CN100357771C - Light transmission module and manufacturing method - Google Patents
Light transmission module and manufacturing method Download PDFInfo
- Publication number
- CN100357771C CN100357771C CNB2004100070142A CN200410007014A CN100357771C CN 100357771 C CN100357771 C CN 100357771C CN B2004100070142 A CNB2004100070142 A CN B2004100070142A CN 200410007014 A CN200410007014 A CN 200410007014A CN 100357771 C CN100357771 C CN 100357771C
- Authority
- CN
- China
- Prior art keywords
- housing
- transfer assembly
- circuit structure
- light conducting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to an optical transferring component which is composed of a circuit structure, transferring optical fiber with a core part, an optical conduction component and a shielding cover, wherein the shielding cover enables the core part to be connected to the optical conduction component in an adhesive, spot welding or laser welding mode. Part of the outer margin or the whole outer margin of the transferring optical fiber is coated by a fixed structure, and the core part is used for transferring optical signals; the optical conduction component is directly connected to the circuit structure, and receives and / or sends the optical signals.
Description
Technical field
The relevant a kind of smooth transfer assembly (optical transceiver module) of the present invention is particularly few about a kind of production process, easily assemble contraposition, light transfer assembly cheaply.
Background technology
Please refer to Fig. 1, is the synoptic diagram that illustrates existing light transfer assembly one example.At first, (planar light wave circuit, PLC) 104 are fixed on pottery (ceramic) substrate 102 with opening 108, and the light inlet side of planar optical waveguide 104 is to aim at opening 108 with planar optical waveguide.Afterwards, optical fiber 106 is inserted openings 108 and be fixed in the light inlet of planar optical waveguide 104 in the mode of gluing.At last, with ceramic substrate 102 be fixed in through pin printed circuit board (PCB) (printed circuit board, PCB) on, to finish the preparation of light transfer assembly.Yet, utilizing said method, can be because of must having ceramic substrate, thereby the problem that manufacturing cost increases produces.
Moreover, please refer to Fig. 2, be the synoptic diagram that illustrates existing light transfer assembly 200 another examples.In this example, at first optical fiber 202 is passed zirconia lasso (ferrule) 204 inside, zirconia lasso 204 is socketed on cuts soon in the copper flange (Flange) 206 again.In addition planar optical waveguide 208 is fixed on the ceramic substrate 210.Then, the core heart portion 220 of optical fiber 202 is placed in the V-shaped valley of planar optical waveguide 208, and then the waveguide of alignment surface optical waveguide 208 (waveguide) plane of incidence; Again fiber cover (fiber cover) 212 is covered the core heart portion 220 of optical fiber 202, and fiber cover 212 is fixed on the planar optical waveguide 208 in the mode of heating and melting.And planar optical waveguide 208 and ceramic substrate 210 are electrically connected by the routing mode.Afterwards, with ceramic substrate 210 and flange 206 sockets and be attached on the pedestal 216, so that optical fiber 202 and planar optical waveguide 208 location and further affixed.Then, electrically connect with printed circuit board (PCB) 218 by the pin 214 that extends outstanding ceramic substrate 210, to finish the preparation of light transfer assembly 200.
Though said method can reduce the use amount of stupalith, yet need to increase and cut members such as copper sleeve ring, ceramic flange and zirconia lasso soon, thereby not only can not use stupalith fully, but also to increase the spare part of other high price, so said method can't effectively be saved cost.Moreover said method need be than another prior art increase at least 3 road production process, and the therefore whole production process time can significantly increase, and the production process difficulty also can promote thereupon.
Summary of the invention
Therefore, for addressing the above problem, the objective of the invention is to propose a kind of smooth transfer assembly, significantly to reduce manufacturing cost and time, under the situation that need not use high temperature resistant material, can significantly reduce production process difficulty and manufacturing cost and to reduce the possibility of optical fiber displacement/distortion/fracture etc.
For this reason, smooth transfer assembly of the present invention is by circuit structure, the transmission optical fiber with core heart portion (core), light conducting subassembly and hide institute is constituted, and wherein covering is that mode with gluing, spot welding or laser bonding is connected on the light conducting subassembly core heart portion.Partly or entirely transmit the optical fiber outer rim structure that is fixed and coat, and core heart portion is in order to transmit light signal.The light conducting subassembly is to be directly connected on the circuit structure, and receives and/or send the aforementioned lights signal.
Moreover the present invention provides a kind of smooth transfer assembly in addition, is by circuit structure, light conducting structure, light conducting subassembly and hides institute and constitute, and wherein hiding is that mode with gluing, spot welding or laser bonding is connected on the light conducting subassembly light conducting structure.The light conducting structure is made of fixed sturcture, the part optical fiber that structure coats that is fixed, and wherein transmits optical fiber and has the core heart portion that can transmit light signal.The light conducting subassembly is to be directly connected on the circuit structure, and receives and/or send the aforementioned lights signal.
Light conducting structure (or fixed sturcture) can be directly fixed on the circuit structure in above-mentioned smooth transfer assembly, also can utilize a housing directly affixed and positioning circuit structure and light conducting structure (or fixed sturcture), also can earlier fixed sturcture be fixed in another housing, carry out the location of circuit structure and light conducting structure and affixed again.Aforementioned affixed mode be stick together, fixing, chimeric, one-body molded, close-fitting, clamping or filling.The material of aforementioned fixation structure is material, plastics, metal, resilient material or the packing material that quality is softer than covered shell.The material of housing is the material that metal, plastics, stainless steel, alloy, pottery or rigidity are higher than optical fiber.
Moreover in above-mentioned smooth transfer assembly, the light conducting subassembly is to be positioned on the same side of circuit structure with hiding, and the housing that positioning and fixing is used then is positioned on the opposite flank of circuit structure.In addition, the housing used of light conducting subassembly, covering and positioning and fixing also can be positioned on the same side of circuit structure.
In above-mentioned smooth transfer assembly, the light conducting subassembly is to be selected from one of planar optical waveguide, laser diode, vertical cavity surface emitting laser (VCSEL), light emitting diode or photodiode.Circuit structure is a printed circuit board (PCB).The material that hides is one of plastics, metal, alloy, stainless steel or pottery.
In addition, the present invention provides a kind of manufacture method of smooth transfer assembly in addition, provides the circuit structure of built-in smooth conducting subassembly, and transmits the outer fiber structure that is coated and fixed in one.Afterwards, contraposition connects the core heart portion of transmission optical fiber and the incident section or the outgoing portion of light conducting subassembly, and to be selected from the mode of one of gluing, spot welding or laser bonding, covering hides on the light conducting subassembly, so that core heart portion is fixed on the light conducting subassembly again.Wherein fixed sturcture is covered section or all transmits the optical fiber outer rim.
Manufacture method at above-mentioned smooth transfer assembly, fixed sturcture can be directly fixed on the circuit structure, also can utilize a housing directly affixed and positioning circuit structure and fixed sturcture, also can earlier fixed sturcture be fixed in another housing, carry out again and the location of circuit structure and affixed.Aforementioned affixed mode be stick together, fixing, chimeric, one-body molded, close-fitting, clamping or filling.
In sum, in smooth transfer assembly of the present invention,, therefore do not need to be connected with circuit structure, so can significantly reduce manufacturing cost and time via ceramic substrate because the light conducting subassembly is to be directly connected on the circuit structure.
Moreover, in smooth transfer assembly of the present invention, because the juncture between optical fiber and light conducting subassembly is not to adopt heat to fuse the mode of closing, therefore need not use high temperature resistant material in order to the structure of fiber optic splicing and light conducting subassembly, and need not use resistant to elevated temperatures lasso to fix fiber position, so can significantly reduce production process difficulty and manufacturing cost.
In addition, in smooth transfer assembly of the present invention, because outer fiber is to be subjected to soft/flexible fastening structure to coat, therefore when optical fiber bore external force, fixed sturcture can absorb this external force, and then the possibility of reduction optical fiber displacement/distortion/fracture etc.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 is the synoptic diagram that illustrates the light transfer assembly of an existing example.
Fig. 2 is the synoptic diagram that illustrates the light transfer assembly of existing another example.
Fig. 3 is the synoptic diagram that illustrates the light transfer assembly of a preferred embodiment of the present invention.
Fig. 4 is an assembling example schematic that illustrates the light transfer assembly of a preferred embodiment of the present invention.
Fig. 5 is the synoptic diagram that illustrates the light transfer assembly of another preferred embodiment of the present invention.
Fig. 6 is an assembling example schematic again that illustrates the light transfer assembly of a preferred embodiment of the present invention.
Fig. 7 is an assembling example schematic again that illustrates the light transfer assembly of a preferred embodiment of the present invention.
Fig. 8 is the partial schematic diagram that illustrates the light transfer assembly of a preferred embodiment of the present invention.
Embodiment
Fig. 3 is the synoptic diagram that illustrates the light transfer assembly 300 of a preferred embodiment of the present invention.Please refer to Fig. 3, light transfer assembly 300 is made of light conducting subassembly 314, light conducting structure 318 and circuit structure 310, and wherein light conducting subassembly 314 and engaging of 318 of light conducting structures are to hide 312 and make that to hide 312 edge and light conducting subassembly 314 affixed and reach by covering.Covering 312 for example is gluing, spot welding or laser bonding with the method for attachment of light conducting subassembly 314.The material of covering 312 for example is plastics, metal, alloy, stainless steel or pottery.
In addition, light transfer assembly 300 for example is to be installed on the housing shown in Figure 4 304,320 and firm engagement, and its middle shell 304,320 can be one-body molded, also can be the isolating construction that can mutually combine.The material of housing 304,320 for example is material or the enough material of other rigidity that plastics, metal, stainless steel, alloy, pottery, rigidity are higher than optical fiber.The juncture of housing 304,320 for example be stick together, fixing, chimeric, one-body molded, close-fitting or clamping.In addition, the axle center of housing 304 is formed with runs through opening 306, in order to hold light conducting structure 318.The shape of housing 304 for example is tubular, column, polygon, the rectangular case with holding division 806 802 as shown in Figure 8 or other structure with clamping structure.
Light conducting structure 318 is made of optical fiber 302 and the fixed sturcture 322 that is coated on optical fiber 302 outer rims.Optical fiber 302 centers are made of the core heart (core) portion 308, in order to transmit light signal, its SMIS heart portion 308 for example is the internal reflection structure that can supply light signal portion's reflection within it to advance, and particularly for example is solid interior total reflection structure, hollow interior total reflection structure.
Fixed sturcture 322 is to coat local or whole optical fiber 302 outer rims, and between optical fiber 302 and housing 304, with so that light conducting structure 318 be fixed in the opening 306 of housing 304, the shape of fixed sturcture 322 for example is opening 306 shapes of corresponding housing 304, for example can be to be selected from as shown in Figure 8 horn-like fixed sturcture 804, tubular, column, polygon or other has the structure of clamping structure.The juncture of fixed sturcture 322 and optical fiber 302 or fixed sturcture 322 and housing 304,320 for example be stick together, fixing, chimeric, one-body molded, close-fitting, clamping or filling.The material of fixed sturcture 322 for example is the material that quality is softer than housing 304, for example can be selected from plastics, resilient material, packing material or metal.
In addition, light conducting structure 318 can together be fixed on the housing 320 with circuit structure 310 via housing 304, also can directly be fixed on the circuit structure 310 via housing 304, also can directly be fixed on the circuit structure 310 by fixed sturcture 322.Aforementioned juncture for example be stick together, fixing, chimeric, one-body molded, close-fitting or clamping.
Light conducting subassembly 314 for example is planar optical waveguide, laser diode (laser diode, LD), vertical cavity surface emitting laser (VCSEL) (Vertical Cavity Surface Emitting Lasers, VCSEL), light emitting diode (light emitting diode, LED) and photodiode (photodiode, PD).Also has opening 316 in light conducting subassembly 314 in addition, in order to the location of 314 of light conducting structure 318 and light conducting subassemblies to be provided, in this preferred embodiment, opening 316 for example is to settle the core heart portion 308 of optical fiber 302 1 ends and make 308 pairs in core heart portion be positioned at the incident section or the outgoing portion of light conducting subassembly 314.
Moreover light conducting subassembly 314, covering 312 can be positioned on the side, the same side of circuit structure 310 with housing 320.Light conducting subassembly 314 also can be positioned on the side of circuit structure 310 with covering 312, and housing 320 then is positioned on the opposite flank of circuit structure 310.
Then, be the assemble method that example illustrates smooth transfer assembly 300 of the present invention with a preferred embodiment.Please refer to Fig. 4, at first, the mode of light conducting subassembly 314 with routing is directly connected on the circuit structure 310, light conducting subassembly 314 and circuit structure 310 are electrically connected.In addition, make optical fiber 302 pass housing 304 and the outstanding housing 304 of extension, again fixed sturcture 322 is filled between optical fiber 302 and the housing 304, so that optical fiber 302 is fixed in the housing 304.
Afterwards, foregoing circuit structure 310 and housing 304 are fixed in respectively on the housing 320, and place the core heart portion 308 of optical fiber 302 in the opening 316 and core heart portion 308 is contacted with light conducting subassembly 314 incident sections or outgoing portion.Then, will hide 312 and be covered on the opening 316, and make in the mode of gluing, spot welding or laser bonding and to hide 312 and be fixed on the light conducting subassembly 314, this moment optical fiber 302 be subjected to hiding 312 with the gripping of light conducting subassembly 314.
Then,, circuit structure 310 and housing 304 are fixed on the housing 320 for example to be to fix, chimeric, welding, clamping, mode such as stick together, and the relative position between permanent circuit structure 310 and the housing 304.
Mode by this preferred embodiment, can finish contraposition between light conducting structure and the light conducting subassembly, action such as fixing easily, and owing to do not need the step of high-temperature fusion in the process that engages, therefore, the partial component of this preferred embodiment can be directly easily processing and inexpensive material are constituted with plastics etc.
Moreover, because the optical fiber periphery is subjected to slightly having elasticity or soft structure coats, thereby be subjected to external force and do the time spent when optical fiber, aforementioned elasticity, soft structure have can absorb external force, with the effect that lowers optic fibre force and prevent that effectively optical fiber from the situation of displacement taking place.
In addition, the assembling mode of smooth transfer assembly of the present invention does not exceed with above-mentioned assembling mode, also can for Fig. 5 to each assembling mode and structure shown in Figure 7, or other resulting mode and structure under identical spirit.
Please refer to shown in Figure 5ly, is the synoptic diagram that illustrates the light transfer assembly 500 of another preferred embodiment of the present invention.In this preferred embodiment, the light conducting structure that light conducting subassembly 500 and 300 difference are this preferred embodiments directly with fixed sturcture 502 as protection/positioning housing, and do not need the extra housing 304 shown in Figure 3 that forms.In the process of assembling, fixed sturcture 502 can be shaped in optical fiber 302 peripheries, also can optical fiber 302 is fixed in the fixed sturcture 502.
In this example, because the periphery of fixed sturcture there is no the housing of hard, thereby can provide better shock-absorbing power, and further improve optical fiber and bear the ability of external force and prevent that more effectively optical fiber from the situation of displacement taking place.Moreover, owing to do not need the extra housing 304 shown in Figure 3 that forms, therefore also can further reduce production cost and manufacturing time.
Moreover, please refer to Fig. 6, be another assembling example schematic that illustrates smooth transfer assembly of the present invention.The difference of this assembling mode and assembling mode shown in Figure 4 is that fixed sturcture 502 (or housing 304 of Fig. 3) is affixed earlier or is shaped on the housing 320, the circuit structure 310 that will contain light conducting subassembly 314 again engages with optical fiber 302, and hiding 312 fixing with the fixing and circuit structure 310 of light conducting subassembly 314 and housing 320 individually or simultaneously, all the other are all similar to aforementioned assemble method.Wherein optical fiber 302 can be before fixed sturcture 502 (or housing 304 of Fig. 3) be fixed in housing 320, simultaneously or be fixed in afterwards in the fixed sturcture 502 (or housing 304 of Fig. 3).
In addition, please refer to Fig. 7, is another assembling example schematic that illustrates smooth transfer assembly of the present invention.The difference of this assembling mode and assembling mode shown in Figure 4 be housing 320 change be connected in circuit structure 310 have one of light conducting subassembly 314 side surface, all the other are all similar to aforementioned assemble method.This assemble method can additionally provide hide 312 with the holding force of 314 of light conducting subassemblies, and make optical fiber 302 more difficult incident section or the disengagings of outgoing portions from light conducting subassembly 314.
Moreover, in said structure, also can not need use housing 320, only have enough bond strengths between light requirement conducting structure and circuit structure and get final product, even fixed sturcture 502 or housing 304 also can directly be engaged on the circuit structure 310.
Moreover, though the structure of smooth transfer assembly of the present invention and assemble method are that example describes with above-mentioned example, so do not exceed with above-mentioned, also can look actual situation and be used alternatingly mutually.
In sum, in smooth transfer assembly of the present invention,, therefore do not need to be connected with circuit structure, so can significantly reduce manufacturing cost and time via ceramic substrate because the light conducting subassembly is to be directly connected on the circuit structure.
Moreover, in smooth transfer assembly of the present invention, because the juncture between optical fiber and light conducting subassembly is not to adopt heat to fuse the mode of closing, therefore need not use high temperature resistant material in order to the structure of fiber optic splicing and light conducting subassembly, and need not use resistant to elevated temperatures lasso to fix fiber position, so can significantly reduce production process difficulty and manufacturing cost.
In addition, in smooth transfer assembly of the present invention, because outer fiber is to be subjected to soft/flexible fastening structure to coat, therefore when optical fiber bore external force, fixed sturcture can absorb this external force, and then the possibility of reduction optical fiber displacement/distortion/fracture etc.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation and the modification of various equivalences, therefore, as long as variation, the modification to the foregoing description all will drop in the scope of claims of the present invention in connotation scope of the present invention.
Claims (13)
1. light transfer assembly comprises:
One circuit structure;
One smooth conducting structure is in order to transmit a light signal;
One smooth conducting subassembly is to be directly connected on this circuit structure, and receives and/or send this light signal; And
One hides, and is to adopt the mode of one of gluing, spot welding or laser bonding that an end of this light conducting structure is connected on this light conducting subassembly.
2. smooth transfer assembly as claimed in claim 1 is characterized in that also comprising:
One first housing is affixed and locate this circuit structure and this light conducting structure; And
One second housing is positioned on this first housing or on this circuit structure, and has one and run through opening, and this light conducting structure is positioned at this and runs through opening.
3. smooth transfer assembly as claimed in claim 2 is characterized in that this light conducting structure comprises:
One transmits optical fiber, passes this and runs through opening and have a core heart portion, and this light signal is to transmit in this core heart portion; And
One fixed sturcture is as this second housing, or between this transmission optical fiber and this second housing so that this transmission optical fiber be fixed in this second housing this run through in the opening.
4. smooth transfer assembly as claimed in claim 3, the material that it is characterized in that this fixed sturcture are to be selected from the material that quality is softer than this second housing.
5. smooth transfer assembly as claimed in claim 3, the material that it is characterized in that this fixed sturcture are to be selected from one of plastics, resilient material, packing material or metal.
6. smooth transfer assembly as claimed in claim 3, the shape that it is characterized in that this fixed sturcture are to be selected from running through the shape of opening.
7. smooth transfer assembly as claimed in claim 3 is characterized in that, the shape of this fixed sturcture is one of shape that is selected from horn-like, tubular, column, polygon or tool holding division.
8. smooth transfer assembly as claimed in claim 2, it is characterized in that this light conducting subassembly, this covering and this first housing are to be positioned on the same side of this circuit structure, or the light conducting subassembly is positioned on the same side of circuit structure with hiding, and this first housing is positioned on the opposite flank of this circuit structure.
9. smooth transfer assembly as claimed in claim 1, the material that it is characterized in that this covering are to be selected from plastics or metal.
10. smooth transfer assembly as claimed in claim 1, the material that it is characterized in that this covering are alloy or stainless steel.
11. the manufacture method of a light transfer assembly comprises:
The circuit structure of one a built-in smooth conducting subassembly is provided;
Transmit the optical fiber outer rim in one and coat a fixed sturcture;
Contraposition connects a core heart portion of this transmission optical fiber and an incident section or an outgoing portion of this light conducting subassembly; And
Adopt the mode of one of gluing, spot welding or laser bonding, cover one and hide on this light conducting subassembly, so that this core heart portion is fixed on this light conducting subassembly.
12. the manufacture method of smooth transfer assembly as claimed in claim 11 is characterized in that also comprising affixed this circuit structure and this fixed sturcture on one first housing, and this first housing and this covering are to be fixed in the same side of this circuit structure or heteropleural mutually.
13. the manufacture method of smooth transfer assembly as claimed in claim 12, affixed this circuit structure and this fixed sturcture mode on this first housing that it is characterized in that adopt stick together, one of fixing, chimeric, one-body molded, close-fitting or clamping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100070142A CN100357771C (en) | 2004-02-23 | 2004-02-23 | Light transmission module and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100070142A CN100357771C (en) | 2004-02-23 | 2004-02-23 | Light transmission module and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1661401A CN1661401A (en) | 2005-08-31 |
| CN100357771C true CN100357771C (en) | 2007-12-26 |
Family
ID=35010823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100070142A Expired - Fee Related CN100357771C (en) | 2004-02-23 | 2004-02-23 | Light transmission module and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100357771C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1110466A (en) * | 1993-09-13 | 1995-10-18 | 莫托罗拉公司 | External communication link for a credit card fager |
| US5930428A (en) * | 1997-08-12 | 1999-07-27 | Rockwell Science Center, Inc. | Blind-mate fiber optic connector with integral optoelectronic receiver circuits |
| WO2000077551A1 (en) * | 1999-06-11 | 2000-12-21 | Stratos Lightwave | Multi-port pluggable transceiver (mppt) |
| CN1381959A (en) * | 2001-04-24 | 2002-11-27 | 台达电子工业股份有限公司 | Photoelectric transceiver |
| CN1396470A (en) * | 2001-07-16 | 2003-02-12 | 声宝股份有限公司 | Transmission receptor with guide clamp unit for optical fibre communication system |
-
2004
- 2004-02-23 CN CNB2004100070142A patent/CN100357771C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1110466A (en) * | 1993-09-13 | 1995-10-18 | 莫托罗拉公司 | External communication link for a credit card fager |
| US5930428A (en) * | 1997-08-12 | 1999-07-27 | Rockwell Science Center, Inc. | Blind-mate fiber optic connector with integral optoelectronic receiver circuits |
| WO2000077551A1 (en) * | 1999-06-11 | 2000-12-21 | Stratos Lightwave | Multi-port pluggable transceiver (mppt) |
| CN1381959A (en) * | 2001-04-24 | 2002-11-27 | 台达电子工业股份有限公司 | Photoelectric transceiver |
| CN1396470A (en) * | 2001-07-16 | 2003-02-12 | 声宝股份有限公司 | Transmission receptor with guide clamp unit for optical fibre communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1661401A (en) | 2005-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2839328B1 (en) | Fiber optic modules | |
| US8888383B2 (en) | Active optical cable (AOC) connector having a molded plastic leadframe, an AOC that incorporates the AOC connector, and a method of using an AOC | |
| EP3593186A1 (en) | Universal photonic adaptor for coupling an optical connector to an optoelectronic substrate | |
| WO2013148763A1 (en) | Total-internal-reflection fiber optic interface modules and assemblies | |
| WO2012169586A1 (en) | Optical receptacle and optical module provided with same | |
| WO2010007861A1 (en) | Optical connector | |
| US9046665B2 (en) | Optical coupling module and optical fiber coupling connector | |
| TWI279095B (en) | Optical transceiver module | |
| JP4879525B2 (en) | Manufacturing method of optical transmission medium with optical element | |
| CN100357771C (en) | Light transmission module and manufacturing method | |
| CA2468756A1 (en) | Optical interconnection module | |
| JPH05297245A (en) | Multi-fiber optical connector | |
| WO2020032072A1 (en) | Optical connecting component | |
| WO2018105479A1 (en) | Light receptacle, light module, and method for producing light receptacle | |
| TWI231108B (en) | Optical transceiver module and manufacturing method thereof | |
| JP6279352B2 (en) | Optical coupling component, optical connector, and optical coupling method | |
| JP5764306B2 (en) | Manufacturing method of optical connection part and manufacturing method of active connector | |
| CN110050213A (en) | The manufacturing method of optical receptacle, optical module and optical module | |
| CN1847894A (en) | Light transceiver module | |
| US6921213B2 (en) | Adaptable optical subassembly module for different optical fiber connection interfaces | |
| JP2786326B2 (en) | Optical interface module | |
| WO2009012672A1 (en) | Transmitter optical sub-assembly for optical fiber communication | |
| US10830973B2 (en) | Optical receptacle, optical module, and method for manufacturing optical module | |
| WO2019138755A1 (en) | Optical receptacle, optical module, and optical module manufacturing method | |
| WO2017169390A1 (en) | Optical receptacle, optical module and method for producing optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DACHUANG SCIENCE CO., LTD. Free format text: FORMER OWNER: TAIDA ELECTRONIC INDUSTRY CO LTD Effective date: 20090814 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090814 Address after: Taiwan Ruiguang road Chinese Neihu district of Taipei City No. 186 Patentee after: Dachuang Science and Technology Co., Ltd. Address before: 252, Yingying Road, turtle Township, Taoyuan County, Taiwan Patentee before: Delta Optoelectronics Inc. |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Delta Technology (Dongguan) Co., Ltd. Assignor: Delta Optoelectronics Inc. Contract fulfillment period: 2005.1.1 to 2011.3.31 Contract record no.: 2009990000777 Denomination of invention: Light transmission module and manufacturing method Granted publication date: 20071226 License type: Exclusive license Record date: 20090722 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2005.1.1 TO 2011.3.31; CHANGE OF CONTRACT Name of requester: DACHUANG SCIENCE AND TECHNOLOGY( DONGGUAN ) CO., L Effective date: 20090722 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071226 Termination date: 20190223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |