CN100355110C - Organic electroluminescent cell, packaging method thereof, and coater station thereof - Google Patents
Organic electroluminescent cell, packaging method thereof, and coater station thereof Download PDFInfo
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- CN100355110C CN100355110C CNB021536856A CN02153685A CN100355110C CN 100355110 C CN100355110 C CN 100355110C CN B021536856 A CNB021536856 A CN B021536856A CN 02153685 A CN02153685 A CN 02153685A CN 100355110 C CN100355110 C CN 100355110C
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- deicer
- organic electroluminescent
- electroluminescent element
- cover plate
- organic
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Abstract
The present invention relates to an organic electroluminescent element, an encapsulating method thereof and a coating machine table thereof. A liquid water removing agent is sprayed on a cover plate in an ink jet printing mode to form a pattern with a large surface area, and then, the method for encapsulating an organic electroluminescent element can be used for element encapsulation in order to shorten the hardening time of the water removing agent. Simultaneously, the surface area of the water removing agent is increased to promote the moisture absorbing speed rate and the moisture absorbing capability of the water removing agent.
Description
Technical field
The invention relates to a kind of organic electroluminescent element, organic electroluminescent element method for packing and coating machine platform thereof, particularly, promote organic electroluminescent element, organic electroluminescent element method for packing and the coating machine platform thereof of its moisture absorption speed and wettability power simultaneously by the surface area (surface area) that increases deicer about a kind of shortening deicer firm time.
Background technology
Organic electric exciting light-emitting diode (organic light emitting diode, be called for short OLED) be to utilize the self luminous characteristic of organic functional material (organic functional materials) to reach the element of display effect, its ray structure is made of pair of electrodes and organic functional material layer, and be divided into micromolecule organic illuminating element (small molecule OLED according to the molecular weight difference of organic functional material, SM-OLED and macromolecule organic illuminating element (polymer light-emitting device, PLED) two big classes.Between electric current is by transparent anode and metallic cathode, make electronics and electric hole in the organic functional material layer in conjunction with and when producing exciton, just can make the organic functional material layer according to its properties of materials, and the mechanism of giving out light of generation different colours, this is the element principle of organic electric exciting light-emitting diode.
And the common purposes of organic electric exciting light-emitting diode is various flat-panel screens elements of mobile phone, PDA and light source or the like.Because the organic electric exciting light-emitting diode element possesses some characteristics, as do not have visual angle, simple and easy, low-cost, the high answer speed of technology, serviceability temperature is in extensive range and full-colorization etc., meet the requirement of multimedia era display characteristics, therefore become the upsurge of research in recent years.
Wherein the method for packing of organic electroluminescent element also is one of all circles' research target of gazing at, and its technology mainly is under inert gas environment, is coated with ultraviolet sclerotic type glue around the glass substrate with organic electroluminescent element, to form frame glue.And paste a cover-plate glass and base plate glass whereby, not corroded by aqueous vapor and oxygen in order to protection organic electroluminescent element inside.Organic functional material in the organic LED structure and easy and airborne moisture and oxygen reaction (especially moisture) as second electrode of negative electrode, cause the generation of light-emitting zone not or make element produce deterioration (degradation), therefore, it is considerable moisture being removed completely.
Yet because frame glue is macromolecular material, and its restricted width (being generally 1mm), so that its water permeability is higher, and can't block the external environment aqueous vapor fully and oxygen penetrates into element internal, so that influences component life.
Therefore, present solution is to insert deicer (desiccant) in element internal, use absorption penetrate into element internal via external environment or originally be present in element internal moisture, wherein, insert the method for deicer and have plenty of the rotary coating of using mode,, have the deicer more than 90% to be wasted though this kind method speed is exceedingly fast, manufacturing cost is expensive, and easily produces environmental issue.In addition, solvent relatively is not easy to diffuse out when solidifying, that is required curing time is longer, and the surface area of its moisture absorption simultaneously is less, so wettability power is relatively poor.Also have in addition with the deicer coating on the cover board in the injecting glue mode, though this kind method can effectively be used deicer, but Production Time is extremely long, and thickness is usually up in hundreds of micron, and must use cover plate with profound groove, so very easily break because of small external force produces cover plate, and solvent relatively is not easy to diffuse out when solidifying, that is required curing time is longer.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of organic electroluminescent element, organic electroluminescent element method for packing and coating machine platform thereof, insert problem, reduce the element manufacturing cycle, reduce the element manufacturing cost, take into account environmental protection with the deicer that solves existing method for packing simultaneously.
A further object of the present invention provides a kind of organic electroluminescent element method for packing, and to shorten the firm time of deicer, mat increases the surface area of deicer simultaneously, to promote its moisture absorption speed and wettability power.
Another object of the present invention provides a kind of organic electroluminescent element method for packing, not corroded by aqueous vapor and oxygen with effective protection organic electroluminescent element inside.
According to above-mentioned and other purpose, the present invention proposes a kind of formation method of deicer, comprise that utilizing ink jet printing (inkjet printing) mode that liquid deicer is sprayed on forms the pattern with high surface on the base material, then solidify the patterning deicer, to finish the spraying of deicer.
The present invention proposes a kind of method for packing of organic electroluminescent element in addition, be included in and utilize an ink discharge device on the cover board just to spray the patterning deicer solution with high surface under the inert gas atmosphere (for example nitrogen), then under inert gas or environment under low pressure, modes such as utilization exposure or heating are solidified the patterning deicer on the cover plate.Then, the organic electric exciting light-emitting diode substrate of coating one frame glue is aimed at the back pressing with aforementioned cover plate with deicer, solidify frame glue afterwards, to finish the encapsulation of organic electroluminescent element.In addition, by changing the jet size in the ink discharge device, the control and the repetition ink-jet number of times of deicer concentration, can be with any definite value of deicer THICKNESS CONTROL between tens nanometer is to hundreds of microns.
In addition, the present invention proposes a kind of organic electroluminescent element again, is by an organic electroluminescent element substrate, at the cover plate on the organic electroluminescent element substrate, on cover plate a patterning deicer of organic electroluminescent element substrate and a frame glue that is disposed between organic electroluminescent element substrate and the cover plate is constituted.Owing to have the patterning deicer on the cover plate, to shorten the firm time of patterning deicer, simultaneously by increasing the surface area of deicer, to promote its moisture absorption speed and wettability power.And the shape cording of patterning deicer has the high surface pattern, for example continuous or discontinuous pattern and combination thereof etc.
The present invention also proposes a kind of coating machine platform, is formed by an ink-jet printing apparatus, a solidification equipment and in order to a surge chamber (buffer chamber) of sending or inserting cover plate; Its configuration is to connect ink-jet printing apparatus and solidification equipment by a surge chamber, and must take into account the position of distributing ink-jet spray equipment, feeding mouth, discharge port and solidification equipment under the smooth degree of manufacturing process.In addition, in coating machine platform, more comprise one pan feeding/discharge port.
The present invention uses ink jet printing mode, makes deicer form the structure of high surface on substrate.Therefore, the solvent in the deicer of the present invention is easy to spread out in hardening process, significantly increases because of surface area simultaneously, therefore can effectively promote the wettability power of deicer.
And, the present invention uses ink gun or similar device, directly on substrate, spray deicer with high surface pattern, then with curing deicer is solidified again, the not only required manufacturing time of this kind method is extremely short, and can effectively use deicer (utilization rate is higher than 90%), insert problem, reduce the element manufacturing cycle, reduce the element manufacturing cost, take into account environmental protection so can solve the deicer of existing method for packing simultaneously.
In addition, when deicer spraying method of the present invention is applied to the packaging technology of organic electroluminescent element, can effectively protect organic electroluminescent element inside not corroded by aqueous vapor and oxygen.
Description of drawings
Fig. 1 is the spraying step schematic diagram according to the deicer of one first embodiment of the present invention;
Fig. 2 is the encapsulation step schematic diagram according to the organic electroluminescent element of one second embodiment of the present invention;
Fig. 3 is the encapsulation flow process generalized section according to organic electroluminescent element shown in Figure 2;
Fig. 4 is according to the organic electroluminescent element cover plate of one the 3rd embodiment of the present invention and the section and the schematic top plan view of deicer; And
Fig. 5 is the board schematic diagram of use ink-jetting style spraying deicer on cover plate according to one the 4th embodiment of the present invention.
100: a base material is provided
102: utilize ink jet printing mode that deicer is sprayed on the base material
104,204: solidify deicer
200: cover plate is aimed at
202: utilize ink jet printing mode that deicer is sprayed on the cover plate
210: the organic electric exciting light-emitting diode base plate alignment
212: a frame glue is provided between organic electric exciting light-emitting diode substrate and cover plate
214: the organic electric exciting light-emitting diode substrate is aimed at the cover plate with deicer
216: pressing cover plate and substrate
218: solidify frame glue
300,400: cover plate
302,402: deicer
310: the organic electric exciting light-emitting diode substrate
312: organic electric exciting light-emitting diode
314: frame glue
500: coating machine platform
502: ink-jet printing apparatus
504: feeding mouth
506: discharge port
508: solidification equipment
510: surge chamber
Embodiment
First embodiment
Fig. 1 is the spraying step schematic diagram according to the deicer of one first embodiment of the present invention.
Please refer to Fig. 1, in step 100, provide a base material, wherein base material can be plane or the base material with groove.Then, in step 102, utilize ink jet printing mode (inkjetprinting) that deicer (desiccant) is sprayed on the base material, present embodiment can use one (containing) above ink gun or similar device, directly on base material, spray deicer with high surface pattern, and deicer can be sprayed on the planar substrate, also can be sprayed on the base material with groove, and wherein deicer can be thermmohardening type or UV cured type.Then, carry out step 104, solidify deicer; If deicer is the thermmohardening type, then solidifying deicer is to carry out in the mode of a heating; If deicer is UV cured type, then solidifies deicer and be with the method for the UV-irradiation of a suitable wavelength, appropriate time and carry out.
The not only required manufacturing time of this kind method is extremely short, and can effectively use deicer (utilization rate is higher than 90%); In addition, the change of the jet size by ink gun, the control of deicer concentration and repeat the ink-jet number of times, can be with the deicer THICKNESS CONTROL at tens nanometer to any definite value between hundreds of microns.
Second embodiment
The present invention can be applicable in the display device, light source component technology of organic electroluminescent element.In present embodiment is the packaging technology that applies the present invention to organic electroluminescent element, as shown in Figure 2.Main carry out earlier the preparation of cover plate part and the preparation of organic electric exciting light-emitting diode (organic light emitting diode is called for short OLED) substrate respectively, again in conjunction with both to reach the packaging technology of element.
Fig. 2 is the encapsulation step schematic diagram according to the organic electroluminescent element of one second embodiment of the present invention.
In step 200, cover plate is aimed at, be will be used for carrying out ink gun of ink jet printing mode or similar device and cover plate to implement and aim at, its cover plate can be plane or tool groove glass, plastics or can flexible (flexible) substrate.Then, in step 202, utilize ink jet printing mode that deicer is sprayed on the cover plate, this step is under inert gas atmosphere, use the solution that on the cover board sprays one deck deicer as ink gun or similar device, wherein deicer can be thermmohardening type or UV cured type.
Then, carry out step 204, solidify deicer, can solidify deicer in modes such as ultraviolet irradiation or heating under inert gas or environment under low pressure, wherein if deicer is the thermmohardening type, then deicer being solidified is to carry out in a mode that heats; If deicer is UV cured type, then deicer being solidified is that mode with the ultraviolet irradiation of suitable wavelength, appropriate time is carried out.Subsequently, continue to step 214.
And in step 210, the organic electric exciting light-emitting diode base plate alignment is to carry out the syringe and the organic electric exciting light-emitting diode base plate alignment of the spraying of frame glue, but wherein the organic electric exciting light-emitting diode substrate can be glass, plastics or flexible base, board.Then, in step 212, between organic electric exciting light-emitting diode substrate and cover plate, provide a frame glue.Frame glue can be thermmohardening type or UV cured type.Then, in step 214, the organic electric exciting light-emitting diode substrate is aimed at the cover plate with deicer.Subsequently, in step 216, pressing cover plate and substrate carry out steps 218 afterwards, solidify frame glue, and when frame glue was the thermmohardening type, then solidifying frame glue was to carry out in the mode of a heating; When if frame glue is UV cured type, then solidifies frame glue and be with the method for the UV-irradiation of a suitable wavelength, appropriate time and carry out.
For being described in more detail the manufacturing process of present embodiment, please refer to the encapsulation flow process generalized section of organic electroluminescent element shown in Figure 3.
Please refer to Fig. 3, at first on a cover plate 300, utilize ink jet printing mode that one deicer 302 is sprayed on the cover plate 300.Then, solidify the deicer 302 on the cover plate 300, a frame glue 314 is provided between organic electric exciting light-emitting diode substrate 310 and cover plate 300 again.Afterwards, organic electric exciting light-emitting diode substrate 310 is aimed at the cover plate 300 with deicer 302.Subsequently, pressing cover plate 300 and organic electric exciting light-emitting diode substrate 310 are again with the frame adhesive curing, to finish the encapsulation of organic electroluminescent element.
The 3rd embodiment
The present invention also proposes a kind of organic electroluminescent element, can increase the surface area of deicer significantly, with the curing time of shortening deicer, and the wettability power of increase deicer.Be simplified, only show the relevant position of organic electroluminescent element cover plate of the present invention and deicer in Fig. 4, the structure after cover plate and the organic electroluminescent element substrate package is reference preceding shown in Figure 3 then.
Fig. 4 is according to the organic electroluminescent element cover plate of one the 3rd embodiment of the present invention and the section and the schematic top plan view of deicer, please refer to (a) of Fig. 4, has one deck patterning deicer 402 on a cover plate 400.This layer deicer 402 is the mode of using ink jet printing, make the shape of patterning deicer 402 have the pattern of high surface, wherein this pattern can be continous way pattern (shown in Fig. 3 deicer 302), discontinuous formula pattern, for example triangle, square, polygon, circle or shape or patterns of openings such as irregular, for example the circular open pattern in Fig. 4 (b).Therefore, contained solvent is easy to spread out in solidification process in the deicer of the present invention, so can effectively promote the wettability power of deicer.
The 4th embodiment
The present invention proposes a kind of coating machine platform in addition, as shown in Figure 5.
Fig. 5 is the coating machine platform sketch according to one the 4th embodiment of the present invention, please refer to Fig. 5, coating machine platform 500 is formed by an ink-jet printing apparatus 502, a solidification equipment 508 and in order to 510 of surge chambers (buffer chamber) of sending or inserting cover plate, and wherein ink-jet printing apparatus 502 for example comprises one (containing) above ink gun or similar device; Its configuration is to connect ink-jet printing apparatus 502 and solidification equipment 508 respectively by a surge chamber 510, and the position of distributing ink-jet printing apparatus 502 and solidification equipment 508 under the smooth degree of manufacturing process must taken into account, wherein more can comprise a feeding mouth 504 and a discharge port 506, in order to pan feeding and discharging, certainly for promoting the utilization rate of board, also feeding mouth and discharge port can be arranged to one pan feeding/discharging opening.And above-mentioned ink-jet printing apparatus 502, solidification equipment 508, surge chamber 510 or the quantity of pan feeding/discharge port do not limit has only one, can according to required in coating machine platform 500 configuration more than one device.
Afterwards, please continue with reference to Fig. 5, treat that ink jet printing is finished after, move into again in the solidification equipment 508.At last, cover plate enters surge chamber 510 from solidification equipment 508, shifts out coating machine platform 500 again.In addition, in using the solidification equipment 508 in the board 500 of ink jet printing mode spraying deicer on cover plate to change according to the change of deicer kind, for example when deicer was the thermmohardening type, solidification equipment can be curing oven (oven); When deicer was UV cured type, then solidification equipment was a ultraviolet exposure apparatus according.
As mentioned above, characteristics of the present invention are to use ink jet printing mode, make deicer form the structure of high surface on substrate.Therefore, the solvent in the deicer of the present invention is easy to spread out in hardening process, significantly increases because of surface area simultaneously, therefore can effectively promote the wettability power of deicer.And, the present invention's use directly sprays the deicer of patterning on substrate as ink gun or similar device, then with curing deicer is solidified again, the not only required manufacturing time of this kind method is extremely short, and can effectively use deicer (utilization rate is higher than 90%), insert problem, reduce the element manufacturing cycle, reduce the element manufacturing cost, take into account environmental protection so can solve the deicer of existing method for packing simultaneously.In addition, when deicer spraying method of the present invention is applied to the packaging technology of organic electroluminescent element, can effectively protect organic electroluminescent element inside not corroded by aqueous vapor and oxygen.And the present invention not only can be applicable to display device, the light source component of organic electroluminescent element, more can be widely used in the technologies such as inorganic el element, electric-field light-emitting element, LCD.
Claims (21)
1. the method for packing of an organic electroluminescent element is characterized in that, this method comprises:
Utilize an ink jet printing mode on a cover plate, to form a patterning deicer;
This patterning deicer is solidified;
One frame glue is provided between this organic electric exciting light-emitting diode substrate and this cover plate;
This cover plate of pressing and this organic electric exciting light-emitting diode substrate; And
Solidify this frame glue.
2. the method for packing of organic electroluminescent element as claimed in claim 1 is characterized in that, this deicer comprises thermmohardening type deicer.
3. the method for packing of organic electroluminescent element as claimed in claim 2 is characterized in that, the method that this deicer is solidified is to carry out in the mode of a heating.
4. the method for packing of organic electroluminescent element as claimed in claim 1 is characterized in that, this deicer comprises UV cured type deicer.
5. the method for packing of organic electroluminescent element as claimed in claim 4 is characterized in that, it is to carry out in the mode of a ultraviolet irradiation that this deicer is solidified.
6. the method for packing of organic electroluminescent element as claimed in claim 1 is characterized in that, this will be solidificated in inert gas and environment under low pressure and carry out in one of them.
7. the method for packing of organic electroluminescent element as claimed in claim 1, it is characterized in that, more comprise before this cover plate of pressing and this organic electric exciting light-emitting diode substrate, aim at this organic electric exciting light-emitting diode substrate and this cover plate with this patterning deicer.
8. method that forms deicer on the cover plate of organic electroluminescent element comprises:
One base material is provided, and this base material is the cover plate of an organic electroluminescent element;
Utilize ink jet printing mode that one deicer is sprayed on this base material; And
This deicer is solidified.
9. the method that forms deicer on the cover plate of organic electroluminescent element as claimed in claim 8 is characterized in that this deicer comprises the deicer of thermmohardening type.
10. the method that forms deicer on the cover plate of organic electroluminescent element as claimed in claim 9 is characterized in that, it is to carry out in a mode that heats that this deicer is solidified.
11. the method that forms deicer on the cover plate of organic electroluminescent element as claimed in claim 8 is characterized in that this deicer comprises the deicer of UV cured type.
12. the method that forms deicer on the cover plate of organic electroluminescent element as claimed in claim 11 is characterized in that it is to carry out in the mode of a ultraviolet irradiation that this deicer is solidified.
13. an organic electroluminescent element is characterized in that, this element comprises:
One organic electroluminescent element substrate;
One cover plate is positioned on this organic electroluminescent element substrate;
One patterning deicer is positioned on this cover plate, and in the face of this organic electroluminescent element substrate, wherein this patterning deicer is to utilize the inkjet printing mode to form; And
One frame glue is disposed between this organic electroluminescent element substrate and this cover plate.
14. organic electroluminescent element as claimed in claim 13 is characterized in that, the pattern of this patterning deicer comprises a plurality of openings.
15. organic electroluminescent element as claimed in claim 14 is characterized in that, the pattern of those openings comprise triangle, square, polygon, circle at least one of them.
16. organic electroluminescent element as claimed in claim 14 is characterized in that, the pattern of those openings comprises irregular.
17. a coating machine platform is characterized in that, this board comprises at least:
One ink-jet printing apparatus, it sprays a patterning deicer on a cover plate;
One solidification equipment, it solidifies this deicer; And
One surge chamber connects this ink-jet printing apparatus and this solidification equipment respectively, and it sends or insert this cover plate.
18. coating machine platform as claimed in claim 17 is characterized in that, this solidification equipment comprises curing oven.
19. coating machine platform as claimed in claim 17 is characterized in that, this solidification equipment comprises ultraviolet exposure apparatus according.
20. coating machine platform as claimed in claim 17 is characterized in that, more comprises one pan feeding/discharge port, connects this surge chamber.
21. coating machine platform as claimed in claim 17 is characterized in that, this ink-jet printing apparatus comprises an ink gun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021536856A CN100355110C (en) | 2002-12-03 | 2002-12-03 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021536856A CN100355110C (en) | 2002-12-03 | 2002-12-03 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1505443A CN1505443A (en) | 2004-06-16 |
| CN100355110C true CN100355110C (en) | 2007-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021536856A Expired - Fee Related CN100355110C (en) | 2002-12-03 | 2002-12-03 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
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| CN (1) | CN100355110C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655498B (en) * | 2014-11-28 | 2017-11-17 | 上海和辉光电有限公司 | A kind of OLED display and method for packing |
| CN105576148B (en) * | 2016-01-04 | 2018-03-09 | 京东方科技集团股份有限公司 | The method for packing of OLED display panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1014758A2 (en) * | 1998-12-25 | 2000-06-28 | TDK Corporation | Organic EL device |
| WO2002096160A1 (en) * | 2001-05-18 | 2002-11-28 | Koninklijke Philips Electronics N.V. | Moisture-absorption sheet |
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2002
- 2002-12-03 CN CNB021536856A patent/CN100355110C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1014758A2 (en) * | 1998-12-25 | 2000-06-28 | TDK Corporation | Organic EL device |
| WO2002096160A1 (en) * | 2001-05-18 | 2002-11-28 | Koninklijke Philips Electronics N.V. | Moisture-absorption sheet |
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| CN1505443A (en) | 2004-06-16 |
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