesaid printed circuit board (PCB), wherein the support portion is to make with insulating material.
The effect of invention:
In the plated film structure of printed circuit board (PCB) of the present invention with said structure, need printed circuit board (PCB) be carried out under the situation of plated film in order to make mutually insulated between the electronic component that is installed on the printed circuit board (PCB), forming the support portion on the part around the plated film apparatus inside of putting into for printed circuit board (PCB), make with insulating material this support portion, even the advantage of doing like this is to reduce the use amount of coating liquid, also can make mutually insulated between the electronic component.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the sectional view of the plated film structure of existing printed circuit board (PCB)
Fig. 2 is the sectional view of the plated film structure of printed circuit board (PCB) of the present invention
The number in the figure explanation
52: electronic component 54: printed circuit board (PCB)
56: plated film apparatus (coating guide) 56a: support portion
58: coating liquid
Embodiment
Fig. 2 is the sectional view of the plated film structure of printed circuit board (PCB) of the present invention.
As shown in Figure 2, the plated film of printed circuit board (PCB) of the present invention structure includes printed circuit board (PCB) 54, be installed in electronic component 52 on the printed circuit board (PCB) 54, can support when above-mentioned printed circuit board (PCB) 54 is placed into this printed circuit board (PCB) 54 below, the coating liquid 58 above the printed circuit board (PCB) 54 is rendered in guiding simultaneously, so that coating liquid 58 can not flow to the plated film apparatus below the printed circuit board (PCB) 54.
Herein, electronic component 52 is mounted in the element of the action of inside that washing machine and dishwasher etc. make the household electrical appliance of water, control machine.
Particularly, this plated film apparatus 56 is the box-like of top opening, around its bottom surface on the part to the inside the top tilt and formed support portion 56a.
Since will above-mentioned printed circuit board (PCB) 54 be placed on the bottom surface that is formed at plated film apparatus 56 support portion 56a above, therefore this support portion 56a is made by insulating material, so, though the following of printed circuit board (PCB) 54 can not made electronic component 52 mutually insulateds that are installed on the printed circuit board (PCB) 54 by coating liquid 58 plated films yet.
Now aforesaid operation sequence of the present invention is described below:
At first, above electronic component 52 is housed printed circuit board (PCB) 54 be put in the plated film apparatus 56, and make printed circuit board (PCB) below touch on the support portion 56a of plated film apparatus 56.
Afterwards, if coating liquid 58 is poured in the plated film apparatus 56, so owing to there is above-mentioned support portion 56a to exist, therefore what coating liquid 58 can not flow to printed circuit board (PCB) 54 and has just applied coating liquid 58 from all directions on printed circuit board (PCB) 54, can make thus and realize between the electronic component 52 that is installed on the printed circuit board (PCB) 54 insulating.
On electronic component 52, form terminal for being electrically connected with the outside realization, and, electronic component 52 is to be installed under the situation on the printed circuit board (PCB) 54 by such terminal, will make the amount of pouring the coating liquid in the plated film apparatus into can cover the terminal of electronic component 52 so that realize electric insulation between the electronic component 52 when pouring coating liquid 58 into.
Claims (3)
1. the plated film of a printed circuit board (PCB) is constructed, it is characterized in that, comprise printed circuit board (PCB), be installed in the electronic component above the printed circuit board (PCB), be supported in above-mentioned printed circuit board (PCB) below, guiding is simultaneously rendered to this coating liquid above printed circuit board (PCB) so that coating liquid can not flow to the plated film apparatus below the printed circuit board (PCB).
2. the plated film of printed circuit board (PCB) according to claim 1 is constructed, and it is characterized in that described plated film apparatus is the box-like of top opening, top inclination to the inside and formation support portion on the part all around of its bottom surface.
3. the plated film of printed circuit board (PCB) according to claim 2 structure is characterized in that described support portion is to make with insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021565783A CN100375586C (en) | 2002-12-17 | 2002-12-17 | Coating film structure for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021565783A CN100375586C (en) | 2002-12-17 | 2002-12-17 | Coating film structure for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1509133A CN1509133A (en) | 2004-06-30 |
| CN100375586C true CN100375586C (en) | 2008-03-12 |
Family
ID=34236299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021565783A Expired - Fee Related CN100375586C (en) | 2002-12-17 | 2002-12-17 | Coating film structure for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100375586C (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4794018A (en) * | 1987-08-07 | 1988-12-27 | Scheetz Frederick M | Partial immersion flow coating method and apparatus |
| JPH0575241A (en) * | 1991-09-12 | 1993-03-26 | Toshiba Corp | Circuit board device |
| JPH07242085A (en) * | 1994-03-01 | 1995-09-19 | Mitsubishi Electric Corp | Ic card and manufacture of ic card |
-
2002
- 2002-12-17 CN CNB021565783A patent/CN100375586C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4794018A (en) * | 1987-08-07 | 1988-12-27 | Scheetz Frederick M | Partial immersion flow coating method and apparatus |
| JPH0575241A (en) * | 1991-09-12 | 1993-03-26 | Toshiba Corp | Circuit board device |
| JPH07242085A (en) * | 1994-03-01 | 1995-09-19 | Mitsubishi Electric Corp | Ic card and manufacture of ic card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1509133A (en) | 2004-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080312 Termination date: 20100118 |